V i s h ay I n t e r t e c h n o l o g y, I n c . I INNOVAT AND TEC O L OGY D2TO20, D2TO35 N HN Power Thick Film Resistors O 19 62-2012 Resistors - 20 W and 35 W Power at 25 °C TO-263 (D2PAK) 20- and 35-Watt Power Thick Film Resistors Key Benefits • • • • • Standard TO-263 (D2PAK) package Wide ohmic value range: from R01 in 1 % tolerance up to 550 kΩ Non-inductive Compliant to RoHS Directive 2011/65/EU Compliant with high-temperature (270 ºC) soldering profile APPLICATIONS • • • • • • ower supplies P Current sensing Power conversion High-speed switching Snubbers RF applications Resources • Datasheet: D2TO20 - http://www.vishay.com/doc?51055 • Datasheet: D2TO35 - http://www.vishay.com/doc?51058 • For technical questions contact [email protected] One of the World’s Largest Manufacturers of Discrete Semiconductors and Passive Components PRODUCT SHEET 1/2 VMN-PT9204-1202 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V i s h ay I n t e r t e c h n o l o g y, I n c . TO-263 (D Vishay Sfernice Vishay Sfernice D2TO35 D2TO20 Vishay Sfernice I INNOVAT 2PAK) 20- and 35-Watt Power AND TEC O L OGY D2TO20, D2TO35 D2TO20 D2TO20 D2TO35 D2TO20 Vishay Sfernice N HN Power Thick Film Resistors O 19 62-2012 Mounted Power Resistor Thick Film Resistors Surface Mounted Power Resistor Surface Mounted Power Resistor Thick Film Technology Thick Film Technology Surface Mounted Power Resistor Surface Mounted Power Resistor Thick Film Technology FEATURES VishaySurface Sfernice Vishay Sfernice FEATURES FEATURES AEC-Q200 qualified AEC-Q200 qualified AEC-Q200 qualified 20 W at 25 °C case temperature FEATURES AEC-Q200 qualified AEC-Q200 20 °C temperature 20 AEC-Q200 qualified 35 W at at 25 25qualified °C case case temperature 20 W Surface mounted resistor TO-263 (D2PAK) 35 W at 25 °C case -temperature 22 2PAK) 20 W at 25 °C case temperature 20 W at 25 °C case temperature Surface mounted resistor TO-263 (D style package mounted resistor TO-263 (D2(D 2PAK) Surface2 mounted resistor ----TO-263 (D PAK) style mounted resistor TO-263 (D PAK) Surface mounted resistor - TO-263 style Surface mounted resistor-Surface TO-263 (D PAK) style style package mounted - TO-263 Wide resistance range from 0.01 (D to2PAK) 550 k package packageresistor style package package style package style package Wide resistance range from 0.01 to 550 k Wide resistance range from from 0.01 to to 550 550 k Wide range 0.01 from 0.01 to 550 k 0.01 Non Wide resistance range k Wide resistance range from inductive to 550 k resistance Wide range isolated Non inductive Non inductive Non resistance inductive Non inductive fromfrom metal0.01 tab to 550 k Non inductive Resistor Resistor isolated from metal tab Non inductive Resistor isolated from metal tab Resistor isolated from tab Resistor isolated fromatmetal metal tab s Solder reflow secure 270 °C/10 Resistor isolated from metal tab Resistor from metal tab isolated Solder reflow secure at 270 °C/10 s Solder reflow secure at 270 °C/10 s reflow Resistor isolated from metal tab Solder secure at °C/10 ss Solder reflow secure at 270 °C/10 to RoHS Directive 2002/95/EC Solder reflow secure at 270 270 °C/10 Compliant