Omnidirectional Microphone with Bottom Port and Analog Output ADMP401-1 Preliminary Technical Data FEATURES GENERAL DESCRIPTION 4.72 mm × 3.76 mm × 1.0 mm surface mount package High SNR: 62 dBA High sensitivity: −37 dBV Flat frequency response from 100 Hz to over 12 kHz Low current consumption: <200 μA Single-ended analog output High PSRR: >50 dB Compatible with Sn/Pb and Pb-free solder processes RoHS/WEEE compliant The ADMP401-1 is a high quality, low cost, low power analog output bottom-ported omnidirectional MEMS microphone. The ADMP401-1 consists of a MEMS microphone element and an output amplifier. The ADMP401-1 has a high SNR and high sensitivity, making it an excellent choice for far field applications. The ADMP401-1 has a flat wideband frequency response resulting in natural sound with high intelligibility. Low current consumption enables long battery life for portable applications. A built-in particle filter provides for high reliability. The ADMP401-1 is available in a thin 4.72 mm × 3.76 mm × 1.0 mm surface mount package. The ADMP401-1 is reflow solder compatible with no sensitivity degradation. APPLICATIONS Cell phones PC audio Digital cameras Bluetooth headsets FUNCTIONAL BLOCK DIAGRAM MEMS – ASIC OUTPUT DRIVER OUTPUT + BUFFER MEMS SIGNAL VDD GND MEMBRANE BACKPLATE REFERENCE VOLTAGE BIAS CURRENT MEMS VBIAS CHARGE PUMP GENERATOR 07712-001 FILTER Figure 1. Rev. PrB Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2008 Analog Devices, Inc. All rights reserved. ADMP401-1 Preliminary Technical Data TABLE OF CONTENTS Features .............................................................................................. 1 Typical Performance Characteristics ..............................................6 Applications ....................................................................................... 1 Handling Instructions .......................................................................7 General Description ......................................................................... 1 Pick-and-Place Equipment ..........................................................7 Functional Block Diagram .............................................................. 1 Reflow Solder .................................................................................7 Specifications..................................................................................... 3 Board Wash ....................................................................................7 Absolute Maximum Ratings............................................................ 4 Outline Dimensions ..........................................................................8 ESD Caution .................................................................................. 4 Ordering Guide .............................................................................8 Pin Configuration and Function Descriptions ............................. 5 Rev. PrB | Page 2 of 8 Preliminary Technical Data ADMP401-1 SPECIFICATIONS TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not guaranteed. Table 1. Parameter PERFORMANCE Directionality Sensitivity Signal-to-Noise Ratio Equivalent Input Noise Frequency Response Total Harmonic Distortion Power Supply Rejection Ratio Maximum Acoustic Input POWER SUPPLY Supply Voltage Supply Current OUTPUT CHARACTERISTICS Output Impedance Polarity 1 Symbol Test Conditions/Comments Min 1 kHz, 94 dB SPL −40 60 100 Hz to 10 kHz 100 Hz to 12 kHz 105 dB SPL 217 Hz, 100 mV p-p square wave superimposed on VDD = 1.8 V Peak −2 −3 SNR EIN THD PSRR VDD IS Typ Omni −37 62 32 0 0 Rev. PrB | Page 3 of 8 −34 dBV dBA dBA SPL dB dB % dB +2 +2 3 120 dB SPL 3.6 200 200 Noninverting 1 Positive going (increasing) pressure on the membrane results in a positive going (increasing) output voltage. Unit 50 1.5 ZOUT Max V μA Ω ADMP401-1 Preliminary Technical Data ABSOLUTE MAXIMUM RATINGS ESD CAUTION Table 2. Parameter Supply Voltage Sound Pressure Level (SPL) Mechanical Shock Vibration Temperature Range Rating 3.6 V 160 dB 