Features • Fast Read Access Time – 120 ns • Automatic Page Write Operation • • • • • • • • • • – Internal Address and Data Latches for 128 Bytes – Internal Control Timer Fast Write Cycle Time – Page Write Cycle Time – 10 ms Maximum – 1 to 128-byte Page Write Operation Low Power Dissipation – 40 mA Active Current – 200 µA CMOS Standby Current Hardware and Software Data Protection DATA Polling for End of Write Detection High Reliability CMOS Technology – Endurance: 104 or 105 Cycles – Data Retention: 10 Years Single 5V ± 10% Supply CMOS and TTL Compatible Inputs and Outputs JEDEC Approved Byte-wide Pinout Industrial Temperature Ranges Green (Pb/Halide-free) Packaging Option 1-megabit (128K x 8) Paged Parallel EEPROM AT28C010 1. Description The AT28C010 is a high-performance electrically-erasable and programmable readonly memory. Its 1 megabit of memory is organized as 131,072 words by 8 bits. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the device offers access times to 120 ns with power dissipation of just 220 mW. When the device is deselected, the CMOS standby current is less than 200 µA. The AT28C010 is accessed like a Static RAM for the read or write cycle without the need for external components. The device contains a 128-byte page register to allow writing of up to 128 bytes simultaneously. During a write cycle, the address and 1 to 128 bytes of data are internally latched, freeing the address and data bus for other operations. Following the initiation of a write cycle, the device will automatically write the latched data using an internal control timer. The end of a write cycle can be detected by DATA polling of I/O7. Once the end of a write cycle has been detected a new access for a read or write can begin. Atmel’s AT28C010 has additional features to ensure high quality and manufacturability. The device utilizes internal error correction for extended endurance and improved data retention characteristics. An optional software data protection mechanism is available to guard against inadvertent writes. The device also includes an extra 128 bytes of EEPROM for device identification or tracking. 0353G–PEEPR–10/06 AT28C010 2. Pin Configurations CE Chip Enable OE Output Enable WE Write Enable I/O0 - I/O7 Data Inputs/Outputs NC No Connect DC Don’t Connect 2.1 32-lead TSOP Top View A11 A9 A8 A13 A14 NC WE VCC NC A16 A15 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 NC A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 GND 2.3 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC WE NC A14 A13 A8 A9 A11 OE A10 CE I/O7 I/O6 I/O5 I/O4 I/O3 32-lead PLCC Top View A12 A15 A16 DC VCC WE NC Addresses OE A10 CE I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 A0 A1 A2 A3 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 4 3 2 1 32 31 30 A0 - A16 5 6 7 8 9 10 11 12 13 29 28 27 26 25 24 23 22 21 14 15 16 17 18 19 20 Function 32-lead PDIP Top View A14 A13 A8 A9 A11 OE A10 CE I/O7 I/O1 I/O2 GND I/O3 I/O4 I/O5 I/O6 Pin Name 2.2 Note: PLCC package pin 1 is Don’t Connect. 2 0353G–PEEPR–10/06 AT28C010 3. Block Diagram 4. Device Operation 4.1 Read The AT28C010 is accessed like a Static RAM. When CE and OE are low and WE is high, the data stored at the memory location determined by the address pins is asserted on the outputs. The outputs are put in the high impedance state when either CE or OE is high. This dual-line control gives designers flexibility in preventing bus contention in their system. 