Features • Permanent and Reversible Software Write Protection for the First-half of the Array – Software Procedure to Verify Write Protect Status • Hardware Write Protection for the Entire Array • Low-voltage and Standard-voltage Operation – 1.7 (VCC = 1.7V to 3.6V) Internally Organized 256 x 8 Two-wire Serial Interface Schmitt Trigger, Filtered Inputs for Noise Suppression Bidirectional Data Transfer Protocol 100 kHz (1.7V) and 400 kHz (2.7V and 3.6V) Compatibility 16-byte Page Write Modes Partial Page Writes Are Allowed Self-timed Write Cycle (5 ms max) High-reliability – Endurance: 1 Million Write Cycles – Data Retention: 100 Years • 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3), 8-lead TSSOP, and 8-ball dBGA2 Packages • • • • • • • • • Description The AT34C02B provides 2048 bits of serial electrically-erasable and programmable read only memory (EEPROM) organized as 256 words of 8 bits each. The first-half of the device incorporates a permanent and a reversible software write protection feature while hardware write protection for the entire array is available via an external pin. Once the permanent software write protection is enabled, by sending a special command to the device, it cannot be reversed. However, the reversible software write protection is enabled and can be reversed by sending a special command. The hardware write protection is controlled with the WP pin and can be used to protect the entire array, whether or not the software write protection has been enabled. This allows the user to protect none, first-half, or all of the array depending on the application. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operations are essential. The AT34C02B is available in space saving 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3), 8-lead TSSOP, and 8-ball dBGA2 packages and is accessed via a Two-wire serial interface. It is available in 1.7V (1.7V to 3.6V). 8-ball dBGA2 Table 1. Pin Configurations Pin Name Function VCC WP SCL SDA A0 - A2 Address Inputs SDA Serial Data SCL Serial Clock Input WP 8 1 7 2 6 3 5 4 A0 A1 A2 GND 1 2 3 4 8 7 6 5 AT34C02B Note: Not recommended for new design; please refer to AT34C02C datasheet. VCC WP SCL SDA 8 7 6 5 1 2 3 4 A0 A1 A2 GND (MLP 2x3) Bottom View 8-lead SOIC 8-lead TSSOP A0 A1 A2 GND 2K (256 x 8) 8-lead Ultra Thin Mini-MAP Bottom View Write Protect Two-wire Serial EEPROM with Permanent and Reversible Software Write Protect VCC WP SCL SDA A0 A1 A2 GND 1 2 3 4 8 7 6 5 VCC WP SCL SDA Rev. 3417E–SEEPR–1/07 1 Absolute Maximum Ratings* Operating Temperature..................................–55°C to +125 °C *NOTICE: Storage Temperature .....................................–65°C to +150°C Voltage on Any Pin with Respect to Ground .................................... –1.0V to +7.0V Maximum Operating Voltage .......................................... 6.25V DC Output Current........................................................ 5.0 mA Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 1. Block Diagram VCC GND WP START STOP LOGIC SCL SDA SERIAL CONTROL LOGIC WRITE PROTECT CIRCUITRY EN H.V. PUMP/TIMING LOAD A2 A1 A0 R/W COMP LOAD DATA WORD ADDR/COUNTER DATA RECOVERY SOFTWARE WRITE PROTECTED AREA (00H - 7FH) INC X DEC DEVICE ADDRESS COMPARATOR EEPROM Y DEC DIN SERIAL MUX DOUT/ACK LOGIC DOUT 2 AT34C02B 3417E–SEEPR–1/07 AT34C02B Pin Description SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative edge clock data out of each device. SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may be wire-ORed with any number of other open-drain or open collector devices. DEVICE/PAGE ADDRESSES (A2, A1, A0): The A2, A1, and A0 pins are device address inputs that are hardwired (directly to GND or to Vcc) for compatibility with other AT24Cxx devices. When the pins are hardwired, as many as eight 2K devices may be addressed on a single bus system. (Device addressing is discussed in detail under “Device Addressing,” page 9.) A device is selected when a corresponding hardware and software match is true. If these pins are left floating, the A2, A1, and A0 pins will be internally pulled down to GND. However, due to capacitive coupling that may appear during customer