20,000 g Per MIL-STD-883G −40°C to +85°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CRITICAL ZONE TL TO TP tP TP tL TSMAX TSMIN tS RAMP-DOWN PREHEAT 07712-002 TEMPERATURE RAMP-UP TL t25°C TO PEAK TIME Figure 2. Recommended Soldering Profile Table 3. Recommended Soldering Profile Profile Feature Average Ramp Rate (TL to TP) Preheat Minimum Temperature (TSMIN) Maximum Temperature (TSMAX) Time (TSMIN to TSMAX), tS Ramp-Up Rate (TSMAX to TL) Time Maintained Above Liquidous (tL) Liquidous Temperature (TL) Peak Temperature (TP) Time Within 5°C of Actual Peak Temperature (tP) Ramp-Down Rate Time 25°C to Peak Temperature Sn63/Pb37 3°C/sec max Pb-Free 3°C/sec max 100°C 150°C 60 sec to 120 sec 3°C/sec 60 sec to 150 sec 183°C 240°C + 0°C/−5°C 10 sec to 30 sec 6°C/sec max 6 minute max 150°C 200°C 60 sec to 120 sec 3°C/sec 60 sec to 150 sec 217°C 260°C + 0°C/−5°C 20 sec to 40 sec 6°C/sec max 8 minute max Rev. PrB | Page 4 of 8 Preliminary Technical Data ADMP401-1 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTPUT GND 2 1 GND 3 GND 6 VDD 4 5 BOTTOM VIEW (TERMINAL SIDE DOWN) Not to Scale 007712-003 GND Figure 3. Pin Configuration (Bottom View) Table 4. Pin Function Descriptions Pin No. 1 2 3 4 5 6 Mnemonic OUTPUT GND GND GND VDD GND Description Analog Output Signal. Ground. Ground. Ground. Power Supply. Ground. Rev. PrB | Page 5 of 8 ADMP401-1 Preliminary Technical Data TYPICAL PERFORMANCE CHARACTERISTICS 0 10 100mV p-p SINE WAVE SUPERIMPOSED ON VDD = 3.0V 8 –10 6 –20 PSRR (dB) 2 0 –2 –30 –40 –4 –6 –50 –10 100 1k FREQUENCY (Hz) 10k –60 10 Figure 4. Typical Frequency Response 100 1k FREQUENCY (Hz) 10k Figure 5. Typical Power Supply Rejection Ratio vs. Frequency Rev. PrB | Page 6 of 8 07712-005 –8 07712-004 SENSITIVITY (dB) 4 Preliminary Technical Data ADMP401-1 HANDLING INSTRUCTIONS PICK-AND-PLACE EQUIPMENT REFLOW SOLDER The MEMS microphone can be handled using standard pickand-place and chip shooting equipment. Care should be taken to avoid damage to the MEMS microphone structure as follows: Standard reflow solder conditions specified in Figure 2 can be used to attach the MEMS microphone to the PCB. • When washing the PCB, ensure that water does not make contact with the microphone port. Blow-off procedures and ultrasonic cleaning must not be used. • • • Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. Use care during pick-and-place to ensure that no high shock events above 20 kg are experienced, because such events may cause damage to the microphone. Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. Do not pull air out or blow air into the microphone port. Do not use excessive force to place the microphone on the PCB. BOARD WASH Rev. PrB | Page 7 of 8 ADMP401-1 Preliminary Technical Data OUTLINE DIMENSIONS 4.82 4.72 4.62 REFERENCE CORNER 3.30 2.62 0.90 DIA. (PINS 1, 5, 6) 3.86 3.76 3.66 0.79 1 2 1.68 DIA. 3 2.40 REFERENCE CORNER 2.54 1.02 DIA. 6 1.20 4 5 1.27 0.50 DIA. (THRU HOLE) 0.15 0.68 TOP VIEW 0.61 0.70 DIA. (PINS 2, 4) BOTTOM VIEW 0.82 0.76 0.70 1.10 1.00 0.90 SIDE VIEW 092908-A 0.24 NOM Figure 6. 6-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] 4.72 mm × 3.76 mm Body (CE-6-1) Dimensions shown in millimeters 2 4.00 12.30 12.00 11.70 1.60 MAX 1.50 NOM 8.00 A 1 0.35 0.30 0.25 1.85 1.75 1.65 0.20 MAX 3.20 5.55 5.50 5.45 4.80 1.50 MIN DIA 2.20 3.80 A DETAIL A NOTES: 1. 10 SPROCKET HOLE PITCH CUMULATIVE TOLERANCE ± 0.20. 2. POCKET POSITION RELATIVE TO SPROCKET HOLE MEASURED AS TRUE POSITION OF POCKET, NOT POCKET HOLE. 2 1.60 0.25 1.30 REF SECTION A-A 0.25 0.50 R DETAIL A 062408-A 2.05 2.00 1.95 Figure 7. LGA_CAV Tape and Reel Outline Dimensions Dimensions shown in millimeters ORDERING GUIDE Model ADMP401-1ACEZ-RL 1 ADMP401-1ACEZ-RL71 1 Temperature Range −40°C to +85°C −40°C to +85°C Package Description 6-Terminal LGA_CAV, 13” Tape and Reel 6-Terminal LGA_CAV, 7” Tape and Reel Z = RoHS Compliant Part. ©2008 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. PR07712-0-10/08(PrB) Rev. PrB | Page 8 of 8 Package Option CE-6-1 CE-6-1 Ordering Quantity 4,000 1,000