TI 74ABT162823ADGGRE4

SCBS666B − JULY 1996 − REVISED JUNE 2004
D Members of the Texas Instruments
D
D
D
D
D
D
SN54ABT162823A . . . WD PACKAGE
SN74ABT162823A . . . DGG OR DL PACKAGE
(TOP VIEW)
Widebus  Family
Output Ports Have Equivalent 25-Ω Series
Resistors So No External Resistors Are
Required
Typical VOLP (Output Ground Bounce)
<1 V at VCC = 5 V, TA = 25°C
High-Impedance State During Power Up
and Power Down
Ioff and Power-Up 3-State Support Hot
Insertion
Distributed VCC and GND Pins Minimize
High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB
Layout
1CLR
1OE
1Q1
GND
1Q2
1Q3
VCC
1Q4
1Q5
1Q6
GND
1Q7
1Q8
1Q9
2Q1
2Q2
2Q3
GND
2Q4
2Q5
2Q6
VCC
2Q7
2Q8
GND
2Q9
2OE
2CLR
description/ordering information
These 18-bit bus-interface flip-flops feature
3-state outputs designed specifically for driving
highly capacitive or relatively low-impedance
loads. They are particularly suitable for
implementing wider buffer registers, I/O ports,
bidirectional bus drivers with parity, and working
registers.
The ’ABT162823A devices can be used as two
9-bit flip-flops or one 18-bit flip-flop. With the
clock-enable (CLKEN) input low, the D-type
flip-flops enter data on the low-to-high transitions
of the clock. Taking CLKEN high disables the
clock buffer, thus latching the outputs. Taking the
clear (CLR) input low causes the Q outputs to go
low independently of the clock.
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
1CLK
1CLKEN
1D1
GND
1D2
1D3
VCC
1D4
1D5
1D6
GND
1D7
1D8
1D9
2D1
2D2
2D3
GND
2D4
2D5
2D6
VCC
2D7
2D8
GND
2D9
2CLKEN
2CLK
ORDERING INFORMATION
TA
−40°C
−40
C to 85
85°C
C
−55°C to 125°C
ORDERABLE
PART NUMBER
PACKAGE†
Tube
SN74ABT162823ADL
Tape and reel
SN74ABT162823ADLR
TSSOP − DGG
Tape and reel
SN74ABT162823ADGGR
CFP − WD
Tube
SNJ54ABT162823AWD
SSOP − DL
TOP-SIDE
MARKING
ABT162823A
ABT162823A
SNJ54ABT162823AWD
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
Copyright  2004, Texas Instruments Incorporated
!"#$%&' #"'(' ')"*%("' #$**&' ( ") +$,-#("' !(&. *"!$# #"')"*% "
+&#)#("' +&* & &*% ") &/( '*$%&' ('!(*! 0(**('1.
*"!$#"' +*"#&'2 !"& '" '&#&(*-1 '#-$!& &'2 ") (-+(*(%&&*.
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1
SCBS666B − JULY 1996 − REVISED JUNE 2004
description/ordering information (continued)
A buffered output-enable (OE) input places the nine outputs in either a normal logic state (high or low level) or
a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines
significantly. The high-impedance state and increased drive provide the capability to drive bus lines without
interface or pullup components. OE does not affect the internal operation of the flip-flops. Old data can be
retained or new data can be entered while the outputs are in the high-impedance state.
The outputs, which are designed to source or sink up to 12 mA, include equivalent 25-Ω series resistors to
reduce overshoot and undershoot.
These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the devices when they are powered down.
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
To ensure the high-impedance state during power up or power down, OE shall be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
FUNCTION TABLE
(each 9-bit flip-flop)
INPUTS
2
OE
CLR
CLKEN
CLK
D
OUTPUT
Q
L
L
X
X
X
L
L
H
L
↑
H
H
L
H
L
↑
L
L
L
H
L
L
X
Q0
L
H
H
X
X
Q0
H
X
X
X
X
Z
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SCBS666B − JULY 1996 − REVISED JUNE 2004
logic diagram (positive logic)
1OE
1CLR
1CLKEN
2
1
55
CE
R
56
C1
1CLK
1D1
54
3
1Q1
1D
To Eight Other Channels
2OE
2CLR
2CLKEN
27
28
30
CE
R
29
C1
2CLK
2D1
42
15
2Q1
1D
To Eight Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . −0.5 V to 5.5 V
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −18 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
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3
SCBS666B − JULY 1996 − REVISED JUNE 2004
recommended operating conditions (see Note 3)
SN54ABT162823A
MIN
MAX
MIN
MAX
4.5
5.5
4.5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
IOH
IOL
High-level output current
∆t/∆v
Input transition rise or fall rate
∆t/∆VCC
TA
Input transition rise or fall rate
200
Operating free-air temperature
−55
High-level input voltage
SN74ABT162823A
2
2
0.8
Input voltage
0
Low-level output current
Outputs enabled
VCC
−3
V
V
0.8
0
UNIT
VCC
−12
V
V
mA
8
12
mA
10
10
ns/V
µs/V
200
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.5 V,
II = −18 mA
IOH = −1 mA
VCC = 5 V,
IOH = −1 mA
IOH = −3 mA
VCC = 4.5 V
IOH = −12 mA
IOL = 8 mA
VOL
VCC = 4.5 V
II
VCC = 5.5 V,
VCC = 0 to 2.1 V,
VO = 0.5 V to 2.7 V, OE = X
IOZPU
VCC = 2.1 V to 0,
VO = 0.5 V to 2.7 V, OE = X
IOZH‡
IOZL‡
VCC = 5.5 V,
VCC = 5.5 V,
VO = 2.7 V
VO = 0.5 V
Ioff
VCC = 0,
VCC = 5.5 V,
VO = 5.5 V
VI or VO ≤ 4.5 V
VCC = 5.5 V,
VO = 2.5 V
Outputs high
IO§
ICC
VCC = 5.5 V,
IO = 0,
VI = VCC or GND
TA = 25°C
TYP†
MAX
SN54ABT162823A
MIN
−1.2
MAX
SN74ABT162823A
MIN
−1.2
2.5
2.5
3
3
3
2.4
2.4
2.4
2*
0.8
0.8
±1
±1
µA
±50
±50
±50
µA
±50
±50
±50
µA
10
10
10
µA
−10
−10
−10
µA
±100
µA
50
µA
−100
mA
±100
50
−55
−100
0.5
50
−25
−100
−25
0.5
0.5
80
80
80
Outputs disabled
0.5
0.5
0.5
1.5
1.5
1.5
Ci
VI = 2.5 V or 0.5 V
VO = 2.5 V or 0.5 V
3.5
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+&#)#("' (*& !&2' 2"(-. &/( '*$%&' *&&*4& & *2 "
#('2& "* !#"''$& && +*"!$# 0"$ '"#&.
