Features • • • • • • • • • • • • • • • • • Compatible with MCS®-51 Products 32K Bytes of Reprogrammable Flash Memory Endurance: 1000 Write/Erase Cycles 4V to 5.5V Operating Range Fully Static Operation: 0 Hz to 33 MHz Three-level Program Memory Lock 512 x 8-bit Internal RAM 32 Programmable I/O Lines Three 16-bit Timer/Counters Eight Interrupt Sources Programmable Serial Channel Low-power Idle and Power-down Modes Interrupt Recovery from Power-down Mode Hardware Watchdog Timer Dual Data Pointer Power-off Flag Green (Pb/Halide-free) Packaging Option 8-bit Microcontroller with 32K Bytes Flash AT89C51RC 1. Description The AT89C51RC is a low-power, high-performance CMOS 8-bit microcontroller with 32K bytes of Flash programmable read-only memory and 512 bytes of RAM. The device is manufactured using Atmel’s high-density nonvolatile memory technology and is compatible with the industry-standard 80C51 and 80C52 instruction set and pinout. The on-chip Flash allows the program memory to be user programmed by a conventional nonvolatile memory programmer. A total of 512 bytes of internal RAM are available in the AT89C51RC. The 256-byte expanded internal RAM is accessed via MOVX instructions after clearing bit 1 in the SFR located at address 8EH. The other 256-byte RAM segment is accessed the same way as the Atmel AT89-series and other 8052-compatible products. By combining a versatile 8-bit CPU with Flash on a monolithic chip, the Atmel AT89C51RC is a powerful microcomputer which provides a highly-flexible and cost-effective solution to many embedded control applications. The AT89C51RC provides the following standard features: 32K bytes of Flash, 512 bytes of RAM, 32 I/O lines, three 16-bit timer/counters, a six-vector two-level interrupt architecture, a full duplex serial port, on-chip oscillator, and clock circuitry. In addition, the AT89C51RC is designed with static logic for operation down to zero frequency and supports two software selectable power saving modes. The Idle Mode stops the CPU while allowing the RAM, timer/counters, serial port, and interrupt system to continue functioning. The Power-down mode saves the RAM contents but freezes the oscillator, disabling all other chip functions until the next external interrupt or hardware reset. 1920C–MICRO–03/05 2. Pin Configurations 44A – 44-lead TQFP 44 43 42 41 40 39 38 37 36 35 34 P1.4 P1.3 P1.2 P1.1 (T2 EX) P1.0 (T2) NC VCC P0.0 (AD0) P0.1 (AD1) P0.2 (AD2) P0.3 (AD3) 2.1 33 32 31 30 29 28 27 26 25 24 23 1 2 3 4 5 6 7 8 9 10 11 P0.4 (AD4) P0.5 (AD5) P0.6 (AD6) P0.7 (AD7) EA/VPP NC ALE/PROG PSEN P2.7 (A15) P2.6 (A14) P2.5 (A13) (WR) P3.6 (RD) P3.7 XTAL2 XTAL1 GND GND (A8) P2.0 (A9) P2.1 (A10) P2.2 (A11) P2.3 (A12) P2.4 12 13 14 15 16 17 18 19 20 21 22 P1.5 P1.6 P1.7 RST (RXD) P3.0 NC (TXD) P3.1 (INT0) P3.2 (INT1) P3.3 (T0) P3.4 (T1) P3.5 44J – 44-lead PLCC 39 38 37 36 35 34 33 32 31 30 29 18 19 20 21 22 23 24 25 26 27 28 7 8 9 10 11 12 13 14 15 16 17 P0.4 (AD4) P0.5 (AD5) P0.6 (AD6) P0.7 (AD7) EA/VPP NC ALE/PROG PSEN P2.7 (A15) P2.6 (A14) P2.5 (A13) (WR) P3.6 (RD) P3.7 XTAL2 XTAL1 GND NC (A8) P2.0 (A9) P2.1 (A10) P2.2 (A11) P2.3 (A12) P2.4 P1.5 P1.6 P1.7 RST (RXD) P3.0 NC (TXD) P3.1 (INT0) P3.2 (INT1) P3.3 (T0) P3.4 (T1) P3.5 6 5 4 3 2 1 44 43 42 41 40 P1.4 P1.3 P1.2 P1.1 (T2 EX) P1.0 (T2) NC VCC P0.0 (AD0) P0.1 (AD1) P0.2 (AD2) P0.3 (AD3) 2.2 2.3 40P6 – 40-lead PDIP (T2) P1.0 (T2EX) P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 RST (RXD) P3.0 (TXD) P3.1 (INT0) P3.2 (INT1) P3.3 (T0) P3.4 (T1) P3.5 (WR) P3.6 (RD) P3.7 XTAL2 XTAL1 GND 2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 VCC P0.0 (AD0) P0.1 (AD1) P0.2 (AD2) P0.3 (AD3) P0.4 (AD4) P0.5 (AD5) P0.6 (AD6) P0.7 (AD7) EA/VPP ALE/PROG PSEN P2.7 (A15) P2.6 (A14) P2.5 (A13) P2.4 (A12) P2.3 (A11) P2.2 (A10) P2.1 (A9) P2.0 (A8) AT89C51RC 1920C–MICRO–03/05 AT89C51RC 3. Block Diagram P0.0 - P0.7 P2.0 - P2.7 PORT 0 DRIVERS PORT 2 DRIVERS VCC GND RAM ADDR. REGISTER B REGISTER PORT 0 LATCH RAM PORT 2 LATCH FLASH STACK POINTER ACC BUFFER TMP1 TMP2 PROGRAM ADDRESS REGISTER PC INCREMENTER ALU INTERRUPT, SERIAL PORT, AND TIMER BLOCKS PROGRAM COUNTER PSW PSEN ALE/PROG EA / VPP TIMING AND CONTROL DUAL DPTR INSTRUCTION REGISTER RST WATCH DOG PORT 1 LATCH PORT 3 LATCH PORT 1 DRIVERS PORT 3 DRIVERS OSC P1.0 - P1.7 P3.0 - P3.7 3 1920C–MICRO–03/05 4. Pin Description 4.1 VCC Supply voltage. 4.2 GND Ground. 4.3 Port 0 Port 0 is an 8-bit open drain bi-directional I/O port. As an output port, each pin can sink eight TTL inputs. When 1s are written to port 0 pins, the pins can be used as high-impedance inputs. Port 0 can also be configured to be the multiplexed low-order address/data bus during accesses to external program and data memory. In this mode, P0 has internal pull-ups. Port 0 also receives the code bytes during Flash programming and outputs the code bytes during program verification. External pull-ups are required during program verification. 4.4 Port 1 Port 1 is an 8-bit bi-directional I/O port with internal pull-ups. The Port 1 output buffers can sink/source four TTL inputs. When 1s are written to Port 1 pins, they are pulled high by the internal pull-ups and can be used as inputs. As inputs, Port 1 pins that are externally being pulled low will source current (IIL) because of the internal pull-ups. In addition, P1.0 and P1.1 can be configured to be the timer/counter 2 external count input (P1.0/T2) and the timer/counter 2 trigger input (P1.1/T2EX), respectively, as shown in the following table. Port 1 also receives the low-order address bytes during Flash programming and verification. 4.5 Port Pin Alternate Functions P1.0 T2 (external count input to Timer/Counter 2), clock-out P1.1 T2EX (Timer/Counter 2 capture/reload trigger and direction control) Port 2 Port 2 is an 8-bit bi-directional I/O port with internal pull-ups. The Port 2 output buffers can sink/source four TTL inputs. When 1s are written to Port 2 pins, they are pulled high by the internal pull-ups and can be used as inputs. As inputs, Port 2 pins that are externally being pulled low will source current (IIL) because of the internal pull-ups. Port 2 emits the high-order address byte during fetches from external program memory and during accesses to external data memory that use 16-bit addresses (MOVX @ DPTR). In this application, Port 2 uses strong internal pull-ups when emitting 1s. During accesses to external data memory that use 8-bit addresses (MOVX @ RI), Port 2 emits the contents of the P2 Special Function Register. Port 2 also receives the high-order address bits and some control signals during Flash programming and verification. 