applications, Atmel recommends always connecting the address pins to a known state. When using a pull-up resistor, Atmel recommends using 10kΩ or less. WRITE PROTECT (WP): The write protect input, when connected to GND, allows normal write operations. When WP is connected directly to Vcc, all write operations to the memory are inhibited. If the pin is left floating, the WP pin will be internally pulled down to GND. However, due to capacitive coupling that may appear during customer applications, Atmel recommends always connecting the WP pins to a known state. When using a pull-up resistor, Atmel recommends using 10kΩ or less. Table 2. AT34C02B Write Protection Modes WP Pin Status Permanent Write Protect Register Reversible Write Protect Register Part of the Array Write Protected VCC – – Full Array (2K) GND or Floating Not Programmed Not Programmed Normal Read/Write GND or Floating Programmed – First-Half of Array (1K: 00H - 7FH) GND or Floating – Programmed First-Half of Array (1K: 00H - 7FH) Table 3. Pin Capacitance(1) Applicable over recommended operating range from TA = 25°C, f = 100 kHz, VCC = +1.7V Symbol Test Condition CI/O CIN Note: Max Units Conditions Input/Output Capacitance (SDA) 8 pF VI/O = 0V Input Capacitance (A0, A1, A2, SCL) 6 pF VIN = 0V 1. This parameter is characterized and is not 100% tested. 3 3417E–SEEPR–1/07 Table 4. DC Characteristics Applicable over recommended operating range from: TAI = –40°C to +85°C, VCC = +1.7V to +3.6V, (unless otherwise noted) Symbol Parameter Test Condition VCC1 Supply Voltage ICC Supply Current VCC = 3.6V READ at 100 kHz ICC Supply Current VCC = 3.6V ISB1 Min Typ Max Units 3.6 V 0.4 1.0 mA WRITE at 100 kHz 2.0 3.0 mA Standby Current VCC = 1.7V VIN = VCC or VSS 0.6 3.0 µA ISB2 Standby Current VCC = 3.6V VIN = VCC or VSS 1.6 4.0 µA ILI Input Leakage Current VIN = VCC or VSS 0.10 3.0 µA ILO Output Leakage Current VOUT = VCC or VSS 0.05 3.0 µA VIL Input Low Level(1) –0.6 VCC x 0.3 V VCC x 0.7 VCC + 0.5 V 1.7 (1) VIH Input High Level VOL2 Output Low Level VCC = 3.0V IOL = 2.1 mA 0.4 V Output Low Level VCC = 1.7V IOL = 0.15 mA 0.2 V VOL1 Note: 4 1. VIL min and VIH max are reference only and are not tested. AT34C02B 3417E–SEEPR–1/07 AT34C02B Table 5. AC Characteristics Applicable over recommended operating range from TAI = –40°C to +85°C, VCC = +1.7V to +3.6V, CL = 1 TTL Gate and 100 pF (unless otherwise noted) 1.7V Symbol Parameter Min fSCL Clock Frequency, SCL tLOW Clock Pulse Width Low tHIGH Clock Pulse Width High 2.7V, 3.6V Max Min 100 Max Units 400 kHz 4.7 1.2 µs 4.0 0.6 µs (1) tI Noise Suppression Time tAA Clock Low to Data Out Valid 0.1 tBUF Time the bus must be free before a new transmission can start(1) 4.7 1.2 µs tHD.STA Start Hold Time 4.0 0.6 µs tSU.STA Start Set-up Time 4.7 0.6 µs tHD.DAT Data In Hold Time 0 0 µs tSU.DAT Data In Set-up Time 200 100 ns 100 (1) Inputs Rise Time tR (1) 4.5 0.1 50 ns 0.9 µs 1.0 0.3 µs 300 300 ns tF Inputs Fall Time tSU.STO Stop Set-up Time 4.7 0.6 µs tDH Data Out Hold Time 100 50 ns tWR Write Cycle Time Endurance(1) 25°C, Page Mode Note: 5 1M 5 1M ms Write Cycles 1. This parameter is characterized and is not 100% tested. 5 3417E–SEEPR–1/07 Memory Organization AT34C02B, 2K Serial EEPROM: The 2K is internally organized with 16 pages of 16 bytes each. Random word addressing requires a 8-bit data word address. Device Operation CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external device. Data on the SDA pin may change only during SCL low time periods (see Figure 4 on page 7). Data changes during SCL high periods will indicate a start or stop condition as defined below. START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which must precede any other command (see Figure 5 on page 8). STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition. After a read sequence, the stop command will place the EEPROM in a standby power mode (see Figure 5 on page 8). ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock cycle. STANDBY MODE: The AT34C02B features a low-power standby mode which is enabled: (a) upon power-up or (b) after the receipt of the STOP bit and the completion of any internal operations. MEMORY RESET: After an interruption in protocol, power loss or system reset, any Two-wire part can be reset by following these steps: (a) Clock up to 9 cycles, (b) look for SDA high in each cycle while SCL is high and then (c) create a start condition. 