FEATURES AND SPECIFICATIONS Molex offers the new PCI Express* revision 2 specs connectors in a through hole configuration for high-bandwidth workstation and server applications PCI Express is a third generation I/O architecture. PCI-SIG* recently revised the PCI Express specifications from version 1.1 to version 2.0. This revision doubles the PCI Express interconnect bit rate from 2.5 GT/s (gigatransfer per second) to 5 GT/s per lane. Unlike the previous version in which the PCI bus was implemented via multi-drop parallel architecture, the PCI Express incorporates a point-to-point signaling using differential pairs. A 16-lane link now could provide approximately 16Gbps of data-transfer. With this increase in signaling speed, the PCI Express now provides better support to high-bandwidth applications. It is also backward compatible with current PCI Express 1.1 version products. 1.00mm (.039”) Pitch PCI Express* connector 87715 Vertical, Through Hole Molex’s through hole connector version of the PCI Express version 2.0 specs provides customers design flexibility for a narrower interconnect links. This would improve data-transfer at a lower cost. All Molex PCI Express connectors are compliant with PCI-SIG* specifications. For more information on these specifications please see www.pcisig.com *PCI Express, ExpressModule, and PCI-SIG are trademarks of PCI-SIG Features Benefits • High-temperature thermoplastic housing • Withstands lead-free processing • Complies with PCI-SIG industry specifications • Allows connectors to support all PCI Express module cards available in the market. • Keying design allows only one mating orientation • Ensures correct mating of card module to edge card connector • Hot Plugging • Allows for insertion and removal of card without system shut down, facilitates connection in cramped spaces SPECIFICATIONS Reference Information Packaging: Tray UL File No.: TBD CSA File No.: TBD Mates With: PCI Express Card Designed In: mm Electrical Voltage: 50 Volts AC (RMS)/DC Current: 1.1A Contact Resistance: 30 milliohms max Dielectric Withstanding Voltage: 500V AC Insulation Resistance: 1000 Megohms min Mechanical Max Terminal Retention Force: 5 N min/Terminal Mating Force: 1.15 N max/contact pair Unmating Force: 0.15 N min/contact pair Durability: 50 Cycles Physical Housing: High Temperature Nylon, UL 94V-0 Contact: Copper Alloy Plating: Contact Area —0.76 µm Gold or 0.38 µm Gold Solder Tail Area — Tin Underplating — Nickel Operating Temperature: - 55 ºC to +85 ºC 1.00mm (.039”) Pitch PCI Express* connector Markets and Applications • PCI Express 87715 - Servers - Desktop - Networking and Communications 87715 Vertical, Through Hole II/O Legacy Riser PCI Express Add-in Card PCI Express Connector PCI Express Riser I/O Server Board Ordering Information Descriptions PCI Express connector, version 2, Vertical, Through hole Black color PC Tail Order No. (Lead-free) Plating 87715-9X00 Gold Flash 87715-9X01 0.254µm (10µ”) Gold (Au) 87715-9X02 0.38µm (15µ”) Gold (Au) 87715-9X03 Gold Flash 87715-9X04 0.254µm (10µ”) Gold (Au) 87715-9X05 0.38µm (15µ”) Gold (Au) 87715-9X06 0.76µm (30µ") Gold (Au) 87715-9X07 Gold Flash 87715-9X08 0.38µm (15µ”) Gold (Au) 87715-9X09 0.76µm (30µ") Gold (Au) 2.54mm (0.100”) 3.00mm (0.118”) 2.54mm (0.100”) 2.30mm (0.091”) Circuit size Americas Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 1-800-78MOLEX [email protected] Replace X with: 3.00mm (0.118”) 0= 36 1= 64 2 = 98 3= 164 Asia Pacific North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 [email protected] Asia Pacific South Headquarters Jurong, Singapore 65-6-268-6868 [email protected] European Headquarters Munich, Germany 49-89-413092-0 [email protected] Corporate Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 630-969-4550 Visit our Web site at http://molex.com Order No. 9876501962 ©2008, Molex