MOLEX 75791-0001

0.75mm (.030”) Pitch
AMC.0 B+
170-Circuit Connectors
FEATURES AND SPECIFICATIONS
AMC.0 B+ connectors from Molex support the next generation of mezzanine card standards and
12.5 Gbps speeds
The 170-circuit AMC.0 B+, or AdvancedMCTM
connectors from Molex support the next generation of
mezzanine card standards that allow for hot-plugging
of high-speed serial interconnects. These connectors
support AdvancedTCA (Advanced Telecommunications
Computing Architecture), a standard developed by
PICMG (PCI Industrial Computer Manufacturers Group).
Molex AMC.0 B+ connectors feature controlled
impedance and reduced crosstalk, plus a footprint
launch optimized for high-speed data rates. This design
enables the connector to achieve 12.5 Gbps NRZ (Non
Return to Zero) signal transmission. This enhanced
footprint further reduces crosstalk by managing
inter-pair affinity and incorporating additional ground
vias for isolation. As a result, the AMC.0 B+ connectors
achieve crosstalk of less than 3 percent at 12.5 Gbps.
75800 Standard
75908 Pegless
75791 Extended Height
Three versions of the Molex AMC.0 B+ connector
exist: the standard connector with locating pegs (series
75800), connector without pegs (series 75908) and
the 1.15mm (.045”) extended-height connector (series
75791). This taller height is optimized for blade-server
applications where cooling is critical.
Series 75800 Standard AMC.0 B+ Connector
Features and Benefits
n Insert-molded wafer design provides excellent
electrical performance
n Press-fit contacts and high-speed footprint for
simpler application to PCB and superior signal
integrity than competition
n T in or Tin-Lead tail plating supports RoHS
requirements and customer preferences for
press-fit
n M
eets PICMG Advanced MCTM specification and
industry standard requirements
SPECIFICATIONS
Reference Information
Packaging: Tray
UL File No.: E29179
CSA File No.: LR19980
Mates With: AMC module
Designed In: Millimeters
Electrical
Voltage: 250V AC
Current: 1.5A Power Terminal
1.0A Other Terminals
Contact Resistance: 60 milliohms max.
Dielectric Withstanding Voltage: 80V RMS
Insulation Resistance: 500V DC
Mechanical
Insertion Force to PCB: 6050N (1360 lbf) max.
Mating Force: 100N (22 lbf) max.
Unmating Force: 65N (14 lbf) max.
Durability: 200 cycles
Physical
Housing: Black Thermoplastic
Contact: Copper (Cu) Alloy
Plating:
Contact Area — 0.76μm Gold (Au)
Solder Tail Area — Tin or Tin-Lead (Sn or Sn/Pb)
Underplating — Nickel (Ni)
PCB Thickness: 2.36mm (.092”)
Operating Temperature: -40 to +105ºC
0.75mm (.030”) Pitch
AMC.0 B+
170-Circuit Connectors
applications
75800 Standard
75908 Pegless
75791 Extended Height
n Telecommunications equipment
n For use in the IEEE 1386 market as it transitions to
serial buses
n General “blade” computing applications
n Extended-height version used in non-ATCA
applications
n Any hot-pluggable high-speed serial bus application
ATCA Carrier
ATCA Rack
ORDERING INFORMATION
Order No.
Comment
Tail Plating
Height
PCB Peg
75800-0001
With alignment pegs
Tin plated
21.85mm (.860”)
Yes
75800-0002
With alignment pegs
Tin/Lead plated
21.85mm (.860”)
Yes
75908-0001
Without alignment pegs
Tin plated
21.85mm (.860”)
No
75908-0002
Without alignment pegs
Tin/Lead plated
21.85mm (.860”)
No
75791-0001
Extended height
Tin plated
23.0mm (.905”)
Yes
75791-0002
Extended height
Tin/Lead plated
23.0mm (.905”)
Yes
Americas Headquarters
Lisle, Illinois 60532 U.S.A.
1-800-78MOLEX
[email protected]
Order No. 987650-0651
Asia Pacific North Headquarters
Yamato, Kanagawa, Japan
81-462-65-2324
[email protected]
Asia Pacific South Headquarters
Jurong, Singapore
65-6268-6868
[email protected]
Visit our website at www.molex.com
Printed in USA/JI/2007.01
European Headquarters
Munich, Germany
49-89-413092-0
[email protected]
Corporate Headquarters
2222 Wellington Ct.
Lisle, IL 60532 U.S.A.
630-969-4550 Fax:630-969-1352
©2007, Molex