SN74AVC16244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES141N – JULY 1998 – REVISED MARCH 2005 • FEATURES • • • • Member of the Texas Instruments Widebus™ Family DOC™ (Dynamic Output Control) Circuit Dynamically Changes Output Impedance, Resulting in Noise Reduction Without Speed Degradation Less Than 2-ns Maximum Propagation Delay at 2.5-V and 3.3-V VCC Dynamic Drive Capability Is Equivalent to Standard Outputs With IOH and IOL of ±24 mA at 2.5-V VCC Overvoltage-Tolerant Inputs/Outputs Allow Mixed-Voltage-Mode Data Communications Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) • • • DESCRIPTION/ORDERING INFORMATION A Dynamic Output Control (DOC) circuit is implemented, which, during the transition, initially lowers the output impedance to effectively drive the load and, subsequently, raises the impedance to reduce noise. Figure 1 shows typical VOL vs IOL and VOH vs IOH curves to illustrate the output impedance and drive capability of the circuit. At the beginning of the signal transition, the DOC circuit provides a maximum dynamic drive that is equivalent to a high-drive standard-output device. For more information, refer to the TI application reports, AVC Logic Family Technology and Applications, literature number SCEA006, and Dynamic Output Control (DOC™) Circuitry Technology and Applications, literature number SCEA009. 3.2 TA = 25°C Process = Nominal - Output Voltage - V 2.8 2.4 VCC = 3.3 V 2.0 1.6 VCC = 2.5 V 1.2 OH VCC = 1.8 V 0.8 V VOL - Output Voltage - V 2.8 TA = 25°C Process = Nominal 2.4 2.0 1.6 1.2 0.8 VCC = 3.3 V 0.4 0.4 0 17 34 51 68 85 102 119 IOL - Output Current - mA 136 153 170 VCC = 2.5 V VCC = 1.8 V -160 -144 -128 -112 -96 -80 -64 -48 IOH - Output Current - mA -32 -16 0 Figure 1. Output Voltage vs Output Current ORDERING INFORMATION PACKAGE (1) TA –40°C to 85°C TOP-SIDE MARKING TSSOP – DGG Tape and reel SN74AVC16244DGGR AVC16244 TVSOP – DGV Tape and reel SN74AVC16244DGVR CVA244 VFBGA – GQL VFBGA – ZQL (Pb-free) (1) ORDERABLE PART NUMBER Tape and reel SN74AVC16244GQLR SN74AVC16244ZQLR CVA244 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus, DOC are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1998–2005, Texas Instruments Incorporated SN74AVC16244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES141N – JULY 1998 – REVISED MARCH 2005 DESCRIPTION/ORDERING INFORMATION (CONTINUED) This 16-bit buffer/driver is operational at 1.2-V to 3.6-V VCC, but is designed specifically for 1.65-V to 3.6-V VCC operation. The SN74AVC16244 is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. It provides true outputs and symmetrical active-low output-enable (OE) inputs. