BAT54... Silicon Schottky Diodes • For low-loss, fast-recovery, meter protection, bias isolation and clamping application • Guard ring protected • Low forward voltage • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BAT54-02LRH BAT54-02V BAT54-03W BAT54 BAT54W BAT54-04 BAT54-04W ! ! , Type BAT54 BAT54-02LRH BAT54-02V BAT54-03W* BAT54-04 BAT54-04W BAT54-05 BAT54-05W BAT54-06 BAT54-06W BAT54W BAT54-05 BAT54-05W ! , Package SOT23 TSLP-2-7 SC79 SOD323 SOT23 SOT323 SOT23 SOT323 SOT23 SOT323 SOT323 BAT54-06 BAT54-06W , ! , , Configuration single single single single series series common cathode common cathode common anode common anode single , LS(nH) 1.8 0.4 0.6 1.8 1.8 1.4 1.8 1.4 1.8 1.4 1.4 Marking T 54 b 5/blue TS TS TC TC TA TA T5 * Preliminary data 1Pb-containing package may be available upon special request 1 2008-04-30 BAT54... Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage VR 30 V Forward current IF 200 mA Non-repetitive peak surge forward current I FSM 600 I FRM 300 (t ≤ 10 ms) Repetitive peak forward current1) mA tp ≤ 1 s, δ = 0.5 Total power dissipation mW Ptot BAT54, TS ≤ 94 °C 230 BAT54-02LRH, TS ≤ 135 °C 230 BAT54-02V, TS ≤ 126 °C 230 BAT54-03W, TS ≤ tbd °C 230 BAT54-04, TS ≤ 71 °C 230 BAT54-04W, TS ≤ 117 °C 230 BAT54-05, TS ≤ 48 °C 230 BAT54-05W, TS ≤ 110 °C 230 BAT54-06, TS ≤ 71 °C 230 BAT54-06W, TS ≤ 117 °C 230 BAT54W, TS ≤ 125 °C 230 Junction temperature Tj Storage temperature T stg 1Device 150 °C -65 ... 150 mounted on epoxy PCB 40 x 40 x 1.5 mm / 6 cm² Cu 2 2008-04-30 BAT54... Thermal Resistance Parameter Symbol Junction - soldering point 1) RthJS Value Unit K/W BAT54 ≤ 245 BAT54-02LRH ≤ 65 BAT54-02V ≤ 105 BAT54-03W ≤ tbd BAT54-04 ≤ 345 BAT54-04W ≤ 145 BAT54-05 ≤ 445 BAT54-05W ≤ 175 BAT54-06 ≤ 345 BAT54-06W ≤ 145 BAT54W ≤ 110 Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. 30 - - V - - 2 µA DC Characteristics Breakdown voltage2) V(BR) I(BR) = 10 µA Reverse current2) IR VR = 25 V Forward voltage2) mV VF IF = 0.1 mA - - 240 IF = 1 mA - - 320 IF = 10 mA - - 400 IF = 30 mA - - 500 IF = 100 mA - - 800 1For calculation of RthJA please refer to Application Note Thermal Resistance 2Pulsed test: tp = 300 µs; D = 0.01 3 2008-04-30 BAT54... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. CT - - 10 pF trr - - 5 ns AC Characteristics Diode capacitance VR = 1 V, f = 1 MHz Reverse recovery time I F = 10 mA, IR = 10 mA, measured IR = 1 mA , RL = 100 Ω 4 2008-04-30 BAT54... Diode capacitance CT = ƒ (VR) Reverse current IR = ƒ (TA) f = 1MHz VR = Parameter 10 3 10 pF µA 8 10 2 IR(25V) IR CT 7 6 IR(5V) 10 1 5 4 3 10 0 2 1 0 0 5 10 15 20 V 10 -1 25 30 50 °C 75 125 VR TA Reverse current IR = ƒ(VR) Forward Voltage VF = ƒ (TA) TA = Parameter IF = Parameter 10 3 0.5 µA 125°C VF IR 10 V 30mA 2 85°C 10mA 0.3 10 1 1mA 0.2 0.1mA 10 0 0.1 25°C 10 -1 0 5 10 15 20 V 0 -50 30 VR -25 0 25 50 75 °C 125 TA 5 2008-04-30 BAT54... Forward current IF = ƒ (VF) Forward current IF = ƒ (T S) TA = Parameter BAT54 10 0 220 A mA 10 -1 180 IF IF 160 10 -2 140 120 100 10 -3 80 60 125°C 85°C 25°C - 40°C 10 -4 40 20 10 -5 0 0.2 0.4 0.6 0.8 V 0 0 1.2 15 30 45 60 75 90 105 120 °C VF Forward current IF = ƒ (T S) Forward current IF = ƒ (T S) BAT54-02LRH BAT54-02V 220 220 mA mA 180 180 160 160 140 140 IF IF 150 TS 120 120 100 100 80 80 60 60 40 40 20 20 0 0 15 30 45 60 75 90 105 120 °C 0 0 150 TS 15 30 45 60 75 90 105 120 °C 150 TS 6 2008-04-30 BAT54... Forward current IF = ƒ (T S) Forward current IF = ƒ (T S) BAT54-04 BAT54-04W 220 220 mA 180 180 160 160 140 140 IF IF mA 120 120 100 100 80 80 60 60 40 40 20 20 0 0 15 30 45 60 75 90 105 120 °C 0 0 150 15 30 45 60 75 90 105 120 °C TS Forward current IF = ƒ (T S) Forward current IF = ƒ (T S) BAT54-05 BAT54-05W 220 220 mA mA 180 180 160 160 140 140 IF IF 150 TS 120 120 100 100 80 80 60 60 40 40 20 20 0 0 15 30 45 60 75 90 105 120 °C 0 0 150 TS 15 30 45 60 75 90 105 120 °C 150 TS 7 2008-04-30 BAT54... Forward current IF = ƒ (T S) Forward current IF = ƒ (T S) BAT54-06 BAT54-06W 220 220 mA 180 180 160 160 140 140 IF IF mA 120 120 100 100 80 80 60 60 40 40 20 20 0 0 15 30 45 60 75 90 105 120 °C 0 0 150 TS 15 30 45 60 75 90 105 120 °C 150 TS Forward current IF = ƒ (T S) BAT54W 220 mA 180 IF 160 140 120 100 80 60 40 20 0 0 15 30 45 60 75 90 105 120 °C 150 TS 8 2008-04-30 Package SC79 BAT54... Package Outline 0.2 M A +0.05 0.13 -0.03 0.8 ±0.1 0.2 ±0.05 10˚MAX. 1.6 ±0.1 1 0.3 ±0.05 Cathode marking 10˚MAX. 1.2 ±0.1 A 2 0.55 ±0.04 0.35 1.35 Foot Print 0.35 Marking Layout (Example) 2005, June Date code BAR63-02V Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Cathode marking 0.4 0.93 0.2 8 1.96 Reel with 2 mm Pitch 2 1.33 Standard 4 Cathode marking 9 0.66 2008-04-30 BAT54... Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code Month 2 0 03 2 0 04 2005 2006 2 0 07 2008 2009 2010 2011 2012 2 0 13 2014 01 a p A P a p A P a p A P 02 b q B Q b q B Q b q B Q 03 c r C R c r C R c r C R 04 d s D S d s D S d s D S 05 e t E T e t E T e t E T 06 f u F U f u F U f u F U 07 g v G V g v G V g v G V 08 h x H X h x H X h x H X 09 j y J Y j y J Y j y J Y 10 k z K Z k z K Z k z K Z 11 l 2 L 4 l 2 L 4 l 2 L 4 12 n 3 N 5 n 3 N 5 n 3 N 5 1) New Marking Layout for SC75, implemented at October 2005. . 10 2008-04-30 Package SOT23 BAT54... 0.4 +0.1 -0.05 1) 2 0.08...0.1 C 0.95 1.3 ±0.1 1 2.4 ±0.15 3 0.1 MAX. 10˚ MAX. B 1 ±0.1 10˚ MAX. 2.9 ±0.1 0.15 MIN. Package Outline A 5 0...8˚ 1.9 0.2 0.25 M B C M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 1.3 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s 2005, June Date code (YM) Pin 1 BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 8 2.13 2.65 0.9 Pin 1 1.15 3.15 11 2008-04-30 Package SOT323 BAT54... Package Outline 0.9 ±0.1 2 ±0.2 0.3 +0.1 -0.05 0.1 MAX. 3x 0.1 M 0.1 A 1 2 1.25 ±0.1 0.1 MIN. 2.1 ±0.1 3 0.15 +0.1 -0.05 0.65 0.65 0.2 M A Foot Print 0.8 1.6 0.6 0.65 0.65 Marking Layout (Example) Manufacturer 2005, June Date code (YM) BCR108W Type code Pin 1 Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 0.2 2.3 8 4 Pin 1 2.15 1.1 12 2008-04-30 Package TSLP-2-7 BAT54... Package Outline Top view Bottom view 0.39 +0.01 -0.03 0.6 ±0.05 0.05 MAX. 1 1 0.25 ±0.035 1) 2 1±0.05 0.65 ±0.05 2 0.5 ±0.035 1) Cathode marking 1) Dimension applies to plated terminal Foot Print 0.45 Copper Solder mask 0.375 0.35 0.275 1 0.925 0.3 0.35 0.6 0.275 For board assembly information please refer to Infineon website "Packages" Stencil apertures Marking Layout (Example) BAR90-02LRH Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 mm = 50.000 Pieces/Reel (optional) 0.5 Cathode marking 8 1.16 4 0.76 13 2008-04-30 BAT54... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 14 2008-04-30