to RoHS Directive 2002/95/EC Compliant to RoHS Directive 2002/95/EC Compliant Solder reflow secure at 270 °C/10 ss D2TO35 Solder reflow at 270 °C/10 s Compliant to RoHS 2002/95/EC Compliant to RoHS Directive 2002/95/EC Compliant tosecure RoHS Directive Directive 2002/95/EC ComplianttotoRoHS RoHSDirective Directive2002/95/EC 2002/95/EC Compliant DIMENSIONS in millimeters Vishay Sfernice in millimeter s DIMENSIONS in millimeters DIMENSIONS DIMENSIONS millimeter s DIMENSIONS in in1.25 millimeter 4.5s DIMENSIONS millimeter 10.5 DIMENSIONS ininmillimeter ss 10.5 1.25 2.2 2.8 2.2 1.6 1.25 15.4 8.1 5.15 8.1 8.18.1 8.1 8.1 8.1 0.2 0.2 0.2 0.2 0.2 0.2 15.4 8.8 8.8 8.8 8.8 8.8 8.8 5.15 8.8 7.6 7.8 min. 11.00 15.4 5 15.4 15.4 15.4 15.4 15.4 1.6 2.8 Footprint recommendation for Footprint recommendation for solderable contact area: solderable contact area: Footprint for Footprint recommendation recommendation for Footprint recommendation for Footprint recommendation for solderable contact solderable contact area: area: for Footprint recommendation 11.00 solderable contact area: solderable contact area: solderable contact area: 11.00 1.50 1.50 4.02 4.02 11.00 11.00 11.00 1.50 11.00 4.02 11.00 6.50 6.50 1.50 8.00 1.50 4.02 FEATURES 8.00 1.50 4.02 4.02 1.50 4.02 2.49 1.50 7.6 4.004.02 2.49 4.00 6.50 AEC-Q200 qualified 8.00 6.50 6.50 8.00 6.50 8.00 35 W at 25 °C case temperature 8.00 6.50 2.49 7.6 4.00 8.00 6.50 2.40 2.40 8.00 7.6 Surface mounted resistor - TO-263 (D2PAK) style 2.49 4.00 2.49 7.6 4.00 0.26 2.49 7.6 0.26 4.00 5.08 2.49 7.6 4.00 2.49 7.6 package 4.00 8.7 8.7 8.7 8.7 7.88.7 min. 8.7 7.8 7.8 min. min. 7.8 min. 0.2 7.8 min. 7.8 min. 8.1 0.2 10.1 8.8 10.1 10.1 10.1 10.1 10.1 10.1 4.5 Footprint recommendation for solderable contact area: 8.7 5.15 1.25 5.15 5.15 1.25 1.25 1.25 5.15 5.15 5.15 1.25 1.25 8.7 1.25 1.25 7.8 min. 1.25 1.25 1.25 5 1.6 1.6 4.5 4.5 4.5 4.5 4.5 4.5 Surface Mounted Power Resistor Thick Film Technology 1.6 1.6 1.6 1.6 10.1 1.6 10.51.25 1.25 10.5 10.5 10.5 10.5 10.5 1.6 0.3 5 5555 5 5.08 2.8 0.3 2.8 2.8 2.8 Wide resistance range from 0.01 to 550 k 2.40 2.2 2.8 2 Tolerance: ± 0.3 mm 2 Tolerance: ± 0.3 mm 2.8 2.2 2.40 2.2 2.40 Non inductive 0.26 2.2 2.40 Notes Notes 1.6 2.2 5.08 2.40 2.2 2.40 For the(Pb)-free asssembly on board, weasrecommend the lead (Pb)-free thermal profile as per J-STD-020C 0.26 • For the asssembly on1.6 board, we recommend•the lead thermal profile per J-STD-020C 0.26 0.3 0.26 Resistor isolated from metal tab 1.6 5.08 5.08 1.6 0.26 using FR4 standard, 70 µm of • Power dissipation is 2.8 of 25 °C when mounted a double sided copper board usingmounted FR4 standard, 70 µmsided of copper 5.08 • Power dissipation is 3.3 W at anonambient temperature of 25 °C when on a double board 1.6W at an ambient temperature 0.3 0.26 0.3 0.3 copper, 39 mm x 301.6 mm x 1.6 mm 5.08 copper, 39 mm x 30 mm x 1.6 mm 5.08 Solder reflow secure at 270 °C/10 s 0.3 2 Tolerance: ± 0.3 mm 0.3 Compliant to RoHS Directive 2002/95/EC 22 Tolerance: ±± 2 Tolerance: 0.3 mm ELECTRICAL SPECIFICATIONS Tolerance: ± 0.3 0.3 mm mm Notes ELECTRICAL SPECIFICATIONS Tolerance: 0.3mm mm 2 2 (Pb)-free thermal