SN54ACT374, SN74ACT374 OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS WITH 3-STATE OUTPUTS SCAS539F – OCTOBER 1995 – REVISED NOVEMBER 2002 SN54ACT374 . . . J OR W PACKAGE SN74ACT374 . . . DB, DW, N, NS, OR PW PACKAGE (TOP VIEW) 4.5-V to 5.5-V VCC Operation Inputs Accept Voltages to 5.5 V Max tpd of 10 ns at 5 V Inputs Are TTL-Voltage Compatible OE 1Q 1D 2D 2Q 3Q 3D 4D 4Q GND description/ordering information These 8-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. The devices are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. The eight flip-flops of the ’ACT374 devices are D-type edge-triggered flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 8Q 8D 7D 7Q 6Q 6D 5D 5Q CLK 1D 1Q OE VCC SN54ACT374 . . . FK PACKAGE (TOP VIEW) A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines in bus-organized systems without need for interface or pullup components. 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 8D 7D 7Q 6Q 6D 4Q GND CLK 5Q 5D 2D 2Q 3Q 3D 4D 8Q D D D D OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION PDIP – N –55°C to 125°C TOP-SIDE MARKING Tube SN74ACT374N Tube SN74ACT374DW Tape and reel SN74ACT374DWR SOP – NS Tape and reel SN74ACT374NSR ACT374 SSOP – DB Tape and reel SN74ACT374DBR AD374 TSSOP – PW Tape and reel SN74ACT374PWR AD374 CDIP – J Tube SNJ54ACT374J SNJ54ACT374J CFP – W Tube SNJ54ACT374W SNJ54ACT374W LCCC – FK Tube SNJ54ACT374FK SOIC – DW –40°C 40°C to 85°C ORDERABLE PART NUMBER PACKAGE† TA SN74ACT374N ACT374 SNJ54ACT374FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2002, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54ACT374, SN74ACT374 OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS WITH 3-STATE OUTPUTS SCAS539F – OCTOBER 1995 – REVISED NOVEMBER 2002 FUNCTION TABLE (each flip-flop) INPUTS OE CLK D OUTPUT Q L ↑ H H L ↑ L L L H or L X Q0 H X X Z logic diagram (positive logic) OE CLK 1 11 C1 1D 3 2 1Q 1D To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54ACT374, SN74ACT374 OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS WITH 3-STATE OUTPUTS SCAS539F – OCTOBER 1995 – REVISED NOVEMBER 2002 recommended operating conditions (see Note 3) SN54ACT374 MAX MIN MAX 4.5 5.5 4.5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO IOH Output voltage 0 High-level output current IOL ∆t/∆v Low-level output current High-level input voltage SN74ACT374 MIN 2 2 V V 0.8 Input transition rise or fall rate UNIT 0.8 V VCC VCC V –24 –24 mA 24 24 mA 8 8 ns/V VCC VCC 0 0 V TA Operating free-air temperature –55 125 –40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS 4.5 V IOH = –50 50 µA VOH IOH = –24 24 mA IOH = –50 mA† IOH = –75 mA† MIN TA = 25°C TYP MAX SN54ACT374 MIN MAX MIN 4.49 4.4 5.5 V 5.4 5.49 5.4 5.4 4.5 V 3.86 3.7 3.76 5.5 V 4.86 4.7 4.76 MAX UNIT 4.4 V 3.85 5.5 V IOL = 24 mA SN74ACT374 4.4 5.5 V IOL = 50 µA VOL VCC 3.85 4.5 V 0.1 0.1 5.5 V 0.1 0.1 0.1 0.1 4.5 V 0.36 0.44 0.44 5.5 V 0.36 0.5 0.44 V IOL = 50 mA† IOL = 75 mA† 5.5 V IOZ II VO = VCC or GND VI = VCC or GND 5.5 V ±0.25 ±5 ±2.5 µA 5.5 V ±0.1 ±1 ±1 µA ICC VI = VCC or GND, IO = 0 One input at 3.4 V, Other inputs at GND or VCC 5.5 V 4 80 40 µA 1.6 1.5 mA ∆ICC‡ 1.65 5.5 V 5.5 V 1.65 0.6 Ci VI = VCC or GND 5V 4.5 † Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms. ‡ This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 pF 3 SN54ACT374, SN74ACT374 OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS WITH 3-STATE OUTPUTS SCAS539F – OCTOBER 1995 – REVISED NOVEMBER 2002 timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) TA = 25°C MIN MAX SN54ACT374 MIN 100 MAX SN74ACT374 MIN 90 UNIT fclock tw Clock frequency Pulse duration, CLK high or low 5 5 5 ns tsu th Setup time, data before CLK↑ 5 5.5 5.5 ns 1.5 1.5 1.5 ns Hold time, data after CLK↑ 70 MAX MHz switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER fmax tPLH tPHL