EPCOS B82790C0225N265

Data and signal line chokes
Common-mode chokes, ring core
0.005 … 4.7 mH, 200 … 1000 mA, 60 °C
Series/Type:
B82790C0/S0
%BUB4IFFU
April 2008
Date:
© EPCOS AG 2008. Reproduction, publication and dissemination of this publication, enclosures
hereto and the information contained therein without EPCOS’ prior express consent is prohibited.
Data and signal line chokes
B82790C0/S0
Common-mode chokes, ring core
Rated voltage 42 V AC/80 V DC
Rated inductance 0.005 mH to 4.7 mH
Rated current 200 mA to 1000 mA
Construction
■
■
■
■
■
Current-compensated ring core double choke
Ferrite core
PPS case (UL 94 V-0)
Bifilar winding (B82790C0)
Sector winding (B82790S0)
Features
■ Suitable for reflow soldering
■ Qualified to AEC-Q200
■ RoHS-compatible
Function
■ B82790C0:
Suppression of asymmetrical interference coupled in on lines,
whereas data signals up to some MHz can pass unaffectedly.
■ B82790S0:
Suppression of asymmetrical and symmetrical interference (by Lstray)
coupled in on lines. The high-frequency portions of the symmetrical
data signal are decreased so far that EMC problems can be significantly reduced.
Applications
■ Automotive applications, e.g. CAN bus
■ Industrial applications
Terminals
■ Base material CuSn6
■ Layer composition Ni, Sn
■ Electro-plated
Marking
■ Marking on component: Manufacturer, process location (coded),
winding method (coded), ordering code (short form),
date of manufacture (YWWD)
■ Minimum data on reel: Manufacturer, ordering code,
L value and tolerance, quantity, date of packing
Delivery mode and packing unit
■ 16-mm blister tape, wound on 330-mm ∅ reel
■ Packing unit: 1500 pcs./reel
Please read Cautions and warnings and
Important notes at the end of this document.
2
04/08
Data and signal line chokes
B82790C0/S0
Common-mode chokes, ring core
Layout recommendation
1.9±0.2
(4.5)
1
2
3
1
2
4
3
1.2
10.2
IND0163-B
0.25±0.05 1)
4
2.85
1)
2.5
1.5 min.
5.2 max.
4.9 max.
0.2+0.2
0 ...6
2.5±0.1
0.6±0.05 1)
Dimensional drawing and pin configuration
6.0 max.
0.08
Marking
7.1 max.
_ 0.2
9 +0.4
1) Soldering area
IND0009-B-E
Dimensions in mm
Taping and packing
Blister tape
Reel
4±0.1
8±0.1
Direction of unreeling
IND0417-H-E
_2
330 +0
16±0.3
1.75±0.1
7.5±0.1
1.6±0.1
6.0 max.
13±0.25
2±0.05
10.5 max.
1.5±0.1
22.4 max.
_0
16.4 +2
_0
60 +2
IND0422-K
Dimensions in mm
Please read Cautions and warnings and
Important notes at the end of this document.
3
04/08
Data and signal line chokes
B82790C0/S0
Common-mode chokes, ring core
Technical data and measuring conditions
Rated voltage VR
42 V AC (50/60 Hz) / 80 V DC
Rated temperature TR
60 °C
Rated current IR
Referred to 50 Hz and rated temperature
Rated inductance LR
Measured with Agilent 4284A at 0.1 mA, 20 °C
Measuring frequency: LR ≤ 1 mH = 100 kHz
LR > 1 mH = 10 kHz
Inductance is specified per winding.
Inductance tolerance
±30% (LR ≤ 0.47 mH), –30/+50% (LR ≥ 1 mH) at 20 °C
Inductance decrease ΔL/L0
< 10% at DC magnetic bias with IR, 20 °C
Stray inductance Lstray,typ
Measured with Agilent 4284A at 5 mA, 20 °C, typ. values
Measuring frequency: LR ≤ 11 μH = 1 MHz
LR > 11 μH = 100 kHz
DC resistance Rtyp
Measured at 20 °C, typical values, specified per winding
Solderability
SnPb:
(215 ±3) °C, (3 ±0.3) s
Sn96.5Ag3.0Cu0.5: (245 ±5) °C, (3 ±0.3) s
Wetting of soldering area ≥ 95%
(to IEC 60068-2-58)
Resistance to soldering heat
(260 ±5) °C, (10 ±1) s (to IEC 60068-2-58)
Climatic category
40/125/56 (to IEC 60068-1)
Storage conditions (packaged)
–25 °C … +40 °C, ≤ 75% RH
Weight
Approx. 0.3 g
Please read Cautions and warnings and
Important notes at the end of this document.
4
04/08
Data and signal line chokes
B82790C0/S0
Common-mode chokes, ring core
Characteristics and ordering codes
LR
Lstray,typ
IR
Rtyp
Vtest
mH
nH
mA
mΩ
V DC, 2 s
Ordering code
0.005
40
1000
60
250
B82790C0502N201
0.011
50
500
80
250
B82790C0113N201
0.025
60
500
110
250
B82790C0253N201
0.025
1400
500
110
250
B82790S0253N201
0.051
70
500
140
250
B82790C0513N201
0.051
2100
500
140
250
B82790S0513N201
0.470
100
500
170
250
B82790C0474N215
1.0
100
500
170
250
B82790C0105N240
2.2
200
400
400
250
B82790C0225N265
4.7
300
200
510
250
B82790C0475N265
Types with LR ≥ 0.47 mH:
750 V DC possible for soldering process with Pb containing solder material.
For lead-free soldering please use series B82793.