Tolerance: ± ±0.3 •Notes For the asssembly on board, we recommend the lead as per J-STD-020C Notes Resistance Range 0.01 profile to 550 k ResistancesRange 0.01 to 550 k Notes DIMENSIONS in millimeter Notes For asssembly board, recommend the thermal profile as J-STD-020C ••• (Standard) Power 2.8 W at we an temperature of 25 °C when mounted on double sided copper board using FR4 standard, 70 µm of For the thedissipation asssemblyison on board, we ambient recommend the lead lead (Pb)-free (Pb)-free thermal profile as aper per J-STD-020C Notes For the asssembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C Tolerances ± 1 % profile to 10 % as Tolerances (Standard)the ± 1 % to 10 % • For the asssembly on board, we recommend lead (Pb)-free thermal per J-STD-020C Power dissipation is W at an ambient of 25 when on aa double sided copper using copper, 39 mm x 30 mm x 1.6 mm Power dissipation is 2.8 2.8 W at an ambient temperature temperature of 4.5 25 °C °Cthermal when mounted mounted onper a double sidedFootprint copper board board using FR4 FR4 standard, standard, 70 70 µm µm of of • •••For the asssembly on board, we recommend the lead (Pb)-free profile as J-STD-020C Power dissipation is 2.8 W at an ambient temperature of 25 °C when mounted on double sided copper board using FR4 standard, 70 µm of recommendation for 20 Wwhen at 25 °C (case temperature) 35 W atboard 25 °C (case temperature) Power dissipation is2.8 3.3 atanan ambienttemperature temperature °Cwhen mounted doublesided sidedcopper copper board using FR4standard, standard, µmofof copper, 39 xx mm xx 1.6 mm 1.25 copper, 39 mm mm x10.5 30 mm xatPower 1.6 mm • • Power dissipation is30 WW ambient ofof2525°C mounted onona adouble using FR4 7070µm Power Rating and Thermal Resistance Rating and Thermal Resistance copper, 39 mm 30 mm 1.6 mm solderable area: : 6.5 °C/W R RTH (jcontact TH (j - c) 8.7 - c): 4.28 °C/W copper,3939mm mmx x3030mm mmx x1.6 1.6mm mm ELECTRICAL SPECIFICATIONS copper, SPECIFICATIONS Temperature Coefficient D2TO20 SPECIFICATIONS ELECTRICAL SPECIFICATIONS ELECTRICAL Resistance Range Resistance Range SPECIFICATIONS 1.6 See Special 7.8 Features min. table See Special Features table 1.25 TemperatureELECTRICAL Coefficient Range ELECTRICAL Resistance 15.4 8.1 5 5.15 0.01Standard: to 550± 150 k ppm/°C 11.00 Standard: ± 150 ppm/°C 0.01 k 0.01 to to 550 550 k Resistance Range 0.01 250 V Limiting Element Voltage UL Limiting Element Voltage U(Standard) 250 V L Tolerances ±1 % to to 550 10 %k 1.50 4.02 ResistanceRange Range 0.01toto550 550k k Resistance 0.01 Tolerances ± to % 2000 Vrms 1 min Tolerances (Standard) (Standard) Dielectric Strength IEC 60115-1 ± 11 1% % to-10 10 % - 10 mA max. 20000.2 Vrms - 1 min - 10 mA max. Tolerances (Standard) ± % to 10 % 20 W at 25 °C (case temperature) Dielectric Strength IEC 60115-1 (between terminals and board) Tolerances (Standard) (between terminals and board) Tolerances (Standard) ± ±1 1%%toto1010%% Power Rating and Thermal Resistance 20 (case temperature) 8.8 10.1 20 W W at atR25 25 °C (case temperature) 6.50 : 6.5 °C/W TH °C (j - c) 6 M 20 W at 25 °C (case temperature) 8.00 Insulation