6 AT34C02B 3417E–SEEPR–1/07 AT34C02B Figure 2. Bus Timing SCL: Serial Clock SDA: Serial Data I/O Figure 3. Write Cycle Timing SCL: Serial Clock SDA: Serial Data I/O SCL SDA 8th BIT ACK WORDn (1) twr STOP CONDITION Note: START CONDITION 1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle. Figure 4. Data Validity 7 3417E–SEEPR–1/07 Figure 5. Start and Stop Condition Figure 6. Output Acknowledge 8 AT34C02B 3417E–SEEPR–1/07 AT34C02B Device Addressing The 2K EEPROM device requires an 8-bit device address word following a start condition to enable the chip for a read or write operation (see Figure 10 on page 13). The device address word consists of a mandatory one-zero sequence for the first four most-significant bits (1010) for normal read and write operations and 0110 for writing to the write protect register. The next 3 bits are the A2, A1 and A0 device address bits for the AT34C02B EEPROM. These 3 bits must compare to their corresponding hard-wired input pins. The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is high and a write operation is initiated if this bit is low. Upon a compare of the device address, the EEPROM will output a zero. If a compare is not made, the chip will return to a standby state. The device will not acknowledge if the write protect register has been programmed and the control code is 0110. Write Operations BYTE WRITE: A write operation requires an 8-bit data word address following the device address word and acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the addressing device, such as a microcontroller, must terminate the write sequence with a stop condition. At this time the EEPROM enters an internally-timed write cycle, t WR , to the nonvolatile memory. All inputs are disabled during this write cycle and the EEPROM will not respond until the write is complete (see Figure 11 on page 13). The device will acknowledge a write command, but not write the data, if the software or hardware write protection has been enabled. The write cycle time must be observed even when the write protection is enabled. PAGE WRITE: The 2K device is capable of 16-byte page write. A page write is initiated the same as a byte write, but the microcontroller does not send a stop condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can transmit up to fifteen more data words. The EEPROM will respond with a zero after each data word received. The microcontroller must terminate the page write sequence with a stop condition (see Figure 12 on page 14). The data word address lower four bits are internally incremented following the receipt of each data word. The higher data word address bits are not incremented, retaining the memory page row location. When the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. If more than sixteen data words are transmitted to the EEPROM, the data word address will “roll over” and previous data will be overwritten. The address “roll over” during write is from the last byte of the current page to the first byte of the same page. The device will acknowledge a write command, but not write the data, if the software or hardware write protection has been enabled. The write cycle time must be observed even when the write protection is enabled. ACKNOWLEDGE POLLING: Once the internally-timed write cycle has started and the EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a start condition followed by the device address word. The read/write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM respond with a zero allowing the read or write sequence to continue. 