System LED Drivers for Mobile phones Chopper type for Flash BD6062GU No.11041EBT13 ●Description The BD6062GU is 1A Flash LED Driver ICs that can drive 1LED. It is possible to select how to control, 2wired control mode (Direct Control Mode) or 3wired mode (Register Control Mode). The BD6062GU has original Timer function in 3wired mode and easily set pre-flash timer and flash timer. ●Features 1) 400mA ~ 800mA selectable in Flash mode (Register Control Mode) 2) 50 ~ 200mA Torch mode (Register Control Mode) 3) 800mA in Flash mode (Direct control Mode) 4) 200mA in Torch mode (Direct control Mode) 5) Maximum current of LED is 1A in both Flash and Torch mode 6) 3Wired Mode and Direct control Mode selectable 7) In 3Wired Mode, Pre-Flash Timer and Flash Timer controllable 8) In 3Wired Mode, Flash current and Torch current is controllable 9) Over voltage protection 10) CSP 23pin Small and Thin package ●Applications Flash and torch of camera for mobile phone ●Line up matrix Parameter BD6062GU Input voltage 2.7 ~ 5.5V Switching Frequency 480 ~ 720kHz Maximum LED Current 1A Package VCSP85H2 ●Absolute maximum ratings (Ta=25℃) Parameter Symbol Ratings Unit VMAX 7 V Pd 1100 *1 mW Operating temperature range Topr -30~+85 ℃ Storage temperature range Tstg -55~+150 ℃ Maximum applied voltage Power dissipation Condition VBAT, VIO *1 50mm × 58mm × 1.75mm At glass epoxy board mounting. When it’s used by more than Ta=25℃, it’s reduced by 11mW/℃ ●Recommended operating range (Ta= -30℃ ~ +85℃) Parameter Symbol Ratings Min. Typ. Max. Unit Condition Power Supply Voltage VDD 2.7 3.6 5.5 V *2 IO Supply Voltage VIO 1.62 1.8 3.3 V *2 *2 VBAT ≥ VIO www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/15 2011.05 - Rev.B BD6062GU Technical Note ●Electrical characteristics (Unless otherwise noted, Ta = +25℃, VBAT=3.6V, VIO=1.8V) Limits Parameter Symbol Min. Typ. Max. Units Condition [Logic control terminal (IFMODE=’L’, 3wired control mode)] Low threshold voltage1 VthL1 - - VIO* 0.25 V High threshold voltage1 VthH1 VIO* 0.75 - - V High level Input current1 IinH1 - - 5 μA Vin=VIO Low level Input current1 IinL1 -5 - - μA Vin=0V [Logic control terminal (IFMODE=’H’, Direct control mode)] Low threshold voltage2 VthL2 - - 0.4 V High threshold voltage2 VthH2 1.4 - - V High level Input current2 IinH2 - 18.3 30 μA FLASH=TORCH=5.5V Low level Input current2 IinL2 -2 -0.1 - μA FLASH=TORCH=0V Input voltage range Vin 3.1 - 5.5 V VBAT input range Quiescent Current Iq - 5 10 μA Torch=Flash= OFF Current Consumption Idd1 - 1.8 2.5 mA VFB=1.0V, Vin=3.6V, Torch mode Inductor current limit Icoil 1.5 2.0 2.5 A Switching frequency fSW 480 600 720 kHz SW ON resistance Ron - 0.07 0.15 Ω Iin=200mA Duty cycle limit Duty 60 65 - % VFB=0V Output voltage range Vo - - 5.4 V Over voltage limit Ovl 5.4 5.5 5.6 V Start up time Ts 0.5 1.0 ms 0mA to 200mA(Torch) [Others] Vin=3.6V *3 VFB=0V R torch terminal voltage 1 Vrt1 45 50 55 mV Itorch[1:0]=00 (50mA) R torch terminal voltage 2 Vrt2 90 100 110 mV Itorch[1:0]=01 (100mA) R torch terminal voltage 3 Vrt3 135 150 165 mV Itorch[1:0]=10 (150mA) R torch terminal voltage 4 Vrt4 180 200 220 mV Itorch[1:0]=11 (200mA) R flash terminal voltage 1 Vrf1 43 48 53 mV Iflash[1:0]=00 (400mA) R flash terminal voltage 2 Vrf2 54 60 66 mV Iflash[1:0]=01 (500mA) R flash terminal voltage 3 Vrf3 65 72 79 mV Iflash[1:0]=10 (600mA) R flash terminal voltage 4 Vrf4 86 96 106 mV Iflash[1:0]=11 (800mA) *3 This parameter is tested with dc measurement. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/15 2011.05 - Rev.B BD6062GU Technical Note 0.08 0.06 0.04 Ta=85°C Ta=25°C Ta=-30°C 0.02 0 3 0.08 0.06 0.04 (VBAT) 0 0 1.8 Ta=85°C Ta=-30°C 1.2 0.6 2 VBAT=3.0V VBAT=2.7V 70 Fig.6 Switching Frequency VBAT=3.6V VBAT=4.2V VBAT=3.0V 80 VBAT=2.7V 70 200 400 600 800 1000 LED CURRENT : ILED[mA] 85 Taiyo Yuden Coil 80 Panasonic Coil 75 EFFICIENCY [%] TDK Coil 90 100 95 95 90 Taiyo Yuden Coil 85 TDK Coil 80 Panasonic Coil 200 400 600 800 1000 LED CURRENT : ILED[mA] Fig.10 Each Coil Efficiency (Ta = 25°C, VBAT = 3.6V) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 90 TDK Coil 85 80 Taiyo Yuden Coil Panasonic Coil 75 70 0 200 400 600 800 1000 LED CURRENT : ILED[mA] Fig.9 1A appli. Efficiency (Ta = -30°C) 100 75 70 0 EFFICIENCY [%] 95 VBAT=2.7V 70 200 400 600 800 1000 LED CURRENT : ILED[mA] Fig.8 1A appli. Efficiency (Ta = 85°C) 100 VBAT=3.0V 50 0 Fig.7 1A appli. Efficiency (Ta = 25°C) 80 VBAT=4.2V 60 50 0 VBAT=3.6V 90 60 50 2.5 3 3.5 4 4.5 5 5.5 INPUT VOLTAGE : VBAT[V] 100 90 60 Ta=-30°C 2 EFFICIENCY [%] 80 VBAT=4.2V Ta=25°C 500 3.5 4 4.5 5 5.5 INPUT VOLTAGE : VBAT[V] Fig.5 Over-Current Limiter EFFICIENCY [%] VBAT=3.6V Ta=85°C 550 100 90 EFFICIENCY [%] Ta=-30°C 3 100 1 2 3 4 5 INPUT VOLTAGE : VBAT[V] 600 Ta=85°C 1.75 Fig.4 Current consumption(VBAT) 0 650 Ta=25°C 7 Ta=85°C Ta=25°C Ta=-30°C 0.02 700 1.5 1 2 3 4 5 6 INPUT VOLTAGE : VBAT[V] 0.04 Fig.3 Quiescent current consumption (OVP) 2.25 0 0.06 SWITCHING FREQUENCY : FSW[kHz] CURRENT LIMIT : llimit[A] Ta=25°C 0.08 0 2.5 2.4 0.1 1 2 3 4 5 INPUT VOLTAGE : VBAT[V] Fig.2 Quiescent current consumption (VIO) 3 0 EFFICIENCY [%] Ta=85°C Ta=25°C Ta=-30°C 0.02 3.5 4 4.5 5 5.5 INPUT VOLTAGE : VBAT[V] Fig.1 Quiescent current consumption CURRENT CONSUMPTION: ldd[mA] 0.1 STAND-BY CURRENT: lstb_VIO[μA] STAND-BY CURRENT : lstb[μA] 0.1 STAND-BY CURRENT : lstb_OVP[μA] ●Electrical characteristic curves (Reference data) 70 0 200 400 600 800 1000 LED CURRENT : ILED[mA] Fig.11 Each Coil Efficiency (Ta = 85°C, VBAT = 3.6V) 3/15 0 200 400 600 800 1000 LED CURRENT : ILED[mA] Fig.12 Each Coil Efficiency (Ta = -30°C, VBAT = 3.6V) 2011.05 - Rev.B BD6062GU Technical Note ●Electrical characteristic curves (Reference data) – Continued 0.22 0.2 0.19 0.18 Ta=85°C Ta=25°C Ta=-30°C 0.21 0.2 0.19 0.18 0 50 100 150 200 250 TFB CURRENT : ITFB[mA] Fig.13 TORCH Load Regulation (VBAT = 5.5V) Ta=85°C 90 85 80 100 95 Ta=-30°C 90 Ta=85°C Ta=25°C 85 80 0 300 600 900 1200 FFB CURRENT : IFFB[mA] Fig.16 FLASH Load Regulation (VBAT = 5.5V) 50 100 150 200 250 TFB CURRENT : ITFB[mA] Fig.15 TORCH Load Regulation (VBAT = 2.7V) FFB VOLTAGE: VFFB[mV] Ta=25°C 0.19 0 Fig.14 TORCH Load Regulation (VBAT = 3.6V) FFB VOLTAGE: VFFB[mV] Ta=-30°C 0.2 50 100 150 200 250 TFB CURRENT : ITFB[mA] 100 95 Ta=85°C Ta=25°C Ta=-30°C 0.21 0.18 0 100 FFB VOLTAGE : VFFB[mV] 0.22 TFB VOLTAGE: VTFB[V] Ta=85°C Ta=25°C Ta=-30°C 0.21 TFB VOLTAGE: VTFB[V] TFB VOLTAGE : VTFB[V] 0.22 