4.2 Byte Write A low pulse on the WE or CE input with CE or WE low (respectively) and OE high initiates a write cycle. The address is latched on the falling edge of CE or WE, whichever occurs last. The data is latched by the first rising edge of CE or WE. Once a byte write has been started it will automatically time itself to completion. Once a programming operation has been initiated and for the duration of tWC, a read operation will effectively be a polling operation. 4.3 Page Write The page write operation of the AT28C010 allows 1 to 128 bytes of data to be written into the device during a single internal programming period. A page write operation is initiated in the same manner as a byte write; the first byte written can then be followed by 1 to 127 additional bytes. Each successive byte must be written within 150 µs (tBLC) of the previous byte. If the tBLC limit is exceeded the AT28C010 will cease accepting data and commence the internal programming operation. All bytes during a page write operation must reside on the same page as defined by the state of the A7 - A16 inputs. For each WE high to low transition during the page write operation, A7 - A16 must be the same. The A0 to A6 inputs are used to specify which bytes within the page are to be written. The bytes may be loaded in any order and may be altered within the same load period. Only bytes which are specified for writing will be written; unnecessary cycling of other bytes within the page does not occur. 4.4 DATA Polling The AT28C010 features DATA Polling to indicate the end of a write cycle. During a byte or page write cycle an attempted read of the last byte written will result in the complement of the written data to be presented on I/O7. Once the write cycle has been completed, true data is valid on all outputs, and the next write cycle may begin. DATA Polling may begin at anytime during the write cycle. 3 0353G–PEEPR–10/06 4.5 Toggle Bit In addition to DATA Polling the AT28C010 provides another method for determining the end of a write cycle. During the write operation, successive attempts to read data from the device will result in I/O6 toggling between one and zero. Once the write has completed, I/O6 will stop toggling and valid data will be read. Reading the toggle bit may begin at any time during the write cycle. 4.6 Data Protection If precautions are not taken, inadvertent writes may occur during transitions of the host system power supply. Atmel® has incorporated both hardware and software features that will protect the memory against inadvertent writes. 4.6.1 Hardware Protection Hardware features protect against inadvertent writes to the AT28C010 in the following ways: (a) VCC sense – if VCC is below 3.8V (typical) the write function is inhibited; (b) VCC power-on delay – once VCC has reached 3.8V the device will automatically time out 5 ms (typical) before allowing a write; (c) write inhibit – holding any one of OE low, CE high or WE high inhibits write cycles; and (d) noise filter—pulses of less than 15 ns (typical) on the WE or CE inputs will not initiate a write cycle. 4.6.2 Software Data Protection A software controlled data protection feature has been implemented on the AT28C010. When enabled, the software data protection (SDP), will prevent inadvertent writes. The SDP feature may be enabled or disabled by the user; the AT28C010 is shipped from Atmel with SDP disabled. SDP is enabled by the host system issuing a series of three write commands; three specific bytes of data are written to three specific addresses (refer to Software Data Protection Algorithm). After writing the 3-byte command sequence and after tWC the entire AT28C010 will be protected against inadvertent write operations. It should be noted, that once protected the host may still perform a byte or page write to the AT28C010. This is done by preceding the data to be written by the