4 AT89C51RC 1920C–MICRO–03/05 AT89C51RC 4.6 Port 3 Port 3 is an 8-bit bi-directional I/O port with internal pull-ups. The Port 3 output buffers can sink/source four TTL inputs. When 1s are written to Port 3 pins, they are pulled high by the internal pull-ups and can be used as inputs. As inputs, Port 3 pins that are externally being pulled low will source current (IIL) because of the pull-ups. Port 3 receives some control signals for Flash programming and verification. Port 3 also serves the functions of various special features of the AT89C51RC, as shown in the following table. 4.7 Port Pin Alternate Functions P3.0 RXD (serial input port) P3.1 TXD (serial output port) P3.2 INT0 (external interrupt 0) P3.3 INT1 (external interrupt 1) P3.4 T0 (timer 0 external input) P3.5 T1 (timer 1 external input) P3.6 WR (external data memory write strobe) P3.7 RD (external data memory read strobe) RST Reset input. A high on this pin for two machine cycles while the oscillator is running resets the device. This pin drives High for 98 oscillator periods after the Watchdog times out. The DISRTO bit in SFR AUXR (address 8EH) can be used to disable this feature. In the default state of bit DISRTO, the RESET HIGH out feature is enabled. 4.8 ALE/PROG Address Latch Enable is an output pulse for latching the low byte of the address during accesses to external memory. This pin is also the program pulse input (PROG) during Flash programming. In normal operation, ALE is emitted at a constant rate of 1/6 the oscillator frequency and may be used for external timing or clocking purposes. Note, however, that one ALE pulse is skipped during each access to external data memory. If desired, ALE operation can be disabled by setting bit 0 of SFR location 8EH. With the bit set, ALE is active only during a MOVX or MOVC instruction. Otherwise, the pin is weakly pulled high. Setting the ALE-disable bit has no effect if the microcontroller is in external execution mode. 4.9 PSEN Program Store Enable is the read strobe to external program memory. When the AT89C51RC is executing code from external program memory, PSEN is activated twice each machine cycle, except that two PSEN activations are skipped during each access to external data memory. 5 1920C–MICRO–03/05 4.10 EA/VPP External Access Enable. EA must be strapped to GND in order to enable the device to fetch code from external program memory locations starting at 0000H up to FFFFH. Note, however, that if lock bit 1 is programmed, EA will be internally latched on reset. EA should be strapped to VCC for internal program executions. This pin also receives the 12-volt programming enable voltage (VPP) during Flash programming. 4.11 XTAL1 Input to the inverting oscillator amplifier and input to the internal clock operating circuit. 4.12 XTAL2 Output from the inverting oscillator amplifier. 5. Special Function Registers A map of the on-chip memory area called the Special Function Register (SFR) space is shown in Table 5-1. Table 5-1. AT89C51RC SFR Map and Reset Values 0F8H 0F0H 0FFH B 00000000 0F7H 0E8H 0E0H 0EFH ACC 00000000 0E7H 0D8H 0DFH 0D0H PSW 00000000 0C8H T2CON 00000000 0D7H T2MOD XXXXXX00 RCAP2L 00000000 RCAP2H 00000000 TL2 00000000 TH2 00000000 0CFH 0C0H 6 0C7H 0B8H IP XX000000 0BFH 0B0H P3 11111111 0B7H 0A8H IE 0X000000 0AFH 0A0H P2 11111111 98H SCON 00000000 90H P1 11111111 88H TCON 00000000 TMOD 00000000 TL0 00000000 TL1 00000000 TH0 00000000 TH1 00000000 80H P0 11111111 SP 00000111 DP0L 00000000 DP0H 00000000 DP1L 00000000 DP1H 00000000 AUXR1 XXXXXXX0 WDTRST XXXXXXXX 0A7H SBUF XXXXXXXX 9FH 97H AUXR XXX00X00 8FH PCON 0XXX0000 87H AT89C51RC 1920C–MICRO–03/05 AT89C51RC Note that not all of the addresses are occupied, and unoccupied addresses may not be implemented on the chip. Read accesses to these addresses will in general return random data, and write accesses will have an indeterminate effect. User software should not write 1s to these unlisted locations, since they may be used in future products to invoke new features. In that case, the reset or inactive values of the new bits will always be 0. Timer 2 Registers: Control and status bits are contained in registers T2CON (shown in Table 52) and T2MOD (shown in Table 13-1 and Table 5-4) for Timer 2. The register pair (RCAP2H, RCAP2L) are the Capture/Reload registers for Timer 2 in 16-bit capture mode or 16-bit autoreload mode. Interrupt Registers: The individual interrupt enable bits are in the IE register. Two priorities can be set for each of the six interrupt sources in the IP register. Dual Data Pointer Registers: To facilitate accessing both internal and external data memory, two banks of 16-bit Data Pointer Registers are provided: DP0 at SFR address locations 82H83H and DP1 at 84H-85H. Bit DPS = 0 in SFR AUXR1 selects DP0 and DPS = 1 selects DP1. The user should always initialize the DPS bit to the appropriate value before accessing the respective Data Pointer Register. Power Off Flag: The Power Off Flag (POF) is located at bit 4 (PCON.4) in the PCON SFR. POF is set to “1” during power up. It can be set and reset under software control and is not affected by reset. 7 1920C–MICRO–03/05 Table 5-2. T2CON – Timer/Counter 2 Control Register T2CON Address = 0C8H Reset Value = 0000 0000B Bit Addressable TF2 EXF2 RCLK TCLK EXEN2 TR2 C/T2 CP/RL2 7 6 5 4 3 2 1 0 Bit Symbol Function TF2 Timer 2 overflow flag set by a Timer 2 overflow and must be cleared by software. TF2 will not be set when either RCLK = 1 or TCLK = 1. EXF2 Timer 2 external flag set when either a capture or reload is caused by a negative transition on T2EX and EXEN2 = 1. When Timer 2 interrupt is enabled, EXF2 = 1 will cause the CPU to vector to the Timer 2 interrupt routine. EXF2 must be cleared by software. EXF2 does not cause an interrupt in up/down counter mode (DCEN = 1). RCLK Receive clock enable. When set, causes the serial port to use Timer 2 overflow pulses for its receive clock in serial port Modes 1 and 3. RCLK = 0 causes Timer 1 overflow to be used for the receive clock. TCLK Transmit clock enable. When set, causes the serial port to use Timer 2 overflow pulses for its transmit clock in serial port Modes 1 and 3. TCLK = 0 causes Timer 1 overflows to be used for the transmit clock. EXEN2 Timer 2 external enable. When set, allows a capture or reload to occur as a result of a negative transition on T2EX if Timer 2 is not being used to clock the serial port. EXEN2 = 0 causes Timer 2 to ignore events at T2EX. TR2 Start/Stop control for Timer 2. TR2 = 1 starts the timer. C/T2 Timer or counter select for Timer 2. C/T2 = 0 for timer function. C/T2 = 1 for external event counter (falling edge triggered). CP/RL2 Capture/Reload select. CP/RL2 = 1 causes captures to occur on negative transitions at T2EX if EXEN2 = 1. CP/RL2 = 0 causes automatic reloads to occur when Timer 2 overflows or negative transitions occur at T2EX when EXEN2 = 1. When either RCLK or TCLK = 1, this bit is ignored and the timer is forced to auto-reload on Timer 2 overflow. 