Sample kit available. Ordering code: B82790X001
For more information refer to chapter “Sample kits”.
Please read Cautions and warnings and
Important notes at the end of this document.
5
04/08
Data and signal line chokes
B82790C0/S0
Common-mode chokes, ring core
Insertion loss α (typical values at |Z| = 50 Ω, 20 °C)
asymmetrical, all branches in parallel (common mode)
symmetrical (differential mode)
LR = 0.011 mH
LR = 0.005 mH
IND0013-6
50
dB
IND0014-8
50
B82790C0502N201
dB
B82790C0113N201
α
α
40
40
30
30
20
20
10
10
0 4
10
10 5
10 6
10 7
0 4
10
10 8 Hz 10 9
f
LR = 0.025 mH (low Lstray)
10 6
10 7
10 8 Hz 10 9
f
LR = 0.025 mH (high Lstray)
IND0011-4
50
dB
10 5
IND0015-W
50
B82790C0253N201
dB
α
B82790S0253N201
α
40
40
30
30
20
20
10
10
0 4
10
10 5
10 6
10 7
0 4
10
10 8 Hz 10 9
f
Please read Cautions and warnings and
Important notes at the end of this document.
6
04/08
10 5
10 6
10 7
10 8 Hz 10 9
f
Data and signal line chokes
B82790C0/S0
Common-mode chokes, ring core
Insertion loss α (typical values at |Z| = 50 Ω, 20 °C)
asymmetrical, all branches in parallel (common mode)
symmetrical (differential mode)
LR = 0.051 mH (high Lstray)
LR = 0.051 mH (low Lstray)
IND0012-V
50
dB
IND0016-9
50
B82790C0513N201
dB
α
B82790S0513N201
α
40
40
30
30
20
20
10
10
0 4
10
10 5
10 6
10 7
0 4
10
10 8 Hz 10 9
f
LR = 0.47 mH
10 6
10 7
10 8 Hz 10 9
f
LR = 1.0 mH
IND0017-H
50
dB
10 5
IND0018-R
50
B82790C0474N215
dB
α
B82790C0105N240
α
40
40
30
30
20
20
10
10
0 4
10
10 5
10 6
10 7
0 4
10
10 8 Hz 10 9
f
Please read Cautions and warnings and
Important notes at the end of this document.
7
04/08
10 5
10 6
10 7
10 8 Hz 10 9
f
Data and signal line chokes
B82790C0/S0
Common-mode chokes, ring core
Insertion loss α (typical values at |Z| = 50 Ω, 20 °C)
asymmetrical, all branches in parallel (common mode)
symmetrical (differential mode)
LR = 4.7 mH
LR = 2.2 mH
IND0019-1
50
B82790C0225N265
dB
IND0020-Z
50
dB
α
B82790C0475N265
α
40
40
30
30
20
20
10
10
0 4
10
10 5
10 6
10 7
0 4
10
10 8 Hz 10 9
f
Current derating Iop/IR
versus ambient temperature
IND0681-C-E
1.4
Iop
IR 1.2
1.0
TR = 60 ˚C
0.8
0.6
0.4
0.2
0
0
20
40
60
80 100
˚C
140
TA
Please read Cautions and warnings and
Important notes at the end of this document.
8
04/08
10 5
10 6
10 7
10 8 Hz 10 9
f
Data and signal line chokes
B82790C0/S0
Common-mode chokes, ring core
Recommended reflow soldering curve
Pb containing solder material (based on CECC 00802 edition 2)
300
10 s
˚C
260 ˚C
approx. 245 ˚C
Temperature
250
10 s
215 ˚C
200
180 ˚C
150
approx.
40 s
130 ˚C
100
2 K/s
Normal curve
Limit curves
50
0
50
0
100
150
200
s
Time
250
IND0813-D-E
Pb-free solder material (based on JEDEC J-STD 020C)
t3
T4
T3
t2
T2
T1
t1
IND0814-F
T1
T2
T3
T4
t1
t2
t3
°C
°C
°C
°C
s
s
s
150
200
217
250
< 110
< 90
< 30 @ T4 –5 °C
Time from 25 °C to T4: max 300 s
Maximal numbers of reflow cycles: 3
Please read Cautions and warnings and
Important notes at the end of this document.
9
04/08
Cautions and warnings
■ Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■ If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
■ The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
■ Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Please read Cautions and warnings and
Important notes at the end of this document.
10
04/08
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with
them than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state
of the art, even if they are operated as specified. In customer applications requiring a very
high level of operational safety and especially in customer applications in which the malfunction
or failure of an electronic component could endanger human life or health (e.g. in accident
prevention or life-saving systems), it must therefore be ensured by means of suitable design of
the customer application or other action taken by the customer (e.g. installation of protective
circuitry or redundancy) that no injury or damage is sustained by third parties in the event of
malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our
Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products.
Consequently, we cannot guarantee that all products named in this publication will always be
available.
The aforementioned does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version
of the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP, MiniBlue,
MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT, SIFI, SIKOREL,
SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are
trademarks registered or pending in Europe and in other countries. Further information will be
found on the Internet at www.epcos.com/trademarks.
11
03/09