same 3-byte command sequence used to enable SDP. Once set, SDP will remain active unless the disable command sequence is issued. Power transitions do not disable SDP and SDP will protect the AT28C010 during power-up and power-down conditions. All command sequences must conform to the page write timing specifications. The data in the enable and disable command sequences is not written to the device and the memory addresses used in the sequence may be written with data in either a byte or page write operation. After setting SDP, any attempt to write to the device without the 3-byte command sequence will start the internal write timers. No data will be written to the device; however, for the duration of tWC, read operations will effectively be polling operations. 4.7 Device Identification An extra 128 bytes of EEPROM memory are available to the user for device identification. By raising A9 to 12V ± 0.5V and using address locations 1FF80H to 1FFFFH the bytes may be written to or read from in the same manner as the regular memory array. 4.8 Optional Chip Erase Mode The entire device can be erased using a 6-byte software code. Please see Software Chip Erase application note for details. 4 AT28C010 0353G–PEEPR–10/06 AT28C010 5. DC and AC Operating Range Operating Temperature (Case) Ind. AT28C010-12 AT28C010-15 -40°C - 85°C -40°C - 85°C 5V ± 10% 5V ± 10% VCC Power Supply 6. Operating Modes Mode CE OE WE I/O Read VIL VIL VIH DOUT VIL VIH VIL DIN X High Z Write (2) Standby/Write Inhibit (1) VIH X Write Inhibit X X VIH Write Inhibit X VIL X Output Disable X VIH X Notes: High Z 1. X can be VIL or VIH. 2. Refer to AC Programming Waveforms. 7. Absolute Maximum Ratings* Temperature Under Bias................................ -55°C to +125°C *NOTICE: Storage Temperature ..................................... -65°C to +150°C All Input Voltages (including NC Pins) with Respect to Ground ...................................-0.6V to +6.25V All Output Voltages with Respect to Ground .............................-0.6V to VCC + 0.6V Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability Voltage on OE and A9 with Respect to Ground ...................................-0.6V to +13.5V 8. DC Characteristics Symbol Parameter Condition ILI Input Load Current ILO Min Max Units VIN = 0V to VCC + 1V 10 µA Output Leakage Current VI/O = 0V to VCC 10 µA ISB1 VCC Standby Current CMOS CE = VCC - 0.3V to VCC + 1V 200 µA ISB2 VCC Standby Current TTL CE = 2.0V to VCC + 1V 3 mA ICC VCC Active Current f = 5 MHz; IOUT = 0 mA 40 mA VIL Input Low Voltage 0.8 V VIH Input High Voltage VOL Output Low Voltage IOL = 2.1 mA VOH1 Output High Voltage IOH = -400 µA 2.4 V VOH2 Output High Voltage CMOS IOH = -100 µA; VCC = 4.5V 4.2 V 2.0 V 0.45 V 5 0353G–PEEPR–10/06 9. AC Read Characteristics AT28C010-12 Symbol Parameter tACC Min Max AT28C010-15 Min Max Units Address to Output Delay 120 150 ns (1) CE to Output Delay 120 150 ns tOE(2) OE to Output Delay 0 50 0 55 ns tDF(3)(4) CE or OE to Output Float 0 50 0 55 ns tOH Output Hold from OE, CE or Address, Whichever Occurred First 0 tCE 0 ns 10. AC Read Waveforms(1)(2)(3)(4) Notes: 1. CE may be delayed up to tACC - tCE after the address transition without impact on tACC. 2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change without impact on tACC. 3. tDF is specified from OE or CE whichever occurs first (CL = 5 pF). 4. This parameter is characterized and is not 100% tested. 6 AT28C010 0353G–PEEPR–10/06 AT28C010 11. Input Test Waveforms and Measurement Level tR, tF < 5 ns 12. Output Test Load 13. Pin Capacitance f = 1 MHz, T = 25°C(1) Symbol Typ Max Units Conditions CIN 4 10 pF VIN = 0V COUT 8 12 pF VOUT = 0V Note: 1. This parameter is characterized and is not 100% tested. 