9 3417E–SEEPR–1/07 Write Protection The software write protection, once enabled, write protects only the first-half of the array (00H - 7FH) while the hardware write protection, via the WP pin, is used to protect the entire array. PERMANENT SOFTWARE WRITE PROTECTION: The software write protection is enabled by sending a command, similar to a normal write command, to the device which programs the permanent write protect register. This must be done with the WP pin low. The write protect register is programmed by sending a write command with the device address of 0110 instead of 1010 with the address and data bit being don’t cares (see Figure 7 on page 10). Once the software write protection has been enabled, the device will no longer acknowledge the 0110 control byte. The software write protection cannot be reversed even if the device is powered down. The write cycle time must be observed. REVERSIBLE SOFTWARE WRITE PROTECTION: The reversible software write protection is enabled by sending a command, similar to a normal write command, to the device which programs the reversible write protect register. This must be done with the WP pin low. The write protect register is programmed by sending a write command 01100010 with pins A2 and A1 tied to ground or don't connect and pin A0 connected to VHV (see Figure 8). The reversible write protection can be reversed by sending a command 01100110 with pin A2 tied to ground or no connect, pin A1 tied to VCC and pin A0 tied to VHV (see Figure 9). HARDWARE WRITE PROTECTION: The WP pin can be connected to VCC, GND, or left floating. Connecting the WP pin to VCC will write protect the entire array, regardless of whether or not the software write protection has been enabled. The software write protection register cannot be programmed when the WP pin is connected to VCC. If the WP pin is connected to GND or left floating, the write protection mode is determined by the status of the software write protect register. Figure 7. Setting Permanent Write Protect Register (PSWP) S T A R T SDA LINE CONTROL BYTE WORD ADDRESS S T O P DATA 0 1 1 0 A2 A1 A0 0 A C K A C K A C K = Don't Care Figure 8. Setting Reversible Write Protect Register (RSWP) S T A R T SDA LINE CONTROL BYTE WORD ADDRESS S T O P DATA 0 1 1 0 0 0 1 0 A C K A C K A C K = Don't Care Figure 9. Clearing Reversible Write Protect Register (RSWP) S T A R T SDA LINE CONTROL BYTE WORD ADDRESS S T O P DATA 0 1 1 0 0 1 1 0 A C K A C K A C K = Don't Care 10 AT34C02B 3417E–SEEPR–1/07 AT34C02B Table 6. Write Protection Pin Preamble RW Command A2 A1 A0 B7 B6 B5 B4 B3 B2 B1 B0 Set PSWP A2 A1 A0 0 1 1 0 A2 A1 A0 0 Set RSWP 0 0 VHV 0 1 1 0 0 0 1 0 Clear RSWP 0 1 VHV 0 1 1 0 0 1 1 0 Table 7. VHV VHV Note: Min Max Units 7 10 V VHV - VCC > 4.8V Table 8. WP Connected to GND or Floating WP Connected to GND or Floating Reversible Write Protect Register RSWP Acknowledgment from Device Command R/W Bit Permanent Write Protect Register PSWP 1010 R X X ACK 1010 W Programmed X ACK Can write to second Half (80H - FFH) only 1010 W X Programmed ACK Can write to second Half (80H - FFH) only 1010 W Not Programmed Not Programmed ACK Can write to full array Read PSWP R Programmed X No ACK STOP - Indicates permanent write protect register is programmed Read PSWP R Not Programmed X ACK Read out data don't care. Indicates PSWP register is not programmed Set PSWP W Programmed X No ACK STOP - Indicates permanent write protect register is programmed Set PSWP W Not Programmed X ACK Read RSWP R X Programmed No ACK STOP - Indicates reversible write protect register is programmed Read RSWP R X Not Programmed ACK Read out data don't care. Indicates RSWP register is not programmed Set RSWP W X Programmed No ACK STOP - Indicates reversible write protect register is programmed Set RSWP W X Not Programmed ACK Program reversible write protect register (reversible) Clear RSWP W Programmed X No ACK STOP - Indicates permanent write protect register is programmed Clear RSWP W Not Programmed X ACK Action from Device Program permanent write protect register (irreversible) Clear (unprogram) reversible write protect register (reversible) 11 3417E–SEEPR–1/07 Table 9. WP Connected to Vcc WP Connected to Vcc Reversible Write Protect Register RSWP Acknowledgment from Device Command R/W Bit Permanent Write Protect Register PSWP 1010 R X X ACK Read array 1010 W X X ACK Device Write Protect Read PSWP R Programmed X No ACK STOP - Indicates permanent write protect register is programmed Read PSWP R Not Programmed X ACK Read out data don't care. Indicates PSWP register is not programmed