A Product Line of Diodes Incorporated BCX6825 20V NPN SILICON PLANAR MEDIUM POWER TRANSISTOR IN SOT89 Features Mechanical Data • • • • • • • • • • • • • BVCEO > 20V High current capability Maximum Continuous Current IC = 1A Low saturation voltage VCE(sat) < 500mV @ 1A Complementary PNP type: BCX69 Lead Free, RoHS Compliant (Note 1) Halogen and Antimony Free, “Green” Device (Note 2) Qualified to AEC-Q101 Standards for High Reliability Case: SOT89 Case Material: Molded Plastic, “Green” Molding Compound Moisture Sensitivity: Level 1 per J-STD-020 UL Flammability Rating 94V-0 Terminals: Matte Tin Finish Weight: 0.052 grams (Approximate) Application • • Power MOSFET gate driving Low loss power switching C SOT89 E B C C B E Top View Device symbol Top View Pin-out Ordering Information (Notes 3 & 4) Product BCX6825TA BCX6825QTA Notes: Status Commercial Automotive Marking CD CD Reel size (inches) 7 7 Tape width (mm) 12 12 Quantity per reel 1000 1000 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free. 2. Diodes Inc’s “Green” Policy can be found on our website at http://www.diodes.com 3. For packaging details, go to our website at http://www.diodes.com 4. Products with Q-suffix are automotive grade. Automotive products are electrical and thermal the same as the commercial, except where specified. Marking Information CD BCX6825 Datasheet Number: DS33010 Rev. 4 - 2 CD = Product Type Marking Code 1 of 5 www.diodes.com February 2012 © Diodes Incorporated A Product Line of Diodes Incorporated BCX6825 Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Continuous Collector Current Peak Pulse Current Symbol VCBO VCEO VEBO IC ICM Value 25 20 5 1 2 Unit V V V A A Value 1 125 10.01 -65 to +150 Unit W °C/W °C/W °C Thermal Characteristics @TA = 25°C unless otherwise specified Characteristic Collector Power Dissipation Thermal Resistance, Junction to Ambient Air (Note 5) Thermal Resistance, Junction to Leads (Note 6) Operating and Storage Temperature Range Notes: Symbol PD RθJA RθJL TJ,TSTG 5. For the device mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. 6.Thermal resistance from junction to solder-point (on the exposed collector pad). 1.0 Thermal Resistance (°C/W) Max Power Dissipation (W) Thermal Characteristics 0.8 0.6 0.4 0.2 0.0 0 25 50 75 100 125 150 Temperature (°C) 120 100 80 D=0.5 60 40 Single Pulse D=0.2 D=0.05 20 0 100µ D=0.1 1m 10m 100m 1 10 100 1k Pulse Width (s) Transient Thermal Impedance Derating Curve Max Power Dissipation (W) 100 Single Pulse. T amb=25°C 10 1 100µ 1m 10m 100m 1 10 100 1k Pulse Width (s) Pulse Power Dissipation BCX6825 Datasheet Number: DS33010 Rev. 4 - 2 2 of 5 www.diodes.com February 2012 © Diodes Incorporated A Product Line of Diodes Incorporated BCX6825 Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage (Note 7) Emitter-Base Breakdown Voltage Symbol BVCBO BVCEO BVEBO Min 25 20 5 Typ. - Collector Cutoff Current ICBO - - Emitter Cutoff Current IEBO - hFE 50 160 60 VCE(sat) VBE(on) - fT Cobo DC current transfer Static ratio (Note 7) Collector-Emitter Saturation Voltage (Note 7) Base-Emitter Turn-on Voltage (Note 7) Transitional Frequency Output capacitance Notes: - Max 100 10 10 Unit V V V nA µA µA 250 - 400 - - - - 0.5 1.0 V V 100 - - MHz - - 25 pF Test Condition IC = 100µA IC = 10mA IE = 100µA VCB = 25V VCB = 25V, TA = 125°C VEB = 5V IC = 5mA, VCE = 10V IC = 500mA, VCE = 1V IC = 1A, VCE = 1V IC = 1A, IB = 100mA IC = 1A, VCE = 1V IC = 100mA, VCE = 5V f = 100MHz VCB = 10V, f = 1MHz 7. Measured under pulsed conditions. Pulse width = 300μs. Duty cycle ≤2%. Typical Characteristics BCX6825 Datasheet Number: DS33010 Rev. 4 - 2 3 of 5 www.diodes.com February 2012 © Diodes Incorporated A Product Line of Diodes Incorporated BCX6825 Package Outline Dimensions R0 D1 .2 00 C E SOT89 Dim Min Max A 1.40 1.60 B 0.44 0.62 B1 0.35 0.54 C 0.35 0.43 D 4.40 4.60 D1 1.52 1.83 E 2.29 2.60 e 1.50 Typ e1 3.00 Typ H 3.94 4.25 L 0.89 1.20 All Dimensions in mm H L B e B1 e1 8° (4 X ) A D Suggested Pad Layout X1 X2 (2x) Y1 Y3 Y4 Y2 Y C Dimensions Value (in mm) X 0.900 X1 1.733 X2 0.416 Y 1.300 Y1 4.600 Y2 1.475 Y3 0.950 Y4 1.125 C 1.500 X (3x) BCX6825 Datasheet Number: DS33010 Rev. 4 - 2 4 of 5 www.diodes.com February 2012 © Diodes Incorporated A Product Line of Diodes Incorporated BCX6825 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2012, Diodes Incorporated www.diodes.com BCX6825 Datasheet Number: DS33010 Rev. 4 - 2 5 of 5 www.diodes.com February 2012 © Diodes Incorporated