5-Channel Integrated Power Solution with Quad Buck Regulators and 200 mA LDO Regulator ADP5050 Data Sheet FEATURES TYPICAL APPLICATION CIRCUIT ADP5050 SYNC/MODE VREG VDD C1 INT VREG OSCILLATOR 100mA RT C0 FB1 PVIN1 4.5V TO 15V BST1 C2 COMP1 CHANNEL 1 BUCK REGULATOR (1.2A/2.5A/4A) SW1 EN1 DL2 RILIM1 RILIM2 Q2 CHANNEL 2 BUCK REGULATOR (1.2A/2.5A/4A) VREG EN3 C6 L2 C7 FB2 PVIN3 COMP3 VOUT2 SW2 BST2 EN2 C8 VOUT1 C4 PGND PVIN2 COMP2 L1 Q1 DL1 SS12 C5 C3 VREG BST3 CHANNEL 3 BUCK REGULATOR (1.2A) SW3 C9 L3 VOUT3 C10 FB3 PGND3 SS34 BST4 PVIN4 C11 COMP4 CHANNEL 4 BUCK REGULATOR (1.2A) EN4 1.7V TO 5.5V C14 PVIN5 EN5 VDDIO SCL SDA SW4 C12 L4 VOUT4 C13 FB4 PGND4 CHANNEL 5 200mA LDO REGULATOR I2C ALERT VOUT5 VOUT5 FB5 C15 PWRGD nINT APPLICATIONS EXPOSED PAD Small cell base stations FPGA and processor applications Security and surveillance Medical applications Figure 1. GENERAL DESCRIPTION The ADP5050 combines four high performance buck regulators and one 200 mA low dropout (LDO) regulator in a 48-lead LFCSP package that meets demanding performance and board space requirements. The device enables direct connection to high input voltages up to 15 V with no preregulators. Channel 1 and Channel 2 integrate high-side power MOSFETs and low-side MOSFET drivers. External NFETs can be used in low-side power devices to achieve an efficiency optimized solution and deliver a programmable output current of 1.2 A, 2.5 A, or 4 A. Combining Channel 1 and Channel 2 in a parallel configuration can provide a single output with up to 8 A of current. Channel 3 and Channel 4 integrate both high-side and low-side MOSFETs to deliver output current of 1.2 A. Rev. 0 The switching frequency of the ADP5050 can be programmed or synchronized to an external clock. The ADP5050 contains a precision enable pin on each channel for easy power-up sequencing or adjustable UVLO threshold. The ADP5050 integrates a general-purpose LDO regulator with low quiescent current and low dropout voltage that provides up to 200 mA of output current. The optional I2C interface provides the user with flexible configuration options, including adjustable and fixed output voltage options, junction temperature overheat warning, low input voltage detection, and dynamic voltage scaling (DVS). Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2013 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com 10899-001 Wide input voltage range: 4.5 V to 15 V ±1.5% output accuracy over full temperature range 250 kHz to 1.4 MHz adjustable switching frequency Adjustable/fixed output options via factory fuse or I2C interface I2C interface with interrupt on fault conditions Power regulation Channel 1 and Channel 2: programmable 1.2 A/2.5 A/4 A sync buck regulators with low-side FET driver Channel 3 and Channel 4: 1.2 A sync buck regulators Channel 5: 200 mA low dropout (LDO) regulator Single 8 A output (Channel 1 and Channel 2 operated in parallel) Dynamic voltage scaling (DVS) for Channel 1 and Channel 4 Precision enable with 0.8 V accurate threshold Active output discharge switch Programmable phase shift in 90° steps Individual channel FPWM/PSM mode selection Frequency synchronization input or output Optional latch-off protection on OVP/OCP failure Power-good flag on selected channels Low input voltage detection Overheat detection on junction temperature UVLO, OCP, and TSD protection 48-lead, 7 mm × 7 mm LFCSP package −40°C to +125°C junction temperature ADP5050 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Thermal Shutdown .................................................................... 26 Applications ....................................................................................... 1 Overheat Detection .................................................................... 26 Typical Application Circuit ............................................................. 1 Low Input Voltage Detection .................................................... 26 General Description ......................................................................... 1 LDO Regulator ........................................................................... 26 Revision History ............................................................................... 3 I C Interface .................................................................................... 27 Detailed Functional Block Diagram .............................................. 4 SDA and SCL Pins ...................................................................... 27 Specifications..................................................................................... 5 I2C Addresses .............................................................................. 27 Buck Regulator Specifications .................................................... 6 Self-Clear Register Bits .............................................................. 27 LDO Regulator Specifications .................................................... 8 I2C Interface Timing Diagrams ................................................ 28 I2C Interface Timing Specifications ........................................... 9 Applications Information .............................................................. 29 Absolute Maximum Ratings .......................................................... 10 ADIsimPower Design Tool ....................................................... 29 Thermal Resistance .................................................................... 10 Programming the Adjustable Output Voltage ........................ 29 ESD Caution ................................................................................ 10 Voltage Conversion Limitations ............................................... 29 Pin Configuration and Function Descriptions ........................... 11 Current-Limit Setting ................................................................ 29 Typical Performance Characteristics ........................................... 13 Soft Start Setting ......................................................................... 30 Theory of Operation ...................................................................... 19 Inductor Selection ...................................................................... 30 Buck Regulator Operational Modes......................................... 19 Output Capacitor Selection....................................................... 30 Adjustable and Fixed Output Voltages .................................... 20 Input Capacitor Selection .......................................................... 31 Dynamic Voltage Scaling (DVS) .............................................. 20 Low-Side Power Device Selection ............................................ 31 Internal Regulators (VREG and VDD) ................................... 20 Programming the UVLO Input ................................................ 31 Separate Supply Applications .................................................... 20 Compensation Components Design ....................................... 32 Low-Side Device Selection ........................................................ 21 Power Dissipation....................................................................... 32 Bootstrap Circuitry .................................................................... 21 Junction Temperature ................................................................ 33 Active Output Discharge Switch .............................................. 21 Design Example .............................................................................. 34 Precision Enabling ...................................................................... 21 Setting the Switching Frequency .............................................. 34 Oscillator ..................................................................................... 21 Setting the Output Voltage ........................................................ 34 Synchronization Input/Output ................................................. 22 Setting the Current Limit .......................................................... 34 Soft Start ...................................................................................... 23 Selecting the Inductor ................................................................ 34 Parallel Operation....................................................................... 23 Selecting the Output Capacitor ................................................ 35 Startup with Precharged Output .............................................. 23 Selecting the Low-Side MOSFET ............................................. 35 Current-Limit Protection .......................................................... 24 Designing the Compensation Network ................................... 35 Frequency Foldback ................................................................... 24 Selecting the Soft Start Time..................................................... 35 Hiccup Protection ...................................................................... 24 Selecting the Input Capacitor ................................................... 35 Latch-Off Protection .................................................................. 24 Recommended External Components .................................... 36 Undervoltage Lockout (UVLO) ............................................... 25 Circuit Board Layout Recommendations ................................... 37 Power-Good Function ............................................................... 25 Typical Application Circuits ......................................................... 38 Interrupt Function...................................................................... 25 Register Map ................................................................................... 41 2 Rev. 0 | Page 2 of 60 Data Sheet ADP5050 Detailed Register Descriptions ......................................................42 Register 1: PCTRL (Channel Enable Control), Address 0x01 ................................................................................42 Register 2: VID1 (VID Setting for Channel 1), Address 0x02 ................................................................................42 Register 3: VID23 (VID Setting for Channel 2 and Channel 3), Address 0x03...................................................43 Register 4: VID4 (VID Setting for Channel 4), Address 0x04 ................................................................................43 Register 5: DVS_CFG (DVS Configuration for Channel 1 and Channel 4), Address 0x05 .........................44 Register 6: OPT_CFG (FPWM/PSM Mode and Output Discharge Function Configuration), Address 0x06................45 Register 7: LCH_CFG (Short-Circuit Latch-Off and Overvoltage Latch-Off Configuration), Address 0x07 ..........46 Register 8: SW_CFG (Switching Frequency and Phase Shift Configuration), Address 0x08 .......................47 Register 9: TH_CFG (Temperature Warning and Low VIN Warning Threshold Configuration), Address 0x09 .........48 Register 10: HICCUP_CFG (Hiccup Configuration), Address 0x0A .................................................. 49 Register 11: PWRGD_MASK (Channel Mask Configuration for PWRGD Pin), Address 0x0B..................... 50 Register 12: LCH_STATUS (Latch-Off Status Readback), Address 0x0C .......................................................... 51 Register 13: STATUS_RD (Status Readback), Address 0x0D .............................................................................. 51 Register 14: INT_STATUS (Interrupt Status Readback), Address 0x0E........................................................... 52 Register 15: INT_MASK (Interrupt Mask Configuration), Address 0x0F ................................................... 53 Register 17: DEFAULT_SET (Default Reset), Address 0x11................................................................................ 53 Factory Programmable Options .................................................... 54 Factory Default Options............................................................. 56 Outline Dimensions ........................................................................ 57 Ordering Guide ........................................................................... 57 REVISION HISTORY 5/13—Revision 0: Initial Version Rev. 0 | Page 3 of 60 ADP5050 Data Sheet DETAILED FUNCTIONAL BLOCK DIAGRAM CHANNEL 1 BUCK REGULATOR UVLO1 PVIN1 – 0.8V + + EN1 ACS1 – 1MΩ VREG HICCUP AND LATCH-OFF + OCP CLK1 – BST1 Q1 DRIVER + CMP1 – COMP1 0.8V FB1 + EA1 – CLK1 FREQUENCY FOLDBACK OVP LATCH-OFF + VID1 0.72V + 0.99V – PWRGD1 QDG1 CONTROL LOGIC AND MOSFET DRIVER WITH ANTICROSS PROTECTION VREG SW1 DISCHARGE SWITCH SLOPE COMP DL1 DRIVER PGND ZERO CROSS – CURRENT-LIMIT SELECTION CURRENT BALANCE EN2 PVIN2 CHANNEL 2 BUCK REGULATOR BST2 COMP2 DUPLICATE CHANNEL 1 DL2 SW2 FB2 VREG PVIN1 RT OSCILLATOR INTERNAL REGULATOR SOFT START DECODER POWER-ON I2C RESET INTERFACE AND REGISTERS SYNC/MODE SS12 SS34 PWRGD HOUSEKEEPING LOGIC QPWRGD CHANNEL 3 BUCK REGULATOR UVLO3 VDDIO SCL SDA nINT + + EN3 VDD PVIN3 – 0.8V VREG ACS3 – 1MΩ VREG HICCUP AND LATCH-OFF + OCP – CLK3 BST3 Q3 DRIVER + CMP3 – COMP3 0.8V FB3 + EA3 – CLK3 FREQUENCY FOLDBACK OVP LATCH-OFF + VID3 0.72V EN4 + 0.99V – PWRGD3 SW3 CONTROL LOGIC AND MOSFET DRIVER WITH ANTICROSS PROTECTION VREG Q4 DRIVER PGND3 ZERO CROSS – QDG3 DISCHARGE SWITCH SLOPE COMP PVIN4 CHANNEL 4 BUCK REGULATOR BST4 DUPLICATE CHANNEL 3 COMP4 SW4 FB4 PGND4 CHANNEL 5 LDO REGULATOR VOUT5 PVIN5 0.8V + LDO CONTROL Q7 1MΩ – EA5 + 0.5V FB5 10899-202 EN5 – Figure 2. Rev. 0 | Page 4 of 60 Data Sheet ADP5050 SPECIFICATIONS VIN = 12 V, VVREG = 5.1 V, TJ = −40°C to +125°C for minimum and maximum specifications, and TA = 25°C for typical specifications, unless otherwise noted. Table 1. Parameter INPUT SUPPLY VOLTAGE RANGE QUIESCENT CURRENT Operating Quiescent Current UNDERVOLTAGE LOCKOUT Rising Threshold Falling Threshold Hysteresis OSCILLATOR CIRCUIT Switching Frequency Switching Frequency Range SYNC Input Input Clock Range Input Clock Pulse Width Minimum On Time Minimum Off Time Input Clock High Voltage Input Clock Low Voltage SYNC Output Clock Frequency Positive Pulse Duty Cycle Rise or Fall Time High Level Voltage PRECISION ENABLING High Level Threshold Low Level Threshold Pull-Down Resistor POWER GOOD Internal Power-Good Rising Threshold Internal Power-Good Hysteresis Internal Power-Good Falling Delay Rising Delay for PWRGD Pin Leakage Current for PWRGD Pin Output Low Voltage for PWRGD Pin LOGIC INPUTS (SCL AND SDA PINS) High Level Threshold Low Level Threshold LOGIC OUTPUTS Low Level Output Voltage SDA Pin nINT Pin INTERNAL REGULATORS VDD Output Voltage VDD Current Limit VREG Output Voltage VREG Dropout Voltage VREG Current Limit Symbol VIN IQ(4-BUCKS) ISHDN(4BUCKS+LDO) UVLO VUVLO-RISING VUVLO-FALLING VHYS Min 4.5 3.6 fSW 700 250 fSYNC 250 tSYNC_MIN_ON tSYNC_MIN_OFF VH(SYNC) VL(SYNC) 100 100 1.3 Typ Max 15.0 Unit V 4.8 25 6.25 65 mA µA 4.2 3.78 0.42 4.36 V V V 740 780 1400 kHz kHz 1400 kHz 0.4 ns ns V V Test Conditions/Comments PVIN1, PVIN2, PVIN3, PVIN4 pins PVIN1, PVIN2, PVIN3, PVIN4 pins No switching, all ENx pins high All ENx pins low PVIN1, PVIN2, PVIN3, PVIN4 pins RT = 25.5 kΩ fCLK tCLK_PULSE_DUTY tCLK_RISE_FALL VH(SYNC_OUT) fSW 50 10 VVREG kHz % ns V VTH_H(EN) VTH_L(EN) RPULL-DOWN(EN) 0.806 0.725 1.0 0.832 V V MΩ 90.5 3.3 50 1 0.1 50 95 1 100 % % µs ms µA mV 0.3 × VDDIO V V 0.4 0.4 V V VDDIO = 3.3 V, ISDA = 3 mA InINT = 3 mA 3.4 80 5.3 V mA V mV mA IVDD = 10 mA EN1, EN2, EN3, EN4, EN5 pins 0.688 VPWRGD(RISE) VPWRGD(HYS) tPWRGD_FALL tPWRGD_PIN_RISE IPWRGD_LEAKAGE VPWRGD_LOW 86.3 VLOGIC_HIGH VLOGIC_LOW 0.7 × VDDIO VSDA_LOW VnINT_LOW VVDD ILIM_VDD VVREG VDROPOUT ILIM_VREG 3.2 20 4.9 50 3.305 51 5.1 225 95 Rev. 0 | Page 5 of 60 140 IPWRGD = 1 mA VDDIO = 3.3 V IVREG = 50 mA ADP5050 Data Sheet Parameter LOW INPUT VOLTAGE DETECTION Low Input Voltage Threshold Symbol Min Typ Max Unit Test Conditions/Comments VLVIN-TH 4.236 10.25 Low Input Voltage Threshold Range THERMAL SHUTDOWN Thermal Shutdown Threshold Thermal Shutdown Hysteresis 4.07 10.05 4.2 4.39 10.4 11.2 V V V LVIN_TH[3:0] = 0000 LVIN_TH[3:0] = 1100 I2C programmable (4-bit value) TSHDN THYS THERMAL OVERHEAT WARNING Thermal Overheat Threshold Overheat Threshold Range Thermal Overheat Hysteresis °C °C 150 15 THOT 115 105 125 THOT(HYS) 5 °C °C °C TEMP_TH[1:0] = 10 I2C programmable (2-bit value) BUCK REGULATOR SPECIFICATIONS VIN = 12 V, VVREG = 5.1 V, fSW = 600 kHz for all channels, TJ = −40°C to +125°C for minimum and maximum specifications, and TA = 25°C for typical specifications, unless otherwise noted. Table 2. Parameter CHANNEL 1 SYNC BUCK REGULATOR FB1 Pin Fixed Output Options Adjustable Feedback Voltage Feedback Voltage Accuracy Symbol Min VOUT1 0.85 VFB1 VFB1(DEFAULT) Typ IFB1 Minimum On Time Minimum Off Time Low-Side Driver, DL1 Pin Rising Time Falling Time Sourcing Resistor Sinking Resistor Error Amplifier (EA), COMP1 Pin EA Transconductance Soft Start Soft Start Time Programmable Soft Start Range Hiccup Time COUT Discharge Switch On Resistance tMIN_ON1 tMIN_OFF1 4.4 2.63 6.44 117 1/9 × tSW tRISING1 tFALLING1 tSOURCING1 tSINKING1 20 3.4 10 0.95 RDSON(1H) gm1 Test Conditions/Comments 1.60 V Fuse trim or I2C interface (5-bit value) +0.55 +1.0 +1.5 0.1 V % % % µA