Ta=85°C 95 Ta=-30°C Ta=25°C 90 85 80 0 300 600 900 1200 FFB CURRENT : IFFB[mA] 0 Fig.17 FLASH Load Regulation (VBAT = 3.6V) 300 600 900 1200 TFB CURRENT : ITFB[mA] Fig.18 FLASH Load Regulation (VBAT = 2.7V) TORCH/FLASH Terminal (VBAT) [500mV/div] OUTPUT VOLTAGE [500mV/div] OUTPUT VOLTAGE [500mV/div] TORCH/FLASH Terminal (VBAT) [500mV/div] TORCH/FLASH Terminal (VBAT) [1V/div] INPUT CURRENT [200mA/div] LED CURRENT [200mA/div] 0V, 0A 200µs/div Fig.19 500mA Input rush current (VBAT=3.0V) 0V, 0A INPUT CURRENT [200mA/div] OUTPUT VOLTAGE [1A/div] LED CURRENT [200mA/div] LED CURRENT [200mA/div] 200µs/div Fig.20 500mA Input rush current (VBAT=3.6V) INPUT CURRENT [200mA/div] 0V, 0A 200µs/div Fig.21 500mA Input rush current (VBAT=4.5V) OUTPUT VOLTAGE [500mV/div] TORCH/FLASH Terminal (VBAT) 500mV/div] LED CURRENT [200mA/div] INPUT CURRENT [500mA/div] Fig.22 1A Input rush current (200mA 1A) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/15 2011.05 - Rev.B BD6062GU Technical Note ●Block diagram and pin configuration VBAT Battery 2.2µF VBAT GND GND VIO VIO 4.7µH 4.7µH SBD SBD SW1 SW1 osc R Q S Q 47µF (6.3V) SW2 osc R Q S Q 47µF PGND1 CLK slope PGND2 CURDRV TORCH TORCH (CS) CURDRV FLASH VFB RFLASH RFLASH FFB Control CURDRV TORCH TORCH (CS) CLK 1Ω OVP TEST FFB RTORCH TFB CSDI 0.12Ω GNDSENS RSTB (FLASH) OVP IFMODE 1Ω OVP OVP OPEN Fig.24 1A application Block diagram of 3wired control Mode Fig.23 1A application Block diagram of Direct control Mode Battery 4.7µF VBAT (6.3V) GND VIO VIO 4.7µH 4.7µH SBD SBD SW1 osc Q S Q SW1 22µF (6.3V) SW2 osc R Q S Q PGND1 slope CURDRV TORCH PGND2 CLK VFB RFLASH CURDRV FLASH FFB CLK 2Ω TEST OVP RFLASH FFB TFB CSDI 0.24Ω GNDSENS FLASH (RSTB) OVP IFMODE 2Ω Fig.25 500mA application Block diagram of Direct control Mode 0.24Ω GNDSENS OVP TEST OPEN A CURDRV FLASH RTORCH Control TFB CSDI FLASH (RSTB) IFMODE CURDRV TORCH TORCH (CS) RTORCH Control 22µF (6.3V) SW2 PGND1 slope PGND2 VFB TORCH (CS) Battery 4.7µF (6.3V) GND R 0.12Ω GNDSENS TEST OPEN VBAT CURDRV FLASH Control TFB CSDI IFMODE PGND2 VFB RTORCH FLASH (RSTB) (6.3V) SW2 PGND1 slope Battery 2.2µF (6.3V) (6.3V) OVP OPEN Fig.26 500mA application Block diagram of 3wired control Mode B C D E 5 N.C. SW2 VIO PGND2 N.C. 4 GND SENS SW1 CSDI PGND1 CLK 3 FTB IFMODE OVP VBAT 2 RSTB/ FLASH TFB CS/ TORCH GND 1 TEST VFB RTORCH N.C. RFLASH Fig.27 pin location diagram (TOP VIEW) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/15 2011.05 - Rev.B BD6062GU Technical Note ●Pin assignment table No. Pin Name A1 TEST In/ Out In A2 RSTB/FLASH In A3 A4 A5 B1 B3 B4 B5 C1 C2 C4 C5 D1 FFB GNDSENS N.C RFLASH IFMODE SW1 SW2 VFB TFB CSDI VIO RTORCH In In Out In In In In In In Out D2 CS/TORCH In D3 D4 D5 E1 E2 E3 E4 E5 OVP PGND1 PGND2 N.C GND In In - VBAT CLK N.C Functions Digital test select pin Reset (“L”:Reset) (IFMODE=’0’) FLASH enable (“H”) (IFMODE=’1’) Flash current driver feedback pin Sense GND pin for current driver open Flash current adjustment resistor pin Interface mode select Switching terminal 1 Switching terminal 2 Voltage feedback pin Torch current driver feedback pin Data input I/O power supply pin Torch current adjustment resistor pin Chip select (IFMODE=’0’) TORCH enable (IFMODE=’1’) Boost