Set PSWP W Programmed X No ACK STOP - Indicates permanent write protect register is programmed Set PSWP W Not Programmed X ACK Read RSWP R X Programmed No ACK Read RSWP R X Not Programmed ACK Set RSWP W X Programmed No ACK Set RSWP W X Not Programmed ACK Clear RSWP W Programmed X No ACK Clear RSWP W Not Programmed X ACK Read Operations Action from Device Cannot program write protect registers STOP - Indicates reversible write protect register is programmed Read out data don't care. Indicates RSWP register is not programmed STOP - Indicates reversible write protect register is programmed Cannot program write protect registers STOP - Indicates permanent write protect register is programmed Cannot write to write protect registers Read operations are initiated the same way as write operations with the exception that the read/write select bit in the device address word is set to one. There are three read operations: current address read, random address read and sequential read. CURRENT ADDRESS READ: The internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. This address stays valid between operations as long as the chip power is maintained. The address “roll over” during read is from the last byte of the last memory page to the first byte of the first page. Once the device address with the read/write select bit set to one is clocked in and acknowledged by the EEPROM, the current address data word is serially clocked out. To end the command, the microcontroller does not respond with an input zero but does generate a following stop condition (see Figure 13 on page 14). RANDOM READ: A random read requires a “dummy” byte write sequence to load in the data word address. Once the device address word and data word address are clocked in and acknowledged by the EEPROM, the microcontroller must generate another start condition. The microcontroller now initiates a current address read by sending a device address with the read/write select bit high. The EEPROM acknowledges the device address and serially clocks out the data word. To end the command, the microcontroller 12 AT34C02B 3417E–SEEPR–1/07 AT34C02B does not respond with a zero but does generate a following stop condition (see Figure 14 on page 14). SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a random address read. After the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will “roll over” and the sequential read will continue. The sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition (see Figure 15 on page 14). PERMANENT WRITE PROTECT REGISTER (PSWP) STATUS: To find out if the register has been programmed, the same procedure is used as to program the register except that the R/W bit is set to 1. If the device sends an acknowledge, then the permanent write protect register has not been programmed. Otherwise, it has been programmed and the device is permanently write protected at the first half of the array. Table 10. PSWP Status Pin Preamble RW Command A2 A1 A0 B7 B6 B5 B4 B3 B2 B1 B0 Read PSWP A2 A1 A0 0 1 1 0 A2 A1 A0 1 REVERSIBLE WRITE PROTECT REGISTER(RSWP) STATUS: To find out if the register has been programmed, the same procedure is used as to program the register except that the R/W bit is set to 1. If the sends an device acknowledge, then the reversible write protect register has not been programmed. Otherwise, it has been programmed and the device is write protected (reversible) at the first half of the array. Figure 10. Device Address Figure 11. Byte Write 13 3417E–SEEPR–1/07 Figure 12. Page Write Figure 13. Current Address Read Figure 14. Random Read Figure 15. Sequential Read 14 AT34C02B 3417E–SEEPR–1/07 AT34C02B AT34C02B Ordering Information(1) Ordering Code AT34C02BN-10SU-1.7(2) AT34C02B-10TU-1.7(2) AT34C02BY6-10YH-1.7(3) AT34C02BU3-10UU-1.7(2) Notes: Package Operation Range 8S1 8A2 8Y6 8U3-1 Lead-free/Halogen-free/ Industrial Temperature (–40°C to 85°C) 1. Not Recommended for new design; Please refer to AT34C02C datasheet. 2. “U” designates Green package + RoHS compliant. 