TJ = 25°C 0°C ≤ TJ ≤ 85°C −40°C ≤ TJ ≤ +125°C Adjustable voltage mΩ Pin-to-pin measurement A A A ns ns RILIM1 = floating RILIM1 = 47 kΩ RILIM1 = 22 kΩ fSW = 250 kHz to 1.4 MHz fSW = 250 kHz to 1.4 MHz ns ns Ω Ω CISS = 1.2 nF CISS = 1.2 nF 100 3.50 1.91 4.95 310 tSS1 470 5.28 3.08 7.48 155 620 2.0 2.0 tHICCUP1 RDIS1 Unit 0.800 −0.55 −1.25 −1.5 Feedback Bias Current SW1 Pin High-Side Power FET On Resistance Current-Limit Threshold ITH(ILIM1) Max 8.0 7 × tSS1 250 Rev. 0 | Page 6 of 60 µS ms ms ms Ω SS12 connected to VREG Data Sheet Parameter CHANNEL 2 SYNC BUCK REGULATOR FB2 Pin Fixed Output Options Adjustable Feedback Voltage Feedback Voltage Accuracy Feedback Bias Current SW2 Pin High-Side Power FET On Resistance Current-Limit Threshold Minimum On Time Minimum Off Time Low-Side Driver, DL2 Pin Rising Time Falling Time Sourcing Resistor Sinking Resistor Error Amplifier (EA), COMP2 Pin EA Transconductance Soft Start Soft Start Time Programmable Soft Start Range Hiccup Time COUT Discharge Switch On Resistance CHANNEL 3 SYNC BUCK REGULATOR FB3 Pin Fixed Output Options Adjustable Feedback Voltage Feedback Voltage Accuracy Feedback Bias Current SW3 Pin High-Side Power FET On Resistance Low-Side Power FET On Resistance Current-Limit Threshold Minimum On Time Minimum Off Time Error Amplifier (EA), COMP3 Pin EA Transconductance Soft Start Soft Start Time Programmable Soft Start Range Hiccup Time COUT Discharge Switch On Resistance ADP5050 Symbol Min VOUT2 3.3 VFB2 VFB2(DEFAULT) Typ −0.55 −1.25 −1.5 RDSON(2H) tMIN_ON2 tMIN_OFF2 tRISING2 tFALLING2 tSOURCING2 tSINKING2 20 3.4 10 0.95 3.50 1.91 4.95 310 470 tSS2 V Fuse trim or I2C interface (3-bit value) +0.55 +1.0 +1.5 0.1 V % % % µA TJ = 25°C 0°C ≤ TJ ≤ 85°C −40°C ≤ TJ ≤ +125°C Adjustable voltage mΩ Pin-to-pin measurement A A A ns ns RILIM2 = floating RILIM2 = 47 kΩ RILIM2 = 22 kΩ fSW = 250 kHz to 1.4 MHz fSW = 250 kHz to 1.4 MHz ns ns Ω Ω CISS = 1.2 nF CISS = 1.2 nF 5.28 3.08 7.48 155 620 SS12 connected to VREG 1.80 V Fuse trim or I2C interface (3-bit value) +0.55 +1.0 +1.5 0.1 V % % % µA TJ = 25°C 0°C ≤ TJ ≤ 85°C −40°C ≤ TJ ≤ +125°C Adjustable voltage 7 × tSS2 250 1.20 0.800 −0.55 −1.25 −1.5 IFB3 µS ms ms ms Ω 8.0 tHICCUP2 RDIS2 VFB3 VFB3(DEFAULT) 5.0 2.0 2.0 VOUT3 Test Conditions/Comments 110 4.4 2.63 6.44 117 1/9 × tSW gm2 Unit 0.800 IFB2 ITH(ILIM2) Max RDSON(3H) 225 mΩ Pin-to-pin measurement RDSON(3L) 150 mΩ Pin-to-pin measurement fSW = 250 kHz to 1.4 MHz fSW = 250 kHz to 1.4 MHz ITH(ILIM3) tMIN_ON3 tMIN_OFF3 1.7 gm3 310 tSS3 2.2 90 1/9 × tSW 2.55 120 A ns ns 470 620 µS 2.0 2.0 tHICCUP3 RDIS3 8.0 7 × tSS3 250 Rev. 0 | Page 7 of 60 ms ms ms Ω SS34 connected to VREG ADP5050 Parameter CHANNEL 4 SYNC BUCK REGULATOR FB4 Pin Fixed Output Options Adjustable Feedback Voltage Feedback Voltage Accuracy Feedback Bias Current SW4 Pin High-Side Power FET On Resistance Low-Side Power FET On Resistance Current-Limit Threshold Minimum On Time Minimum Off Time Error Amplifier (EA), COMP4 Pin EA Transconductance Soft Start Soft Start Time Programmable Soft Start Range Hiccup Time COUT Discharge Switch On Resistance Data Sheet Symbol Min VOUT4 2.5 VFB4 VFB4(DEFAULT) Typ Max Unit Test Conditions/Comments 5.5 V Fuse trim or I2C interface (5-bit value) +0.55 +1.0 +1.5 0.1 V % % % µA TJ = 25°C 0°C ≤ TJ ≤ 85°C −40°C ≤ TJ ≤ +125°C 0.800 −0.55 −1.25 −1.5 IFB4 RDSON(4H) 225 mΩ Pin-to-pin measurement RDSON(4L) 150 mΩ Pin-to-pin measurement fSW = 250 kHz to 1.4 MHz fSW = 250 kHz to 1.4 MHz ITH(ILIM4) tMIN_ON4 tMIN_OFF4 1.7 gm4 310 tSS4 2.2 90 1/9 × tSW 2.55 120 A ns ns 470 620 µS 2.0 2.0 8.0 tHICCUP4 RDIS4 7 × tSS4 250 ms ms ms Ω SS34 connected to VREG LDO REGULATOR SPECIFICATIONS VIN5 = (VOUT5 + 0.5 V) or 1.7 V (whichever is greater) to 5.5 V; CIN = COUT = 1 µF; TJ = −40°C to +125°C for minimum and maximum specifications, and TA = 25°C for typical specifications, unless otherwise noted. Table 3. Parameter INPUT SUPPLY VOLTAGE RANGE OPERATIONAL SUPPLY CURRENT Bias Current for LDO Regulator VOLTAGE FEEDBACK (FB5 PIN) Adjustable Feedback Voltage Feedback Voltage Accuracy Min 1.7 Typ Max 5.5 Unit V Test Conditions/Comments PVIN5 pin 30 60 145 130 170 320 µA µA µA IOUT5 = 200 µA IOUT5 = 10 mA IOUT5 = 200 mA +1.0 +1.6 +2.0 V % % % 0.500 −1.0 −1.6 −2.0 DROPOUT VOLTAGE CURRENT-LIMIT THRESHOLD OUTPUT NOISE POWER SUPPLY REJECTION RATIO 250 80 100 180 510 mV mV mV mA 92 µV rms 77 66 dB dB Rev. 0 | Page 8 of 60 TJ = 25°C 0°C ≤ TJ ≤ 85°C −40°C ≤ TJ ≤ +125°C IOUT5 = 200 mA VOUT5 = 3.3 V VOUT5 = 2.5 V VOUT5 = 1.5 V Specified from the output voltage drop to 90% of the specified typical value 10 Hz to 100 kHz, VPVIN5 = 5 V, VOUT5 = 1.8 V VPVIN5 = 5 V, VOUT5 = 1.8 V, IOUT5 = 1 mA 10 kHz 100 kHz Data Sheet ADP5050 I2C INTERFACE TIMING SPECIFICATIONS TA = 25°C, VVDD = 3.3 V, VVDDIO = 3.3 V, unless otherwise noted. Table 4. Parameter fSCL tHIGH tLOW tSU,DAT tHD,DAT tSU,STA tHD,STA tBUF tSU,STO tR tF tSP CB 2 Min Typ 0.6 1.3 100 0 0.6 0.6 1.3 0.6 20 + 0.1CB2 20 + 0.1CB2 0 Max 400 Unit kHz µs µs ns µs µs µs µs µs ns ns ns pF 0.9 300 300 50 400 Description SCL clock frequency SCL high time SCL low time Data setup time Data hold time 1 Setup time for a repeated start condition Hold time for a start or repeated start condition Bus free time between a stop condition and a start condition Setup time for a stop condition Rise time of SCL and SDA Fall time of SCL and SDA Pulse width of suppressed spike Capacitive load for each bus line A master device must provide a hold time of at least 300 ns for the SDA signal (referred to the VIH minimum of the SCL signal) to bridge the undefined region of the SCL falling edge. 2 CB is the total capacitance of one bus line in picofarads (pF). 1 Timing Diagram SDA tLOW tF tR tF tHD,STA tSU,DAT tSP tBUF tR SCL tHD,DAT tHIGH tSU,STA Sr tSU,STO P S 10899-102 S S = START CONDITION Sr = REPEATED START CONDITION P = STOP CONDITION Figure 3. I2C Interface Timing Diagram Rev. 0 | Page 9 of 60 ADP5050 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 5. Parameter PVIN1 to PGND PVIN2 to PGND PVIN3 to PGND3 PVIN4 to PGND4 PVIN5 to GND SW1 to PGND SW2 to PGND SW3 to PGND3 SW4 to PGND4 PGND to GND PGND3 to GND PGND4 to GND BST1 to SW1 BST2 to SW2 BST3 to SW3 BST4 to SW4 DL1 to PGND DL2 to PGND SS12, SS34 to GND EN1, EN2, EN3, EN4, EN5 to GND VREG to GND SYNC/MODE to GND VOUT5, FB5 to GND RT to GND nINT, PWRGD to GND FB1, FB2, FB3, FB4 to GND1 FB2 to GND2 FB4 to GND2 COMP1, COMP2, COMP3, COMP4 to GND VDD, VDDIO to GND SCL, SDA Storage Temperate Range Operational Junction Temperature Range 1 2 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rating −0.3 V to +18 V −0.3 V to +18 V −0.3 V to +18 V −0.3 V to +18 V −0.3 V to +6.5 V −0.3 V to +18 V −0.3 V to +18 V −0.3 V to +18 V −0.3 V to +18 V −0.3 V to +0.3 V −0.3 V to +0.3 V −0.3 V to +0.3 V −0.3 V to +6.5 V −0.3 V to +6.5 V −0.3 V to +6.5 V −0.3 V to +6.5 V −0.3 V to +6.5 V −0.3 V to +6.5 V −0.3 V to +6.5 V −0.3 V to +6.5 V −0.3 V to +6.5 V −0.3 V to +6.5 V −0.3 V to +6.5 V −0.3 V to +3.6 V −0.3 V to +6.5 V −0.3 V to +3.6 V −0.3 V to +6.5 V −0.3 V to +7 V −0.3 V to +3.6 V THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 6. Thermal Resistance Package Type 48-Lead LFCSP ESD CAUTION −0.3 V to +3.6 V −0.3 V to VDDIO + 0.3 V −65°C to +150°C −40°C to +125°C This rating applies to the adjustable output voltage models of the ADP5050. This rating applies to the fixed output voltage models of the ADP5050. Rev. 0 | Page 10 of 60 θJA 27.87 θJC 2.99 Unit °C/W Data Sheet ADP5050 48 47 46 45 44 43 42 41 40 39 38 37 EN3 SS34 COMP3 FB3 VREG SYNC/MODE VDD RT FB1 COMP1 SS12 EN1 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS ADP5050 TOP VIEW (Not to Scale) 36 35 34 33 32 31 30 29 28 27 26 25 PVIN1 PVIN1 SW1 SW1 BST1 DL1 PGND DL2 BST2 SW2 SW2 PVIN2 NOTES 1. THE EXPOSED PAD MUST BE CONNECTED AND SOLDERED TO AN EXTERNAL GROUND PLANE. 10899-002 nINT EN4 COMP4 FB4 VDDIO SDA SCL PWRGD FB2 COMP2 EN2 PVIN2 13 14 15 16 17 18 19 20 21 22 23 24 BST3 1 PGND3 2 SW3 3 PVIN3 4 EN5 5 FB5 6 VOUT5 7 PVIN5 8 PVIN4 9 SW4 10 PGND4 11 BST4 12 Figure 4. Pin Configuration Table 7. Pin Function Descriptions Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Mnemonic BST3 PGND3 SW3 PVIN3 EN5 FB5 VOUT5 PVIN5 PVIN4 SW4 PGND4 BST4 nINT EN4 COMP4 FB4 VDDIO SDA SCL PWRGD 21 22 23 24, 25 26, 27 28 29 FB2 COMP2 EN2 PVIN2 SW2 BST2 DL2 Description High-Side FET Driver Power Supply for Channel 3. Power Ground for Channel 3. Switching Node Output for Channel 3. Power Input for Channel 3. Connect a bypass capacitor between this pin and ground. Enable Input for Channel 5. An external resistor divider can be used to set the turn-on threshold. Feedback Sensing Input for Channel 5. Power Output for Channel 5. Power Input for Channel 5. Connect a bypass capacitor between this pin and ground. Power Input for Channel 4. Connect a bypass capacitor between this pin and ground. Switching Node Output for Channel 4. Power Ground for Channel 4. High-Side FET Driver Power Supply for Channel 4. Interrupt Output on Fault Condition. Open-drain output port. Enable Input for Channel 4. An external resistor divider can be used to set the turn-on threshold. Error Amplifier Output for Channel 4. Connect an RC network from this pin to ground. Feedback Sensing Input for Channel 4. Power Supply for the I2C Interface. Data Input/Output for the I2C Interface. Open-drain I/O port. Clock Input for the I2C Interface. Power-Good Signal Output. This open-drain output is the power-good signal for the selected channels. This pin can be programmed by the factory to set the I2C address of the part; the I2C address setting function replaces the power-good function on this pin. For more information, see the I2C Addresses section. Feedback Sensing Input for Channel 2. Error Amplifier Output for Channel 2. Connect an RC network from this pin to ground. Enable Input for Channel 2. An external resistor divider can be used to set the turn-on threshold. Power Input for Channel 2. Connect a bypass capacitor between this pin and ground. Switching Node Output for Channel 2. High-Side FET Driver Power Supply for Channel 2. Low-Side FET Gate Driver for Channel 2. Connect a resistor from this pin to ground to program the current-limit threshold for Channel 2. Rev. 0 | Page 11 of 60 ADP5050 Pin No. 30 31 Mnemonic PGND DL1 32 33, 34 35, 36 BST1 SW1 PVIN1 37 38 EN1 SS12 39 40 41 COMP1 FB1 RT 42 43 VDD SYNC/MODE 44 45 46 47 VREG FB3 COMP3 SS34 48 EN3 EPAD Data Sheet Description Power Ground for Channel 1 and Channel 2. Low-Side FET Gate Driver for Channel 1. Connect a resistor from this pin to ground to program the current-limit threshold for Channel 1. High-Side FET Driver Power Supply for Channel 1. Switching Node Output for Channel 1. Power Input for the Internal 5.1 V VREG Linear Regulator and the Channel 1 Buck Regulator. Connect a bypass capacitor between this pin and ground. Enable Input for Channel 1. An external resistor divider can be used to set the turn-on threshold. Connect a resistor divider from this pin to VREG and ground to configure the soft start time for Channel 1 and Channel 2 (see the Soft Start section). This pin is also used to configure parallel operation of Channel 1 and Channel 2 (see the Parallel Operation section). Error Amplifier Output for Channel 1. Connect an RC network from this pin to ground. Feedback Sensing Input for Channel 1. Connect a resistor from RT to ground to program the switching frequency from 250 kHz to 1.4 MHz. For more information, see the Oscillator section. Output of the Internal 3.3 V Linear Regulator. Connect a 1 µF ceramic capacitor between this pin and ground. Synchronization Input/Output (SYNC). To synchronize the switching frequency of the part to an external clock, connect this pin to an external clock with a frequency from 250 kHz to 1.4 MHz. This pin can also be configured as a synchronization output using the I2C interface or by factory fuse. Forced PWM or Automatic PWM/PSM Selection Pin (MODE). When this pin is logic high, each channel operates in forced PWM or automatic PWM/PSM mode, as specified by the PSMx_ON bits in Register 6. When this pin is logic low, all channels operate in automatic PWM/PSM mode, and the PSMx_ON settings in Register 6 are ignored. Output of the Internal 5.1 V Linear Regulator. Connect a 1 µF ceramic capacitor between this pin and ground. Feedback Sensing Input for Channel 3. Error Amplifier Output for Channel 3. Connect an RC network from this pin to ground. Connect a resistor divider from this pin to VREG and ground to configure the soft start time for Channel 3 and Channel 4 (see the Soft Start section). Enable Input for Channel 3. An external resistor divider can be used to set the turn-on threshold. Exposed Pad (Analog Ground). The exposed pad must be connected and soldered to an external ground plane. Rev. 0 | Page 12 of 60 Data Sheet ADP5050 100 100 90 90 80 80 70 70 60 50 VOUT = 1.2V VOUT = 1.5V VOUT = 1.8V VOUT = 2.5V VOUT = 3.3V VOUT = 5.0V 40 30 20 40 VOUT = 1.2V, FPWM VOUT = 1.2V, AUTO PWM/PSM VOUT = 1.8V, FPWM VOUT = 1.8V, AUTO PWM/PSM VOUT = 3.3V, FPWM VOUT = 3.3V, AUTO PWM/PSM 20 10 0 1 2 IOUT (A) 3 4 0 10899-003 0 0 90 90 80 80 70 70 EFFICIENCY (%) 100 60 50 VOUT = 1.2V VOUT = 1.5V VOUT = 1.8V VOUT = 2.5V VOUT = 3.3V 30 20 1 10 Figure 8. Channel 1/Channel 2 Efficiency Curve, VIN = 12 V, fSW = 600 kHz, FPWM and Automatic PWM/PSM Modes 100 40 0.1 IOUT (A) Figure 5. Channel 1/Channel 2 Efficiency Curve, VIN = 12 V, fSW = 600 kHz, FPWM Mode 60 VOUT = 1.2V VOUT = 1.5V VOUT = 1.8V VOUT = 2.5V VOUT = 3.3V VOUT = 5.0V 50 40 30 20 0 1 2 IOUT (A) 3 4 0 10899-004 0 Figure 6. Channel 1/Channel 2 Efficiency Curve, VIN = 5.0 V, fSW = 600 kHz, FPWM Mode 0 90 90 80 80 70 EFFICIENCY (%) 50 40 1.2 40 30 20 10 10 4 0 10899-005 0 VOUT = 1.2V VOUT = 1.5V VOUT = 1.8V VOUT = 2.5V VOUT = 3.3V 50 20 3 1.0 60 30 2 IOUT (A) 0.8 70 fSW = 300kHz fSW = 600kHz fSW = 1.0MHz 1 0.6 Figure 9. Channel 3/Channel 4 Efficiency Curve, VIN = 12 V, fSW = 600 kHz, FPWM Mode 100 0 0.4 IOUT (A) 100 60 0.2 10899-007 10 10 0 0.2 0.4 0.6 IOUT (A) Figure 7. Channel 1/Channel 2 Efficiency Curve, VIN = 12 V, VOUT = 1.8 V, FPWM Mode 0.8 1.0 1.2 10899-008 EFFICIENCY (%) 50 30 10 EFFICIENCY (%) 60 10899-006 EFFICIENCY (%) EFFICIENCY (%) TYPICAL PERFORMANCE CHARACTERISTICS Figure 10. Channel 3/Channel 4 Efficiency Curve, VIN = 5.0 V, fSW = 600 kHz, FPWM Mode Rev. 0 | Page 13 of 60 ADP5050 Data Sheet 100 0.4 90 0.3 LINE REGULATION (%) 80 60 50 40 30 fSW = 300kHz fSW = 600kHz fSW = 1.0MHz 20 0.2 0 –0.1 –0.3 0.4 0.6 0.8 1.0 1.2 IOUT (A) –0.4 10899-009 0 0.1 –0.2 10 0 0.2 4.5 6.0 7.5 9.0 10.5 12.0 13.5 15.0 INPUT VOLTAGE (V) 10899-012 EFFICIENCY (%) 70 Figure 14. Channel 1 Line Regulation, VOUT = 3.3 V, IOUT = 4 A, fSW = 600 kHz, FPWM Mode Figure 11. Channel 3/Channel 4 Efficiency Curve, VIN = 12 V, VOUT = 1.8 V, FPWM Mode 0.4 100 90 0.3 LOAD REGULATION (%) 80 60 50 VOUT = 1.2V, FPWM VOUT = 1.2V, AUTO PWM/PSM VOUT = 1.8V, FPWM VOUT = 1.8V, AUTO PWM/PSM VOUT = 3.3V, FPWM VOUT = 3.3V, AUTO PWM/PSM 20 10 0.1 1 –0.1 –0.3 2 IOUT (A) Figure 12. Channel 3/Channel 4 Efficiency Curve, VIN = 12 V, fSW = 600 kHz, FPWM and and Automatic PWM/PSM Modes –0.4 0 0.3 0.3 0.2 0.2 LINE REGULATION (%) 0.4 0 –0.1 –0.3 2 IOUT (A) 3 4 1.0 1.2 –0.1 –0.3 1 0.8 0 –0.2 0 0.6 0.1 –0.2 –0.4 0.4 Figure 15. Channel 3 Load Regulation, VIN = 12 V, VOUT = 3.3 V, fSW = 600 kHz, FPWM Mode 0.4 0.1 0.2 IOUT (A) 10899-011 LOAD REGULATION (%) 0 –0.2 0 0 0.1 10899-013 30 0.2 Figure 13. Channel 1 Load Regulation, VIN = 12 V, VOUT = 3.3 V, fSW = 600 kHz, FPWM Mode Rev. 0 | Page 14 of 60 –0.4 4.5 6.0 7.5 9.0 10.5 12.0 INPUT VOLTAGE (V) 13.5 15.0 Figure 16. Channel 3 Line Regulation, VOUT = 3.3 V, IOUT = 1 A, fSW = 600 kHz, FPWM Mode 10899-014 40 10899-010 EFFICIENCY (%) 70 Data Sheet ADP5050 6.0 0.4 5.5 0.3 QUIESCENT CURRENT (mA) FEEDBACK VOLTAGE ACCURACY (%) 0.5 0.2 0.1 0 –0.1 –0.2 –0.3 5.0 4.5 4.0 3.5 –20 10 40 70 100 130 TEMPERATURE (°C) 3.0 –50 10899-015 –0.5 –50 Figure 17. 