7 0353G–PEEPR–10/06 14. AC Write Characteristics Symbol Parameter Min Max Units tAS, tOES Address, OE Set-up Time 0 ns tAH Address Hold Time 50 ns tCS Chip Select Set-up Time 0 ns tCH Chip Select Hold Time 0 ns tWP Write Pulse Width (WE or CE) 100 ns tDS Data Set-up Time 50 ns tDH, tOEH Data, OE Hold Time 0 ns 15. AC Write Waveforms 15.1 WE Controlled 15.2 CE Controlled 8 AT28C010 0353G–PEEPR–10/06 AT28C010 16. Page Mode Characteristics Symbol Parameter Min Max Units tWC Write Cycle Time 10 ms tAS Address Set-up Time 0 ns tAH Address Hold Time 50 ns tDS Data Set-up Time 50 ns tDH Data Hold Time 0 ns tWP Write Pulse Width 100 ns tBLC Byte Load Cycle Time tWPH Write Pulse Width High 150 50 µs ns 17. Page Mode Write Waveforms(1)(2) Notes: 1. A7 through A16 must specify the same page address during each high to low transition of WE (or CE). 2. OE must be high only when WE and CE are both low. 18. Chip Erase Waveforms tS = 5 µsec (min.) tW = tH = 10 msec (min.) VH = 12.0V ± 0.5V 9 0353G–PEEPR–10/06 19. Software Data Protection Enable Algorithm(1) Notes: 20. Software Data Protection Disable Algorithm(1) LOAD DATA AA TO ADDRESS 5555 LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA A0 TO ADDRESS 5555 LOAD DATA 80 TO ADDRESS 5555 WRITES ENABLED(2) LOAD DATA XX TO ANY ADDRESS(4) LOAD DATA AA TO ADDRESS 5555 LOAD LAST BYTE TO LAST ADDRESS LOAD DATA 55 TO ADDRESS 2AAA ENTER DATA PROTECT STATE 1. Data Format: I/O7 - I/O0 (Hex); Address Format: A14 - A0 (Hex). 2. Write Protect state will be activated at end of write even if no other data is loaded. 3. Write Protect state will be deactivated at end of write period even if no other data is loaded. LOAD DATA 20 TO ADDRESS 5555 EXIT DATA PROTECT STATE(3) LOAD DATA XX TO ANY ADDRESS(4) 4. 1 to 128 bytes of data are loaded. LOAD LAST BYTE TO LAST ADDRESS 21. Software Protected Write Cycle Waveforms(1)(2)(3) Notes: 1. A0 through A14 must conform to the addressing sequence for the first 3 bytes as shown above. 2. After the command sequence has been issued and a page write operation follows, the page address inputs (A7 - A16) must be the same for each high to low transition of WE (or CE). 3. OE must be high only when WE and CE are both low. 10 AT28C010 0353G–PEEPR–10/06 AT28C010 22. Data Polling Characteristics(1) Symbol Parameter tDH Data Hold Time tOEH OE Hold Time Typ Max ns 10 ns OE to Output Delay tWR Write Recovery Time Units 10 (2) tOE Notes: Min ns 0 ns 1. These parameters are characterized and not 100% tested. 2. See AC Read Characteristics. 23. Data Polling Waveforms 24. Toggle Bit Characteristics(1) Symbol Parameter tDH Data Hold Time tOEH OE Hold Time Min OE to Output Delay tOEHP OE High Pulse tWR Write Recovery Time Notes: Max Units 10 ns 10 ns (2) tOE Typ ns 150 ns 0 ns 1. These parameters are characterized and not 100% tested. 2. See AC Read Characteristics. 25. Toggle Bit Waveforms Notes: 1. Toggling either OE or CE or both OE and CE will operate toggle bit. 2. Beginning and ending state of I/O6 will vary. 3. Any address location may be used but the address should not vary. 11 0353G–PEEPR–10/06 26. Ordering Information(1) 26.1 tACC (ns) 120 150 Standard Package ICC (mA) Active Standby 40 40 Ordering Code Package 0.2 AT28C010(E)-12JI AT28C010(E)-12PI AT28C010(E)-12TI 32J 32P6 32T 0.2 AT28C010(E)-15JI AT28C010(E)-15PI AT28C010(E)-15TI 32J 32P6 32T Note: 1. See “Valid Part Numbers” on page 13. 