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. DGG OR DGV PACKAGE (TOP VIEW) 1OE 1Y1 1Y2 GND 1Y3 1Y4 VCC 2Y1 2Y2 GND 2Y3 2Y4 3Y1 3Y2 GND 3Y3 3Y4 VCC 4Y1 4Y2 GND 4Y3 4Y4 4OE 2 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 2OE 1A1 1A2 GND 1A3 1A4 VCC 2A1 2A2 GND 2A3 2A4 3A1 3A2 GND 3A3 3A4 VCC 4A1 4A2 GND 4A3 4A4 3OE SN74AVC16244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES141N – JULY 1998 – REVISED MARCH 2005 GQL OR ZQL PACKAGE (TOP VIEW) 1 2 3 4 5 6 A B C D E F G H J K TERMINAL ASSIGNMENTS (1) 1 (1) 2 3 4 5 6 A 1OE NC NC NC NC 2OE B 1Y2 1Y1 GND GND 1A1 1A2 C 1Y4 1Y3 VCC VCC 1A3 1A4 D 2Y2 2Y1 GND GND 2A1 2A2 E 2Y4 2Y3 2A3 2A4 F 3Y1 3Y2 3A2 3A1 G 3Y3 3Y4 GND GND 3A4 3A3 H 4Y1 4Y2 VCC VCC 4A2 4A1 J 4Y3 4Y4 GND GND 4A4 4A3 K 4OE NC NC NC NC 3OE NC - No internal connection FUNCTION TABLE (EACH 4-BIT BUFFER) INPUTS OE A OUTPUT Y L L L L H H H X Z 3 SN74AVC16244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES141N – JULY 1998 – REVISED MARCH 2005 LOGIC DIAGRAM (POSITIVE LOGIC) 1OE 1A1 1A2 1A3 1A4 2OE 2A1 2A2 2A3 2A4 1 3OE 47 2 46 3 44 5 43 6 1Y1 3A1 1Y2 3A2 1Y3 3A3 1Y4 3A4 48 4OE 41 8 40 9 38 11 37 12 2Y1 4A1 2Y2 4A2 2Y3 4A3 2Y4 4A4 25 36 13 35 14 33 16 32 17 3Y1 3Y2 3Y3 3Y4 24 30 19 29 20 27 22 26 23 4Y1 4Y2 4Y3 4Y4 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VCC MIN MAX Supply voltage range –0.5 4.6 UNIT V range (2) VI Input voltage –0.5 4.6 V VO Voltage range applied to any output in the high-impedance or power-off state (2) –0.5 4.6 V VO Voltage range applied to any output in the high or low state (2) (3) –0.5 VCC + 0.5 V IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through each VCC or GND θJA Tstg (1) (2) (3) (4) 4 Package thermal impedance (4) Storage temperature range DGG package 70 DGV package 58 GQL/ZQL package 42 –65 150 °C/W °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The output positive-voltage rating may be exceeded up to 4.6 V maximum if the output current rating is observed. The package thermal impedance is calculated in accordance with JESD 51. SN74AVC16244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com Recommended Operating Conditions VCC Supply voltage SCES141N – JULY 1998 – REVISED MARCH 2005 (1) MIN MAX Operating 1.4 3.6 Data retention only 1.2 VCC = 1.2 V VIH High-level input voltage 0.65 × VCC VCC = 1.65 V to 1.95 V 0.65 × VCC VCC = 3 V to 3.6 V Low-level input voltage 2 GND VCC = 1.4 V to 1.6 V 0.35 × VCC VCC = 1.65 V to 1.95 V 0.35 × VCC VCC = 2.3 V to 2.7 V Input voltage VO Output voltage IOHS Static high-level output current (2) 0.8 0 3.6 Active state 0 VCC 3-state 0 3.6 VCC = 1.4 V to 1.6 V –2 VCC = 1.65 V to 1.95 V –4 VCC = 2.3 V to 2.7 V –8 VCC = 3 V to 3.6 V Static low-level output current (2) IOLS Input transition rise or fall rate TA Operating free-air temperature (1) (2) V V mA –12 VCC = 1.4 V to 1.6 V 2 VCC = 1.65 V to 1.95 V 4 VCC = 2.3 V to 2.7 V 8 VCC = 3 V to 3.6 V ∆t/∆v V 0.7 VCC = 3 V to 3.6 V VI V 1.7 VCC = 1.2 V VIL V VCC VCC = 1.4 V to 1.6 V VCC = 2.3 V to 2.7 V UNIT mA 12 VCC = 1.4 V to 3.6 V –40 5 ns/V 85 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Dynamic drive capability is equivalent to standard outputs with IOH and IOL of ±24 mA at 2.5-V VCC. See Figure 1 for VOL vs IOL and VOH vs IOH characteristics. Refer to the TI application reports, AVC Logic Family Technology and Applications, literature number SCEA006, and Dynamic Output Control (DOC™) Circuitry Technology and Applications, literature number SCEA009. 