tPZH tPZL tPHZ tPLZ FROM (INPUT) TO (OUTPUT) CLK Q OE Q OE Q MIN TA = 25°C TYP MAX SN54ACT374 MIN MAX SN74ACT374 MIN 70 MAX 100 160 90 2 8.5 10 1.5 12 2 11.5 2 8 9.5 1.5 11.5 1.5 11 2 8 9.5 1.5 11.5 1.5 10.5 1.5 8 9 1.5 11.5 1.5 10.5 1.5 8.5 11.5 1.5 13 1 12.5 1.5 7 8.5 1.5 11 1 10 UNIT MHz ns ns ns operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd 4 TEST CONDITIONS Power dissipation capacitance CL = 50 pF, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 f = 1 MHz TYP 40 UNIT pF SN54ACT374, SN74ACT374 OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS WITH 3-STATE OUTPUTS SCAS539F – OCTOBER 1995 – REVISED NOVEMBER 2002 PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 500 Ω From Output Under Test CL = 50 pF (see Note A) Open 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC Open 3V 1.5 V Timing Input LOAD CIRCUIT 0V th tsu 3V 1.5 V Data Input tw 0V 3V 1.5 V Input 1.5 V VOLTAGE WAVEFORMS 1.5 V 0V VOLTAGE WAVEFORMS Output Control (low-level enabling) 3V 1.5 V 1.5 V 0V tPZL 3V Input 1.5 V 1.5 V 0V tPLH Output tPHL 50% VCC VOH 50% VCC VOL Output Waveform 1 S1 at 2 × VCC (see Note B) tPLZ ≈VCC 50% VCC tPZH Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS VOL + 0.3 V VOL tPHZ 50% VCC VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-87631012A ACTIVE LCCC FK 20 1 TBD 5962-8763101RA ACTIVE CDIP J 20 1 TBD Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type 5962-8763101SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type 5962-8763101VRA ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type 5962-8763101VSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type SN74ACT374DBLE OBSOLETE SSOP DB 20 Call TI Call TI SN74ACT374DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT374DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT374DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT374DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT374DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT374DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT374DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT374DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT374DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT374N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ACT374NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ACT374NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT374NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT374NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT374PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT374PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT374PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT374PWLE OBSOLETE TSSOP PW 20 SN74ACT374PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT374PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ACT374PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54ACT374FK ACTIVE LCCC FK 20 TBD TBD 1 Addendum-Page 1 TBD Call TI Call TI POST-PLATE N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 Orderable Device Status (1) Package Type SNJ54ACT374J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SNJ54ACT374W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 5-Aug-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74ACT374DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74ACT374DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74ACT374NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74ACT374PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Aug-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ACT374DBR SN74ACT374DWR SSOP DB 20 2000 346.0 346.0 33.0 SOIC DW 20 2000 346.0 346.0 41.0 SN74ACT374NSR SO NS 20 2000 346.0 346.0 41.0 SN74ACT374PWR TSSOP PW 20 2000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. 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