8 AT89C51RC 1920C–MICRO–03/05 AT89C51RC Table 5-3. AUXR: Auxiliary Register AUXR Address = 8EH Reset Value = XXX00X00B Not Bit Addressable Bit – – – WDIDLE DISRTO – EXTRAM DISALE 7 6 5 4 3 2 1 0 – Reserved for future expansion DISALE Disable/Enable ALE EXTRAM DISRTO WDIDLE DISALE Operating Mode 0 ALE is emitted at a constant rate of 1/6 the oscillator frequency 1 ALE is active only during a MOVX or MOVC instruction Internal/External RAM access using MOVX @ Ri/@DPTR EXTRAM Operating Mode 0 Internal ERAM (00H-FFH) access using MOVX @ Ri/@DPTR 1 External data memory access Disable/Enable Reset out DISRTO Operating Mode 0 Reset pin is driven High after WDT times out 1 Reset pin is input only Disable/Enable WDT in IDLE mode WDIDLE Operating Mode 0 WDT continues to count in IDLE mode 1 WDT halts counting in IDLE mode Table 5-4. AUXR1: Auxiliary Register 1 AUXR1 Address = A2H Reset Value = XXXXXXX0B Not Bit Addressable Bit – – – – – – – DPS 7 6 5 4 3 2 1 0 – Reserved for future expansion DPS Data Pointer Register Select DPS 0 Selects DPTR Registers DP0L, DP0H 1 Selects DPTR Registers DP1L, DP1H 9 1920C–MICRO–03/05 6. Memory Organization The MCS-51 devices have a separate address space for Program and Data Memory. Up to 64K bytes each of external Program and Data Memory can be addressed. 7. Program Memory If the EA pin is connected to GND, all program fetches are directed to external memory. On the AT89C51RC, if EA is connected to VCC, program fetches to addresses 0000H through 7FFFH are directed to internal memory and fetches to addresses 8000H through FFFFH are to external memory. 7.1 Data Memory The AT89C51RC has internal data memory that is mapped into four separate segments: the lower 128 bytes of RAM, upper 128 bytes of RAM, 128 bytes special function register (SFR) and 256 bytes expanded RAM (ERAM). The four segments are: 1. The Lower 128 bytes of RAM (addresses 00H to 7FH) are directly and indirectly addressable. 2. The Upper 128 bytes of RAM (addresses 80H to FFH) are indirectly addressable only. 3. The Special Function Registers, SFRs, (addresses 80H to FFH) are directly addressable only. 4. The 256-byte expanded RAM (ERAM, 00H-FFH) is indirectly accessed by MOVX instructions, and with the EXTRAM bit cleared. The Lower 128 bytes can be accessed by either direct or indirect addressing. The Upper 128 bytes can be accessed by indirect addressing only. The Upper 128 bytes occupy the same address space as the SFR. This means they have the same address, but are physically separate from the SFR space. When an instruction accesses an internal location above address 7FH, the CPU knows whether the access is to the upper 128 bytes of data RAM or to SFR space by the addressing mode used in the instruction. Instructions that use direct addressing access SFR space. For example: MOV 0A0H, # data accesses the SFR at location 0S0H (which is P2). Instructions that use indirect addressing access the Upper 128 bytes of data RAM. For example: MOV@R0, # data where R0 contains 0A0H, accesses the data byte at address 0A0H, rather than P2 (whose address is 0A0H). Note that stack operations are examples of indirect addressing, so the upper 128 bytes of data RAM are available as stack space. The 256 bytes of ERAM can be accessed by indirect addressing, with EXTRAM bit cleared and MOVX instructions. This part of memory is physically located on-chip, logically occupying the first 256 bytes of external data memory. 10 AT89C51RC 1920C–MICRO–03/05 AT89C51RC With EXTRAM = 0, the ERAM is indirectly addressed, using the MOVX instruction in combination with any of the registers R0, R1 of the selected bank or DPTR. An access to ERAM will not affect ports P0, P2, P3.6 (WR), and P3.7 (RD). For example, with EXTRAM = 0, MOVX@R0, # data where R0 contains 0A0H, accesses the ERAM at address 0A0H rather than external memory. An access to external data memory locations higher than FFH (i.e. 0100H to FFFFH) will be performed with the MOVX DPTR instructions in the same way as in the standard 80C51, i.e., with P0 and P2 as data/address bus, and P3.6 and P3.7 as write and read timing signals (see Figure 7-1). Figure 7-1. Internal and External Data Memory Address (with EXTRAM = 0) FF UPPER 128 BYTES INTERNAL RAM ERAM 256 BYTES 00 EXTERNAL DATA MEMORY SPECIAL FUNCTION REGISTER 80 80 LOWER 128 BYTES INTERNAL RAM 00 FFFF FF FF 0100 0000 With EXTRAM = 1, MOVX @ Ri and MOVX@DPTR will be similar to the standard 80C51. MOVX@Ri will provide an 8-bit address multiplexed with data on Port 0 and any output port pins can be used to output higher-order address bits. This is to provide the external paging capability. MOVX@DPTR will generate a 16-bit address. Port 2 outputs the high-order 8 address bits (the contents of DP0H), while Port 0 multiplexes the low-order 8 address bits (the contents of DP0L) with data. MOVX@Ri and MOVX@DPTR will generate either read or write signals on P3.6 (WR) and P3.7 (RD). The stack pointer (SP) may be located anywhere in the 256 bytes RAM (lower and upper RAM) internal data memory. The stack may not be located in the ERAM. 8. Hardware Watchdog Timer (One-time Enabled with Reset-out) The WDT is intended as a recovery method in situations where the CPU may be subjected to software upsets. The WDT consists of a 13-bit counter and the WatchDog Timer Reset (WDTRST) SFR. The WDT is defaulted to disable from exiting reset. To enable the WDT, a user must write 01EH and 0E1H in sequence to the WDTRST register (SFR location 0A6H). When the WDT is enabled, it will increment every machine cycle while the oscillator is running. The WDT timeout period is dependent on the external clock frequency. There is no way to disable the WDT except through reset (either hardware reset or WDT overflow reset). When WDT overflows, it will drive an output RESET HIGH pulse at the RST pin. 11 1920C–MICRO–03/05 9. Using the WDT To enable the WDT, a user must write 01EH and 0E1H in sequence to the WDTRST register (SFR location 0A6H). When the WDT is enabled, the user needs to service it by writing 01EH and 0E1H to WDTRST to avoid a WDT overflow. The 13-bit counter overflows when it reaches 8191 (1FFFH), and this will reset the device. When the WDT is enabled, it will increment every machine cycle while the oscillator is running. This means the user must re-initialize the WDT at least every 8191 machine cycles. To re-initialize the WDT the user must write 01EH and 0E1H to WDTRST. WDTRST is a write-only register. The WDT counter cannot be read or written. When WDT overflows, it will generate an output RESET pulse at the RST pin. The RESET pulse duration is 98xTOSC, where TOSC=1/FOSC. To make the best use of the WDT, it should be serviced in those sections of code that will periodically be executed within the time required to prevent a WDT reset. 