3.5x2.8 mm SMD CHIP LED LAMP PRELIMINARY SPEC Part Number: AA3529SES/L Features Description z SINGLE The Red-orange device is made with TS AlInGaP light COLOR. z SUITABLE RED-ORANGE FOR ALL SMT ASSEMBLY AND SOLDER emitting diode. PROCESS. z AVAILABLE z IDEAL z WHITE z LOW ON TAPE AND REEL. FOR BACKLIGHTING. SMD PACKAGE, SILICONE RESIN. THERMAL RESISTANCE. z PACKAGE: 1500PCS / REEL. z MOISTURE SENSITIVITY LEVEL : LEVEL 2a. z RoHS COMPLIANT. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Specifications are subject to change without notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAH3956 REV NO: V.4 DATE: JAN/14/2008 PAGE: 1 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.CHEN ERP: 1201002739 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might leads to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Outside impact may scratch the silicone lens or damage the internal circuitry. 4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. 5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. SPEC NO: DSAH3956 REV NO: V.4 DATE: JAN/14/2008 PAGE: 2 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.CHEN ERP: 1201002739 Selection Guide Dice Part No. AA3529SES/L Lens Type RED-ORANGE (AlInGaP) WATER CLEAR Iv (mcd) [2] @ 150mA Φv (mlm) [2] @ 150mA Viewing Angle [1] Min. Typ. Min. Typ. 2θ1/2 3800 6000 2500 4000 120° Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. 2. Luminous intensity / luminous flux: +/-15%. Electrical / Optical Characteristics at TA=25°C Symbol Parameter Device λpeak Peak Wavelength Red-orange λD [1] Dominant Wavelength Δλ1/2 Typ. Max. Units Test Conditions 626 nm IF=150mA Red-orange 618 nm IF=150mA Spectral Line Half-width Red-orange 20 nm IF=150mA C Capacitance Red-orange 25 pF VF=0V;f=1MHz VF [2] Forward Voltage Red-orange 2.9 3.5 V IF=150mA IR Reverse Current Red-orange 10 uA VR = 5V Notes: 1.Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V. Absolute Maximum Ratings at TA=25°C Parameter Red-orange Units Power dissipation 525 mW DC Forward Current 150 mA Peak Forward Current [1] 350 mA Reverse Voltage 5 V Operating / Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAH3956 REV NO: V.4 DATE: JAN/14/2008 PAGE: 3 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.CHEN ERP: 1201002739 Red-orange AA3529SES/L SPEC NO: DSAH3956 REV NO: V.4 DATE: JAN/14/2008 PAGE: 4 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.CHEN ERP: 1201002739 AA3529SES/L Recommended Soldering Pattern (Units : mm; Tolerance: ±0.1) Tape Specifications (Units : mm) SPEC NO: DSAH3956 REV NO: V.4 DATE: JAN/14/2008 PAGE: 5 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.CHEN ERP: 1201002739 PACKING & LABEL SPECIFICATIONS AA3529SES/L SPEC NO: DSAH3956 REV NO: V.4 DATE: JAN/14/2008 PAGE: 6 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.CHEN ERP: 1201002739