0.8 V Feedback Voltage Accuracy vs. Temperature for Channel 1, Adjustable Output Model –25 0 25 50 75 TEMPERATURE (°C) 100 125 150 10899-018 –0.4 Figure 20. Quescient Current vs. Temperature (Includes PVIN1, PVIN2, PVIN3, and PVIN4) 2.0 75 65 SHUTDOWN CURRENT (µA) 1.0 0.5 0 –0.5 VID1 VID2 VID3 VID4 –1.0 10 15 20 25 30 35 VIN = 4.5V VIN = 7.0V VIN = 12V VIN = 15V 35 VID CODE 15 –50 10899-016 –2.0 5 45 25 –1.5 0 55 Figure 18. Output Voltage Error vs. VID Code, Adjustable Output Model –25 0 25 50 75 TEMPERATURE (°C) 100 125 150 10899-019 OUTPUT VOLTAGE ERROR (%) 1.5 Figure 21. Shutdown Current vs. Temperature (EN1, EN2, EN3, EN4, and EN5 Low) 850 5.0 4.8 UVLO THRESHOLD (V) 4.6 750 700 650 4.4 RISING 4.2 4.0 3.8 FALLING 3.6 3.4 600 550 –50 –20 10 40 70 100 TEMPERATURE (°C) 130 Figure 19. Frequency vs. Temperature, VIN = 12 V 3.0 –50 –20 10 40 70 100 TEMPERATURE (°C) Figure 22. UVLO Threshold vs. Temperature Rev. 0 | Page 15 of 60 130 10899-020 3.2 10899-017 FREQUENCY (kHz) 800 ADP5050 Data Sheet 100 7 RILIM = 22kΩ 6 RILIM = OPEN NOISE (µV/√Hz) CURRENT LIMIT (A) 10 5 4 3 1 VOUT = 1.2V VOUT = 1.8V VOUT = 2.5V VOUT = 3.3V RILIM = 47kΩ 2 0.1 4 6 8 10 12 14 16 INPUT VOLTAGE (V) 0.01 10899-021 0 10 10k 100k Figure 23. Channel 1/Channel 2 Current Limit vs. Input Voltage Figure 26. Channel 5 (LDO Regulator) Output Noise Spectrum, VIN = 5 V, COUT = 1 µF, IOUT = 10 mA 200 180 180 160 CH3/CH4 80 60 100 60 VOUT = 1.2V 20 20 10 40 70 TEMPERATURE (°C) 100 130 0 10899-022 –20 1 100 IOUT (mA) 0 2.5 –20 2.4 –40 PSRR (dB) 2.6 2.3 IOUT = 1mA IOUT = 10mA IOUT = 50mA IOUT = 100mA IOUT = 150mA IOUT = 200mA 2.2 10 Figure 27. Channel 5 (LDO Regulator) Output Noise vs. Output Load, VIN = 5 V, COUT = 1 µF Figure 24. Minimum On Time vs. Temperature IOUT = 1mA IOUT = 10mA IOUT = 50mA IOUT = 100mA IOUT = 150mA IOUT = 200mA –60 –80 –100 2.1 2.5 3.0 3.5 4.0 4.5 INPUT VOLTAGE (V) 5.0 5.5 6.0 –120 10 10899-023 2.0 2.0 VOUT = 1.8V 80 40 40 0 –50 VOUT = 2.5V 120 10899-025 100 CH1/CH2 100 1k 10k 100k 1M 10M FREQUENCY (Hz) Figure 25. Channel 5 (LDO Regulator) Line Regulation over Output Load Rev. 0 | Page 16 of 60 Figure 28. Channel 5 (LDO Regulator) PSRR over Output Load, VIN = 5 V, VOUT = 3.3 V, COUT = 1 µF 10899-026 120 VOUT = 3.3V 140 140 RMS NOISE (µV) MINIMUM ON TIME (ns) 1k FREQUENCY (Hz) 160 OUTPUT VOLTAGE (V) 100 10899-024 1 Data Sheet 0 ADP5050 PVIN5 = PVIN5 = PVIN5 = PVIN5 = PVIN5 = PVIN5 = –10 –20 4.0V; IOUT = 1mA 3.6V, IOUT = 1mA 4.0V, IOUT = 100mA 3.6V, IOUT = 100mA 4.0V, IOUT = 200mA 3.6V, IOUT = 200mA 1 VOUT PSRR (dB) –30 –40 –50 –60 IOUT –70 –80 –90 100 1k 10k 100k 1M 10M FREQUENCY (Hz) CH1 50.0mV BW M100µs A CH1 –22.0mV CH4 2.00A Ω 10899-030 10 10899-027 4 –100 Figure 32. Channel 1/Channel 2 Load Transient, 1 A to 4 A, VIN = 12 V, VOUT = 3.3 V, fSW = 600 kHz, L = 2.2 µH, COUT = 47 µF × 2 Figure 29. Channel 5 (LDO Regulator) PSRR over Various Loads and Dropout Voltages, VOUT = 3.3 V, COUT = 1 µF VOUT 2 VOUT 2 SW IOUT2 IOUT1 1 M1.00µs A CH1 7.40V CH2 100mV BW M100µs A CH2 CH3 2.00A Ω BW CH4 2.00A Ω B W Figure 30. Steady State Waveform at Heavy Load, VIN = 12 V, VOUT = 3.3 V, IOUT = 3 A, fSW = 600 kHz, L = 4.7 µH, COUT = 47 µF × 2, FPWM Mode –56.0mV 10899-031 CH1 5.00V CH2 10.0mV BW 10899-028 4 Figure 33. Load Transient, Channel 1/Channel 2 Parallel Output, 0 A to 6 A, VIN = 12 V, VOUT = 3.3 V, fSW = 600 kHz, L = 4.7 µH, COUT = 47 µF × 4 VOUT 1 VOUT 2 IOUT 4 SW EN 2 10899-029 CH1 5.00V CH2 50.0mV BW M100µs A CH1 PWRGD 3 CH1 500mV BW CH3 5.00V BW 11.0mV Figure 31. Steady State Waveform at Light Load, VIN = 12 V, VOUT = 3.3 V, IOUT = 30 mA, fSW = 600 kHz, L = 4.7 µH, COUT = 47 µF × 2, Automatic PWM/PSM Mode Rev. 0 | Page 17 of 60 M1.00ms CH2 5.00V CH4 2.00A Ω A CH1 650mV 10899-032 1 Figure 34. Channel 1/Channel 2 Soft Start with 4 A Resistance Load, VIN = 12 V, VOUT = 1.2 V, fSW = 600 kHz, L = 1 µH, COUT = 47 µF × 2 ADP5050 Data Sheet VIN 1 VOUT VOUT 1 SW EN 3 2 2 IOUT IOUT A CH2 2.80V 10899-033 M400µs CH2 5.00V BW CH4 1.00A Ω BW CH1 10.0V BW CH3 1.00V BW CH1 500mV BW Figure 35. Startup with Precharged Output, VIN = 12 V, VOUT = 3.3 V M10.0ms A CH1 CH2 10.0V BW CH4 5.00A Ω BW 970mV 10899-136 4 4 Figure 38. Short-Circuit Protection Recovery, VIN = 12 V, VOUT = 1.2 V, fSW = 600 kHz, L = 1 µH, COUT = 47 µF × 2 VOUT VOUT 1 IOUT 4 EN 2 M10.0ms A CH1 CH2 5.00V BW CH4 5.00A Ω BW 650mV 2 10899-034 CH1 500mV BW CH3 5.00V BW CH2 200mV BW Figure 36. Channel 1/Channel 2 Shutdown with Active Output Discharge, VIN = 12 V, VOUT = 1.2 V, fSW = 600 kHz, L = 1 µH, COUT = 47 µF × 2 M200µs A CH2 1.21V 10899-137 PWRGD 3 Figure 39. Channel 1 Dynamic Voltage Scaling (DVS) from 1.1 V to 1.3 V, 62.5 µs Interval, VIN = 12 V, IOUT = 4 A, fSW = 600 kHz, L = 1 µH, COUT = 47 µF × 2 1 VOUT VOUT SW 2 IOUT CH2 10.00V BW CH4 5.00A Ω M10.0ms A CH1 970mV 2 10899-135 CH1 500mV BW Figure 37. Short-Circuit Protection Entry, VIN = 12 V, VOUT = 1.2 V, fSW = 600 kHz, L = 1 µH, COUT = 47 µF × 2 CH2 200mV BW M200µs A CH2 1.18V 10899-138 4 Figure 40. Channel 1 Dynamic Voltage Scaling (DVS) from 1.3 V to 1.1 V, 62.5 µs Interval, VIN = 12 V, IOUT = 4 A, fSW = 600 kHz, L = 1 µH, COUT = 47 µF × 2 Rev. 0 | Page 18 of 60 Data Sheet ADP5050 THEORY OF OPERATION The ADP5050 is a micropower management unit that combines four high performance buck regulators with a 200 mA low dropout (LDO) regulator in a 48-lead LFCSP package to meet demanding performance and board space requirements. The device enables direct connection to high input voltages up to 15 V with no preregulators to make applications simpler and more efficient. BUCK REGULATOR OPERATIONAL MODES PWM Mode In pulse-width modulation (PWM) mode, the buck regulators in the ADP5050 operate at a fixed frequency; this frequency is set by an internal oscillator that is programmed by the RT pin. At the start of each oscillator cycle, the high-side MOSFET turns on and sends a positive voltage across the inductor. The inductor current increases until the current-sense signal exceeds the peak inductor current threshold that turns off the high-side MOSFET; this threshold is set by the error amplifier output. During the high-side MOSFET off time, the inductor current decreases through the low-side MOSFET until the next oscillator clock pulse starts a new cycle. The buck regulators in the ADP5050 regulate the output voltage by adjusting the peak inductor current threshold. PSM Mode To achieve higher efficiency, the buck regulators in the ADP5050 smoothly transition to variable frequency power save mode (PSM) operation when the output load falls below the PSM current threshold. When the output voltage falls below regulation, the buck regulator enters PWM mode for a few oscillator cycles until the voltage increases to within regulation. During the idle time between bursts, the MOSFET turns off, and the output capacitor supplies all the output current. The PSM comparator monitors the internal compensation node, which represents the peak inductor current information. The average PSM current threshold depends on the input voltage (VIN), the output voltage (VOUT), the inductor, and the output capacitor. Because the output voltage occasionally falls below regulation and then recovers, the output voltage ripple in PSM operation is larger than the ripple in the forced PWM mode of operation under light load conditions. Forced PWM and Automatic PWM/PSM Modes The buck regulators can be configured to always operate in PWM mode using the SYNC/MODE pin and the I2C interface. In forced PWM (FPWM) mode, the regulator continues to operate at a fixed frequency even when the output current is below the PWM/PSM threshold. In PWM mode, efficiency is lower compared to PSM mode under light load conditions. The low-side MOSFET remains on when the inductor current falls to less than 0 A, causing the ADP5050 to enter continuous conduction mode (CCM). The buck regulators can be configured to operate in automatic PWM/PSM mode using the SYNC/MODE pin and the I2C interface. In automatic PWM/PSM mode, the buck regulators operate in either PWM mode or PSM mode, depending on the output current. When the average output current falls below the PWM/PSM threshold, the buck regulator enters PSM mode operation; in PSM mode, the regulator operates with a reduced switching frequency to maintain high efficiency. The low-side MOSFET turns off when the output current reaches 0 A, causing the regulator to operate in discontinuous mode (DCM). The user can alternate between forced PWM (FPWM) mode and automatic PWM/PSM mode during operation. The flexible configuration capability during operation of the device enables efficient power management. When a logic high level is applied to the SYNC/MODE pin (or when SYNC/MODE is configured as a clock input or output), the operational mode of each channel is set by the PSMx_ON bit in Register 6. A value of 0 for the PSMx_ON bit configures the channel for forced PWM mode; a value of 1 configures the channel for automatic PWM/PSM mode. When a logic low level is applied to the SYNC/MODE pin, the operational mode of all four buck regulators is automatic PWM/PSM mode, and the settings of the PSMx_ON bits in Register 6 are ignored. Table 8 describes the function of the SYNC/MODE pin in setting the operational mode of the device. Table 8. Configuring the Mode of Operation Using the SYNC/MODE Pin SYNC/MODE Pin High Clock Input/Output Low Mode of Operation for Each Channel Specified by the PSMx_ON bit setting in Register 6 (0 = forced PWM mode; 1 = automatic PWM/PSM mode) Specified by the PSMx_ON bit setting in Register 6 (0 = forced PWM mode; 1 = automatic PWM/PSM mode) Automatic PWM/PSM mode (PSMx_ON bit settings in Register 6 are ignored) For example, with the SYNC/MODE pin high, write 1 to the PSM4_ON bit in Register 6 to configure automatic PWM/PSM mode operation for Channel 4, and write 0 to the PSM1_ON, PSM2_ON, and PSM3_ON bits to configure forced PWM mode for Channel 1, Channel 2, and Channel 3. Rev. 0 | Page 19 of 60 ADP5050 Data Sheet ADJUSTABLE AND FIXED OUTPUT VOLTAGES INTERNAL REGULATORS (VREG AND VDD) The ADP5050 provides adjustable and fixed output voltage settings via the I2C interface or factory fuse. For the adjustable output settings, use an external resistor divider to set the desired output voltage via the feedback reference voltage (0.8 V for Channel 1 to Channel 4, and 0.5 V for Channel 5). The internal VREG regulator in the ADP5050 provides a stable 5.1 V power supply for the bias voltage of the MOSFET drivers. The internal VDD regulator in the ADP5050 provides a stable 3.3 V power supply for internal control circuits. Connect a 1.0 µF ceramic capacitor between VREG and ground, and connect another 1.0 µF ceramic capacitor between VDD and ground. The internal VREG and VDD regulators are active as long as PVIN1 is available. For the fixed output settings, the feedback resistor divider is built into the ADP5050, and the feedback pin (FBx) must be tied directly to the output. Each buck regulator channel can be programmed for a specific output voltage range using the VIDx bits in Register 2 to Register 4. Table 9 lists the fixed output voltage ranges configured by the VIDx bits. Table 9. Fixed Output Voltage Ranges Set by the VIDx Bits Channel Channel 1 Channel 2 Channel 3 Channel 4 Fixed Output Voltage Range Set by the VIDx Bits 0.85 V to 1.6 V in 25 mV steps 3.3 V to 5.0 V in 300 mV or 200 mV steps 1.2 V to 1.8 V in 100 mV steps 2.5 V to 5.5 V in 100 mV steps The output range can also be programmed by factory fuse. If a different output voltage range is required, contact your local Analog Devices, Inc., sales or distribution representative. DYNAMIC VOLTAGE SCALING (DVS) The ADP5050 provides a dynamic voltage scaling (DVS) function for Channel 1 and Channel 4; these outputs can be programmed in real time via the I2C interface (Register 5, DVS_CFG). The DVS_CFG register is used to enable DVS and to set the step interval during the transition (see Table 28). It is recommended that the user enable the DVS function before setting the output voltage for Channel 1 or Channel 4. (The output voltage for Channel 1 is set using the VID1 bits in Register 2; the output voltage for Channel 4 is set using the VID4 bits in Register 4.) If DVS is enabled after the VID value is set, the output voltage changes rapidly to the next target voltage, which can result in problems such as a PWRGD failure or OVP and OCP events. Figure 41 shows the dynamic voltage scaling function. The internal VREG regulator can provide a total load of 95 mA including the MOSFET driving current, and it can be used as an always alive 5.1 V power supply for a small system current demand. The current-limit circuit is included in the VREG regulator to protect the circuit when the part is heavily loaded. The VDD regulator is for internal circuit use and is not recommended for other purposes. SEPARATE SUPPLY APPLICATIONS The ADP5050 supports separate input voltages for the four buck regulators. This means that the input voltages for the four buck regulators can be connected to different supply voltages. The PVIN1 voltage provides the power supply for the internal regulators and the control circuitry. Therefore, if the user plans to use separate supply voltages for the buck regulators, the PVIN1 voltage must be above the UVLO threshold before the other channels begin to operate. Precision enabling can be used to monitor the PVIN1 voltage and to delay the startup of the outputs to ensure that PVIN1 is high enough to support the outputs in regulation. For more information, see the Precision Enabling section. The ADP5050 supports cascading supply operation for the four buck regulators. As shown in Figure 42, PVIN2, PVIN3, and PVIN4 are powered from the Channel 1 output. In this configuration, the Channel 1 output voltage must be higher than the UVLO threshold for PVIN2, PVIN3, and PVIN4. DVSx_INTVAL SETTING VIN 25mV FOR CH1 (100mV FOR CH4) PVIN2 TO PVIN4 VOUT1 BUCK 1 VOUT2 TO VOUT4 BUCK 2 10899-036 OUTPUT PVIN1 OLD VID CODE VIDx OLD VID NEW VID 10899-035 NEW VID CODE VID FOR CH1 OR CH4 Figure 42. Cascading Supply Application Figure 41. Dynamic Voltage Scaling During the DVS transition period, the regulator is forced into PWM mode operation, and OVP latch-off, SCP latch-off, and hiccup protection are masked. Rev. 0 | Page 20 of 60 Data Sheet ADP5050 The buck regulators in Channel 1 and Channel 2 integrate 4 A high-side power MOSFETs and low-side MOSFET drivers. The N-channel MOSFETs selected for use with the ADP5050 must be able to work with the synchronized buck regulators. In general, a low RDSON N-channel MOSFET can be used to achieve higher efficiency; dual MOSFETs in one package (for both Channel 1 and Channel 2) are recommended to save space on the PCB. For more information, see the Low-Side Power Device Selection section. BOOTSTRAP CIRCUITRY Each buck regulator in the ADP5050 has an integrated bootstrap regulator. The bootstrap regulator requires a 0.1 µF ceramic capacitor (X5R or X7R) between the BSTx and SWx pins to provide the gate drive voltage for the high-side MOSFET. ACTIVE OUTPUT DISCHARGE SWITCH Each buck regulator in the ADP5050 integrates a discharge switch from the switching node to ground. This switch is turned on when its associated regulator is disabled, which helps to discharge the output capacitor quickly. The typical value of the discharge switch is 250 Ω for Channel 1 to Channel 4. In addition to the ENx pins, the I2C interface (Register 1, PCTRL) can also be used to enable and disable each channel. The on/off status of a channel is controlled by the I2C enable bit for the channel (CHx_ON) and the external hardware enable pin for the channel (logical AND). The default value of the I2C enable bit (CHx_ON = 1) specifies that the channel enable is controlled by the external hardware enable pin. Pulling the external ENx pin low resets the channel and forces the corresponding CHx_ON bit to the default value, 1, to support another startup when the external ENx pin is pulled high again. OSCILLATOR The switching frequency (fSW) of the ADP5050 can be set to a value from 250 kHz to 1.4 MHz by connecting a resistor from the RT pin to ground. The value of the RT resistor can be calculated as follows: RRT (kΩ) = [14,822/fSW (kHz)]1.081 Figure 44 shows the typical relationship between the switching frequency (fSW) and the RT resistor. The adjustable frequency allows users to make decisions based on the trade-off between efficiency and solution size. The discharge switch function can be enabled or disabled for each channel by factory fuse or by using the I2C interface (Register 6, OPT_CFG). The ADP5050 has an enable control pin for each regulator, including the LDO regulator. The enable control pin (ENx) features a precision enable circuit with a 0.8 V reference voltage. When the voltage at the ENx pin is greater than 0.8 V, the regulator is enabled. When the voltage at the ENx pin falls below 0.725 V, the regulator is disabled. An internal 1 MΩ pull-down resistor prevents errors if the ENx pin is left floating. The precision enable threshold voltage allows easy sequencing of channels within the part, as well as sequencing between the ADP5050 and other input/output supplies. The ENx pin can also be used as a programmable UVLO input using a resistor divider (see Figure 43). For more information, see the Programming the UVLO Input section. ADP5050 INPUT/OUTPUT VOLTAGE DEGLITCH TIMER 0.8V 1.2M 600k 0 0 20 40 RT RESISTOR (kΩ) 60 80 Figure 44. Switching Frequency vs. RT Resistor For Channel 1 and Channel 3, the frequency can be set to half the master switching frequency set by the RT pin. This setting is configured using Register 8 (Bit 7 for Channel 3, and Bit 6 for Channel 1). If the master switching frequency is less than 250 kHz, this halving of the frequency for Channel 1 or Channel 3 is not recommended. R1 R2 800k 200k ENx 1MΩ 1.0M 400k 10899-037 INTERNAL ENABLE 1.4M FREQUENCY (Hz) PRECISION ENABLING 1.6M 10899-044 LOW-SIDE DEVICE SELECTION Figure 43. Precision Enable Diagram for One Channel Rev. 0 | Page 21 of 60 ADP5050 Data Sheet Phase Shift By default, the phase shift between Channel 1 and Channel 2 and between Channel 3 and Channel 4 is 180° (see Figure 45). This value provides the benefits of out-of-phase operation by reducing the input ripple current and lowering the ground noise. 