10. WDT During Power-down and Idle In Power-down mode the oscillator stops, which means the WDT also stops. While in Powerdown mode, the user does not need to service the WDT. There are two methods of exiting Power-down mode: by a hardware reset or via a level-activated external interrupt which is enabled prior to entering Power-down mode. When Power-down is exited with hardware reset, servicing the WDT should occur as it normally does whenever the AT89C51RC is reset. Exiting Power-down with an interrupt is significantly different. The interrupt is held low long enough for the oscillator to stabilize. When the interrupt is brought high, the interrupt is serviced. To prevent the WDT from resetting the device while the interrupt pin is held low, the WDT is not started until the interrupt is pulled high. It is suggested that the WDT be reset during the interrupt service for the interrupt used to exit Power-down mode. To ensure that the WDT does not overflow within a few states of exiting Power-down, it is best to reset the WDT just before entering Power-down mode. Before going into the IDLE mode, the WDIDLE bit in SFR AUXR is used to determine whether the WDT continues to count if enabled. The WDT keeps counting during IDLE (WDIDLE bit = 0) as the default state. To prevent the WDT from resetting the AT89C51RC while in IDLE mode, the user should always set up a timer that will periodically exit IDLE, service the WDT, and reenter IDLE mode. With WDIDLE bit enabled, the WDT will stop to count in IDLE mode and resumes the count upon exit from IDLE. 11. UART The UART in the AT89C51RC operates the same way as the UART in the AT89C51 and AT89C52. For more detailed information on the UART operation, please click on the document link below: http://www.atmel.com/dyn/resources/prod_documents/DOC4316.PDF 12 AT89C51RC 1920C–MICRO–03/05 AT89C51RC 12. Timer 0 and 1 Timer 0 and Timer 1 in the AT89C51RC operate the same way as Timer 0 and Timer 1 in the AT89C51 and AT89C52. For further information on the timers’ operation, please click on the document link below: http://www.atmel.com/dyn/resources/prod_documents/DOC4316.PDF 13. Timer 2 Timer 2 is a 16-bit Timer/Counter that can operate as either a timer or an event counter. The type of operation is selected by bit C/T2 in the SFR T2CON (shown in Table 5-2). Timer 2 has three operating modes: capture, auto-reload (up or down counting), and baud rate generator. The modes are selected by bits in T2CON, as shown in Table 13-1. Timer 2 consists of two 8-bit registers, TH2 and TL2. In the Timer function, the TL2 register is incremented every machine cycle. Since a machine cycle consists of 12 oscillator periods, the count rate is 1/12 of the oscillator frequency. Table 13-1. Timer 2 Operating Modes RCLK +TCLK CP/RL2 TR2 MODE 0 0 1 16-bit Auto-reload 0 1 1 16-bit Capture 1 X 1 Baud Rate Generator X X 0 (Off) In the Counter function, the register is incremented in response to a 1-to-0 transition at its corresponding external input pin, T2. In this function, the external input is sampled during S5P2 of every machine cycle. When the samples show a high in one cycle and a low in the next cycle, the count is incremented. The new count value appears in the register during S3P1 of the cycle following the one in which the transition was detected. Since two machine cycles (24 oscillator periods) are required to recognize a 1-to-0 transition, the maximum count rate is 1/24 of the oscillator frequency. To ensure that a given level is sampled at least once before it changes, the level should be held for at least one full machine cycle. 13.1 Capture Mode In the capture mode, two options are selected by bit EXEN2 in T2CON. If EXEN2 = 0, Timer 2 is a 16-bit timer or counter which upon overflow sets bit TF2 in T2CON. This bit can then be used to generate an interrupt. If EXEN2 = 1, Timer 2 performs the same operation, but a 1-to-0 transition at external input T2EX also causes the current value in TH2 and TL2 to be captured into RCAP2H and RCAP2L, respectively. In addition, the transition at T2EX causes bit EXF2 in T2CON to be set. The EXF2 bit, like TF2, can generate an interrupt. The capture mode is illustrated in Figure 13-1. 13 1920C–MICRO–03/05 13.2 Auto-Reload (Up or Down Counter) Timer 2 can be programmed to count up or down when configured in its 16-bit auto-reload mode. This feature is invoked by the DCEN (Down Counter Enable) bit located in the SFR T2MOD (see Table 13-2). Upon reset, the DCEN bit is set to 0 so that timer 2 will default to count up. When DCEN is set, Timer 2 can count up or down, depending on the value of the T2EX pin. Figure 13-2 shows Timer 2 automatically counting up when DCEN=0. In this mode, two options are selected by bit EXEN2 in T2CON. If EXEN2 = 0, Timer 2 counts up to 0FFFFH and then sets the TF2 bit upon overflow. The overflow also causes the timer registers to be reloaded with the 16-bit value in RCAP2H and RCAP2L. The values in Timer in Capture Mode RCAP2H and RCAP2L are preset by software. If EXEN2 = 1, a 16-bit reload can be triggered either by an overflow or by a 1-to-0 transition at external input T2EX. This transition also sets the EXF2 bit. Both the TF2 and EXF2 bits can generate an interrupt if enabled. Setting the DCEN bit enables Timer 2 to count up or down, as shown in Figure 13-2. In this mode, the T2EX pin controls the direction of the count. A logic 1 at T2EX makes Timer 2 count up. The timer will overflow at 0FFFFH and set the TF2 bit. This overflow also causes the 16-bit value in RCAP2H and RCAP2L to be reloaded into the timer registers, TH2 and TL2, respectively. A logic 0 at T2EX makes Timer 2 count down. The timer underflows when TH2 and TL2 equal the values stored in RCAP2H and RCAP2L. The underflow sets the TF2 bit and causes 0FFFFH to be reloaded into the timer registers. The EXF2 bit toggles whenever Timer 2 overflows or underflows and can be used as a 17th bit of resolution. In this operating mode, EXF2 does not flag an interrupt. Figure 13-1. Timer in Capture Mode ÷12 OSC C/T2 = 0 TH2 TL2 OVERFLOW CONTROL C/T2 = 1 TF2 TR2 CAPTURE T2 PIN RCAP2H RCAP2L TRANSITION DETECTOR TIMER 2 