3. “H” designates Green package + RoHS compliant, with NiPdAu Lead Finish. Package Type 8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC) 8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP) 8Y6 8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm) 8U3-1 8-ball, die Ball Grid Array Package (dBGA2) Options –1.7 Low Voltage (1.7V to 3.6V) 15 3417E–SEEPR–1/07 Packaging Information 8S1 – JEDEC SOIC C 1 E E1 L N ∅ Top View End View e B COMMON DIMENSIONS (Unit of Measure = mm) A A1 D Side View SYMBOL MIN NOM MAX A 1.35 – 1.75 A1 0.10 – 0.25 b 0.31 – 0.51 C 0.17 – 0.25 D 4.80 – 5.00 E1 3.81 – 3.99 E 5.79 – 6.20 e NOTE 1.27 BSC L 0.40 – 1.27 ∅ 0˚ – 8˚ Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. 10/7/03 R 16 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) DRAWING NO. 8S1 REV. B AT34C02B 3417E–SEEPR–1/07 AT34C02B 8A2 – TSSOP 3 2 1 Pin 1 indicator this corner E1 E L1 N L Top View End View COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL A b D MIN NOM MAX NOTE 2.90 3.00 3.10 2, 5 3, 5 E e D A2 6.40 BSC E1 4.30 4.40 4.50 A – – 1.20 A2 0.80 1.00 1.05 b 0.19 – 0.30 e Side View L 0.65 BSC 0.45 L1 Notes: 4 0.60 0.75 1.00 REF 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. 5. Dimension D and E1 to be determined at Datum Plane H. 5/30/02 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 8A2, 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) DRAWING NO. 8A2 REV. B 17 3417E–SEEPR–1/07 8Y6 – Mini-MAP D2 A b (8X) E E2 Pin 1 Index Area Pin 1 ID L (8X) D A2 e (6X) A1 1.50 REF. A3 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN 2.00 BSC E 3.00 BSC MAX D2 1.40 1.50 1.60 E2 - - 1.40 A - - 0.60 A1 0.0 0.02 0.05 A2 - - 0.55 A3 L b NOTE 0.20 REF 0.20 e Notes: NOM D 0.30 0.40 0.50 BSC 0.20 0.25 0.30 2 1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions, tolerances, datums, etc. 2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. 8/26/05 R 18 2325 Orchard Parkway San Jose, CA 95131 DRAWING NO. TITLE 8Y6, 8-lead 2.0 x 3.0 mm Body, 0.50 mm Pitch, Utlra Thin Mini-Map, 8Y6 Dual No Lead Package (DFN) ,(MLP 2x3) REV. C AT34C02B 3417E–SEEPR–1/07 AT34C02B 8U3-1 – dBGA2 E D 1. b A1 PIN 1 BALL PAD CORNER A2 Top View A Side View PIN 1 BALL PAD CORNER 1 2 3 4 8 7 6 5 (d1) d e COMMON DIMENSIONS (Unit of Measure = mm) (e1) Bottom View 8 SOLDER BALLS 1. This drawing is for general information only. 2. Dimension ‘b’ is measured at maximum solder ball diameter SYMBOL MIN NOM MAX A 0.71 0.81 0.91 A1 0.10 0.15 0.20 A2 0.40 0.45 0.50 b 0.20 0.25 0.30 D 1.50 BSC E 2.00 BSC e 0.50 BSC e1 0.25 REF d 1.00 BSC d1 0.25 REF NOTE 2 6/24/03 R 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TITLE 8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch, Small Die Ball Grid Array Package (dBGA2) DRAWING NO. REV. PO8U3-1 A 19 3417E–SEEPR–1/07 Revision History 20 Doc. Rev. Date Comments 3417E 1/2007 Revision History Implemented. Pg 1: Added note: Not Recommended for new design; Please refer to AT34C02C datasheet. AT34C02B 3417E–SEEPR–1/07 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Regional Headquarters Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland Tel: (41) 26-426-5555 Fax: (41) 26-426-5500 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Atmel Operations Memory 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France Tel: (33) 2-40-18-18-18 Fax: (33) 2-40-18-19-60 ASIC/ASSP/Smart Cards Zone Industrielle 13106 Rousset Cedex, France Tel: (33) 4-42-53-60-00 Fax: (33) 4-42-53-60-01 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel: (49) 71-31-67-0 Fax: (49) 71-31-67-2340 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel: 1(719) 576-3300 Fax: 1(719) 540-1759 Biometrics/Imaging/Hi-Rel MPU/ High Speed Converters/RF Datacom Avenue de Rochepleine BP 123 38521 Saint-Egreve Cedex, France Tel: (33) 4-76-58-30-00 Fax: (33) 4-76-58-34-80 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel: 1(719) 576-3300 Fax: 1(719) 540-1759 Scottish Enterprise Technology Park Maxwell Building East Kilbride G75 0QR, Scotland Tel: (44) 1355-803-000 Fax: (44) 1355-242-743 Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life ©2007 Atmel Corporation. All rights reserved. Atmel ®, logo and combinations thereof, Everywhere You Are ® and others, are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. Printed on recycled paper. 3417E–SEEPR–1/07