0° REFERENCE CH1 (½ fSW OPTIONAL) CH2 0°, 90°,180°, OR 270° ADJUSTABLE CH3 (½ fSW OPTIONAL) 270° PHASE SHIFT 10899-040 90° PHASE SHIFT CH4 The SYNC/MODE pin can be configured as a synchronization clock output by factory fuse or via the I2C interface (Register 10, HICCUP_CFG). A positive clock pulse with a 50% duty cycle is generated at the SYNC/MODE pin with a frequency equal to the internal switching frequency set by the RT pin. There is a short delay time (approximately 15% of tSW) from the generated synchronization clock to the Channel 1 switching node. Figure 47 shows two ADP5050 devices configured for frequency synchronization mode: one ADP5050 device is configured as the clock output to synchronize another ADP5050 device. It is recommended that a 100 kΩ pull-up resistor be used to prevent logic errors when the SYNC/MODE pin is left floating. Figure 45. Phase Shift Diagram, Four Buck Regulators VREG For Channel 2 to Channel 4, the phase shift with respect to Channel 1 can be set to 0˚, 90˚, 180˚, or 270˚ using Register 8, SW_CFG (see Figure 46). When parallel operation of Channel 1 and Channel 2 is configured, the switching frequency of Channel 2 is locked to a 180˚ phase shift with respect to Channel 1. 100kΩ SYNC/MODE ADP5050 SW1 SYNC/MODE ADP5050 10899-039 SW 180° PHASE SHIFT Note that the internal switching frequency set by the RT pin must be programmed to a value that is close to the external clock value for successful synchronization; the suggested frequency difference is less than ±15% in typical applications. Figure 47. Two ADP5050 Devices Configured for Synchronization Mode In the configuration shown in Figure 47, the phase shift between Channel 1 of the first ADP5050 device and Channel 1 of the second ADP5050 device is 0˚ (see Figure 48). 1 SW2 2 SW3 SYNC-OUT AT FIRST ADP5050 3 1 CH1 10.0V BW CH3 10.0V BW CH2 10.0V BW CH4 10.0V BW M400ns A CH1 7.40V SW1 AT FIRST ADP5050 Figure 46. I2C Configurable 90˚ Phase Shift Waveforms, Four Buck Regulators 2 SW1 AT SECOND ADP5050 SYNCHRONIZATION INPUT/OUTPUT The switching frequency of the ADP5050 can be synchronized to an external clock with a frequency range from 250 kHz to 1.4 MHz. The ADP5050 automatically detects the presence of an external clock applied to the SYNC/MODE pin, and the switching frequency transitions smoothly to the frequency of the external clock. When the external clock signal stops, the device automatically switches back to the internal clock and continues to operate. Rev. 0 | Page 22 of 60 3 CH1 2.00V BW CH3 5.00V BW CH2 5.00V BW M400ns A CH1 560mV Figure 48. Waveforms of Two ADP5050 Devices Operating in Synchronization Mode 10899-148 4 10899-146 SW4 Data Sheet ADP5050 SOFT START VIN The buck regulators in the ADP5050 include soft start circuitry that ramps the output voltage in a controlled manner during startup, thereby limiting the inrush current. The soft start time is typically fixed at 2 ms for each buck regulator when the SS12 and SS34 pins are tied to VREG. PVIN1 PVIN2 VREG SS12 To set the soft start time to a value of 2 ms, 4 ms, or 8 ms, connect a resistor divider from the SS12 or SS34 pin to the VREG pin and ground (see Figure 49). This configuration may be required to accommodate a specific start-up sequence or an application with a large output capacitor. SW1 CHANNEL 1 BUCK REGULATOR (4A) VOUT (UP TO 8A) L1 FB1 COMP1 SW2 COMP2 EN1 CHANNEL 2 BUCK REGULATOR (4A) L2 FB2 10899-042 EN2 ADP5050 VREG Figure 50. Parallel Operation for Channel 1 and Channel 2 When Channel 1 and Channel 2 are operated in the parallel configuration, configure the channels as follows: TOP RESISTOR LEVEL DETECTOR AND DECODER • 10899-041 BOTTOM RESISTOR Figure 49. Level Detector Circuit for Soft Start The SS12 pin can be used to program the soft start time and parallel operation for Channel 1 and Channel 2. The SS34 pin can be used to program the soft start time for Channel 3 and Channel 4. Table 10 provides the values of the resistors needed to set the soft start time. • Set the input voltages and current-limit settings for Channel 1 and Channel 2 to the same values. Operate both channels in forced PWM mode. Bits pertaining to Channel 2 in the configuration registers cannot be used. These bits include CH2_ON in Register 1, VID2 in Register 3, OVP2_ON and SCP2_ON in Register 7, PHASE2 in Register 8, and PWRG2 in Register 13. Current balance in parallel configuration is well regulated by the internal control loop. Figure 51 shows the typical current balance matching in the parallel output configuration. 6 Table 10. Soft Start Time Set by the SS12 and SS34 Pins RBOT (kΩ) N/A 600 500 400 300 200 100 0 Soft Start Time Channel 1 Channel 2 2 ms 2 ms 2 ms Parallel 2 ms 8 ms 4 ms 2 ms 4 ms 4 ms 8 ms 2 ms 8 ms Parallel 8 ms 8 ms Soft Start Time Channel 3 Channel 4 2 ms 2 ms 2 ms 4 ms 2 ms 8 ms 4 ms 2 ms 4 ms 4 ms 4 ms 8 ms 8 ms 2 ms 8 ms 8 ms 5 CHANNEL CURRENT (A) RTOP (kΩ) 0 100 200 300 400 500 600 N/A 2 CH1 CH2 IDEAL 0 0 The ADP5050 supports two-phase parallel operation of Channel 1 and Channel 2 to provide a single output with up to 8 A of current. To configure Channel 1 and Channel 2 as a two-phase single output in parallel operation, do the following (see Figure 50): • • • • 3 1 PARALLEL OPERATION • 4 Use the SS12 pin to select parallel operation as specified in Table 10. Leave the COMP2 pin open. Use the FB1 pin to set the output voltage. Connect the FB2 pin to ground (FB2 is ignored). Connect the EN2 pin to ground (EN2 is ignored). 2 4 6 8 10 TOTAL OUTPUT LOAD (A) 10899-151 SS12 OR SS34 Figure 51. Current Balance in Parallel Output Configuration, VIN = 12 V, VOUT = 1.2 V, fSW = 600 kHz, FPWM Mode STARTUP WITH PRECHARGED OUTPUT The buck regulators in the ADP5050 include a precharged start-up feature to protect the low-side FETs from damage during startup. If the output voltage is precharged before the regulator is turned on, the regulator prevents reverse inductor current—which discharges the output capacitor—until the internal soft start reference voltage exceeds the precharged voltage on the feedback (FBx) pin. Rev. 0 | Page 23 of 60 ADP5050 Data Sheet CURRENT-LIMIT PROTECTION HICCUP PROTECTION The buck regulators in the ADP5050 include peak current-limit protection circuitry to limit the amount of positive current flowing through the high-side MOSFET. The peak current limit on the power switch limits the amount of current that can flow from the input to the output. The programmable current-limit threshold feature allows for the use of small size inductors for low current applications. The buck regulators in the ADP5050 include a hiccup mode for overcurrent protection (OCP). When the peak inductor current reaches the current-limit threshold, the high-side MOSFET turns off and the low-side MOSFET turns on until the next cycle. Table 11. Peak Current-Limit Threshold Settings for Channel 1 and Channel 2 RILIM1 or RILIM2 Floating 47 kΩ 22 kΩ Typical Peak Current-Limit Threshold 4.4 A 2.63 A 6.44 A The buck regulators in the ADP5050 include negative currentlimit protection circuitry to limit certain amounts of negative current flowing through the low-side MOSFET. FREQUENCY FOLDBACK The buck regulators in the ADP5050 include frequency foldback to prevent output current runaway when a hard short occurs on the output. Frequency foldback is implemented as follows: • • If the voltage at the FBx pin falls below half the target output voltage, the switching frequency is reduced by half. If the voltage at the FBx pin falls again to below one-fourth the target output voltage, the switching frequency is reduced to half its current value, that is, to one-fourth of fSW. The reduced switching frequency allows more time for the inductor current to decrease, but also increases the ripple current during peak current regulation. This results in a reduction in average current and prevents output current runaway. Hiccup protection is masked during the initial soft start cycle to enable startup of the buck regulator under heavy load conditions. Note that careful design and proper component selection are required to ensure that the buck regulator recovers from hiccup mode under heavy loads. The HICCUPx_OFF bits in Register 10 can be used to disable hiccup protection for each buck regulator. When hiccup protection is disabled, the frequency foldback feature is still available for overcurrent protection. LATCH-OFF PROTECTION The buck regulators in the ADP5050 have an optional latch-off mode to protect the device from serious problems such as shortcircuit and overvoltage conditions. Latch-off mode can be enabled via the I2C interface or by factory fuse. Short-Circuit Latch-Off Mode Short-circuit latch-off mode is enabled by factory fuse or by writing a 1 to the SCPx_ON bit in Register 7, LCH_CFG. When shortcircuit latch-off mode is enabled and the protection circuit detects an overcurrent status after a soft start, the buck regulator enters hiccup mode and attempts to restart. If seven continuous restart attempts are made and the regulator remains in the fault condition, the regulator is shut down. This shutdown (latch-off) condition is cleared only by reenabling the channel or by resetting the channel power supply. Figure 52 shows the short-circuit latch-off detection function. Pulse Skip Mode Under Maximum Duty Cycle Under maximum duty cycle conditions, frequency foldback maintains the output in regulation. If the maximum duty cycle is reached—for example, when the input voltage decreases—the PWM modulator skips every other PWM pulse, resulting in a switching frequency foldback of one-half. If the duty cycle increases further, the PWM modulator skips two of every three PWM pulses, resulting in a switching frequency foldback to one-third of the switching frequency. Frequency foldback increases the effective maximum duty cycle, thereby decreasing the dropout voltage between the input and output voltages. OUTPUT VOLTAGE SHORT CIRCUIT DETECTED BY COUNTER OVERFLOW ATTEMPT TO RESTART SCP LATCH-OFF FUNCTION ENABLED AFTER 7 RESTART ATTEMPTS TIME 7 × tSS PWRGD LATCH OFF THIS REGULATOR LATCH-OFF WRITE 1 TO CHx_LCH BIT CHx_LCH Figure 52. Short-Circuit Latch-Off Detection Rev. 0 | Page 24 of 60 10899-045 To configure the current-limit threshold for Channel 1, connect a resistor from the DL1 pin to ground; to configure the currentlimit threshold for Channel 2, connect another resistor from the DL2 pin to ground. Table 11 lists the peak current-limit threshold settings for Channel 1 and Channel 2. When hiccup mode is active, the overcurrent fault counter is incremented. If the overcurrent fault counter reaches 15 and overflows (indicating a short-circuit condition), both the highside and low-side MOSFETs are turned off. The buck regulator remains in hiccup mode for a period equal to seven soft start cycles and then attempts to restart from soft start. If the shortcircuit fault has cleared, the regulator resumes normal operation; otherwise, it reenters hiccup mode after the soft start. Data Sheet ADP5050 The short-circuit latch-off status can be read from Register 12, LCH_STATUS. To clear the status bit, write a 1 to the bit (provided that the fault no longer persists). The status bit is latched until a 1 is written to the bit or the part is reset by the internal VDD power-on reset signal. Note that short-circuit latch-off mode does not work if hiccup protection is disabled. POWER-GOOD FUNCTION Overvoltage Latch-Off Mode The ADP5050 includes an open-drain power-good output (PWRGD pin) that becomes active high when the selected buck regulators are operating normally. By default, the PWRGD pin monitors the output voltage on Channel 1. Other channels can be configured to control the PWRGD pin when the ADP5050 is ordered (see Table 56). Overvoltage latch-off mode is enabled by factory fuse or by writing a 1 to the OVPx_ON bit in Register 7, LCH_CFG. The overvoltage latch-off threshold is 124% of the nominal output voltage level. When the output voltage exceeds this threshold, the protection circuit detects the overvoltage status and the regulator shuts down. This shutdown (latch-off) condition is cleared only by reenabling the channel or by resetting the channel power supply. The power-good status of each channel (PWRGx bit) can be read back via the I2C interface (Register 13, STATUS_RD). A value of 1 for the PWRGx bit indicates that the regulated output voltage of the buck regulator is above 90.5% (typical) of its nominal output. When the regulated output voltage of the buck regulator falls below 87.2% (typical) of its nominal output for a delay time greater than approximately 50 µs, the PWRGx bit is set to 0. Figure 53 shows the overvoltage latch-off detection function. The output of the PWRGD pin is the logical AND of the internal unmasked PWRGx signals. An internal PWRGx signal must be high for a validation time of 1 ms before the PWRGD pin goes high; if one PWRGx signal fails, the PWRGD pin goes low with no delay. The channels that control the PWRGD pin (Channel 1 to Channel 4) are specified by factory fuse or by setting the appropriate bits in Register 11 (PWRGD_MASK) via the I2C interface. OUTPUT VOLTAGE 124% NOMINAL OUTPUT 100% NOMINAL OUTPUT INTERRUPT FUNCTION TIME CHx ON CHx_LCH LATCH OFF THIS REGULATOR 10899-046 LATCH-OFF WRITE 1 TO CHx_LCH BIT Figure 53. Overvoltage Latch-Off Detection The overvoltage latch-off status can be read from Register 12, LCH_STATUS. To clear the status bit, write a 1 to the bit (provided that the fault no longer persists). The status bit is latched until a 1 is written to the bit or the part is reset by the internal VDD power-on reset signal. UNDERVOLTAGE LOCKOUT (UVLO) Undervoltage lockout circuitry monitors the input voltage level of each buck regulator in the ADP5050. If any input voltage (PVINx pin) falls below 3.78 V (typical), the corresponding channel is turned off. After the input voltage rises above 4.2 V (typical), the soft start period is initiated, and the corresponding channel is enabled when the ENx pin is high. Note that a UVLO condition on Channel 1 (PVIN1 pin) has a higher priority than a UVLO condition on other channels, which means that the PVIN1 supply must be available before other channels can be operated. The ADP5050 provides an interrupt output (nINT pin) for fault conditions. During normal operation, the nINT pin is pulled high (an external pull-up resistor should be used). When a fault condition occurs, the ADP5050 pulls the nINT pin low to alert the I2C host processor that a fault condition has occurred. Six interrupt sources can trigger the nINT pin. By default, no interrupt sources are configured. To select one or more interrupt sources to trigger the nINT pin, set the appropriate bits to 1 in Register 15, INT_MASK (see Table 48). When the nINT pin is triggered, one or more bits in Register 14 (Bits[5:0]) are set to 1. The fault condition that triggered the nINT pin can be read from Register 14, INT_STATUS (see Table 12). Table 12. Fault Conditions for Device Interrupt (Register 14) Interrupt TEMP_INT LVIN_INT PWRG4_INT PWRG3_INT PWRG2_INT PWRG1_INT Description Junction temperature has exceeded the configured threshold (selected in Register 9) PVIN1 voltage has fallen below the configured threshold (selected in Register 9) Power-good failure detected on Channel 4 Power-good failure detected on Channel 3 Power-good failure detected on Channel 2 Power-good failure detected on Channel 1 To clear an interrupt, write a 1 to the appropriate bit in Register 14 (INT_STATUS), take all ENx pins low, or reset the part using the internal VDD power-on reset signal. Reading the interrupt or writing a 0 to the bit does not clear the interrupt. Rev. 0 | Page 25 of 60 ADP5050 Data Sheet THERMAL SHUTDOWN LOW INPUT VOLTAGE DETECTION If the ADP5050 junction temperature exceeds 150°C, the thermal shutdown circuit turns off the IC except for the internal linear regulators. Extreme junction temperatures can be the result of high current operation, poor circuit board design, or high ambient temperature. A 15°C hysteresis is included so that the ADP5050 does not return to operation after thermal shutdown until the on-chip temperature falls below 135°C. When the part exits thermal shutdown, a soft start is initiated for each enabled channel. In addition to undervoltage lockout (UVLO), the ADP5050 provides a low input voltage detection circuit to monitor PVIN1; this circuit compares the input voltage with the specified voltage threshold. The voltage threshold can be set from 4.2 V to 11.2 V in steps of 0.5 V using Register 9, TH_CFG. Unlike UVLO shutdown, the low input voltage detection function sends a warning signal but does not shut down the part. When the PVIN1 input voltage falls below the threshold, the status bit LVIN_INT in Register 14 is set to 1. The status bit is latched until a 1 is written to the bit, all ENx pins are taken low, or the part is reset by the internal VDD power-on reset signal. OVERHEAT DETECTION In addition to thermal shutdown protection, the ADP5050 provides an overheat warning function, which compares the junction temperature with the specified overheat threshold: 105°, 115°, or 125°. The overheat threshold is configured in Register 9, TH_CFG. Unlike thermal shutdown, the overheat detection function sends a warning signal but does not shut down the part. When the junction temperature exceeds the overheat threshold, the status bit TEMP_INT in Register 14 is set to 1. The status bit is latched until a 1 is written to the bit, all ENx pins are taken low, or the part is reset by the internal VDD power-on reset signal. The overheat detection function can be used to send a warning signal to the host processor. After the host processor detects the overheat warning signal, the processor can take action to prepare for a possible impending thermal shutdown. Figure 54 shows the overheat warning function. JUNCTION TEMPERATURE The low input voltage detection function can be used to send a warning signal to the host processor. After the host processor detects the low input voltage warning signal, the processor can take action to prepare for a possible impending UVLO shutdown. Figure 55 shows the low input voltage warning function. INPUT VOLTAGE ON PVIN1 10.7V (ADJUSTABLE) 12V INPUT VOLTAGE TIME LOW INPUT VOLTAGE CONDITION DETECTED LVIN_INT (LVIN STATUS) Figure 55. Low Input Voltage Warning Function (VIN = 12 V) LDO REGULATOR The ADP5050 integrates a general-purpose LDO regulator with low quiescent current and low dropout voltage. The LDO regulator provides up to 200 mA of output current. The LDO regulator operates with an input voltage of 1.7 V to 5.5 V. The wide supply range makes the regulator suitable for cascading configurations where the LDO supply voltage is provided from one of the buck regulators. The LDO output voltage is set using an external resistor divider (see Figure 56). NORMAL TEMPERATURE 1.7V TO 5.5V TIME VOUT5 RA LDO 10899-047 OVERHEAT CONDITION DETECTED PVIN5 C1 1µF C2 1µF FB5 RB Figure 54. Overheat Warning Function EN5 10899-049 115°C (ADJUSTABLE) TEMP_INT (HEAT STATUS) 10899-048 The thermal shutdown status can be read via the I2C interface (Register 12, LCH_STATUS). When thermal shutdown is detected, the TSD_LCH bit (Bit 4) is set to 1. To clear the status bit, write a 1 to the bit (provided that the fault no longer persists). The status bit is latched until a 1 is written to the bit or the part is reset by the internal VDD power-on reset signal. Figure 56. 