INTERRUPT T2EX PIN EXF2 CONTROL EXEN2 14 AT89C51RC 1920C–MICRO–03/05 AT89C51RC Figure 13-2. Timer 2 Auto Reload Mode (DCEN = 0) 12 OSC C/T2 = 0 TH2 TL2 OVERFLOW CONTR OL TR2 C/T2 = 1 RELO AD T2 PIN RCAP2H TIMER 2 INTERRUPT RCAP2L TF2 TRANSITION DETECTOR EXF2 T2EX PIN CONTROL EXEN2 Table 13-2. T2MOD—Timer 2 Mode Control Register T2MOD Address = 0C9H Reset Value = XXXX XX00B Not Bit Addressable Bit – – – – – – T2OE DCEN 7 6 5 4 3 2 1 0 Symbol Function – Not implemented, reserved for future T2OE Timer 2 Output Enable bit DCEN When set, this bit allows Timer 2 to be configured as an up/down counter Figure 13-3. Timer 2 Auto Reload Mode (DCEN = 1) TOGGLE (DOWN COUNTING RELOAD VALUE) 0FFH OSC 0FFH 12 EXF2 OVERFLOW C/T2 = 0 TH2 TL2 TF2 CONTROL TR2 TIMER 2 INTERRUPT C/T2 = 1 T2 PIN RCAP2H RCAP2L (UP COUNTING RELOAD VALUE) COUNT DIRECTION 1=UP 0=DO T2EX PIN 15 1920C–MICRO–03/05 14. Baud Rate Generator Timer 2 is selected as the baud rate generator by setting TCLK and/or RCLK in T2CON (Table 5-2). Note that the baud rates for transmit and receive can be different if Timer 2 is used for the receiver or transmitter and Timer 1 is used for the other function. Setting RCLK and/or TCLK puts Timer 2 into its baud rate generator mode, as shown in Figure 14-1. The baud rate generator mode is similar to the auto-reload mode, in that a rollover in TH2 causes the Timer 2 registers to be reloaded with the 16-bit value in registers RCAP2H and RCAP2L, which are preset by software. The baud rates in Modes 1 and 3 are determined by Timer 2’s overflow rate according to the following equation. Timer 2 Overflow Rate Mdes 1 and 3 Baud Rates = -----------------------------------------------------------16 Figure 14-1. Timer 2 in Baud Rate Generator Mode TIMER 1 OVERFLOW ÷2 "0" "1" NOTE: OSC. FREQ. IS DIVIDED BY 2, NOT 12 SMOD1 OSC ÷2 C/T2 = 0 "1" TH2 "0" TL2 RCLK CONTROL TR2 ÷ 16 Rx CLOCK C/T2 = 1 "1" "0" T2 PIN TCLK RCAP2H RCAP2L TRANSITION DETECTOR ÷ 16 T2EX PIN EXF2 Tx CLOCK TIMER 2 INTERRUPT CONTROL EXEN2 The Timer can be configured for either timer or counter operation. In most applications, it is configured for timer operation (CP/T2 = 0). The timer operation is different for Timer 2 when it is used as a baud rate generator. Normally, as a timer, it increments every machine cycle (at 1/12 the oscillator frequency). As a baud rate generator, however, it increments every state time (at 1/2 the oscillator frequency). The baud rate formula is given below. Modes 1 and 3 Oscillator Frequency --------------------------------------- = -------------------------------------------------------------------------------------Baud Rate 32 x [65536-RCAP2H,RCAP2L)] where (RCAP2H, RCAP2L) is the content of RCAP2H and RCAP2L taken as a 16-bit unsigned integer. Timer 2 as a baud rate generator is shown in Figure 14-1. This figure is valid only if RCLK or TCLK = 1 in T2CON. Note that a rollover in TH2 does not set TF2 and will not generate an inter- 16 AT89C51RC 1920C–MICRO–03/05 AT89C51RC rupt. Note too, that if EXEN2 is set, a 1-to-0 transition in T2EX will set EXF2 but will not cause a reload from (RCAP2H, RCAP2L) to (TH2, TL2). Thus when Timer 2 is in use as a baud rate generator, T2EX can be used as an extra external interrupt. Note that when Timer 2 is running (TR2 = 1) as a timer in the baud rate generator mode, TH2 or TL2 should not be read from or written to. Under these conditions, the Timer is incremented every state time, and the results of a read or write may not be accurate. The RCAP2 registers may be read but should not be written to, because a write might overlap a reload and cause write and/or reload errors. The timer should be turned off (clear TR2) before accessing the Timer 2 or RCAP2 registers. 15. Programmable Clock Out A 50% duty cycle clock can be programmed to come out on P1.0, as shown in Figure 15-1. This pin, besides being a regular I/O pin, has two alternate functions. It can be programmed to input the external clock for Timer/Counter 2 or to output a 50% duty cycle clock ranging from 61 Hz to 4 MHz at a 16 MHz operating frequency. To configure the Timer/Counter 2 as a clock generator, bit C/T2 (T2CON.1) must be cleared and bit T2OE (T2MOD.1) must be set. Bit TR2 (T2CON.2) starts and stops the timer. The clock-out frequency depends on the oscillator frequency and the reload value of Timer 2 capture registers (RCAP2H, RCAP2L), as shown in the following equation. Oscillator Frequency Clock-Out Frequency = -----------------------------------------------------------------------------------4 x [65536-(RCAP2H,RCAP2L)] In the clock-out mode, Timer 2 roll-overs will not generate an interrupt. This behavior is similar to when Timer 2 is used as a baud-rate generator. It is possible to use Timer 2 as a baud-rate generator and a clock generator simultaneously. Note, however, that the baud-rate and clock-out frequencies cannot be determined independently from one another since they both use RCAP2H and RCAP2L. Figure 15-1. Timer 2 in Clock-Out Mode OSC TL2 (8-BITS) ÷2 TH2 (8-BITS) TR2 RCAP2L RCAP2H C/T2 BIT P1.0 (T2) ÷2 T2OE (T2MOD.1) TRANSITION DETECTOR P1.1 (T2EX) EXF2 TIMER 2 INTERRUPT EXEN2 17 1920C–MICRO–03/05 16. Interrupts The AT89C51RC has a total of six interrupt vectors: two external interrupts (INT0 and INT1), three timer interrupts (Timers 0, 1, and 2), and the serial port interrupt. These interrupts are all shown in Figure 16-1. Each of these interrupt sources can be individually enabled or disabled by setting or clearing a bit in Special Function Register IE. IE also contains a global disable bit, EA, which disables all interrupts at once. Note that Table 14-1 shows that bit position IE.6 is unimplemented. User software should not write 1s to these bit positions, since they may be used in future AT89 products. Timer 2 interrupt is generated by the logical OR of bits TF2 and EXF2 in register T2CON. Neither of these flags is cleared by hardware when the service routine is vectored to. In fact, the service routine may have to determine whether it was TF2 or EXF2 that generated the interrupt, and that bit will have to be cleared in software. The Timer 0 and Timer 1 flags, TF0 and TF1, are set at S5P2 of the cycle in which the timers overflow. The values are then polled by the circuitry in the next cycle. However, the Timer 2 flag, TF2, is set at S2P2 and is polled in the same cycle in which the timer overflows. Table 16-1. Interrupt Enable (IE) Register (MSB) EA (LSB) – ET2 ES ET1 EX1 ET0 EX0 Enable Bit = 1 enables the interrupt. Enable Bit = 0 disables the interrupt. Symbol Position Function EA IE.7 Disables all interrupts. If EA = 0, no interrupt is acknowledged. If EA = 1, each interrupt source is individually enabled or disabled by setting or clearing its enable bit. – IE.6 Reserved. ET2 IE.5 Timer 2 interrupt enable bit. ES IE.4 Serial Port interrupt enable bit. ET1 IE.3 Timer 1 interrupt enable bit. EX1 IE.2 External interrupt 1 enable bit. ET0 IE.1 Timer 0 interrupt enable bit. EX0 IE.0 External interrupt 0 enable bit. User software should never write 1s to reserved bits, because they may be used in future AT89 products. 