6N137 TOSHIBA Photocoupler GaAℓAs Ired & Photo IC 6N137 Degital Logic Isolation Tele-Communication Analog Data Equipment Control Unit in mm The TOSHIBA 6N137 consist of a high emitting diode and a one chip photo IC. This unit is 8-lead DIP package. • LSTTL / TTL compatible: 5V Supply • Ultra high speed: 10MBd • Guaranteed performance over temperature: 0°C to 70°C • High isolation voltage: 2500Vrms min. • UL recognized: UL1577, file no. E67349 Truth Table Input Enable Output H H L L H H H L H L L H IF VF TOSHIBA Weight: 0.54 g (typ.) Pin Configurations (top view) ICC IO 8 VCC V 6 O 2 11−10C4 1 8 2 3 7 6 4 5 3 7 IE 5 GND 1 : N.C. 2 : Anode 3 : Cathode 4 : N.C. 5 : GND 6 : Output(Open collector) 7 : Enable 8 : VCC VE 1 2007-10-01 6N137 Absolute Maximum Ratings Characteristic Symbol Rating Unit IF 20 mA IFP 40 mA VR 5 V Output current IO 50 mA Output voltage VO 7 V Supply voltage (1 minute maximum) VCC 7 V Enable input voltage (not to exceed VCC by more than 500mV) VEH 5.5 V LED Forward current Pulse forward current (Note 1) Detector Reverse voltage PO 85 mW Operating temperature range Output collector power dissipation Topr 0~70 °C Storage temperature range Tstg −55~125 °C Tsol 260 °C Lead solder temperature (10 s) (Note 2) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). (Note 1) 50% duty cycle, 1ms pulse width. (Note 2) Soldering portion of lead: Up to 2mm from the body of the device. Recommended Operating Conditions Characteristic Symbol Min. Max. Unit Input current, low level each channel IFL 0 250 μA Input current, high level each channel IFH 7 20 mA High level enable voltage VEH 2.0 VCC V Low level enable voltage (output high) VEL 0 0.8 V Supply voltage, output* VCC 4.5 5.5 V Fan out (TTL load) N ― 8 ― Operating temperature Ta 0 70 °C Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. *This item denotes operating ranges, not meaning of recommended operating conditions. Precaution Please be careful of the followings. A ceramic capacitor(0.1μF)should be connected from pin 8 to pin 5 to stabilize the operation of the high gain linear amplifier. Failure to provide the bypassing may impair the switching property. The total lead length between capacitor and coupler should not exceed 1cm. 2 2007-10-01 6N137 Electrical Characteristics Over Recommended Temperature (Ta = 0~70°C unless otherwise noted) Characteristic Symbol Test Condition Min. (**)Typ. Max. Unit High level output current IOH VCC=5.5V, VO=5.5V IF=250μA, VE = 2.0V ― 1 250 μA Low level output voltage VOL VCC=5.5V, IF=5mA VEH=2.0V IOL(sinking)=13mA ― 0.4 0.6 V High level enable current IEH VCC=5.5V, VE=2.0V ― −1.0 ― mA Low level enable current IEL VCC=5.5V, VE=0.5V ― −1.6 −2.0 mA High level supply current ICCH VCC=5.5V, IF=0, VE=0.5V ― 7 15 mA Low level supply current ICCL VCC=5.5V, IF=10mA VE=0.5V ― 12 18 mA (Note 3) RI−O VI−O=500V, Ta=25°C R.H.≤60% ― 10 ― Ω (Note 3) CI−O f=1MHz, Ta=25°C ― 0.6 ― pF VF IF=10mA, Ta=25°C ― 1.65 1.75 V Input reverse breakdown voltage BVR IR=10μA, Ta=25°C 5 ― ― V Input capacitance CIN VF=0, f=1MHz ― 45 ― pF Current transfer ratio CTR IF=5.0mA, RL=100Ω ― 1000 ― % Resistance (input−output) Capacitance (input−output) Input forward voltage 12 (**) All typical values are at VCC=5V, Ta=25°C (Note 3) Pins 1, 2, 3 and 4 shorted together and pins 5, 6, 7 and 8 shorted together. 