200 mA LDO Regulator The LDO regulator provides a high power supply rejection ratio (PSRR), low output noise, and excellent line and load transient response using small 1 µF ceramic input and output capacitors. Rev. 0 | Page 26 of 60 Data Sheet ADP5050 I2C INTERFACE The ADP5050 includes an I2C-compatible serial interface for control of the power management blocks and for readback of system status (see Figure 57). The I2C interface operates at clock frequencies of up to 400 kHz. VDD VDDIO UVLO_VDDIO VDDIO VDDIO VDD VDD VDD VDDIO LEVEL SHIFTER I2C REGISTER The default 7-bit I2C chip address for the ADP5050 is 0x48 (1001000 in binary). A different I2C address can be configured using the optional A0 pin, which can replace the power-good functionality on Pin 20. (For information about obtaining an ADP5050 model with Pin 20 functioning as the A0 pin, contact your local Analog Devices sales or distribution representative.) The A0 pin allows the use of two ADP5050 devices on the same I2C communication bus. Figure 58 shows two ADP5050 devices configured with different I2C addresses using the A0 pin. SCL I2C INTERFACE TRIM DATA SCP/OVP 10899-051 SDA I2C ADDRESSES VDDIO VDDIO 2 Figure 57. I C Interface Block Diagram SCL Note that the ADP5050 does not respond to general calls. The ADP5050 accepts multiple masters, but if the device is in read mode, access is limited to one master until the data transmission is completed. SDA VREG A0 I2C ADDRESS = 0x48 A0 I2C ADDRESS = 0x49 10899-050 The I2C serial interface can be used to access the internal registers of the ADP5050. For complete information about the ADP5050 registers, see the Register Map section. SCL SDA Figure 58. Two ADP5050 Devices Configured with Different I2C Addresses (A0 Function Replaces PWRGD Function on Pin 20) SELF-CLEAR REGISTER BITS SDA AND SCL PINS The ADP5050 has two dedicated I C interface pins, SDA and SCL. SDA is an open-drain line for receiving and transmitting data. SCL is an input line for receiving the clock signal. Pull up these pins to the VDDIO supply using external resistors. 2 Register 12 and Register 14 are status registers that contain selfclear register bits. These bit are cleared automatically when a 1 is written to the status bit. Therefore, it is not necessary to write a 0 to the status bit to clear it. Serial data is transferred on the rising edge of SCL. The read data is generated at the SDA pin in read mode. Rev. 0 | Page 27 of 60 ADP5050 Data Sheet I2C INTERFACE TIMING DIAGRAMS The subaddress is used to select one of the user registers in the ADP5050. The ADP5050 sends data to and from the register specified by the subaddress. Figure 59 shows the timing diagram for the I2C write operation. Figure 60 shows the timing diagram for the I2C read operation. SCL 0 0 0 A7 A6 A5 A4 A3 A2 A1 A0 CHIP ADDRESS D7 D6 D5 D4 D3 D2 D1 D0 0 SUBADDRESS WRITE DATA OUTPUT BY PROCESSOR ACK BY SLAVE 1 ACK BY SLAVE START 0 WRITE ACK BY SLAVE 0 1 STOP A6 A5 A4 A3 A2 A1 A0 R/W SDA OUTPUT BY ADP5050 10899-052 NOTES 1. MAXIMUM SCL FREQUENCY IS 400kHz. 2. NO RESPONSE TO GENERAL CALLS. Figure 59. I2C Write to Register SCL 0 CHIP ADDRESS 0 A6 A5 A4 A3 A2 A1 A0 R/W A7 A6 A5 A4 A3 A2 A1 A0 0 1 SUBADDRESS 0 0 1 0 0 CHIP ADDRESS OUTPUT BY PROCESSOR OUTPUT BY ADP5050 D7 D6 D5 D4 D3 D2 D1 D0 1 READ DATA 10899-053 NOTES 1. MAXIMUM SCL FREQUENCY IS 400kHz. 2. NO RESPONSE TO GENERAL CALLS. 0 STOP 0 NO ACK BY MASTER TO STOP READING 1 READ 0 ACK BY SLAVE 0 WRITE ACK BY SLAVE START 1 ACK BY SLAVE A6 A5 A4 A3 A2 A1 A0 R/W SDA Figure 60. I2C Read from Register Rev. 0 | Page 28 of 60 Data Sheet ADP5050 APPLICATIONS INFORMATION ADIsimPower DESIGN TOOL The ADP5050 is supported by the ADIsimPower™ design tool set. ADIsimPower is a collection of tools that produce complete power designs optimized for a specific design goal. The tools enable the user to generate a full schematic and bill of materials and to calculate performance in minutes. ADIsimPower can optimize designs for cost, area, efficiency, and part count while taking into consideration the operating conditions and limitations of the IC and all real external components. The ADIsimPower tool can be found at www.analog.com/ADIsimPower; the user can request an unpopulated board through the tool. PROGRAMMING THE ADJUSTABLE OUTPUT VOLTAGE The output voltage of the ADP5050 is externally set by a resistive voltage divider from the output voltage to the FBx pin. To limit the degradation of the output voltage accuracy due to feedback bias current, ensure that the bottom resistor in the divider is not too large—a value of less than 50 kΩ is recommended. The equation for the output voltage setting is VOUT = VREF × (1 + (RTOP/RBOT)) The minimum output voltage in continuous conduction mode (CCM) for a given input voltage and switching frequency can be calculated using the following equation: VOUT_MIN = VIN × tMIN_ON × fSW − (RDSON1 − RDSON2) × IOUT_MIN × tMIN_ON × fSW − (RDSON2 + RL) × IOUT_MIN (1) where: VOUT_MIN is the minimum output voltage. tMIN_ON is the minimum on time. fSW is the switching frequency. RDSON1 is the on resistance of the high-side MOSFET. RDSON2 is the on resistance of the low-side MOSFET. IOUT_MIN is the minimum output current. RL is the resistance of the output inductor. The maximum output voltage for a given input voltage and switching frequency is limited by the minimum off time and the maximum duty cycle. Note that the frequency foldback feature helps to increase the effective maximum duty cycle by lowering the switching frequency, thereby decreasing the dropout voltage between the input and output voltages (see the Frequency Foldback section). The maximum output voltage for a given input voltage and switching frequency can be calculated using the following equation: where: VOUT is the output voltage. VREF is the feedback reference voltage: 0.8 V for Channel 1 to Channel 4 and 0.5 V for Channel 5. RTOP is the feedback resistor from VOUT to FB. RBOT is the feedback resistor from FB to ground. VOUT_MAX = VIN × (1 − tMIN_OFF × fSW) − (RDSON1 − RDSON2) × IOUT_MAX × (1 − tMIN_OFF × fSW) − (RDSON2 + RL) × IOUT_MAX (2) No resistor divider is required in the fixed output options. Each channel has VIDx bits to program the output voltage for a specific range (see Table 9). If a different fixed output voltage (default VID code) is required, contact your local Analog Devices sales or distribution representative. VOLTAGE CONVERSION LIMITATIONS For a given input voltage, upper and lower limitations on the output voltage exist due to the minimum on time and the minimum off time. The minimum output voltage for a given input voltage and switching frequency is limited by the minimum on time. The minimum on time for Channel 1 and Channel 2 is 117 ns (typical); the minimum on time for Channel 3 and Channel 4 is 90 ns (typical). The minimum on time increases at higher junction temperatures. where: VOUT_MAX is the maximum output voltage. tMIN_OFF is the minimum off time. fSW is the switching frequency. RDSON1 is the on resistance of the high-side MOSFET. RDSON2 is the on resistance of the low-side MOSFET. IOUT_MAX is the maximum output current. RL is the resistance of the output inductor. As shown in Equation 1 and Equation 2, reducing the switching frequency eases the minimum on time and off time limitations. CURRENT-LIMIT SETTING The ADP5050 has three selectable current-limit thresholds for Channel 1 and Channel 2. Make sure that the selected currentlimit value is larger than the peak current of the inductor, IPEAK. See Table 11 for the current-limit configuration for Channel 1 and Channel 2. Note that in forced PWM mode, Channel 1 and Channel 2 can potentially exceed the nominal output voltage when the minimum on time limit is exceeded. Careful switching frequency selection is required to avoid this problem. Rev. 0 | Page 29 of 60 ADP5050 Data Sheet SOFT START SETTING Table 13. Recommended Inductors The buck regulators in the ADP5050 include soft start circuitry that ramps the output voltage in a controlled manner during startup, thereby limiting the inrush current. To set the soft start time to a value of 2 ms, 4 ms, or 8 ms, connect a resistor divider from the SS12 or SS34 pin to the VREG pin and ground (see the Soft Start section). Vendor Coilcraft INDUCTOR SELECTION The inductor value is determined by the switching frequency, input voltage, output voltage, and inductor ripple current. Using a small inductor value yields faster transient response but degrades efficiency due to the larger inductor ripple current. Using a large inductor value yields a smaller ripple current and better efficiency but results in slower transient response. Thus, a trade-off must be made between transient response and efficiency. As a guideline, the inductor ripple current, ΔIL, is typically set to a value from 30% to 40% of the maximum load current. The inductor value can be calculated using the following equation: where: VIN is the input voltage. VOUT is the output voltage. D is the duty cycle (D = VOUT/VIN). ΔIL is the inductor ripple current. fSW is the switching frequency. The ADP5050 has internal slope compensation in the current loop to prevent subharmonic oscillations when the duty cycle is greater than 50%. The peak inductor current is calculated using the following equation: IPEAK = IOUT + (ΔIL/2) The saturation current of the inductor must be larger than the peak inductor current. For ferrite core inductors with a fast saturation characteristic, make sure that the saturation current rating of the inductor is higher than the current-limit threshold of the buck regulator to prevent the inductor from becoming saturated. ISAT (A) 5.4 3.7 2.9 2.7 3.6 2.8 23 15.9 12.2 10.5 9.2 11.2 7.1 5.5 4.6 IRMS (A) 11 8.0 5.2 5.0 3.9 2.8 18 10 8.0 11 9.0 9.1 7.0 5.3 4.2 DCR (mΩ) 10.8 21.35 34.8 52.2 67.4 84 5.62 12.7 19.92 14.4 18.9 9.4 17.3 29.6 46.6 Size (mm) 4×4 4×4 4×4 4×4 4×4 4×4 6×6 6×6 6×6 6×6 6×6 6.2 × 5.8 6.2 × 5.8 6.2 × 5.8 6.2 × 5.8 OUTPUT CAPACITOR SELECTION The output capacitance required to meet the undershoot (voltage droop) requirement can be calculated using the following equation: COUT _ UV = K UV × ∆I STEP 2 × L 2 × (VIN − VOUT ) × ∆VOUT _ UV where: KUV is a factor (typically set to 2). ΔISTEP is the load step. ΔVOUT_UV is the allowable undershoot on the output voltage. Another example of the effect of the output capacitor on the loop dynamics of the regulator is when the load is suddenly removed from the output and the energy stored in the inductor rushes into the output capacitor, causing an overshoot of the output voltage. The output capacitance required to meet the overshoot requirement can be calculated using the following equation: The rms current of the inductor can be calculated using the following equation: I RMS = I OUT + Value (µH) 1.0 2.2 3.3 4.7 6.8 10 1.0 2.2 3.3 4.7 6.8 1.0 2.2 3.3 4.7 The selected output capacitor affects both the output voltage ripple and the loop dynamics of the regulator. For example, during load step transients on the output, when the load is suddenly increased, the output capacitor supplies the load until the control loop can ramp up the inductor current, causing an undershoot of the output voltage. L = [(VIN − VOUT) × D]/(ΔIL × fSW) 2 TOKO Part No. XFL4020-102 XFL4020-222 XFL4020-332 XFL4020-472 XAL4030-682 XAL4040-103 XAL6030-102 XAL6030-222 XAL6030-332 XAL6060-472 XAL6060-682 FDV0530-1R0 FDV0530-2R2 FDV0530-3R3 FDV0530-4R7 ∆I L 2 COUT _ OV = 12 (V OUT Shielded ferrite core materials are recommended for low core loss and low EMI. Table 13 lists recommended inductors. K OV × ∆I STEP 2 × L + ∆VOUT_OV )2 − VOUT 2 where: KOV is a factor (typically set to 2). ΔISTEP is the load step. ΔVOUT_OV is the allowable overshoot on the output voltage. Rev. 0 | Page 30 of 60 Data Sheet ADP5050 The output voltage ripple is determined by the ESR of the output capacitor and its capacitance value. Use the following equations to select a capacitor that can meet the output ripple requirements: COUT _ RIPPLE = RESR = ∆I L 8 × f SW × ∆VOUT _ RIPPLE When the high-side MOSFET is turned off, the low-side MOSFET supplies the inductor current. For low duty cycle applications, the low-side MOSFET supplies the current for most of the period. To achieve higher efficiency, it is important to select a MOSFET with low on resistance. The power conduction loss for the lowside MOSFET can be calculated using the following equation: ∆VOUT _ RIPPLE PFET_LOW = IOUT2 × RDSON × (1 − D) ∆I L where: ΔIL is the inductor ripple current. fSW is the switching frequency. ΔVOUT_RIPPLE is the allowable output voltage ripple. RESR is the equivalent series resistance of the output capacitor. Select the largest output capacitance given by COUT_UV, COUT_OV, and COUT_RIPPLE to meet both load transient and output ripple requirements. The voltage rating of the selected output capacitor must be greater than the output voltage. The minimum rms current rating of the output capacitor is determined by the following equation: I COUT _ rms = ∆I L 12 where: RDSON is the on resistance of the low-side MOSFET. D is the duty cycle (D = VOUT/VIN). Table 14 lists recommended dual MOSFETs for various currentlimit settings. Ensure that the MOSFET can handle thermal dissipation due to power loss. Table 14. Recommended Dual MOSFETs Vendor IR Fairchild Vishay INPUT CAPACITOR SELECTION The input decoupling capacitor attenuates high frequency noise on the input and acts as an energy reservoir. Use a ceramic capacitor and place it close to the PVINx pin. The loop composed of the input capacitor, the high-side NFET, and the low-side NFET must be kept as small as possible. The voltage rating of the input capacitor must be greater than the maximum input voltage. Make sure that the rms current rating of the input capacitor is larger than the following equation: I CIN _ rms = I OUT × D × (1 − D ) where D is the duty cycle (D = VOUT/VIN). LOW-SIDE POWER DEVICE SELECTION Channel 1 and Channel 2 include integrated low-side MOSFET drivers, which can drive low-side N-channel MOSFETs (NFETs). The selection of the low-side N-channel MOSFET affects the performance of the buck regulator. The selected MOSFET must meet the following requirements: • • • • Drain-to-source voltage (VDS) must be higher than 1.2 × VIN. Drain current (ID) must be greater than 1.2 × ILIMIT_MAX, where ILIMIT_MAX is the selected maximum current-limit threshold. The selected MOSFET can be fully turned on at VGS = 4.5 V. Total gate charge (Qg at VGS = 4.5 V) must be less than 20 nC. Lower Qg characteristics provide higher efficiency. AOS Part No. IRFHM8363 IRLHS6276 FDMA1024 FDMB3900 FDMB3800 FDC6401 Si7228DN Si7232DN Si7904BDN Si5906DU Si5908DC SiA906EDJ AON7804 AON7826 AO6800 AON2800 VDS (V) 30 20 20 25 30 20 30 20 20 30 20 20 30 20 30 20 ID (A) 10 3.4 5.0 7.0 4.8 3.0 23 25 6 6 5.9 4.5 22 22 3.4 4.5 RDSON (mΩ) 20.4 45 54 33 51 70 25 16.4 30 40 40 46 26 26 70 47 Qg (nC) 6.7 3.1 5.2 11 4 3.3 4.1 12 9 8 5 3.5 7.5 6 4.7 4.1 Size (mm) 3×3 2×2 2×2 3×2 3×2 3×3 3×3 3×3 3×3 3×2 3×2 2×2 3×3 3×3 3×3 2×2 PROGRAMMING THE UVLO INPUT The precision enable input can be used to program the UVLO threshold of the input voltage, as shown in Figure 43. To limit the degradation of the input voltage accuracy due to the internal 1 MΩ pull-down resistor tolerance, ensure that the bottom resistor in the divider is not too large—a value of less than 50 kΩ is recommended. The precision turn-on threshold is 0.8 V. The resistive voltage divider for the programmable VIN start-up voltage is calculated as follows: VIN_STARTUP = (0.8 nA + (0.8 V/RBOT_EN)) × (RTOP_EN + RBOT_EN) where: RTOP_EN is the resistor from VIN to EN. RBOT_EN is the resistor from EN to ground. Rev. 0 | Page 31 of 60 ADP5050 Data Sheet COMPENSATION COMPONENTS DESIGN For the peak current-mode control architecture, the power stage can be simplified as a voltage controlled current source that supplies current to the output capacitor and load resistor. The simplified loop is composed of one domain pole and a zero contributed by the output capacitor ESR. The control-to-output transfer function is shown in the following equations: s 1 + 2 × π × f VOUT (s) z Gvd (s) = = AVI × R × VCOMP (s) s 1 + 2 × π × f p fz = fp = 2. RC = 1 2 × π × RESR × COUT 4. 