18 AT89C51RC 1920C–MICRO–03/05 AT89C51RC Figure 16-1. Interrupt Sources 0 IE0 INT0 1 TF0 0 INT1 IE1 1 TF1 TI RI TF2 EXF2 17. Oscillator Characteristics XTAL1 and XTAL2 are the input and output, respectively, of an inverting amplifier that can be configured for use as an on-chip oscillator, as shown in Figure 19-1. Either a quartz crystal or ceramic resonator may be used. To drive the device from an external clock source, XTAL2 should be left unconnected while XTAL1 is driven, as shown in Figure 19-2. There are no requirements on the duty cycle of the external clock signal, since the input to the internal clocking circuitry is through a divide-by-two flip-flop, but minimum and maximum voltage high and low time specifications must be observed. 18. Idle Mode In idle mode, the CPU puts itself to sleep while all the on-chip peripherals remain active. The mode is invoked by software. The content of the on-chip RAM and all the special functions registers remain unchanged during this mode. The idle mode can be terminated by any enabled interrupt or by a hardware reset. Note that when idle mode is terminated by a hardware reset, the device normally resumes program execution from where it left off, up to two machine cycles before the internal reset algorithm takes control. On-chip hardware inhibits access to internal RAM in this event, but access to the port pins is not inhibited. To eliminate the possibility of an unexpected write to a port pin when idle mode is terminated by a reset, the instruction following the one that invokes idle mode should not write to a port pin or to external memory. 19 1920C–MICRO–03/05 19. Power-down Mode In the Power-down mode, the oscillator is stopped, and the instruction that invokes Power-down is the last instruction executed. The on-chip RAM and Special Function Registers retain their values until the Power-down mode is terminated. Exit from Power-down can be initiated either by a hardware reset or by an enabled external interrupt. Reset redefines the SFRs but does not change the on-chip RAM. The reset should not be activated before VCC is restored to its normal operating level and must be held active long enough to allow the oscillator to restart and stabilize. Figure 19-1. Oscillator Connections C2 XTAL2 C1 XTAL1 GND Note: C1, C2 = 30 pF ± 10 pF for Crystals = 40 pF ± 10 pF for Ceramic Resonators Figure 19-2. External Clock Drive Configuration NC XTAL2 EXTERNAL OSCILLATOR SIGNAL XTAL1 GND Table 19-1. 20 Status of External Pins During Idle and Power-down Modes Mode Program Memory Idle ALE PSEN PORT0 PORT1 PORT2 PORT3 Internal 1 1 Data Data Data Data Idle External 1 1 Float Data Address Data Power-down Internal 0 0 Data Data Data Data Power-down External 0 0 Float Data Data Data AT89C51RC 1920C–MICRO–03/05 AT89C51RC 20. Program Memory Lock Bits The AT89C51RC has three lock bits that can be left unprogrammed (U) or can be programmed (P) to obtain the additional features listed in Table 20-1. Table 20-1. Lock Bit Protection Modes Program Lock Bits 1 LB1 LB2 LB3 Protection Type U U U No program lock features 2 P U U MOVC instructions executed from external program memory are disabled from fetching code bytes from internal memory, EA is sampled and latched on reset, and further programming of the Flash memory is disabled 3 P P U Same as mode 2, but verify is also disabled 4 P P P Same as mode 3, but external execution is also disabled When lock bit 1 is programmed, the logic level at the EA pin is sampled and latched during reset. If the device is powered up without a reset, the latch initializes to a random value and holds that value until reset is activated. The latched value of EA must agree with the current logic level at that pin in order for the device to function properly. 21. Programming the Flash The AT89C51RC is shipped with the on-chip Flash memory array ready to be programmed. The programming interface needs a high-voltage (12-volt) program enable signal and is compatible with conventional third-party Flash or EPROM programmers. The AT89C51RC code memory array is programmed byte-by-byte. Programming Algorithm: Before programming the AT89C51RC, the address, data, and control signals should be set up according to Table 22-1 and Figures 22-1 and 22-2. To program the AT89C51RC, take the following steps: 1. Input the desired memory location on the address lines. 2. Input the appropriate data byte on the data lines. 3. Activate the correct combination of control signals. 4. Raise EA/VPP to 12V. 5. Pulse ALE/PROG once to program a byte in the Flash array or the lock bits. The bytewrite cycle is self-timed and typically takes no more than 50 µs. Repeat steps 1 through 5, changing the address and data for the entire array or until the end of the object file is reached. 21 1920C–MICRO–03/05 Chip Erase Sequence: Before the AT89C51RC can be reprogrammed, a Chip Erase operation needs to be performed. To erase the contents of the AT89C51RC, follow this sequence: 1. Raise VCC to 6.5V. 2. Pulse ALE/PROG once (duration of 200 ns - 500 ns) and wait for 150 ms. 3. Power VCC down and up to 6.5V. 4. Pulse ALE/PROG once (duration of 200 ns - 500 ns) and wait for 150 ms. 5. Power VCC down and up. Data Polling: The AT89C51RC features Data Polling to indicate the end of a write cycle. During a write cycle, an attempted read of the last byte written will result in the complement of the written data on P0.7. Once the write cycle has been completed, true data is valid on all outputs, and the next cycle may begin. Data Polling may begin any time after a write cycle has been initiated. Ready/Busy: The progress of byte programming can also be monitored by the RDY/BSY output signal. P3.0 is pulled low after ALE goes high during programming to indicate BUSY. P3.0 is pulled high again when programming is done to indicate READY. Program Verify: If lock bits LB1 and LB2 have not been programmed, the programmed code data can be read back via the address and data lines for verification. The status of the individual lock bits can be verified directly by reading them back. Reading the Signature Bytes: The signature bytes are read by the same procedure as a