voltage feedback input pin Power GND pin 1 Power GND pin 2 Open GND pin Battery power supply pin Clock Open Total : 23 Pin ●Description of function 1) CPU I/F The Control Serial I/F provides access to Flash LED driver control registers. Write timing show following timing chart. CLK Duty tsFS thFS Tcyc CS tsDI CSDI thDI A7 A6 A0 D7 D6 D0 Fig.28 Control Serial Port Timing www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/15 2011.05 - Rev.B BD6062GU Technical Note Control Serial Port Specifications Limits Symbol Parameter Min. Typ. Max. Unit CS Input Setup tsFS 50 - - ns CS Input Hold thFS 50 - - ns CSDI Input Setup tsDI 50 - - ns CSDI Input Hold thDI 50 - - ns Clock Cycle Time Tcyc 133.3 - - ns Duty Ratio Duty 40 50 60 % Condition MAX 7.5 MHz Performance specifications are guaranteed, but not production tested. 2) Register map ENA Address [7:0] 01 (H) - - - - - - Flash Torch TIME 02 (H) - Tmode Tdelay2 Tdelay1 Tdelay0 Tflash2 Tflash1 Tflash0 CURR 03 (H) - - - CLMT Iflash1 Iflash0 Itorch1 Itorch0 TEST 04 (H) - - - - Test3 Test2 Test1 Test0 TEST2 05 (H) - - - TEST24 TEST23 TEST22 TEST21 TEST20 Symbol D[7] D[6] D[5] D[4] D[3] D[2] D[1] D[0] *Note: Write access is prohibited in TEST and TEST2 registers. Address”00(H)”, Enable control 2-1) Enable control Flash Torch Output Default * 0 0 off 0 1 Itorch 1 0 Iflash 1 1 Itorch + Iflash *When IFMODE=H, each enable signal are controlled by CPU directly from Pin. Address”01(H)”, Timer mode setting and Flash timer period control 2-2) Timer mode control Tmode Timer mode Default 0 disable 1 enable www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. * 7/15 2011.05 - Rev.B BD6062GU Technical Note 2-3) Flash delay timer setting Tdelay[2:0] tFlash1 000 0ms 001 5ms 010 10ms 011 15ms 100 20ms 101 25ms 110 30ms 111 35ms Default * tFLASH1 : Flash on delay timer It control the period from flash enable to light up. 2-4) Flash ON timer setting Tflash[2:0] TFlash2 000 50ms 001 100ms 010 150ms 011 200ms 100 400ms 101 600ms 110 800ms 111 1000ms tFLASH2 : Flash on timer It control the period from light up to off. Default * *When IFMODE=H, it does not use timer function. Flash period is controlled by CPU directly. Address”02(H)”, Flash and Torch current setting 2-5) Output current setting for the Torch current driver Itorch[1:0] Output current Default 00 50mA * 01 100mA 10 150mA 11 200mA 2-6) Output current setting for the Flash current driver Iflash[1:0] Output current Default 00 400mA * 01 500mA 10 600mA 11 800mA 2-7) Over power protection enable CLMT Current Limit 0 disable 1 enable www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Default * IFMODE=H * IFMODE=H * IFMODE=H * 8/15 2011.05 - Rev.B BD6062GU Technical Note It depends on battery or external components condition, internal power consumption will be large at flash action and there is a possibility that it will over Power dissipation of IC. BD6062GU can limit drive current on over power condition, and protect to over Power dissipation. When this mode is enable, BD6062GU limit maximum current automatically as below. Torch Flash Max200mA Max800mA Max200mA 400mA 3) Power Control BD6062GU can be controlled the status of activation using Enable control resistor. 