1 2 × π × (R + R ESR ) × COUT VOUT + AVI CCP – 10899-054 CC + CCP × R ×C ×C s × 1 + C C CP × s CC + CCP RC PLOSS = PCOND + PSW + PTRAN RESR The closed-loop transfer equation is as follows: × RESR × COUT Use the following equation to estimate the power dissipation of the buck regulator: The compensation components, RC and CC, contribute a zero; RC and the optional CCP contribute an optional pole. RBOT + RTOP CCP is optional. It can be used to cancel the zero caused by the ESR of the output capacitor. Calculate CCP using the following equation: The power dissipation (PLOSS) for each buck regulator includes power switch conduction losses (PCOND), switching losses (PSW), and transition losses (PTRAN). Other sources of power dissipation exist, but these sources are generally less significant at the high output currents of the application thermal limit. COUT 1 + RC × CC × s RC Buck Regulator Power Dissipation Figure 61. Simplified Peak Current-Mode Control Small Signal Circuit −gm (R + RESR ) × COUT PD = PBUCK1 + PBUCK2 + PBUCK3 + PBUCK4 + PLDO CC RBOT Place the compensation zero at the domain pole (fP). Calculate CC using the following equation: The total power dissipation in the ADP5050 simplifies to R RC 0.8 V × g m × AVI POWER DISSIPATION RTOP VCOMP 2 × π ×VOUT × COUT × f C CCP = VOUT – gm + Determine the cross frequency (fC). Generally, fC is between fSW/12 and fSW/6. Calculate RC using the following equation: CC = The ADP5050 uses a transconductance amplifier as the error amplifier to compensate the system. Figure 61 shows the simplified peak current-mode control small signal circuit. TV (s) = 1. 3. where: AVI = 10 A/V for Channel 1 or Channel 2, and 3.33 A/V for Channel 3 or Channel 4. R is the load resistance. RESR is the equivalent series resistance of the output capacitor. COUT is the output capacitance. RBOT The following guidelines show how to select the compensation components—RC, CC, and CCP—for ceramic output capacitor applications. × Gvd(s) Power Switch Conduction Loss (PCOND) Power switch conduction losses are caused by the flow of output current through both the high-side and low-side power switches, each of which has its own internal on resistance (RDSON). Use the following equation to estimate the power switch conduction loss: PCOND = (RDSON_HS × D + RDSON_LS × (1 − D)) × IOUT2 where: RDSON_HS is the on resistance of the high-side MOSFET. RDSON_LS is the on resistance of the low-side MOSFET. D is the duty cycle (D = VOUT/VIN). Rev. 0 | Page 32 of 60 Data Sheet ADP5050 Switching Loss (PSW) LDO Regulator Power Dissipation Switching losses are associated with the current drawn by the driver to turn the power devices on and off at the switching frequency. Each time a power device gate is turned on or off, the driver transfers a charge from the input supply to the gate, and then from the gate to ground. Use the following equation to estimate the switching loss: The power dissipation of the LDO regulator is given by the following equation: PSW = (CGATE_HS + CGATE_LS) × VIN2 × fSW where: CGATE_HS is the gate capacitance of the high-side MOSFET. CGATE_LS is the gate capacitance of the low-side MOSFET. fSW is the switching frequency. PLDO = [(VIN − VOUT) × IOUT] + (VIN × IGND) where: VIN and VOUT are the input and output voltages of the LDO regulator. IOUT is the load current of the LDO regulator. IGND is the ground current of the LDO regulator. Power dissipation due to the ground current is small in the ADP5050 and can be ignored. JUNCTION TEMPERATURE Transition Loss (PTRAN) Transition losses occur because the high-side MOSFET cannot turn on or off instantaneously. During a switch node transition, the MOSFET provides all the inductor current. The source-todrain voltage of the MOSFET is half the input voltage, resulting in power loss. Transition losses increase with both load and input voltage and occur twice for each switching cycle. Use the following equation to estimate the transition loss: PTRAN = 0.5 × VIN × IOUT × (tR + tF) × fSW where: tR is the rise time of the switch node. tF is the fall time of the switch node. Thermal Shutdown Channel 1 and Channel 2 store the value of the inductor current only during the on time of the internal high-side MOSFET. Therefore, a small amount of power (as well as a small amount of input rms current) is dissipated inside the ADP5050, which reduces thermal constraints. However, when Channel 1 and Channel 2 are operating under maximum load with high ambient temperature and high duty cycle, the input rms current can become very large and cause the junction temperature to exceed the maximum junction temperature of 125°C. If the junction temperature exceeds 150°C, the regulator enters thermal shutdown and recovers when the junction temperature falls below 135°C. The junction temperature of the die is the sum of the ambient temperature of the environment and the temperature rise of the package due to power dissipation, as shown in the following equation: TJ = TA + TR where: TJ is the junction temperature. TA is the ambient temperature. TR is the rise in temperature of the package due to power dissipation. The rise in temperature of the package is directly proportional to the power dissipation in the package. The proportionality constant for this relationship is the thermal resistance from the junction of the die to the ambient temperature, as shown in the following equation: TR = θJA × PD where: TR is the rise in temperature of the package. θJA is the thermal resistance from the junction of the die to the ambient temperature of the package (see Table 6). PD is the power dissipation in the package. An important factor to consider is that the thermal resistance value is based on a 4-layer, 4 inch × 3 inch PCB with 2.5 oz. of copper, as specified in the JEDEC standard, whereas real-world applications may use PCBs with different dimensions and a different number of layers. It is important to maximize the amount of copper used to remove heat from the device. Copper exposed to air dissipates heat better than copper used in the inner layers. Connect the exposed pad to the ground plane with several vias. Rev. 0 | Page 33 of 60 ADP5050 Data Sheet DESIGN EXAMPLE This section provides an example of the step-by-step design procedures and the external components required for Channel 1. Table 15 lists the design requirements for this example. Table 15. Example Design Requirements for Channel 1 Parameter Input Voltage Output Voltage Output Current Output Ripple Load Transient Specification VPVIN1 = 12 V ± 5% VOUT1 = 1.2 V IOUT1 = 4 A ΔVOUT1_RIPPLE = 12 mV in CCM mode ±5% at 20% to 80% load transient, 1 A/µs Although this example shows step-by-step design procedures for Channel 1, the procedures apply to all other buck regulator channels (Channel 2 to Channel 4). SETTING THE SWITCHING FREQUENCY The first step is to determine the switching frequency for the ADP5050 design. In general, higher switching frequencies produce a smaller solution size due to the lower component values required, whereas lower switching frequencies result in higher conversion efficiency due to lower switching losses. The switching frequency of the ADP5050 can be set to a value from 250 kHz to 1.4 MHz by connecting a resistor from the RT pin to ground. The selected resistor allows the user to make decisions based on the trade-off between efficiency and solution size. (For more information, see the Oscillator section.) However, the highest supported switching frequency must be assessed by checking the voltage conversion limitations enforced by the minimum on time and the minimum off time (see the Voltage Conversion Limitations section). In this design example, a switching frequency of 600 kHz is used to achieve a good combination of small solution size and high conversion efficiency. To set the switching frequency to 600 kHz, use the following equation to calculate the resistor value, RRT: RRT (kΩ) = [14,822/fSW (kHz)]1.081 Therefore, select standard resistor RRT = 31.6 kΩ. SETTING THE OUTPUT VOLTAGE Select a 10 kΩ bottom resistor (RBOT) and then calculate the top feedback resistor using the following equation: SETTING THE CURRENT LIMIT For 4 A output current operation, the typical peak current limit is 6.44 A. For this example, choose RILIM1 = 22 kΩ (see Table 11). For more information, see the Current-Limit Protection section. SELECTING THE INDUCTOR The peak-to-peak inductor ripple current, ΔIL, is set to 35% of the maximum output current. Use the following equation to estimate the value of the inductor: L = [(VIN − VOUT) × D]/(ΔIL × fSW) where: VIN = 12 V. VOUT = 1.2 V. D is the duty cycle (D = VOUT/VIN = 0.1). ΔIL = 35% × 4 A = 1.4 A. fSW = 600 kHz. The resulting value for L is 1.28 µH. The closest standard inductor value is 1.5 µH; therefore, the inductor ripple current, ΔIL, is 1.2 A. The peak inductor current is calculated using the following equation: IPEAK = IOUT + (ΔIL/2) The calculated peak current for the inductor is 4.6 A. The rms current of the inductor can be calculated using the following equation: I RMS = I OUT 2 + ∆I L 2 12 The rms current of the inductor is approximately 4.02 A. Therefore, an inductor with a minimum rms current rating of 4.02 A and a minimum saturation current rating of 4.6 A is required. However, to prevent the inductor from reaching its saturation point in current-limit conditions, it is recommended that the inductor saturation current be higher than the maximum peak current limit, typically 7.48 A, for reliable operation. Based on these requirements and recommendations, the TOKO FDV0530-1R5, with a DCR of 13.5 mΩ, is selected for this design. RBOT = RTOP × (VREF/(VOUT − VREF)) where: VREF is 0.8 V for Channel 1. VOUT is the output voltage. To set the output voltage to 1.2 V, choose the following resistor values: RTOP = 4.99 kΩ, RBOT = 10 kΩ. Rev. 0 | Page 34 of 60 Data Sheet ADP5050 COUT _ RIPPLE = ∆I L 100 120 8 × f SW × ∆VOUT _ RIPPLE 80 90 60 60 40 30 20 0 ∆VOUT _ RIPPLE ∆I L MAGNITUDE (dB) R ESR = Figure 62 shows the Bode plot for the 1.2 V output rail. The cross frequency is 62 kHz, and the phase margin is 58°. Figure 63 shows the load transient waveform. The calculated capacitance, COUT_RIPPLE, is 20.8 µF, and the calculated RESR is 10 mΩ. To meet the ±5% overshoot and undershoot requirements, use the following equations to calculate the capacitance: COUT _ UV = COUT _ OV = K UV × ∆I STEP × L 2 –30 –60 –40 –90 –60 –120 –80 2 × (VIN − VOUT ) × ∆VOUT _ UV (V 0 –20 K OV × ∆I STEP 2 × L OUT –150 CROSS FREQUENCY: 62kHz PHASE MARGIN: 58° –100 1k 10k –180 100k 1M FREQUENCY (Hz) + ∆VOUT_OV ) − VOUT 2 PHASE (Degrees) The output capacitor must meet the output voltage ripple and load transient requirements. To meet the output voltage ripple requirement, use the following equations to calculate the ESR and capacitance: Choose standard components: RC = 15 kΩ and CC = 2.7 nF. CCP is optional. 10899-161 SELECTING THE OUTPUT CAPACITOR Figure 62. Bode Plot for 1.2 V Output 2 For estimation purposes, use KOV = KUV = 2; therefore, COUT_OV = 117 µF and COUT_UV = 13.3 µF. The ESR of the output capacitor must be less than 13.3 mΩ, and the output capacitance must be greater than 117 µF. It is recommended that three ceramic capacitors be used (47 µF, X5R, 6.3 V), such as the GRM21BR60J476ME15 from Murata with an ESR of 2 mΩ. VOUT 1 IOUT SELECTING THE LOW-SIDE MOSFET A low RDSON N-channel MOSFET must be selected for high efficiency solutions. The MOSFET breakdown voltage (VDS) must be greater than 1.2 × VIN, and the drain current must be greater than 1.2 × ILIMIT_MAX. It is recommended that a 20 V, dual N-channel MOSFET—such as the Si7232DN from Vishay—be used for both Channel 1 and Channel 2. The RDSON of the Si7232DN at 4.5 V driver voltage is 16.4 mΩ, and the total gate charge is 12 nC. DESIGNING THE COMPENSATION NETWORK For better load transient and stability performance, set the cross frequency, fC, to fSW/10. In this example, fSW is set to 600 kHz; therefore, fC is set to 60 kHz. For the 1.2 V output rail, the 47 µF ceramic output capacitor has a derated value of 40 µF. RC = 2 × π × 1.2 V × 3 × 40 µ F × 60 kHz CC = CCP = 0.8 V × 470 µS × 10 A/V (0.3 Ω + 0.001 Ω) × 3 × 40 µ F 14.4 k Ω 0.001 Ω × 3 × 40 µ F 14.4 k Ω = 14.4 k Ω = 2.51 nF CH1 50.0mV BW M200µs CH4 2.00A Ω BW A CH4 2.32A 10899-162 4 Figure 63. 0.8 A to 3.2 A Load Transient for 1.2 V Output SELECTING THE SOFT START TIME The soft start feature allows the output voltage to ramp up in a controlled manner, eliminating output voltage overshoot during soft start and limiting the inrush current. The SS12 pin can be used to program a soft start time of 2 ms, 4 ms, or 8 ms and can also be used to configure parallel operation of Channel 1 and Channel 2. For more information, see the Soft Start section and Table 10. SELECTING THE INPUT CAPACITOR For the input capacitor, select a ceramic capacitor with a minimum value of 10 µF; place the input capacitor close to the PVIN1 pin. In this example, one 10 µF, X5R, 25 V ceramic capacitor is recommended. = 8.3 pF Rev. 0 | Page 35 of 60 ADP5050 Data Sheet RECOMMENDED EXTERNAL COMPONENTS Table 16 lists the recommended external components for 4 A applications used with Channel 1 and Channel 2 of the ADP5050. Table 17 lists the recommended external components for 1.2 A applications used with Channel 3 and Channel 4. Table 16. Recommended External Components for Typical 4 A Applications, Channel 1 and Channel 2 (±1% Output Ripple, ±7.5% Tolerance at ~60% Step Transient) fSW (kHz) 300 IOUT (A) 4 600 4 1000 4 1 2 3 VIN (V) 12 (or 5) 12 (or 5) 12 (or 5) 12 (or 5) 12 (or 5) 12 12 (or 5) 12 (or 5) 12 (or 5) 12 (or 5) 12 (or 5) 12 5 5 12 (or 5) 12 (or 5) 12 (or 5) 12 VOUT (V) 1.2 1.5 1.8 2.5 3.3 5.0 1.2 1.5 1.8 2.5 3.3 5.0 1.2 1.5 1.8 2.5 3.3 5.0 L (µH) 3.3 3.3 3.3 4.7 6.8 6.8 1.5 1.5 2.2 2.2 3.3 3.3 1.0 1.0 1.0 1.5 1.5 2.2 COUT (µF) 2 × 1001 2 × 1001 3 × 472 3 × 472 3 × 472 473 2 × 472 2 × 472 2 × 472 2 × 472 2 × 472 473 2 × 472 2 × 472 472 472 472 473 RTOP (kΩ) 4.99 8.87 12.7 21.5 31.6 52.3 4.99 8.87 12.7 21.5 31.6 52.3 4.99 8.87 12.7 21.5 31.6 52.3 RBOT (kΩ) 10 10.2 10.2 10.2 10.2 10 10 10.2 10.2 10.2 10.2 10 10 10.2 10.2 10.2 10.2 10 RC (kΩ) 10 10 6.81 10 10 4.7 10 10 10 10 15 10 15 15 10 10 10 15 CC (pF) 4700 4700 4700 4700 4700 4700 2700 2700 2700 2700 2700 2700 1500 1500 1500 1500 1500 1500 Dual FET Si7232DN Si7232DN Si7232DN Si7232DN Si7232DN Si7232DN Si7232DN Si7232DN Si7232DN Si7232DN Si7232DN Si7232DN Si7232DN Si7232DN Si7232DN Si7232DN Si7232DN Si7232DN 100 µF capacitor: Murata GRM31CR60J107ME39 (6.3 V, X5R, 1206). 47 µF capacitor: Murata GRM21BR60J476ME15 (6.3 V, X5R, 0805). 47 µF capacitor: Murata GRM31CR61A476ME15 (10 V, X5R, 1206). Table 17. Recommended External Components for Typical 1.2 A Applications, Channel 3 and Channel 4 (±1% Output Ripple, ±7.5% Tolerance at ~60% Step Transient) fSW (kHz) 300 IOUT (A) 1.2 600 1.2 1000 1.2 1 2 VIN (V) 12 (or 5) 12 (or 5) 12 (or 5) 12 (or 5) 12 (or 5) 12 12 (or 5) 12 (or 5) 12 (or 5) 12 (or 5) 12 (or 5) 12 5 12 (or 5) 12 (or 5) 12 (or 5) 12 (or 5) 12 VOUT (V) 1.2 1.5 1.8 2.5 3.3 5.0 1.2 1.5 1.8 2.5 3.3 5.0 1.2 1.5 1.8 2.5 3.3 5.0 L (µH) 10 10 15 15 22 22 4.7 6.8 6.8 10 10 10 2.2 3.3 4.7 4.7 6.8 6.8 COUT (µF) 2 × 221 2 × 221 2 × 221 2 × 221 2 × 221 222 221 221 221 221 221 222 221 221 221 221 221 222 22 µF capacitor: Murata GRM188R60J226MEA0 (6.3 V, X5R, 0603). 