3 2007-10-01 6N137 Switching Characteristics (Ta = 25°C, VCC = 5V) Symbol Test Circuit Propagation delay time to high output level tpLH 1 Propagation delay time to low output level tpHL Output rise−fall time (10−90%) Characteristic Min. Typ. Max. Unit RL=350Ω, CL=15pF IF=7.5mA ― 60 75 ns 1 RL=350Ω, CL=15pF IF=7.5mA ― 60 75 ns tr, tf ― RL=350Ω, CL=15pF IF=7.5mA ― 30 ― ns Propagation delay time of enable from VEH to VEL tELH 2 RL=350Ω, CL=15pF IF=7.5mA VEH=3.0V VEL=0.5V ― 25 ― ns Propagation delay time of enable from VEL to VEH tEHL 2 RL=350Ω, CL=15pF IF=7.5mA VEH=3.0V VEL=0.5V ― 25 ― ns 3 VCM=10V RL=350Ω VO(min.)=2V IF=0mA ― 200 ― V / μs 3 VCM=10V RL=350Ω VO(max.)=0.8V IF=5mA ― −500 ― V / μs Common mode transient immunity at logic high output level Common mode transient Immunity at logic low output level CMH CML Test Condition 4 2007-10-01 6N137 Test Circuit 1. 5V tpHL and tpLH Pulse generator ZO = 50Ω tr = 5ns Input 175mV(IF = 3.75mA) tpHL tpLH Output VO VOH 1.5V IF Monitoring Node VOL 1 VCC 8 2 7 3 6 GND 4 47Ω 350mV(IF = 7.5mA) 0.1μF RL Bypass Output CL 5 VO monitoring node ･ CL is approximately 15pF which includes probe and stray wiring capacitance. Test Circuit 2. tEHL and tELH Input VE Monitoring node Pulse generator ZO = 50Ω tr = 5ns 5V 1 3.0V Input VE 7.5mA dc IF 1.5V tEHL VOH tELH Output VO 1.5V VCC 8 0.1μF 2 7 3 6 4 GND Bypass CL 5 VOL RL VO Output monitoring node ･ CL is approximately 15pF which includes prove and stray wiring capacitance. Test Circuit 3. Transient immunity and typical waveforms 1 90% 10V 10% 90% 10% tr IF A 0V tf 7 3 6 4 VFF Switch at A : IF = 0mA GND 5V 0.1μF Bypass RL VO 5 Pulse gen. ZO = 50Ω. VO 8 2 B 5V VO VCC VCM VOL Switching at B : IF = 5mA 5 2007-10-01 6N137 ΔVF / ΔTa – IF IF – V F -2.6 Forward voltage temperature coefficient ΔVF /Δta (mV / °C ) Ta = 25°C 10 Forward current IF (mA) 100 1 0.1 0.01 1.0 1.2 1.6 1.4 Forward voltage VF -1.6 1 0.3 (mA) VCC = 5.5V 5 VO = 5.5V 3 High level output current IOH (μA) RL = 350Ω 1kΩ 4kΩ 2 1 0.5 0.3 0.1 1 3 2 5 4 IF 6 0 20 8 60 Ta 80 (°C) VO L – Ta IF = 5mA Low level output voltage VOL (V) RL = 350Ω RL = 4kΩ VO 6 VCC = 5.5V 0.5 VCC = 5V Ta = 70°C 4 40 Ambient temperature (mA) VO – IF (V) IF 30 VF = 1V 6 Forward current Output voltage 10 IOH - Ta Ta = 25°C 0°C 2 0 3 10 VO (V) -1.8 Forward current VCC = 5V Output voltage -2.0 (V) 8 0 0 -2.2 -1.4 0.1 1.8 VO – IF 4 -2.4 VE = 2V IOL = 16mA 0.4 12.8mA 9.6mA 6.4mA 0.3 0.2 0 1 2 Forward current 5 4 3 IF 6 0 (mA) 20 40 Ambient temperature 6 60 Ta 80 (°C) 2007-10-01 6N137 tpHL, tpLH - IF tpHL, tpLH - Ta 120 120 tpLH 100 80 tpLH 60 tpHL tpLH 1kΩ 350Ω 350Ω 1kΩ 40 4kΩ Ta = 25°C 20 Propagation delay time (ns) tpHL, tpLH Propagation delay time tpHL, tpLH (ns) 100 0 350Ω 1kΩ 350Ω 60 7 9 11 13 15 IF 17 4kΩ 40 VCC = 5V IF = 7.5mA 0 19 (mA) 10 20 VCC = 5V IF = 7.5mA (ns) 70 RL = 4kΩ tf Rise, fall time tr, tf 280 1kΩ tf 80 60 350Ω tf 40 tr 20 350Ω 1kΩ 4kΩ 10 20 30 40 Ambient temperature 50 40 Ta 60 70 (°C) tEHL,tELH - Ta 80 50 Ta 60 Enable propagation delay time tEHL, tELH (ns) 300 30 Ambient temperature tr, tf – Ta 320 1kΩ tpHL 0 5 tpLH 80 20 VCC = 5V Forward current 0 0 RL = 4kΩ tpLH RL = 4kΩ VCC = 5V VEH = 3V IF = 7.5mA tELH RL = 4kΩ tELH 1kΩ tELH 350Ω 60 50 40 30 350Ω 20 tEHL 70 1kΩ 10 (°C) 0 0 4kΩ 10 20 30 40 Ambient temperature 7 50 Ta 60 70 (°C) 2007-10-01 6N137 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS. • Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. 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Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 8 2007-10-01