5 SN74AVC16244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES141N – JULY 1998 – REVISED MARCH 2005 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOHS = –100 µA VOH 1.4 V to 3.6 V MAX UNIT VCC – 0.2 IOHS = –2 mA, VIH = 0.91 V 1.4 V IOHS = –4 mA, VIH = 1.07 V 1.65 V 1.2 IOHS = –8 mA, VIH = 1.7 V 2.3 V 1.75 IOHS = –12 mA, VIH = 2 V 3V 2.3 IOLS = 100 µA VOL MIN TYP (1) VCC 1.05 V 1.4 V to 3.6 V 0.2 IOLS = 2 mA, VIL = 0.49 V 1.4 V 0.4 IOLS = 4 mA, VIL = 0.57 V 1.65 V 0.45 IOLS = 8 mA, VIL = 0.7 V 2.3 V 0.55 IOLS = 12 mA, VIL = 0.8 V 3V 0.7 V II VI = VCC or GND 3.6 V ±2.5 µA Ioff VI or VO = 3.6 V 0 ±10 µA IOZ VO = VCC or GND 3.6 V ±10 µA ICC VI = VCC or GND, 3.6 V 40 µA Control inputs IO = 0 VI = VCC or GND Ci Co (1) Data inputs VI = VCC or GND Outputs VO = VCC or GND 2.5 V 3.5 3.3 V 3.5 2.5 V 6 3.3 V 6 2.5 V 6.5 3.3 V 6.5 pF pF Typical values are measured at TA = 25°C. Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2) VCC = 1.5 V ± 0.1 V VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V FROM (INPUT) TO (OUTPUT) VCC = 1.2 V TYP MIN MAX MIN MAX MIN MAX MIN MAX tpd A Y 3.1 0.6 3.3 0.7 2.9 0.6 1.9 0.5 1.7 ns ten OE Y 7.6 1.4 8 1.3 6.8 0.9 4 0.7 3.5 ns tdis OE Y 7.2 1.7 7.3 1.6 6.2 1 4.3 1 3.5 ns PARAMETER UNIT Operating Characteristics TA = 25°C PARAMETER Cpd 6 Power dissipation capacitance TEST CONDITIONS Outputs enabled Outputs disabled CL = 0, f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP 23 27 33 0.1 0.1 0.1 UNIT pF SN74AVC16244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES141N – JULY 1998 – REVISED MARCH 2005 PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 RL From Output Under Test Open GND CL (see Note A) TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND RL LOAD CIRCUIT VCC CL RL V∆ 1.2 V 1.5 V ± 0.1 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 15 pF 15 pF 30 pF 30 pF 30 pF 2 kΩ 2 kΩ 1 kΩ 500 Ω 500 Ω 0.1 V 0.1 V 0.15 V 0.15 V 0.3 V VCC Timing Input VCC/2 0V tw tsu th VCC VCC/2 Input VCC/2 VCC VCC/2 VCC/2 Data Input 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION VCC VCC/2 Input VCC/2 0V tPHL tPLH VOH VCC/2 Output VCC/2 VOL tPHL VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VCC/2 VCC/2 0V tPZL tPLZ VCC/2 tPZH VOH Output Output Waveform 1 S1 at 2 × VCC (see Note B) tPLH VCC/2 VCC Output Control Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VCC/2 VOH - V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 2. Load Circuit and Voltage Waveforms 7 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74AVC16244DGGRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74AVC16244DGVRE4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AVC16244DGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AVC16244DGVR ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AVC16244GQLR ACTIVE BGA MI CROSTA R JUNI OR GQL 56 1000 SNPB Level-1-240C-UNLIM SN74AVC16244ZQLR ACTIVE BGA MI CROSTA R JUNI OR ZQL 56 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM TBD Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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