22 µF capacitor: Murata GRM219R61A226MEA0 (10 V, X5R, 0805). Rev. 0 | Page 36 of 60 RTOP (kΩ) 4.99 8.87 12.7 21.5 31.6 52.3 4.99 8.87 12.7 21.5 31.6 52.3 4.99 8.87 12.7 21.5 31.6 52.3 RBOT (kΩ) 10 10.2 10.2 10.2 10.2 10 10 10.2 10.2 10.2 10.2 10 10 10.2 10.2 10.2 10.2 10 RC (kΩ) 6.81 6.81 6.81 6.81 6.81 6.81 6.81 6.81 6.81 6.81 6.81 6.81 10 10 10 10 10 15 CC (pF) 4700 4700 4700 4700 4700 4700 2700 2700 2700 2700 2700 2700 1800 1800 1800 1800 1800 1800 Data Sheet ADP5050 CIRCUIT BOARD LAYOUT RECOMMENDATIONS • • • • • Place the input capacitor, inductor, MOSFET, output capacitor, and bootstrap capacitor close to the IC. Use short, thick traces to connect the input capacitors to the PVINx pins, and use dedicated power ground to connect the input and output capacitor grounds to minimize the connection length. Use several high current vias, if required, to connect PVINx, PGNDx, and SWx to other power planes. Use short, thick traces to connect the inductors to the SWx pins and the output capacitors. Ensure that the high current loop traces are as short and wide as possible. Figure 64 shows the high current path. Maximize the amount of ground metal for the exposed pad, and use as many vias as possible on the component side to improve thermal dissipation. • • • • Use a ground plane with several vias connecting to the component side ground to further reduce noise interference on sensitive circuit nodes. Place the decoupling capacitors close to the VREG and VDD pins. Place the frequency setting resistor close to the RT pin. Place the feedback resistor divider close to the FBx pin. In addition, keep the FBx traces away from the high current traces and the switch node to avoid noise pickup. Use Size 0402 or 0603 resistors and capacitors to achieve the smallest possible footprint solution on boards where space is limited. VIN PVINx BSTx VOUT SWx ADP5050 DLx FBx ENx GND Figure 64. Typical Circuit with High Current Traces Shown in Blue 10899-163 • • 10899-055 Good circuit board layout is essential to obtain the best performance from the ADP5050 (see Figure 65). Poor layout can affect the regulation and stability of the part, as well as the electromagnetic interference (EMI) and electromagnetic compatibility (EMC) performance. Refer to the following guidelines for a good PCB layout. Figure 65. Typical PCB Layout for the ADP5050 Rev. 0 | Page 37 of 60 ADP5050 Data Sheet TYPICAL APPLICATION CIRCUITS ADP5050 VREG SYNC/MODE VREG VDD C0 1.0µF C1 1.0µF INT VREG OSCILLATOR 100mA RT 31.6kΩ FB1 PVIN1 12V nINT BST1 C2 10µF COMP1 6.81kΩ EN1 2.7nF VREG CHANNEL 1 BUCK REGULATOR (1.2A/2.5A/4A) SW1 5V REG DL1 SS12 COMP2 VREG 2.2µH C4 47µF Q1 1.1V TO 1.3V/2.5A (DVS) SiA906EDJ (46mΩ) VCORE PROCESSOR VDDIO DL2 6.81kΩ EN2 CHANNEL 2 BUCK REGULATOR (1.2A/2.5A/4A) COMP3 6.81kΩ EN3 5V REG L2 VOUT2 4.7µH C7 47µF SW2 BST2 C6 0.1µF FB2 PVIN3 2.7nF VOUT1 Q2 C5 10µF C8 10µF L1 PGND PVIN2 2.7nF C3 0.1µF 3.3V/2.5A OPTIONAL I2C INTERFACE I/O SCL SDA SCL SDA BST3 CHANNEL 3 BUCK REGULATOR (1.2A) SW3 C9 0.1µF L3 VOUT3 4.7µH 1.5V/1.2A C10 22µF FB3 DDR TERM. LDO DDR MEMORY PGND3 SS34 BST4 PVIN4 C11 10µF COMP4 2.7nF 6.81kΩ EN4 CHANNEL 4 BUCK REGULATOR (1.2A) SW4 C12 0.1µF L4 VOUT4 10µH 4.0V TO 4.5V/1.2A (DVS) C13 22µF FB4 RFPA PGND4 PVIN5 OPTIONAL I2C INTERFACE VDDIO SCL SDA FB5 47kΩ 10kΩ I2C PWRGD ALERT C14 1µF VOUT5 VOUT5 2.85V/100mA RF TRANSCEIVER C15 1µF nINT 10899-056 EN5 CHANNEL 5 200mA LDO REGULATOR EXPOSED PAD Figure 66. Typical Femtocell Application, 600 kHz Switching Frequency, Fixed Output Model Rev. 0 | Page 38 of 60 Data Sheet ADP5050 ADP5050 VREG SYNC/MODE VREG VDD C0 1.0µF C1 1.0µF INT VREG OSCILLATOR 100mA RT 31.6kΩ 10kΩ FB1 PVIN1 12V 4.99kΩ BST1 C2 10µF COMP1 2.7nF 10kΩ EN1 VREG SW1 CHANNEL 1 BUCK REGULATOR (1.2A/2.5A/4A) 5V REG PGND PVIN2 DL2 L1 VOUT1 1.5µH C4 47µF Q1 DL1 SS12 C5 10µF COMP2 2.7nF 10kΩ EN2 C3 0.1µF 1.2V/4A VCORE C16 47µF Si7232DN (16.4mΩ) 22kΩ FPGA 22kΩ AUXILIARY VOLTAGE Q2 CHANNEL 2 BUCK REGULATOR (1.2A/2.5A/4A) 5V REG L2 VOUT2 2.2µH C7 47µF SW2 BST2 C6 0.1µF FB2 2.5V/4A C17 47µF 21.5kΩ I/O BANK 0 I/O BANK 1 I/O BANK 2 10.2kΩ PVIN3 C8 10µF COMP3 2.7nF VREG 6.81kΩ EN3 BST3 CHANNEL 3 BUCK REGULATOR (1.2A) SW3 C9 0.1µF L3 VOUT3 6.8µH 8.87kΩ FB3 1.5V/1.2A 10.2kΩ PGND3 I/O BANK 3 MGTs C10 22µF DDR TERM. LDO DDR MEMORY 3.3V/1.2A FLASH MEMORY SS34 BST4 PVIN4 C11 10µF COMP4 2.7nF CHANNEL 4 BUCK REGULATOR (1.2A) 6.81kΩ EN4 SW4 FB4 PGND4 C12 0.1µF L4 VOUT4 10µH 31.6kΩ C13 22µF 10.2kΩ PVIN5 EN5 CHANNEL 5 200mA LDO REGULATOR C14 1µF VOUT5 FB5 14kΩ 10kΩ OPTIONAL INTERFACE VDDIO SCL SDA I 2C ALERT PWRGD 1.2V/100mA C15 1µF nINT 10899-057 I 2C VOUT5 EXPOSED PAD Figure 67. Typical FPGA Application, 600 kHz Switching Frequency, Adjustable Output Model Rev. 0 | Page 39 of 60 ADP5050 Data Sheet ADP5050 VREG SYNC/MODE VREG VDD C1 1.0µF C0 1.0µF PVIN1 INT VREG OSCILLATOR 100mA RT 31.6kΩ 10kΩ FB1 12V 4.99kΩ BST1 C2 10µF COMP1 2.7nF CHANNEL 1 BUCK REGULATOR (1.2A/2.5A/4A) 10kΩ EN1 VREG 100kΩ SW1 DL1 SS12 C5 10µF Si7232DN (16.4mΩ) Q1 PGND DL2 CHANNEL 2 BUCK REGULATOR (1.2A/2.5A/4A) 5V REG 2.7nF VREG 6.81kΩ EN3 C16 100µF 22kΩ L2 1.5µH C6 0.1µF FB2 PVIN3 COMP3 C4 100µF 1.2V/8A 22kΩ SW2 BST2 EN2 C8 10µF VOUT1 Q2 PVIN2 COMP2 L1 1.5µH 5V REG 600kΩ C3 0.1µF BST3 CHANNEL 3 BUCK REGULATOR (1.2A) SW3 C9 0.1µF L3 6.8µH FB3 PGND3 10.2kΩ VOUT3 1.5V/1.2A C10 22µF 8.87kΩ SS34 BST4 PVIN4 2.7nF COMP4 CHANNEL 4 BUCK REGULATOR (1.2A) 6.81kΩ EN4 SW4 C12 0.1µF L4 10µH FB4 PGND4 10.2kΩ VOUT4 C13 22µF 31.6kΩ C14 1µF PVIN5 EN5 OPTIONAL I2C INTERFACE VDDIO SCL SDA CHANNEL 5 200mA LDO REGULATOR I2C ALERT 3.3V/1.2A VOUT5 FB5 10kΩ PWRGD 40.2kΩ C15 1µF VOUT5 2.5V/200mA nINT EXPOSED PAD 10899-165 C11 10µF Figure 68. Typical Channel 1/Channel 2 Parallel Output Application, 600 kHz Switching Frequency, Adjustable Output Model Rev. 0 | Page 40 of 60 Data Sheet ADP5050 REGISTER MAP Table 18. Register Map Reg. 0 1 2 3 4 5 6 7 8 9 10 Register Address 0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A Register Name Reserved PCTRL VID1 VID23 VID4 DVS_CFG OPT_CFG LCH_CFG SW_CFG TH_CFG HICCUP_CFG 11 12 13 14 15 0x0B 0x0C 0x0D 0x0E 0x0F PWRGD_MASK LCH_STATUS STATUS_RD INT_STATUS INT_MASK 16 17 0x10 0x11 Reserved DEFAULT_SET Bit 7 Bit 6 Bit 5 Reserved Reserved Reserved Bit 4 Bit 3 Reserved CH5_ON CH4_ON VID3[2:0] Bit 1 Bit 0 CH3_ON VID1[4:0] CH2_ON CH1_ON VID2[2:0] VID4[4:0] DVS4_INTVAL[1:0] Reserved DVS1_ON DVS1_INTVAL[1:0] DSCG2_ON DSCG1_ON PSM4_ON PSM3_ON PSM2_ON PSM1_ON OVP2_ON OVP1_ON SCP4_ON SCP3_ON SCP2_ON SCP1_ON PHASE4[1:0] PHASE3[1:0] PHASE2[1:0] TEMP_TH[1:0] LVIN_TH[3:0] Reserved HICCUP4_ HICCUP3_ HICCUP2_ HICCUP1_ OFF OFF OFF OFF Reserved MASK_CH4 MASK_CH3 MASK_CH2 MASK_CH1 Reserved TSD_LCH CH4_LCH CH3_LCH CH2_LCH CH1_LCH Reserved PWRG4 PWRG3 PWRG2 PWRG1 Reserved TEMP_INT LVIN_INT PWRG4_INT PWRG3_INT PWRG2_INT PWRG1_INT Reserved MASK_TEMP MASK_LVIN MASK_ MASK_ MASK_ MASK_ PWRG4 PWRG3 PWRG2 PWRG1 Reserved DEFAULT_SET[7:0] Reserved Reserved DVS4_ON DSCG4_ON DSCG3_ON OVP4_ON OVP3_ON FREQ3 FREQ1 Reserved SYNC_OUT Rev. 0 | Page 41 of 60 Reserved Bit 2 ADP5050 Data Sheet DETAILED REGISTER DESCRIPTIONS This section describes the bit functions of each register used by the ADP5050. To reset a register, the internal VDD power-on reset signals must be low, unless otherwise noted. REGISTER 1: PCTRL (CHANNEL ENABLE CONTROL), ADDRESS 0x01 Register 1 is used to enable and disable the operation of each channel. The on or off status of a channel is controlled by the CHx_ON bit in this register and the external hardware enable pin for the channel (logical AND). The default value of the CHx_ON bit, 1, means that the channel enable is controlled by the external hardware enable pin. The channel can be disabled or enabled via the I2C interface only when the ENx pin is high. Pulling the ENx pin low resets the corresponding CHx_ON bit to the default value (1) to allow another valid startup when the ENx pin is high again. Table 19. Register 1 Bit Assignments Bit 7 Bit 6 Reserved Bit 5 Bit 4 CH5_ON Bit 3 CH4_ON Bit 2 CH3_ON Bit 1 CH2_ON Bit 0 CH1_ON Bit 2 VID1[4:0] Bit 1 Bit 0 Table 20. PCTRL Register, Bit Function Descriptions Bits [7:5] 4 Bit Name Reserved CH5_ON Access R/W R/W 3 CH4_ON R/W 2 CH3_ON R/W 1 CH2_ON R/W 0 CH1_ON R/W Description Reserved. 0 = disable Channel 5 (EN5 pin must be high). 1 = enable Channel 5 (default). 0 = disable Channel 4 (EN4 pin must be high). 1 = enable Channel 4 (default). 0 = disable Channel 3 (EN3 pin must be high). 1 = enable Channel 3 (default). 0 = disable Channel 2 (EN2 pin must be high). 1 = enable Channel 2 (default). 0 = disable Channel 1 (EN1 pin must be high). 1 = enable Channel 1 (default). REGISTER 2: VID1 (VID SETTING FOR CHANNEL 1), ADDRESS 0x02 Register 2 is used to set the output voltage for Channel 1. Table 21. Register 2 Bit Assignments Bit 7 Bit 6 Reserved Bit 5 Bit 4 Bit 3 Table 22. VID1 Register, Bit Function Descriptions Bits [7:5] [4:0] Bit Name Reserved VID1[4:0] Access R/W R/W Description Reserved. These bits set the output voltage for Channel 1. The default value is programmed by factory fuse. 00000 = 0.8 V (adjustable). 00001 = 0.85 V. 00010 = 0.875 V. 00011 = 0.9 V. … 00111 = 1.0 V. … 10011 = 1.3 V. … 11011 = 1.5 V. … 11110 = 1.575 V. 11111 = 1.6 V. Rev. 0 | Page 42 of 60 Data Sheet ADP5050 REGISTER 3: VID23 (VID SETTING FOR CHANNEL 2 AND CHANNEL 3), ADDRESS 0x03 Register 3 is used to set the output voltage for Channel 2 and Channel 3. Table 23. Register 3 Bit Assignments Bit 7 Reserved Bit 6 Bit 5 VID3[2:0] Bit 4 Bit 3 Reserved Bit 2 Bit 1 VID2[2:0] Bit 0 Table 24. VID23 Register, Bit Function Descriptions Bits 7 [6:4] Bit Name Reserved VID3[2:0] Access R/W R/W 3 [2:0] Reserved VID2[2:0] R/W R/W Description Reserved. These bits set the output voltage for Channel 3. The default value is programmed by factory fuse. 000 = 0.8 V (adjustable). 001 = 1.2 V. 010 = 1.3 V. 011 = 1.4 V. 100 = 1.5 V. 101 = 1.6 V. 110 = 1.7 V. 111 = 1.8 V. Reserved. These bits set the output voltage for Channel 2. The default value is programmed by factory fuse. 000 = 0.8 V (adjustable). 001 = 3.3 V. 010 = 3.6 V. 011 = 3.9 V. 100 = 4.2 V. 101 = 4.5 V. 110 = 4.8 V. 111 = 5.0 V. REGISTER 4: VID4 (VID SETTING FOR CHANNEL 4), ADDRESS 0x04 Register 4 is used to set the output voltage for Channel 4. Table 25. Register 4 Bit Assignments Bit 7 Bit 6 Reserved Bit 5 Bit 4 Bit 3 Bit 2 VID4[4:0] Bit 1 Bit 0 Table 26. VID4 Register, Bit Function Descriptions Bits [7:5] [4:0] Bit Name Reserved VID4[4:0] Access R/W R/W Description Reserved. These bits set the output voltage for Channel 4. The default value is programmed by factory fuse. 00000 = 0.8 V (adjustable). 00001 = 2.5 V. 00010 = 2.6 V. … 00110 = 3.0 V. … 10000 = 4.0 V. … 11010 = 5.0 V. … 11110 = 5.4 V. 11111 = 5.5 V. Rev. 0 | Page 43 of 60 ADP5050 Data Sheet REGISTER 5: DVS_CFG (DVS CONFIGURATION FOR CHANNEL 1 AND CHANNEL 4), ADDRESS 0x05 Register 5 is used to configure dynamic voltage scaling (DVS) for Channel 1 and Channel 4 (see the Dynamic Voltage Scaling (DVS) section). Table 27. Register 5 Bit Assignments Bit 7 Reserved Bit 6 DVS4_ON Bit 5 Bit 4 DVS4_INTVAL[1:0] Bit 3 Reserved Bit 2 DVS1_ON Table 28. DVS_CFG Register, Bit Function Descriptions Bits 7 6 Bit Name Reserved DVS4_ON Access R/W R/W [5:4] DVS4_INTVAL[1:0] R/W 3 2 Reserved DVS1_ON R/W R/W [1:0] DVS1_INTVAL[1:0] R/W Description Reserved. 0 = disable DVS for Channel 4 (default). 1 = enable DVS for Channel 4. These bits configure the DVS interval for Channel 4. 00 = 62.5 µs (default). 01 = 31.2 µs. 10 = 15.6 µs. 11 = 7.8 µs. Reserved. 0 = disable DVS for Channel 1 (default). 1 = enable DVS for Channel 1. These bits configure the DVS interval for Channel 1. 00 = 62.5 µs (default). 01 = 31.2 µs. 10 = 15.6 µs. 11 = 7.8 µs. Rev. 0 | Page 44 of 60 Bit 1 Bit 0 DVS1_INTVAL[1:0] Data Sheet ADP5050 REGISTER 6: OPT_CFG (FPWM/PSM MODE AND OUTPUT DISCHARGE FUNCTION CONFIGURATION), ADDRESS 0x06 Register 6 is used to configure the operational mode and the discharge switch setting for Channel 1 to Channel 4. The PSMx_ON bit setting for each channel is in effect when the SYNC/MODE pin is high (or when SYNC/MODE is configured as a clock input or output). When the SYNC/MODE pin is low, all channels are forced to work in automatic PWM/PSM mode, and the PSMx_ON settings in this register are ignored. The default value for the output discharge function can be programmed by factory fuse (output discharge function enabled or disabled for all four buck regulators). Table 29. Register 6 Bit Assignments Bit 7 DSCG4_ON Bit 6 DSCG3_ON Bit 5 DSCG2_ON Bit 4 DSCG1_ON Bit 3 PSM4_ON Bit 2 PSM3_ON Table 30. OPT_CFG Register, Bit Function Descriptions Bits 7 Bit Name DSCG4_ON Access R/W 6 DSCG3_ON R/W 5 DSCG2_ON R/W 4 DSCG1_ON R/W 3 PSM4_ON R/W 2 PSM3_ON R/W 1 PSM2_ON R/W 0 PSM1_ON R/W Description The default value is programmed by factory fuse. 0 = disable output discharge function for Channel 4. 1 = enable output discharge function for Channel 4. The default value is programmed by factory fuse. 0 = disable output discharge function for Channel 3. 1 = enable output discharge function for Channel 3. The default value is programmed by factory fuse. 0 = disable output discharge function for Channel 2. 1 = enable output discharge function for Channel 2. The default value is programmed by factory fuse. 0 = disable output discharge function for Channel 1. 1 = enable output discharge function for Channel 1. This bit is ignored when the SYNC/MODE pin is low. 0 = enable forced PWM mode for Channel 4 (default). 1 = enable automatic PWM/PSM mode for Channel 4. This bit is ignored when the SYNC/MODE pin is low. 0 = enable forced PWM mode for Channel 3 (default). 1 = enable automatic PWM/PSM mode for Channel 3. This bit is ignored when the SYNC/MODE pin is low. 0 = enable forced PWM mode for Channel 2 (default). 1 = enable automatic PWM/PSM mode for Channel 2. This bit is ignored when the SYNC/MODE pin is low. 0 = enable forced PWM mode for Channel 1 (default). 1 = enable automatic PWM/PSM mode for Channel 1. Rev. 0 | Page 45 of 60 Bit 1 PSM2_ON Bit 0 PSM1_ON ADP5050 Data Sheet REGISTER 7: LCH_CFG (SHORT-CIRCUIT LATCH-OFF AND OVERVOLTAGE LATCH-OFF CONFIGURATION), ADDRESS 0x07 Register 7 is used to enable and disable the latch-off function for short-circuit protection (SCP) and overvoltage protection (OVP). When the SCP or OVP latch-off function is enabled, the CHx_LCH bit in Register 12 is set after an error condition occurs (see the Latch-Off Protection section). The default value for the SCP latch-off and OVP latch-off functions can be programmed by factory fuse (SCP or OVP latch-off function enabled or disabled for all four buck regulators). Table 31. Register 7 Bit Assignments Bit 7 OVP4_ON Bit 6 OVP3_ON Bit 5 OVP2_ON Bit 4 OVP1_ON Bit 3 SCP4_ON Bit 2 SCP3_ON Table 32. LCH_CFG Register, Bit Function Descriptions Bits 7 Bit Name OVP4_ON Access R/W 6 OVP3_ON R/W 5 OVP2_ON R/W 4 OVP1_ON R/W 3 SCP4_ON R/W 2 SCP3_ON R/W 1 SCP2_ON R/W 0 SCP1_ON R/W Description The default value is programmed by factory fuse. 0 = disable the OVP latch-off function for Channel 4. 1 = enable the OVP latch-off function for Channel 4. The default value is programmed by factory fuse. 0 = disable the OVP latch-off function for Channel 3. 1 = enable the OVP latch-off function for Channel 3. The default value is programmed by factory fuse. 0 = disable the OVP latch-off function for Channel 2. 1 = enable the OVP latch-off function for Channel 2. The default value is programmed by factory fuse. 0 = disable the OVP latch-off function for Channel 1. 1 = enable the OVP latch-off function for Channel 1. The default value is programmed by factory fuse. 0 = disable the SCP latch-off function for Channel 4. 1 = enable the SCP latch-off function for Channel 4. The default value is programmed by factory fuse. 0 = disable the SCP latch-off function for Channel 3. 1 = enable the SCP latch-off function for Channel 3. The default value is programmed by factory fuse. 0 = disable the SCP latch-off function for Channel 2. 1 = enable the SCP latch-off function for Channel 2. The default value is programmed by factory fuse. 0 = disable the SCP latch-off function for Channel 1. 1 = enable the SCP latch-off function for Channel 1. Rev. 0 | Page 46 of 60 Bit 1 SCP2_ON Bit 0 SCP1_ON Data Sheet ADP5050 REGISTER 8: SW_CFG (SWITCHING FREQUENCY AND PHASE SHIFT CONFIGURATION), ADDRESS 0x08 Register 8 is used to configure the switching frequency for Channel 1 and Channel 3 and to configure the phase shift for Channel 2, Channel 3, and Channel 4 with respect to Channel 1 (0˚). The default values for the Channel 1 and Channel 3 switching frequencies can be programmed by factory fuse. Table 33. Register 8 Bit Assignments Bit 7 FREQ3 Bit 6 FREQ1 Bit 5 Bit 4 PHASE4[1:0] Bit 3 Bit 2 PHASE3[1:0] Bit 1 Bit 0 PHASE2[1:0] Table 34. SW_CFG Register, Bit Function Descriptions Bits 7 Bit Name FREQ3 Access R/W 6 FREQ1 R/W [5:4] PHASE4[1:0] R/W [3:2] PHASE3[1:0] R/W [1:0] PHASE2[1:0] R/W Description The default value can be programmed by factory fuse. 0 = switching frequency for Channel 3 is the same as the master frequency set by the RT pin. 1 = switching frequency for Channel 3 is half the master frequency set by the RT pin. The default value can be programmed by factory fuse. 0 = switching frequency for Channel 1 is the same as the master frequency set by the RT pin. 1 = switching frequency for Channel 1 is half the master frequency set by the RT pin. These bits configure the phase shift for Channel 4 with respect to Channel 1 (0°). 00 = 0° phase shift. 01 = 90° phase shift. 10 = 180° phase shift (default). 11 = 270° phase shift. These bits configure the phase shift for Channel 3 with respect to Channel 1 (0°). 00 = 0° phase shift (default). 01 = 90° phase shift. 10 = 180° phase shift. 11 = 270° phase shift. These bits configure the phase shift for Channel 2 with respect to Channel 1 (0°). 00 = 0° phase shift. 01 = 90° phase shift. 10 = 180° phase shift (default). 11 = 270° phase shift. Rev. 0 | Page 47 of 60 ADP5050 Data Sheet REGISTER 9: TH_CFG (TEMPERATURE WARNING AND LOW VIN WARNING THRESHOLD CONFIGURATION), ADDRESS 0x09 Register 9 is used to configure the junction temperature overheat detection threshold and the low input voltage detection threshold. When these thresholds are enabled, the TEMP_INT and LVIN_INT status bits in Register 14 are set if the thresholds are exceeded. Table 35. Register 9 Bit Assignments Bit 7 Bit 6 Reserved Bit 5 Bit 4 TEMP_TH[1:0] Bit 3 Bit 2 Bit 1 LVIN_TH[3:0] Table 36. TH_CFG Register, Bit Function Descriptions Bits [7:6] [5:4] Bit Name Reserved TEMP_TH[1:0] Access R/W R/W [3:0] LVIN_TH[3:0] R/W Description Reserved. These bits set the junction temperature overheat threshold. 00 = temperature warning function disabled (default). 