4) LED drive current (Torch Mode) The LED current is decided by the voltage of RTORCH terminal. (Rtorch=1.0Ω) ILED is given as follows, ILED= I(Torch Current Driver)=VRTORCH / 1.0(Ω) Rtorch =1.0Ω, ILED=50mA : Itorch [1:0] = 00 VRTORCH =0.05V, VRTORCH =0.2V, Rtorch =1.0Ω, ILED=200mA : Itorch [1:0] = 11 VRTORCH is controlled 0.05V~0.2V by resistor setting. 5) LED drive current (Flash Mode) The LED current is decided by the voltage of RFLASH terminal and RTORCH terminal. (Rflash=0.12Ω, Rtorch=1.0Ω) ILED is given as follows, ILED= I(Flash Current Driver)+I(Torch Current Driver) =VRFLASH/0.12(Ω)+VRTORCH / 1.0(Ω) VRFLASH=0.096V, Rflash =0.12Ω, Itorch[1:0]=11 ILED=200mA+800mA=1000mA VRTORCH=0.2V, Rtorch =1.0Ω, Iflash[1:0]=11 VRFLASH is controlled 0.048V~0.096V by resistor setting. 6) Basic function i) Register control interface(3wired) mode (timer enable) Torch (Address : 00 (H), D[0]) Flash (Address : 00 (H), D[1]) tFLASH1 tFLASH2 ILED2 ILED (0mA) ILED1 ILED1 : Torch Current Driver ILED2 : Forch Current Driver tFLASH1,2 : Flash time is controlled by timer resistor setting. Fig.29 3wired mode Torch and Flash Timing (Timer enable) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 9/15 2011.05 - Rev.B BD6062GU Technical Note ii) Register control interface(3wired) mode (timer disable) Torch (Address : 00 (H), D[0]) Flash (Address : 00 (H), D[1]) tFLASH2 ILED2 ILED (0mA) ILED1 ILED1 : Torch Current Driver ILED2 : Flash Current Driver tFLASH2 : Flash period protect Fig.30 3wired mode Torch and Flash Timing (Timer disable) If flash period is over tFLASH2 setting, flash current driver will enable to turn off. Protect time is controlled by flash ON timer resister setting. iii) Direct control interface mode TORCH (Pin) FLASH (Pin) 500ms 800mA ILED (0mA) 200mA There is LED protect function in this mode. Flash period is over 500ms, then this mode turn off flash. Fig.31 Direct Control mode Torch and Flash Timing iv) The voltage of VFB is as follows, (in DC/DC on) Torch mode 350mV Flash mode 350mV www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 10/15 2011.05 - Rev.B BD6062GU Technical Note 7) Soft start BD6062GU has soft start function. Soft start function will prevent the big peak current from IC and coil. The detail of soft start is as follows. L A ERRAMP VOUT SW B R Q S Q C PGND OSC EN VOUT A B (dashed) C duty width increase little by little Fig.32 Soft start Diagram and Timing 8) Soft Current Limiter BD6062GU has Soft Current Limiter function. Soft current limiter function will change the value of current gradually. It has four steps. And the steps are as follows; 4Step of soft current limiter Action Time Current Limit (DC) Current Limit “H (peak) Current Limit “L (peak) Start 0~500us 0A* always 1.125A 0.675A 2nd step 500~700us 0.5A 1.75A 1.05A 3rd step 700~800us 1A 2.375A 1.425A 4th step 800~900us 1.5A 3.0A 1.8A Normal 900us~ 2A 3.625A 2.175A Peak current of BD6062GU depends on only soft current limiter. Switching frequency or VBAT voltage does not affect Peak current of BD6062GU. 9) Thermal shut down BD6062GU has a thermal shut down function. It works above 175℃, and while, IC will change the status from active to inactive. When the temperature will be under 175℃, IC will return to normal operation. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 11/15 2011.05 - Rev.B BD6062GU Technical Note 10) Safety functions 10-1) Over voltage detect function (OVP) When OVP become more than 5.5V, IC stop the switching. When OVP become less than detect voltage, the status of switching will restart. 10-2) Open detect function (ODF) When OVP pin is not connected any components, IC will stop the switching. Absolute voltage stop the switching 5.5V(typ) OVP Normal operation normal voltage 0.7V(typ) stop the switching OPEN 0V Fig.33 Safety Voltage range ●Selection of external parts Recommended external parts are as shown below. When to use other parts than these, select the following equivalent parts. Coil(L1) Size Value Vendor Parts number X Y Z DCR (ohm) 4.7μH Taiyou Yuden NR4018T4R7M 4.0 4.0 1.8 0.09 4.7μH TDK VLF3012AT-4R7MR74* 2.6 2.8 1.2 0.13 *) for under 500mA application Capacitor Value Vendor Parts number MURATA 47μF 22μF Size X Y Z GRM188B30J225KE 1.6 0.8 0.8 MURATA GRM32EB31A476KE20 3.2 3.2 2.5 MURATA GRM21BB30J226ME38B* 2.0 1.25 1.25 Cin 2.2μF Cout *) for under 500mA application Resistance Value Vendor Parts number Size X Y Z class Rflash 0.12ohm ROHM MCR10EZHFLR120 2.0 1.25 0.55 ±1% 0.24ohm ROHM MCR10EZHFLR240* 2.0 1.25 0.55 ±1% Rtorch 1.0ohm ROHM MCR10EZHFL1R00 2.0 1.25 0.55 ±1% 2.0ohm ROHM MCR10EZHFL2R00* 2.0 1.25 0.55 ±1% *) for under 500mA application Shotkey Diode(D1) VF Vendor Parts number 0.43V ROHM RB160M-30 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 12/15 Size X Y Z 2.6 1.6 0.80 2011.05 - Rev.B BD6062GU Technical Note ●Recommended layout pattern BD6062GU + R2 D1 L1 + LED COUT A1 R1 CIN GND VBAT Fig.34 Frontal surface (TOP VIEW) Fig.35 Middle surface1 (TOP VIEW) Fig.36 Middle surface2 (TOP VIEW) Fig.37 Rear surface (TOP VIEW) ●Notes for use ( 1 ) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 13/15 2011.05 - Rev.B BD6062GU Technical Note (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. ( 10 ) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. ( 11 ) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. ( 12 ) Thermal shutdown circuit (TSD) When junction temperatures become 175℃ (typ) or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. ( 13 ) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. ( 14 ) Selection of coil Select the low DCR inductors to decrease power loss for DC/DC converter. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 14/15 2011.05 - Rev.B BD6062GU Technical Note ●Ordering part number B D 6 Part No. 0 6 2 G Part No. 6062 U - E Package GU : VCSP85H2 2 Packaging and forming specification E2: Embossed tape and reel VCSP85H2 (BD6062GU) <Tape and Reel information> 2.86±0.1 1.0MAX 0.25± 0.1 2.86± 0.1 1PIN MARK (φ0.15)INDEX POST B 1 0.43±0.1 E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 0.43± 0.1 A E D C B A 2500pcs P=0.5 × 4 0.08 S 0.05 A B Embossed carrier tape Quantity Direction of feed S 23- φ 0.30±0.05 Tape 2 3 4 5 1pin P=0.5×4 Reel (Unit : mm) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 15/15 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2011.05 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. R1120A