normal verification of locations 000H, 100H, and 200H, except that P3.6 and P3.7 must be pulled to a logic low. The values returned are as follows: (000H) = 1EH indicates manufactured by Atmel (100H) = 51H (200H) = 07H indicates 89C51RC 22 AT89C51RC 1920C–MICRO–03/05 AT89C51RC 22. Programming Interface Every code byte in the Flash array can be programmed by using the appropriate combination of control signals. The write operation cycle is self-timed and once initiated, will automatically time itself to completion. Most major worldwide programming vendors offer support for the Atmel AT89 microcontroller series. Please contact your local programming vendor for the appropriate software revision. Table 22-1. Flash Programming Modes Mode VCC RST PSEN P0.7-0 P3.4 P2.5-0 P1.7-0 ALE/ EA/ PROG VPP P2.6 P2.7 P3.3 P3.6 P3.7 Data 12 V L H H H H DIN A14 A13-8 A7-0 H/12 V L L L H H DOUT A14 A13-8 A7-0 12 V H H H H H X X X X 12 V H H H L L X X X X 12 V H L H H L X X X X H H H L H L P0.2, P0.3, P0.4 X X X 12V H L H L L X X X X Address (1) Write Code Data 5V H L Read Code Data 5V H L Write Lock Bit 1 6.5V H L Write Lock Bit 2 6.5V H L Write Lock Bit 3 6.5V H L 5V H L 6.5V H L Read Atmel ID 5V H L H H L L L L L 1EH X XX 0000 00H Read Device ID 5V H L H H L L L L L 51H X XX 0001 00H Read Device ID 5V H L H H L L L L L 07H X XX 0010 00H H (2) (2) (2) Read Lock Bits 1, 2, 3 H (3) Chip Erase Notes: 1. 2. 3. 4. Write Code Data requires a 200 ns PROG pulse. Write Lock Bits requires a 100 µs PROG pulse. Chip Erase requires a 200 ns - 500 ns PROG pulse. RDY/BSY signal is output on P3.0 during programming. 23 1920C–MICRO–03/05 Figure 22-1. Programming the Flash Memory 4.5V to 5.5V AT89C51RC ADDR. 0000H/7FFFH A0 - A7 A8 - A13 A14* SEE FLASH PROGRAMMING MODES TABLE P1.0 - P1.7 VCC P2.0 - P2.5 P3.4 P2.6 P2.7 P3.3 P3.6 P0 PGM DATA ALE PROG EA VIH/VPP P3.7 XTAL2 3 - 33 MHz XTAL1 GND P3.0 RDY/ BSY RST VIH PSEN Figure 22-2. Verifying the Flash Memory 4.5V to 5.5V AT89C51RC A0 - A7 ADDR. 0000H/7FFFH P1.0 - P1.7 VCC P2.0 - P2.5 P3.4 P2.6 P2.7 P3.3 P3.6 P3.7 P0 A8 - A13 A14* SEE FLASH PROGRAMMING MODES TABLE PGM DATA (USE 10K PULL-UPS) ALE VIH XTAL 2 EA XTAL1 RST 3 - 33 MHz GND Note: 24 VIH PSEN *Programming address line A14 (P3.4) is not the same as the external memory address line A14 (P2.6). AT89C51RC 1920C–MICRO–03/05 AT89C51RC 23. Flash Programming and Verification Characteristics TA = 20°C to 30°C, VCC = 4.5V to 5.5V Symbol Parameter Min Max Units VPP Programming Supply Voltage 11.5 12.5 V IPP Programming Supply Current 10 mA ICC VCC Supply Current 30 mA 1/tCLCL Oscillator Frequency 33 MHz tAVGL Address Setup to PROG Low 48tCLCL tGHAX Address Hold after PROG 48tCLCL tDVGL Data Setup to PROG Low 48tCLCL tGHDX Data Hold after PROG 48tCLCL tEHSH P2.7 (ENABLE) High to VPP 48tCLCL tSHGL VPP Setup to PROG Low 10 µs tGHSL VPP Hold after PROG 10 µs tGLGH PROG Width 0.2 tAVQV Address to Data Valid 48tCLCL tELQV ENABLE Low to Data Valid 48tCLCL tEHQZ Data Float after ENABLE tGHBL PROG High to BUSY Low 1.0 µs tWC Byte Write Cycle Time 80 µs 3 0 1 µs 48tCLCL 25 1920C–MICRO–03/05 24. Flash Programming and Verification Waveforms PROGRAMMING ADDRESS P1.0 - P1.7 P2.0 - P2.5 P3.4 VERIFICATION ADDRESS tAVQV PORT 0 DATA IN tAVGL tDVGL DATA OUT tGHDX tGHAX ALE/PROG tSHGL tGHSL tGLGH VPP LOGIC 1 LOGIC 0 EA/VPP tEHSH tEHQZ tELQV P2.7 (ENABLE) tGHBL P3.0 (RDY/BSY) BUSY READY tWC 25. Lock Bit Programming Test Conditions Setup Lockbit_1, 2 or 3 Data Setup 100 µs ALE/PROG VCC = 4.5V to 5.5V VCC = 6.5V Wait 10 ms to reload new lock bit status 26. Parallel Chip Erase Mode Test Conditions Setup Test Conditions Setup 200 ns 200 ns ALE/PROG P3<0> Erase DC Erase Erase DC Erase VCC = 4.5V to 5.5V VCC = 6.5V Wait 10 ms before reprogramming 10 ms 26 AT89C51RC 1920C–MICRO–03/05 AT89C51RC 27. Absolute Maximum Ratings* Operating Temperature.................................. -55°C to +125°C *NOTICE: Storage Temperature ..................................... -65°C to +150°C Voltage on Any Pin with Respect to Ground .....................................-1.0V to +7.0V Maximum Operating Voltage ............................................ 6.6V Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC Output Current...................................................... 15.0 mA 28. DC Characteristics The values shown in this table are valid for TA = -40°C to 85°C and VCC = 4.0V to 5.5V, unless otherwise noted. Symbol Parameter Condition Min Max Units VIL Input Low-voltage (Except EA) -0.5 0.2 VCC-0.1 V VIL1 Input Low-voltage (EA) -0.5 0.2 VCC-0.3 V VIH Input High-voltage (Except XTAL1, RST) 0.2 VCC+0.9 VCC+0.5 V VIH1 Input High-voltage (XTAL1, RST) 0.7 VCC VCC+0.5 V VOL Output Low-voltage(1) (Ports 1,2,3) IOL = 1.6 mA 0.45 V VOL1 Output Low-voltage(1) (Port 0, ALE, PSEN) IOL = 3.2 mA 0.45 V VOH Output High-voltage (Ports 1,2,3, ALE, PSEN) IOH = -60 µA, VCC = 5V ± 10% 2.4 V IOH = -25 µA 0.75 VCC V IOH = -10 µA 0.9 VCC V 2.4 V IOH = -300 µA 0.75 VCC V IOH = -80 µA 0.9 VCC V IOH = -800 µA, VCC = 5V ± 10% VOH1 Output High-voltage (Port 0 in External Bus Mode) IIL Logical 0 Input Current (Ports 1,2,3) VIN = 0.45V -50 µA ITL Logical 1 to 0 Transition Current (Ports 1,2,3) VIN = 2V, VCC = 5V ± 10% -650 µA ILI Input Leakage Current (Port 0, EA) 0.45 < VIN < VCC ±10 µA RRST Reset Pull-down Resistor 30 kΩ CIO Pin Capacitance Test Freq. = 1 MHz, TA = 25°C 10 pF Active Mode, 12 MHz 25 mA Idle Mode, 12 MHz 6.5 mA VCC = 5.5V 100 µA 10 Power Supply Current ICC Power-down Mode(1) Notes: 1. Under steady state (non-transient) conditions, IOL must be externally limited as follows: Maximum IOL per port pin: 10 mA Maximum IOL per 8-bit port: Port 0: 26 mA Ports 1, 2, 3: 15 mA Maximum total IOL for all output pins: 71 mA If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test conditions. 