01 = 105°C. 10 = 115°C. 11 = 125°C. These bits set the low input voltage detection threshold. 0000 = 4.2 V (default). 0001 = 4.7 V. 0010 = 5.2 V. 0011 = 5.7 V. 0100 = 6.2 V. 0101 = 6.7 V. 0110 = 7.2 V. 0111 = 7.7 V. 1000 = 8.2 V. 1001 = 8.7 V. 1010 = 9.2 V. 1011 = 9.7 V. 1100 = 10.2 V. 1101 = 10.7 V. 1110 = 11.2 V. 1111 = low input voltage warning function disabled. Rev. 0 | Page 48 of 60 Bit 0 Data Sheet ADP5050 REGISTER 10: HICCUP_CFG (HICCUP CONFIGURATION), ADDRESS 0x0A Register 10 is used to configure the SYNC/MODE pin as a synchronization input or output and to configure hiccup protection for each channel. The default value for hiccup protection can be programmed by factory fuse (hiccup function enabled or disabled for all four buck regulators). Table 37. Register 10 Bit Assignments Bit 7 SYNC_OUT Bit 6 Bit 5 Reserved Bit 4 Bit 3 HICCUP4_OFF Bit 2 HICCUP3_OFF Bit 1 HICCUP2_OFF Bit 0 HICCUP1_OFF Table 38. HICCUP_CFG Register, Bit Function Descriptions Bits 7 Bit Name SYNC_OUT Access R/W [6:4] 3 Reserved HICCUP4_OFF R/W R/W 2 HICCUP3_OFF R/W 1 HICCUP2_OFF R/W 0 HICCUP1_OFF R/W Description The default value can be programmed by factory fuse. 0 = configure the SYNC/MODE pin as a clock synchronization input if a clock is connected (default). 1 = configure the SYNC/MODE pin as a clock synchronization output. Reserved. The default value can be programmed by factory fuse. 0 = enable hiccup protection for Channel 4. 1 = disable hiccup protection for Channel 4 (short-circuit protection is disabled automatically). The default value can be programmed by factory fuse. 0 = enable hiccup protection for Channel 3. 1 = disable hiccup protection for Channel 3 (short-circuit protection is disabled automatically). The default value can be programmed by factory fuse. 0 = enable hiccup protection for Channel 2. 1 = disable hiccup protection for Channel 2 (short-circuit protection is disabled automatically). The default value can be programmed by factory fuse. 0 = enable hiccup protection for Channel 1. 1 = disable hiccup protection for Channel 1 (short-circuit protection is disabled automatically). Rev. 0 | Page 49 of 60 ADP5050 Data Sheet REGISTER 11: PWRGD_MASK (CHANNEL MASK CONFIGURATION FOR PWRGD PIN), ADDRESS 0x0B Register 11 is used to mask or unmask the power-good status of Channel 1 to Channel 4; when unmasked, a power-good failure on any of these channels triggers the PWRGD pin. The output of the PWRGD pin represents the logical AND of all unmasked PWRGD signals; that is, the PWRGD pin is pulled low by any PWRGD signal failure. There is a 1 ms validation delay time before the PWRGD pin goes high. The default value for the power-good mask configuration can be programmed by factory fuse (mask function enabled or disabled for all four buck regulators). Table 39. Register 11 Bit Assignments Bit 7 Bit 6 Bit 5 Reserved Bit 4 Bit 3 MASK_CH4 Bit 2 MASK_CH3 Table 40. PWRGD_MASK Register, Bit Function Descriptions Bits [7:4] 3 Bit Name Reserved MASK_CH4 Access R/W R/W 2 MASK_CH3 R/W 1 MASK_CH2 R/W 0 MASK_CH1 R/W Description Reserved. The default value can be programmed by factory fuse. 0 = mask power-good status of Channel 4. 1 = output power-good status of Channel 4 to the PWRGD pin. The default value can be programmed by factory fuse. 0 = mask power-good status of Channel 3. 1 = output power-good status of Channel 3 to the PWRGD pin. The default value can be programmed by factory fuse. 0 = mask power-good status of Channel 2. 1 = output power-good status of Channel 2 to the PWRGD pin. The default value can be programmed by factory fuse. 0 = mask power-good status of Channel 1. 1 = output power-good status of Channel 1 to the PWRGD pin. Rev. 0 | Page 50 of 60 Bit 1 MASK_CH2 Bit 0 MASK_CH1 Data Sheet ADP5050 REGISTER 12: LCH_STATUS (LATCH-OFF STATUS READBACK), ADDRESS 0x0C Register 12 contains latched fault flags for thermal shutdown and channel latch-off caused by an OVP or SCP condition. Latched flags are not reset when the fault disappears but are cleared only when a 1 is written to the appropriate bit (provided that the fault no longer persists). Table 41. Register 12 Bit Assignments Bit 7 Bit 6 Reserved Bit 5 Bit 4 TSD_LCH Bit 3 CH4_LCH Bit 2 CH3_LCH Bit 1 CH2_LCH Bit 0 CH1_LCH Table 42. LCH_STATUS Register, Bit Function Descriptions Bits [7:5] 4 Bit Name Reserved TSD_LCH Access R/W Read/ self-clear 3 CH4_LCH Read/ self-clear 2 CH3_LCH Read/ self-clear 1 CH2_LCH Read/ self-clear 0 CH1_LCH Read/ self-clear Description Reserved. 0 = no thermal shutdown has occurred. 1 = thermal shutdown has occurred. 0 = no short-circuit or overvoltage latch-off has occurred on Channel 4. 1 = short-circuit or overvoltage latch-off has occurred on Channel 4. 0 = no short-circuit or overvoltage latch-off has occurred on Channel 3. 1 = short-circuit or overvoltage latch-off has occurred on Channel 3. 0 = no short-circuit or overvoltage latch-off has occurred on Channel 2. 1 = short-circuit or overvoltage latch-off has occurred on Channel 2. 0 = no short-circuit or overvoltage latch-off has occurred on Channel 1. 1 = short-circuit or overvoltage latch-off has occurred on Channel 1. REGISTER 13: STATUS_RD (STATUS READBACK), ADDRESS 0x0D The read-only Register 13 indicates the real-time status of the power-good signals for Channel 1 to Channel 4. Table 43. Register 13 Bit Assignments Bit 7 Bit 6 Bit 5 Reserved Bit 4 Bit 3 PWRG4 Bit 2 PWRG3 Table 44. STATUS_RD Register, Bit Function Descriptions Bits [7:4] 3 Bit Name Reserved PWRG4 Access R R 2 PWRG3 R 1 PWRG2 R 0 PWRG1 R Description Reserved. 0 = Channel 4 power-good status is low (default). 1 = Channel 4 power-good status is high. 0 = Channel 3 power-good status is low (default). 1 = Channel 3 power-good status is high. 0 = Channel 2 power-good status is low (default). 1 = Channel 2 power-good status is high. 0 = Channel 1 power-good status is low (default). 1 = Channel 1 power-good status is high. Rev. 0 | Page 51 of 60 Bit 1 PWRG2 Bit 0 PWRG1 ADP5050 Data Sheet REGISTER 14: INT_STATUS (INTERRUPT STATUS READBACK), ADDRESS 0x0E Register 14 contains the interrupt status for the following events: junction temperature overheat warning, low input voltage warning, and power-good signal failure on Channel 1 to Channel 4. When any of these unmasked events occur, the nINT pin is pulled low to indicate a fault condition. (Masking of these events is configured in Register 15.) To determine the cause of the fault, read this register. Latched flags are not reset when the fault disappears but are cleared only when a 1 is written to the appropriate bit or when all ENx pins = 0. Table 45. Register 14 Bit Assignments Bit 7 Bit 6 Reserved Bit 5 TEMP_INT Bit 4 LVIN_INT Bit 3 PWRG4_INT Bit 2 PWRG3_INT Bit 1 PWRG2_INT Bit 0 PWRG1_INT Table 46. INT_STATUS Register, Bit Function Descriptions Bits [7:6] 5 Bit Name Reserved TEMP_INT Access R/W Read/ self-clear 4 LVIN_INT Read/ self-clear 3 PWRG4_INT Read/ self-clear 2 PWRG3_INT Read/ self-clear 1 PWRG2_INT Read/ self-clear 0 PWRG1_INT Read/ self-clear Description Reserved. This bit indicates whether the junction temperature threshold has been exceeded. 0 = junction temperature has not exceeded the threshold. 1 = junction temperature has exceeded the threshold. This bit indicates whether the low voltage input threshold has been exceeded. 0 = low voltage input has not fallen below the threshold. 1 = low voltage input has fallen below the threshold. The power-good interrupt is masked when the part is initialized and during a normal shutdown. 0 = no power-good failure has been detected on Channel 4. 1 = power-good failure has been detected on Channel 4. The power-good interrupt is masked when the part is initialized and during a normal shutdown. 0 = no power-good failure has been detected on Channel 3. 1 = power-good failure has been detected on Channel 3. The power-good interrupt is masked when the part is initialized and during a normal shutdown. 0 = no power-good failure has been detected on Channel 2. 1 = power-good failure has been detected on Channel 2. The power-good interrupt is masked when the part is initialized and during a normal shutdown. 0 = no power-good failure has been detected on Channel 1. 1 = power-good failure has been detected on Channel 1. Rev. 0 | Page 52 of 60 Data Sheet ADP5050 REGISTER 15: INT_MASK (INTERRUPT MASK CONFIGURATION), ADDRESS 0x0F Register 15 is used to mask or unmask various warnings for use by the interrupt (nINT) pin. When any bit in this register is masked, the associated event does not trigger the nINT pin. Table 47. Register 15 Bit Assignments Bit 7 Bit 6 Reserved Bit 5 MASK_TEMP Bit 4 MASK_LVIN Bit 3 MASK_PWRG4 Bit 2 MASK_PWRG3 Bit 1 MASK_PWRG2 Bit 0 MASK_PWRG1 Table 48. INT_MASK Register, Bit Function Descriptions Bits [7:6] 5 Bit Name Reserved MASK_TEMP Access R/W R/W 4 MASK_LVIN R/W 3 MASK_PWRG4 R/W 2 MASK_PWRG3 R/W 1 MASK_PWRG2 R/W 0 MASK_PWRG1 R/W Description Reserved. 0 = temperature overheat warning does not trigger the interrupt pin (default). 1 = temperature overheat warning triggers the interrupt pin. 0 = low voltage input warning does not trigger the interrupt pin (default). 1 = low voltage input warning triggers the interrupt pin. 0 = power-good warning on Channel 4 does not trigger the interrupt pin (default). 1 = power-good warning on Channel 4 triggers the interrupt pin. 0 = power-good warning on Channel 3 does not trigger the interrupt pin (default). 1 = power-good warning on Channel 3 triggers the interrupt pin. 0 = power-good warning on Channel 2 does not trigger the interrupt pin (default). 1 = power-good warning on Channel 2 triggers the interrupt pin. 0 = power-good warning on Channel 1 does not trigger the interrupt pin (default). 1 = power-good warning on Channel 1 triggers the interrupt pin. REGISTER 17: DEFAULT_SET (DEFAULT RESET), ADDRESS 0x11 The write-only Register 17 is used to reset all registers to their default values. Table 49. Register 17 Bit Assignments Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 DEFAULT_SET[7:0] Bit 2 Bit 1 Table 50. DEFAULT_SET Register, Bit Function Descriptions Bits [7:0] Bit Name DEFAULT_SET[7:0] Access W Description To reset all registers to their default values, write 0x7F to this register. Rev. 0 | Page 53 of 60 Bit 0 ADP5050 Data Sheet FACTORY PROGRAMMABLE OPTIONS Table 51 through Table 64 list the options that can be programmed into the ADP5050 when it is ordered from Analog Devices. For a list of the default options, see Table 65. To order a device with options other than the default options, contact your local Analog Devices sales or distribution representative. Table 51. Output Voltage Options for Channel 1 (Fixed Output Options: 0.85 V to 1.6 V in 25 mV Increments) Option Option 0 Option 1 Option 2 … Option 30 Option 31 Description 0.8 V adjustable output (default) 0.85 V fixed output 0.875 V fixed output … 1.575 V fixed output 1.6 V fixed output Table 52. Output Voltage Options for Channel 2 (Fixed Output Options: 3.3 V to 5.0 V in 300 mV/200 mV Increments) Option Option 0 Option 1 Option 2 Option 3 Option 4 Option 5 Option 6 Option 7 Description 0.8 V adjustable output (default) 3.3 V fixed output 3.6 V fixed output 3.9 V fixed output 4.2 V fixed output 4.5 V fixed output 4.8 V fixed output 5.0 V fixed output Table 53. Output Voltage Options for Channel 3 (Fixed Output Options: 1.2 V to 1.8 V in 100 mV Increments) Option Option 0 Option 1 Option 2 Option 3 Option 4 Option 5 Option 6 Option 7 Description 0.8 V adjustable output (default) 1.2 V fixed output 1.3 V fixed output 1.4 V fixed output 1.5 V fixed output 1.6 V fixed output 1.7 V fixed output 1.8 V fixed output Table 54. Output Voltage Options for Channel 4 (Fixed Output Options: 2.5 V to 5.5 V in 100 mV Increments) Option Option 0 Option 1 Option 2 … Option 30 Option 31 Description 0.8 V adjustable output (default) 2.5 V fixed output 2.6 V fixed output … 5.4 V fixed output 5.5 V fixed output Table 55. Pin 20—PWRGD/A0 Pin Options Option Option 0 Option 1 Description PWRGD pin for power-good output (default) A0 pin for I2C address setting Rev. 0 | Page 54 of 60 Data Sheet ADP5050 Table 56. PWRGD Output Options Option Option 0 Option 1 Option 2 Option 3 Option 4 Option 5 Option 6 Option 7 Option 8 Option 9 Option 10 Option 11 Option 12 Option 13 Option 14 Option 15 Description No monitoring of any channel Monitor Channel 1 output (default) Monitor Channel 2 output Monitor Channel 1 and Channel 2 outputs Monitor Channel 3 output Monitor Channel 1 and Channel 3 outputs Monitor Channel 2 and Channel 3 outputs Monitor Channel 1, Channel 2, and Channel 3 outputs Monitor Channel 4 output Monitor Channel 1 and Channel 4 outputs Monitor Channel 2 and Channel 4 outputs Monitor Channel 1, Channel 2, and Channel 4 outputs Monitor Channel 3 and Channel 4 outputs Monitor Channel 1, Channel 3, and Channel 4 outputs Monitor Channel 2, Channel 3, and Channel 4 outputs Monitor Channel 1, Channel 2, Channel 3, and Channel 4 outputs Table 57. Output Discharge Functionality Options Option Option 0 Option 1 Description Output discharge function disabled for all four buck regulators Output discharge function enabled for all four buck regulators (default) Table 58. Switching Frequency Options for Channel 1 Option Option 0 Option 1 Description 1 × switching frequency set by the RT pin (default) ½ × switching frequency set by the RT pin Table 59. Switching Frequency Options for Channel 3 Option Option 0 Option 1 Description 1 × switching frequency set by the RT pin (default) ½ × switching frequency set by the RT pin Table 60. Pin 43—SYNC/MODE Pin Options Option Option 0 Option 1 Description Forced PWM/automatic PWM/PSM mode setting with the ability to synchronize to an external clock (default) Generate a clock signal equal to the master frequency set by the RT pin Table 61. Hiccup Protection Options for the Four Buck Regulators Option Option 0 Option 1 Description Hiccup protection enabled for overcurrent events (default) Hiccup protection disabled; frequency foldback protection only for overcurrent events Table 62. Short-Circuit Latch-Off Options for the Four Buck Regulators Option Option 0 Option 1 Description Latch-off function disabled for output short-circuit events (default) Latch-off function enabled for output short-circuit events Rev. 0 | Page 55 of 60 ADP5050 Data Sheet Table 63. Overvoltage Latch-Off Options for the Four Buck Regulators Option Option 0 Option 1 Description Latch-off function disabled for output overvoltage events (default) Latch-off function enabled for output overvoltage events Table 64. I2C Address Options Option Option 0 Option 1 Option 2 Option 3 Description 0x48 (default) 0x58 0x68 0x78 FACTORY DEFAULT OPTIONS Table 65 lists the factory default options programmed into the ADP5050 when the device is ordered (see the Ordering Guide). To order the device with options other than the default options, contact your local Analog Devices sales or distribution representative. Table 51 through Table 64 list all available options for the device. Table 65. Factory Default Options Option Channel 1 output voltage Channel 2 output voltage Channel 3 output voltage Channel 4 output voltage PWRGD pin (Pin 20) function PWRGD pin (Pin 20) output Output discharge function Switching frequency on Channel 1 Switching frequency on Channel 3 SYNC/MODE pin (Pin 43) function Hiccup protection Short-circuit latch-off function Overvoltage latch-off function I2C address Default Value 0.8 V adjustable output 0.8 V adjustable output 0.8 V adjustable output 0.8 V adjustable output PWRGD pin for power-good output Monitor Channel 1 output Enabled for all four buck regulators 1 × switching frequency set by the RT pin 1 × switching frequency set by the RT pin Forced PWM/automatic PWM/PSM mode setting with the ability to synchronize to an external clock Enabled for overcurrent events Disabled for output short-circuit events Disabled for output overvoltage events 0x48 Rev. 0 | Page 56 of 60 Data Sheet ADP5050 OUTLINE DIMENSIONS 0.30 0.25 0.20 PIN 1 INDICATOR 37 36 48 1 0.50 BSC TOP VIEW 0.80 0.75 0.70 0.50 0.40 0.30 5.60 SQ 5.55 13 BOTTOM VIEW 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.203 REF SEATING PLANE *5.65 EXPOSED PAD 24 PIN 1 INDICATOR 0.20 MIN FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. *COMPLIANT TO JEDEC STANDARDS MO-220-WKKD-2 WITH THE EXCEPTION OF THE EXPOSED PAD DIMENSION. 04-26-2013-C 7.10 7.00 SQ 6.90 Figure 69. 48-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 7 mm × 7 mm Body, Very Very Thin Quad (CP-48-13) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADP5050ACPZ-R7 ADP5050-EVALZ 1 2 Temperature Range −40°C to +125°C Package Description 48-Lead Lead Frame Chip Scale Package [LFCSP_WQ] Evaluation Board Package Option 2 CP-48-13 Z = RoHS Compliant Part. Table 65 lists the factory default options for the device. For a list of factory programmable options, see the Factory Programmable Options section. To order a device with options other than the default options, contact your local Analog Devices sales or distribution representative. Rev. 0 | Page 57 of 60 ADP5050 Data Sheet NOTES Rev. 0 | Page 58 of 60 Data Sheet ADP5050 NOTES Rev. 0 | Page 59 of 60 ADP5050 Data Sheet NOTES I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors). ©2013 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10899-0-5/13(0) Rev. 0 | Page 60 of 60