Resistance 10 Power Resistance Power Rating Rating and and Thermal Thermal Resistance Insulation Resistance 106 M Power Rating and Thermal Resistance (case temperature) °C/W R 2035WWatat25 °C°C 6.5temperature) °C/W R25 TH (j(j (case - c) TH c)::: 6.5 6.5 °C/W R Power Rating and Thermal Resistance TH (j -- c) Power Rating and Thermal Resistance 0.1 µHtable SeeRSpecial Features : 4.28 °C/W Inductance Temperature Coefficient Inductance 0.1 7.6 µH 2.49 4.00 TH(j(j- -c)c) : 6.5 °C/W RTH See Special See Special Features table Standard: ±Features 150 ppm/°C 1.79 ktable See Special Features table Temperature Critical Resistance 3.12 k Temperature Coefficient Coefficient Critical Resistance See Special Features table Temperature Coefficient Standard: ± 150 ppm/°C SeeStandard: Special Features table Standard: ± 150 150 ppm/°C ppm/°C 2.8 Temperature Coefficient ± Temperature Coefficient Limiting Element Voltage UL 250 V ppm/°C Standard:± ±150 150 Standard: ppm/°C FEATURES SPECIALLimiting FEATURES 2.2 2.40 Element U 250 Limiting Element Voltage VoltageSPECIAL ULLL 250 V V Limiting Element Voltage U 250 V 2000 V - 1250 minV- 10 mA max. LimitingElement ElementVoltage VoltageUResistance UL Values 0.010 0.045 0.26 0.1 0.5 ResistanceLimiting Values 0.010 0.045 0.1 0.5 rms 250 V Dielectric IEC 60115-1 L 1.6 Strength 2000 V 1 min 10 mA max. 2000 V 1 min 10 mA max. 5.08 (between terminals and board) rms 2000 V±rms min 10 mA max. rms Tolerances 1% 10 % 2000 V -- at 11 ±min -- 10 mA max. Dielectric Strength Strength IEC IEC 60115-1 60115-1 0.3 rms Tolerances Dielectric ± 1 % at ± 10 % Dielectric Strength IEC 60115-1 2000 V 1 min 10 mA max. Dielectric Strength IEC 60115-1 (between terminals and board) (between terminals and board) board) rms terminals (between and Requirement Temperature Coefficient (TCR) Dielectric Strength IEC(TCR) 60115-1 (between terminals board) Insulation Resistance 106 Mand Requirement Temperature Coefficient (between andppm/°C board) (- 55 °C + 150ppm/°C °C) 1100 ppm/°C 700ppm/°C ppm/°Cterminals 250 ± 150 ppm/°C Tolerance: ±Resistance 0.3 mm 10 Insulation Resistance 10666 ±M M (- 55 °C + 150Insulation °C) ± 1100 ± 2700 ppm/°C ±± 250 ppm/°C ±±150 M Insulation Resistance 10 Inductance 0.1 µH IEC 60115-1 IEC 60115-1 Notes Insulation Resistance 106 M Inductance 0.1 µH Inductance 0.1 µH Inductance 0.1 k µH • Critical For the Resistance asssembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C 3.12 www.vishay.com For technical questions, contact: [email protected] Document Number: 51058 0.1 board µH using FR4 www.vishay.com technical questions, contact: [email protected] Number: •Inductance Power dissipation is 3.3 For W an ambient temperature of 25 °C when mounted onDocument a double sided51055 copper standard, 70 µm of Critical Resistance 3.12 22 at Revision: 19-Jul-11 Critical Resistance 3.12 k Critical Resistance 3.12 k k 18 Revision: 19-Jul-111.79 copper, 39 mm x 30 mm x 1.6 mm This document is subject to change without notice.3.12 k Critical Resistance SPECIAL FEATURES This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 THE PRODUCTSSPECIAL DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 