2. Minimum VCC for Power-down is 2V. 27 1920C–MICRO–03/05 29. AC Characteristics Under operating conditions, load capacitance for Port 0, ALE/PROG, and PSEN = 100 pF; load capacitance for all other outputs = 80 pF. 29.1 External Program and Data Memory Characteristics 12 MHz Oscillator Variable Oscillator Min Min Max Units 0 33 MHz Symbol Parameter 1/tCLCL Oscillator Frequency tLHLL ALE Pulse Width 127 2tCLCL-40 ns tAVLL Address Valid to ALE Low 43 tCLCL-25 ns tLLAX Address Hold after ALE Low 48 tCLCL-25 ns tLLIV ALE Low to Valid Instruction In tLLPL ALE Low to PSEN Low 43 tCLCL-25 ns tPLPH PSEN Pulse Width 205 3tCLCL-45 ns tPLIV PSEN Low to Valid Instruction In tPXIX Input Instruction Hold after PSEN tPXIZ Input Instruction Float after PSEN tPXAV PSEN to Address Valid tAVIV Address to Valid Instruction In 312 5tCLCL-80 ns tPLAZ PSEN Low to Address Float 10 10 ns tRLRH RD Pulse Width 400 6tCLCL-100 ns tWLWH WR Pulse Width 400 6tCLCL-100 ns tRLDV RD Low to Valid Data In tRHDX Data Hold after RD tRHDZ Data Float after RD 97 2tCLCL-28 ns tLLDV ALE Low to Valid Data In 517 8tCLCL-150 ns tAVDV Address to Valid Data In 585 9tCLCL-165 ns tLLWL ALE Low to RD or WR Low 200 3tCLCL+50 ns tAVWL Address to RD or WR Low 203 4tCLCL-75 ns tQVWX Data Valid to WR Transition 23 tCLCL-30 ns tQVWH Data Valid to WR High 433 7tCLCL-130 ns tWHQX Data Hold after WR 33 tCLCL-25 ns tRLAZ RD Low to Address Float tWHLH RD or WR High to ALE High 28 Max 233 4tCLCL-65 145 0 3tCLCL-60 0 59 75 tCLCL-8 0 5tCLCL-90 3tCLCL-50 0 43 123 tCLCL-25 ns ns 0 300 ns ns tCLCL-25 252 ns ns ns 0 ns tCLCL+25 ns AT89C51RC 1920C–MICRO–03/05 AT89C51RC 30. External Program Memory Read Cycle tLHLL ALE tAVLL tLLIV tLLPL tPLIV PSEN tPXAV tPLAZ tPXIZ tLLAX tPXIX A0 - A7 PORT 0 tPLPH INSTR IN A0 - A7 tAVIV A8 - A15 PORT 2 A8 - A15 31. External Data Memory Read Cycle tLHLL ALE tWHLH PSEN tLLDV tRLRH tLLWL RD tLLAX tAVLL PORT 0 tRLDV tRLAZ A0 - A7 FROM RI OR DPL tRHDZ tRHDX DATA IN A0 - A7 FROM PCL INSTR IN tAVWL tAVDV PORT 2 P2.0 - P2.7 OR A8 - A15 FROM DPH A8 - A15 FROM PCH 29 1920C–MICRO–03/05 32. External Data Memory Write Cycle tLHLL ALE tWHLH PSEN tLLWL WR tAVLL tLLAX tQVWX A0 - A7 FROM RI OR DPL PORT 0 tWLWH tQVWH DATA OUT tWHQX A0 - A7 FROM PCL INSTR IN tAVWL PORT 2 P2.0 - P2.7 OR A8 - A15 FROM DPH A8 - A15 FROM PCH 33. External Clock Drive Waveforms tCHCX VCC - 0.5V tCHCX tCLCH tCHCL 0.7 VCC 0.2 VCC - 0.1V 0.45V tCLCX tCLCL 34. External Clock Drive Symbol Parameter Min Max Units 1/tCLCL Oscillator Frequency 0 33 MHz tCLCL Clock Period 30 ns tCHCX High Time 12 ns tCLCX Low Time 12 ns tCLCH Rise Time 5 ns tCHCL Fall Time 5 ns 30 AT89C51RC 1920C–MICRO–03/05 AT89C51RC 35. Serial Port Timing: Shift Register Mode Test Conditions The values in this table are valid for VCC = 4.0V to 5.5V and Load Capacitance = 80 pF. 12 MHz Osc Variable Oscillator Symbol Parameter Min Max Min Max tXLXL Serial Port Clock Cycle Time 1.0 12tCLCL µs tQVXH Output Data Setup to Clock Rising Edge 700 10tCLCL - 133 ns tXHQX Output Data Hold after Clock Rising Edge 50 2tCLCL - 80 ns tXHDX Input Data Hold after Clock Rising Edge 0 0 ns tXHDV Clock Rising Edge to Input Data Valid 700 Units 10tCLCL - 133 ns 36. Shift Register Mode Timing Waveforms INSTRUCTION ALE 0 1 2 3 4 5 6 7 8 tXLXL CLOCK tQVXH tXHQX WRITE TO SBUF 0 1 2 tXHDV OUTPUT DATA CLEAR RI 3 4 5 6 tXHDX VALID VALID VALID 7 SET TI VALID VALID VALID VALID VALID SET RI INPUT DATA 37. AC Testing Input/Output Waveforms(1) VCC - 0.5V 0.2 VCC + 0.9V TEST POINTS 0.2 VCC - 0.1V 0.45V Note: 1. AC Inputs during testing are driven at VCC - 0.5V for a logic 1 and 0.45V for a logic 0. Timing measurements are made at VIH min. for a logic 1 and VIL max. for a logic 0. 38. Float Waveforms(1) V LOAD+ 0.1V 0.1V V OL + 0.1V Timing Reference Points V LOAD V LOAD Note: V OL - 0.1V 1. For timing purposes, a port pin is no longer floating when a 100 mV change from load voltage occurs. A port pin begins to float when a 100 mV change from the loaded VOH/VOL level occurs. 31 1920C–MICRO–03/05 39. Ordering Information 39.1 Standard Package Speed (MHz) 24 4.0V to 5.5V 33 39.2 4.5V to 5.5V Ordering Code Package AT89C51RC-24AC AT89C51RC-24JC AT89C51RC-24PC 44A 44J 40P6 Operation Range Commercial (0°C to 70°C) AT89C51RC-24AI AT89C51RC-24JI AT89C51RC-24PI 44A 44J 40P6 Industrial (-40°C to 85°C) AT89C51RC-33AC AT89C51RC-33JC AT89C51RC-33PC 44A 44J 40P6 Commercial (0°C to 70°C) Green Package Option (Pb/Halide-free) Speed (MHz) 24 Power Supply Power Supply 4.0V to 5.5V Ordering Code Package AT89C51RC-24AU AT89C51RC-24JU AT89C51RC-24PU 44A 44J 40P6 Operation Range Industrial (-40°C to 85°C) Package Type 44A 44-lead, Thin Plastic Gull Wing Quad Flatpack (TQFP) 44J 44-lead, Plastic J-leaded Chip Carrier (PLCC) 40P6 40-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 32 AT89C51RC 1920C–MICRO–03/05 AT89C51RC 40. Package Information 40.1 44A – TQFP PIN 1 B PIN 1 IDENTIFIER E1 e E D1 D C 0˚~7˚ A1 A2 A L COMMON DIMENSIONS (Unit of Measure = mm) Notes: 1. This package conforms to JEDEC reference MS-026, Variation ACB. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.10 mm maximum. SYMBOL MIN NOM MAX A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 11.75 12.00 12.25 D1 9.90 10.00 10.10 E 11.75 12.00 12.25 E1 9.90 10.00 10.10 B 0.30 – 0.45 C 0.09 – 0.20 L 0.45 – 0.75 e NOTE Note 2 Note 2 0.80 TYP 10/5/2001 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness, 0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) DRAWING NO. REV. 44A B 33 1920C–MICRO–03/05 40.2 44J – PLCC 1.14(0.045) X 45˚ PIN NO. 1 1.14(0.045) X 45˚ 0.318(0.0125) 0.191(0.0075) IDENTIFIER E1 D2/E2 B1 E B e A2 D1 A1 D A 0.51(0.020)MAX 45˚ MAX (3X) COMMON DIMENSIONS (Unit of Measure = mm) Notes: 1. This package conforms to JEDEC reference MS-018, Variation AC. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line. 3. Lead coplanarity is 0.004" (0.102 mm) maximum. SYMBOL MIN NOM MAX A 4.191 – 4.572 A1 2.286 – 3.048 A2 0.508 – – D 17.399 – 17.653 D1 16.510 – 16.662 E 17.399 – 17.653 E1 16.510 – 16.662 D2/E2 14.986 – 16.002 B 0.660 – 0.813 B1 0.330 – 0.533 e NOTE Note 2 Note 2 1.270 TYP 10/04/01 R 34 2325 Orchard Parkway San Jose, CA 95131 TITLE 44J, 44-lead, Plastic J-leaded Chip Carrier (PLCC) DRAWING NO. REV. 44J B AT89C51RC 1920C–MICRO–03/05 AT89C51RC 40.3 40P6 – PDIP D PIN 1 E1 A SEATING PLANE A1 L B B1 e E 0º ~ 15º C COMMON DIMENSIONS (Unit of Measure = mm) REF MIN NOM MAX A – – 4.826 A1 0.381 – – D 52.070 – 52.578 E 15.240 – 15.875 E1 13.462 – 13.970 B 0.356 – 0.559 B1 1.041 – 1.651 L 3.048 – 3.556 C 0.203 – 0.381 eB 15.494 – 17.526 SYMBOL eB Notes: 1. This package conforms to JEDEC reference MS-011, Variation AC. 2. Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed 0.25 mm (0.010"). e NOTE Note 2 Note 2 2.540 TYP 09/28/01 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 40P6, 40-lead (0.600"/15.24 mm Wide) Plastic Dual Inline Package (PDIP) DRAWING NO. 40P6 REV. B 35 1920C–MICRO–03/05 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Regional Headquarters Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland Tel: (41) 26-426-5555 Fax: (41) 26-426-5500 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Atmel Operations Memory 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel: (49) 71-31-67-0 Fax: (49) 71-31-67-2340 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France Tel: (33) 2-40-18-18-18 Fax: (33) 2-40-18-19-60 ASIC/ASSP/Smart Cards 1150 East Cheyenne Mtn. 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