26.2 Green Package Option (Pb/Halide-free) tACC (ns) 120 150 Operation Range Industrial (-40° to 85° C) ICC (mA) Active 40 40 Standby 0.2 0.2 Ordering Code Package AT28C010-12JU AT28C010-12TU 32J 32T AT28C010(E)-12JU AT28C010(E)-12PU AT28C010(E)-12TU 32J 32P6 32T AT28C010-15JU AT28C010-15TU 32J 32T AT28C010(E)-15JU AT28C010(E)-15PU AT28C010(E)-15TU 32J 32P6 32T Operation Range Industrial (-40° to 85° C) Package Type 32J 32-lead, Plastic J-leaded Chip Carrier (PLCC) 32P6 32-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 32T 32-lead, Plastic Thin Small Outline Package (TSOP) W Die Options Blank Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms E High-endurance Option: Endurance = 100K Write Cycles 12 AT28C010 0353G–PEEPR–10/06 AT28C010 27. Valid Part Numbers The following table lists standard Atmel products that can be ordered. Device Numbers Speed Package and Temperature Combinations AT28C010 12 JI, JU, PI, TI, TU, PU AT28C010E 12 JI, PI, TI, JU, PU, TU AT28C010 15 JI, JU, PI, TI, TU, PU AT28C010E 15 JI, PI, TI, JU, PU, TU 28. Die Products Reference Section: Parallel EEPROM Die Products 13 0353G–PEEPR–10/06 29. Packaging Information 29.1 32J – PLCC 1.14(0.045) X 45˚ PIN NO. 1 IDENTIFIER 1.14(0.045) X 45˚ 0.318(0.0125) 0.191(0.0075) E1 E2 B1 E B e A2 D1 A1 D A 0.51(0.020)MAX 45˚ MAX (3X) COMMON DIMENSIONS (Unit of Measure = mm) D2 Notes: 1. This package conforms to JEDEC reference MS-016, Variation AE. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line. 3. Lead coplanarity is 0.004" (0.102 mm) maximum. SYMBOL MIN NOM MAX A 3.175 – 3.556 A1 1.524 – 2.413 A2 0.381 – – D 12.319 – 12.573 D1 11.354 – 11.506 D2 9.906 – 10.922 E 14.859 – 15.113 E1 13.894 – 14.046 E2 12.471 – 13.487 B 0.660 – 0.813 B1 0.330 – 0.533 e NOTE Note 2 Note 2 1.270 TYP 10/04/01 R 14 2325 Orchard Parkway San Jose, CA 95131 TITLE 32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC) DRAWING NO. REV. 32J B AT28C010 0353G–PEEPR–10/06 AT28C010 29.2 32P6 – PDIP D PIN 1 E1 A SEATING PLANE A1 L B B1 e E 0º ~ 15º C COMMON DIMENSIONS (Unit of Measure = mm) REF MIN NOM MAX A – – 4.826 A1 0.381 – – D 41.783 – 42.291 E 15.240 – 15.875 E1 13.462 – 13.970 B 0.356 – 0.559 B1 1.041 – 1.651 L 3.048 – 3.556 C 0.203 – 0.381 eB 15.494 – 17.526 SYMBOL eB Note: 1. Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed 0.25 mm (0.010"). e NOTE Note 1 Note 1 2.540 TYP 09/28/01 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 32P6, 32-lead (0.600"/15.24 mm Wide) Plastic Dual Inline Package (PDIP) DRAWING NO. 32P6 REV. B 15 0353G–PEEPR–10/06 29.3 32T – TSOP PIN 1 0º ~ 8º c Pin 1 Identifier D1 D L b e L1 A2 E A GAGE PLANE SEATING PLANE COMMON DIMENSIONS (Unit of Measure = mm) A1 MIN NOM MAX A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 19.80 20.00 20.20 D1 18.30 18.40 18.50 Note 2 E 7.90 8.00 8.10 Note 2 L 0.50 0.60 0.70 SYMBOL Notes: 1. This package conforms to JEDEC reference MO-142, Variation BD. 2. Dimensions D1 and E do not include mold protrusion. Allowable protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side. 3. Lead coplanarity is 0.10 mm maximum. L1 0.25 BASIC b 0.17 0.22 0.27 c 0.10 – 0.21 e NOTE 0.50 BASIC 10/18/01 R 16 2325 Orchard Parkway San Jose, CA 95131 TITLE 32T, 32-lead (8 x 20 mm Package) Plastic Thin Small Outline Package, Type I (TSOP) DRAWING NO. REV. 32T B AT28C010 0353G–PEEPR–10/06 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Regional Headquarters Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland Tel: (41) 26-426-5555 Fax: (41) 26-426-5500 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Atmel Operations Memory 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel: (49) 71-31-67-0 Fax: (49) 71-31-67-2340 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France Tel: (33) 2-40-18-18-18 Fax: (33) 2-40-18-19-60 ASIC/ASSP/Smart Cards 1150 East Cheyenne Mtn. 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