FEATURES SPECIALValues FEATURES Resistance 0.010 SPECIAL FEATURES ELECTRICAL SPECIFICATIONS D2TO35 SPECIAL FEATURES Resistance 0.010 Resistance Values Values 0.010 0.045 0.1 0.5 0.045 0.045 0.1 0.1 0.5 0.5 Resistance Values Values 0.010 0.045 0.1 0.5 Resistance 0.010 0.045 0.1 0.5 Tolerances ± 1 % at ±0.01 10 % ResistanceValues Range to Resistance 0.010 0.045 0.1550 k 0.5 Tolerances ±± 11 % at ±± 10 % Tolerances % at 10 % Tolerances ± 1 % at ± 10 Requirement Temperature Coefficient (TCR) Tolerances (Standard) ± 1%% to 10 % Tolerances ± 1 % at ± 10 % Requirement Coefficient Requirement Temperature Coefficient (TCR) (TCR) (55 °C + 150 Temperature °C) ± 1100 ppm/°C ± 700 ppm/°C 250 ppm/°C Requirement Temperature Coefficient (TCR) 35 W at 25 ±°C (case temperature) ± 150 ppm/°C (55 °C + 150 °C) ± 1100 ppm/°C ± 700 ppm/°C ±± 250 ± Power Rating and Thermal Resistance Requirement Temperature Coefficient (TCR) (55 °C + 150 °C) ± 1100 ppm/°C ± 700 ppm/°C 250 ppm/°C ppm/°C ± 150 150 ppm/°C ppm/°C IEC 60115-1 (- 55 °C + 150 °C) ± 1100 ppm/°C ± 700 ppm/°C ppm/°C ± 150 ppm/°C RTH ±(j -250 c): 4.28 °C/W 60115-1 (-IEC 55 °C + 150 °C) ± 1100 ppm/°C ± 700 ppm/°C ± 250 ppm/°C ± 150 ppm/°C IEC 60115-1 IEC 60115-1 See Special Features table IEC 60115-1 Coefficient www.vishay.com For technical questions, contact: [email protected] Document Number: 51055 Temperature Standard: ± 150 ppm/°C www.vishay.com For Document Number: 51055 18 Revision: 19-Jul-11 51055 www.vishay.com For technical technical questions, questions, contact: contact: [email protected] [email protected] Document Number: 51058 51055 18 Revision: 18Limiting Element Voltage UL 250 V www.vishay.com For technical questions, contact: [email protected] Document Number:19-Jul-11 51055 22 Revision: 19-Jul-11 This document is subject to change without notice. 18 18THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT Revision: 19-Jul-11 ARE TO SPECIFIC FORTH AT www.vishay.com/doc?91000 This is subject without notice. This document document is SUBJECT subject to to change change withoutDISCLAIMERS, notice. 2000 Vrms -SET 1 min - 10 mA max. THE PRODUCTS DESCRIBED HEREIN SUBJECT TO DISCLAIMERS, SET AT Dielectric Strength IEC 60115-1 THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 www.vishay.com/doc?91000 This documentARE is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND AND THIS THIS DOCUMENT DOCUMENT ARE SUBJECT TO SPECIFIC SPECIFIC DISCLAIMERS, SET FORTH FORTH www.vishay.com/doc?91000 (between terminals andATboard) THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Insulation Resistance 106 M Revision 19-Jul-11 Resistors - 20 W and 35 W Power at 25 °C Film Technology Thick Film TechnologyThick FEATURES FEATURES AEC-Q200 qualified Inductance 0.1 µH Critical Resistance 1.79 k SPECIAL FEATURES PRODUCT SHEET Resistance Values Tolerances 0.010 2/2 0.045 0.1 VMN-PT9204-1202 0.5 ± 1 % at ± 10 % Requirement Temperature Coefficient (TCR) This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO (- 55 °C + 150 °C) ± 1100 ppm/°C ± 700 ppm/°C ± 250 ppm/°C ± 150 ppm/°C SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 IEC 60115-1