ZXTP25060BFH 60V, SOT23, PNP medium power transistor Summary BV(BR)CEX > -100V, BV(BR)CEO > -60V BV(BR)ECO > -7V ; IC(cont) = -3A; RCE(sat) = 58 m⍀ typical; VCE(sat) < -85mV @ -1A ; PD = 1.25W Complementary part number ZXTN25060BFH Description C Advanced process capability and package design have been used to maximize the power handling and performance of this small outline transistor. The compact size and ratings of this device make it ideally suited to applications where space is at a premium. B Features • Higher power dissipation SOT23 package • High peak current • Low saturation voltage • 100V forward blocking voltage • 7V reverse blocking voltage E E C Applications • MOSFET gate drivers • Power switches • Motor control B Pinout - top view Ordering information Device ZXTP25060BFHTA Reel size (inches) Tape width Quantity per reel 7 8mm 3,000 Device marking 028 Issue 3 - March 2008 © Zetex Semiconductors plc 2008 1 www.zetex.com ZXTP25060BFH Absolute maximum ratings Parameter Symbol Limit Unit Collector-base voltage VCBO -100 V Collector-emitter voltage (forward blocking) VCEX -100 V Collector-emitter voltage VCEO -60 V Emitter-collector voltage (reverse blocking) VECO -7 V Emitter-base voltage VEBO -7 V IC -3 A Peak pulse current ICM -9 A Power dissipation at TA =25°C (a) Linear derating factor PD 0.73 5.84 W mW/°C Power dissipation at TA =25°C (b) Linear derating factor PD 1.05 8.4 W mW/°C Power dissipation at TA =25°C (c) Linear derating factor PD 1.25 9.6 W mW/°C Power dissipation at TA =25°C (d) Linear derating factor PD 1.81 14.5 W mW/°C Tj, Tstg -55 to 150 °C Symbol Limit Unit Junction to ambient (a) R⍜JA 171 °C/W Junction to ambient (b) R⍜JA 119 °C/W Junction to ambient (c) R⍜JA 100 °C/W Junction to ambient (d) R⍜JA 69 °C/W Continuous collector current (a) Operating and storage temperature range Thermal resistance Parameter NOTES: (a) For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (c) Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (d) As (c) above measured at t<5secs Issue 3 - March 2008 © Zetex Semiconductors plc 2008 2 www.zetex.com ZXTP25060BFH Characteristics Issue 3 - March 2008 © Zetex Semiconductors plc 2008 3 www.zetex.com ZXTP25060BFH Electrical characteristics (at TAMB = 25°C unless otherwise stated) Parameter Symbol Min. Typ. Collector-base breakdown BVCBO voltage -100 Collector-emitter breakdown voltage (forward blocking) BVCEX, Collector-emitter breakdown voltage (base open) Max. Unit Conditions -120 V IC = -100mA -100 -120 V IC = -100mA, RBE < 1k⍀ or -0.25V < VBE < 1V BVCEO -60 -80 V IC = -10mA (*) Emitter-collector breakdown voltage (reverse blocking) BVECO -7 -8.6 V IE = -100uA (*) Emitter-base breakdown voltage BVEBO -7 -8.1 V IE = -100A Collector cut-off current ICBO <-1 -50 -20 nA A VCB = -80V VCB = -80V, TAMB= 100°C Collector emitter cut-off current ICEX - -100 nA VCE = -80V; RBE < 1k⍀ or -0.25V < VBE < 1V Emitter cut-off current IEBO <-1 -50 nA VEB = -5.6V Collector-emitter saturation voltage VCE(sat) -45 -55 mV IC = -0.5A, IB = -50mA (*) -100 -135 mV IC = -0.5A, IB = -10mA (*) -70 -85 mV IC = -1A, IB = -100mA (*) -175 -235 mV IC = -3A, IB = -300mA (*) Base-emitter saturation voltage VBE(sat) -940 -1040 mV IC = -3A, IB = -300mA (*) Base-emitter turn-on voltage VBE(on) -830 -930 mV IC = -3A, VCE = -2V (*) Static forward current transfer ratio hFE 100 200 300 75 150 IC = -1A, VCE = -2V (*) 30 60 IC = -3A, VCE = -2V (*) Transition frequency fT 250 Output capacitance COBO 17.6 Turn-on time t(on) Turn-off time t(off) IC = -10mA, VCE = -2V (*) MHz IC = -100mA, VCE = -5V f = 100MHz pF VCB = -10V, f = 1MHz (*) 26.5 ns 291 ns VCC = -10V. IC = -500mA, IB1 = IB2= -50mA. 30 NOTES: (*) Measured under pulsed conditions. Pulse width ⱕ300s; duty cycle ⱕ2%. Issue 3 - March 2008 © Zetex Semiconductors plc 2008 4 www.zetex.com ZXTP25060BFH Typical characteristics Issue 3 - March 2008 © Zetex Semiconductors plc 2008 5 www.zetex.com ZXTP25060BFH Package outline - SOT23 E e e1 b 3 leads L1 D E1 A A1 Dim. L c Millimeters Inches Dim. Millimeters Min. Max. Min. Max. A - 1.12 - 0.044 e1 A1 0.01 0.10 0.0004 0.004 E 2.10 2.64 0.083 0.104 b 0.30 0.50 0.012 0.020 E1 1.20 1.40 0.047 0.055 c 0.085 0.20 0.003 0.008 L 0.25 0.60 0.0098 0.0236 D 2.80 3.04 0.110 0.120 L1 0.45 0.62 0.018 0.024 - - - - - e 0.95 NOM Min. 0.037 NOM Max. Inches 1.90 NOM Min. Max. 0.075 NOM Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Issue 3 - March 2008 © Zetex Semiconductors plc 2008 6 www.zetex.com ZXTP25060BFH Intentionally left blank Issue 3 - March 2008 © Zetex Semiconductors plc 2008 7 www.zetex.com ZXTP25060BFH Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. 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Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production has been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. 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