POST OFFICE BOX 655303
V
±1
Co
9
* On products compliant to MIL-PRF-38535, this parameter does not apply.
† All typical values are at VCC = 5 V.
‡ The parameters IOZH and IOZL include the input leakage current.
§ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
¶ This is the increase in supply current for each input that is at the specified TTL-voltage level, rather than VCC or GND.
4
V
Outputs low
VCC = 5.5 V, One input at 3.4 V,
Other inputs at VCC or GND
V
0.65
0.8*
Outputs high
∆ICC¶
UNIT
2
0.4
−25
MAX
−1.2
2.5
IOL = 12 mA
VI = VCC or GND
IOZPD
ICEX
MIN
• DALLAS, TEXAS 75265
mA
mA
pF
pF
SCBS666B − JULY 1996 − REVISED JUNE 2004
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
VCC = 5 V,
TA = 25°C
MIN
fclock
Clock frequency
tw
Pulse duration
tsu
th
SN54ABT162823A
MAX
MIN
150
Hold time after CLK↑
MIN
150
CLR low
3.3
3.3
3.3
3.3
3.3
3.3
CLR inactive
1.6
2
1.6
2
2
2
CLKEN low
2.8
2.8
2.8
Data
1.2
1.2
1.2
CLKEN low
0.6
0.6
0.6
UNIT
MAX
150
CLK high or low
Data
Setup time before CLK↑
MAX
SN74ABT162823A
MHz
ns
ns
ns
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
PARAMETER
fmax
tPLH
tPHL
tPHL
FROM
(INPUT)
TO
(OUTPUT)
VCC = 5 V,
TA = 25°C
MIN
TYP
SN54ABT162823A
MAX
150
CLK
Q
CLR
Q
tPZH
tPZL
OE
Q
tPHZ
tPLZ
OE
Q
MIN
MAX
150
SN74ABT162823A
MIN
UNIT
MAX
150
MHz
2.3
4.6
6.2
2.3
8.4
2.3
7.5
2.8
4.6
6.1
2.8
7.1
2.8
6.7
2.8
5
6.3
2.8
7.2
2.8
7
1.7
3.8
5
1.7
5.8
1.7
5.9
3
5
6.1
3
7.2
3
7
2.6
4.8
6.1
2.6
7.3
2.6
6.6
1.9
4.6
6.7
1.9
10.2
1.9
9
ns
ns
ns
ns
!"#$%&' #"'(' ')"*%("' #$**&' ( ") +$,-#("' !(&. *"!$# #"')"*% "
+&#)#("' +&* & &*% ") &/( '*$%&' ('!(*! 0(**('1.
*"!$#"' +*"#&'2 !"& '" '&#&(*-1 '#-$!& &'2 ") (-+(*(%&&*.
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5
SCBS666B − JULY 1996 − REVISED JUNE 2004
PARAMETER MEASUREMENT INFORMATION
500 Ω
From Output
Under Test
S1
7V
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
3V
LOAD CIRCUIT
Timing Input
1.5 V
0V
tw
tsu
3V
th
3V
Input
1.5 V
1.5 V
0V
Data Input
1.5 V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
3V
1.5 V
Input
1.5 V
0V
VOH
1.5 V
Output
1.5 V
VOL
VOH
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
1.5 V
0V
tPZL
tPLZ
Output
Waveform 1
S1 at 7 V
(see Note B)
tPLH
tPHL
Output
3V
Output
Control
tPHL
tPLH
1.5 V
Output
Waveform 2
S1 at Open
(see Note B)
1.5 V
3.5 V
VOL + 0.3 V
VOL
tPHZ
tPZH
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
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PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74ABT162823ADGGRE4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ABT162823ADLRG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT162823ADGGR
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT162823ADL
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT162823ADLG4
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT162823ADLR
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
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MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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