SEMTECH RCLAMP0524P

RClamp0522P
RClamp0524P
Ultra Low Capacitance TVS Arrays

PRELIMINARY
PROTECTION PRODUCTS
PRODUCTS- RailClamp
PROTECTION
Features
Description
RailClamps are ultra low capacitance TVS arrays
designed to protect high speed data interfaces. This
series has been specifically designed to protect sensitive
components which are connected to high-speed data
and transmission lines from overvoltage caused by ESD
(electrostatic discharge), CDE (Cable Discharge Events),
and EFT (electrical fast transients).
The RClampTM0522P and RClampTM0524P have a
typical capacitance of only 0.30pF between I/O pins.
This allows it to be used on circuits operating in excess
of 3GHz without signal attenuation. They may be used to
meet the ESD immunity requirements of IEC 61000-4-2,
Level 4 (±15kV air, ±8kV contact discharge). The
RClamp0522P is designed to protect two lines, while the
RClamp0524P will protect four lines.
The RClamp0522P is in a 6-pin, RoHS/WEEE compliant,
SLP1610P4 package. It measures 1.6 x 1.0 x 0.58mm.
The RClamp0524P is in a 10-pin, RoHS/WEEE compliant,
SLP2510P8 package. It measures 2.5 x 1.0 x 0.58mm.
The leads are spaced at a pitch of 0.5mm and are finished
with lead-free NiPd. They are designed for easy PCB layout
by allowing the traces to run straight through the device.
The combination of small size, low capacitance, and high
level of ESD protection makes them a flexible solution for
applications such as HDMI, UDI, DisplayPortTM, MDDI, Serial
ATA, and Infiniband circuits.
ESD protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-5 (Lightning) 5A (8/20µs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Package design optimized for high speed lines
Flow-Through design
Protects two or four I/O lines
Low capacitance: 0.3pF typical (I/O to I/O)
Low clamping voltage
Low operating voltage: 5V
Solid-state silicon-avalanche technology
Mechanical Characteristics
SLP1610P4 6-pin package (1.6 x 1.0 x 0.58mm)
SLP2510P8 10-pin package (2.5 x 1.0 x 0.58mm)
RoHS/WEEE Compliant
Lead Pitch: 0.5mm
Lead finish: NiPd
Marking: Marking Code
Packaging: Tape and Reel per EIA 481
Applications
High Definition Multi-Media Interface (HDMI)
Digital Visual Interface (DVI)
Unified Display Interface (UDI)
DisplayPortTM Interface
MDDI Ports
PCI Express
Serial ATA
Circuit Diagram - RClamp0522P
Pin 1
Circuit Diagram - RClamp0524P
Pin 1
Pin 2
Pin 4
Pin 5
3, 8
3, 4
2-Line Protection
Revision 09/19/2006
Pin 2
4-Line Protection
1
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RClamp0522P
RClamp0524P
Ultra Low Capacitance TVS Arrays

PRELIMINARY
PROTECTION PRODUCTS
PRODUCTS- RailClamp
PROTECTION
Pin Identification and Configuration
RClamp0524P
RClamp0522P
6
5
4
1
2
3
10
9
8
7
6
1
2
3
4
5
Pin
Identification
Pin
Identification
1-2
Input Lines
1, 2, 4, 5
Input Lines
5-6
Output Lines
(No Internal Connection)
6, 7, 9, 10
Output Lines
(No Internal Connection)
3-4
Ground
3, 8
Ground
SLP2510P8 Pin Configuration (Top View)
SLP1610P4 Pin Configuration (Top View)
Pin 1
Pin 2
Pin 1
Pin 2
Pin 4
Pin 5
3, 8
3, 4
Circuit Diagram
Circuit Diagram
Ordering Information
Part Number
Number
of Lines
Qty per
Reel
Reel Size
RClamp0522P.TCT
2
3000
7 Inch
RClamp0524P.TCT
4
3000
7 Inch
Note: Lead finish is lead-free NiPd.
RailClamp and RClamp are marks of Semtech Corporation.
2
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RClamp0522P
RClamp0524P
PRELIMINARY
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20µs)
Ppk
150
Watts
Peak Pulse Current (tp = 8/20µs)
IPP
5
A
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
VESD
+/- 17
+/- 12
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Operating Temperature
Storage Temperature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Any I/O pin to ground
Reverse Breakdown Voltage
VBR
It = 1mA
Any I/O pin to ground
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
Any I/O pin to ground
1
µA
Clamping Voltage
VC
IPP = 1A, tp = 8/20µs
Any I/O pin to ground
15
V
Junction Capacitance
Cj
VR = 0V, f = 1MHz
Between I/O pins
0.4
pF
Junction Capacitance
Cj
VR = 0V, f = 1MHz
Any I/O pin to ground
0.8
pF
 2006 Semtech Corp.
3
Minimum
Typical
Maximum
Units
5
V
6
V
0.30
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RClamp0522P
RClamp0524P
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
110
10
% of Rated Power or IPP
Peak Pulse Power - PPP (kW)
100
1
0.1
90
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
100
0
1000
25
Pulse Waveform
125
150
40
Waveform
Parameters:
tr = 8µs
td = 20µs
90
80
70
e
60
35
Clamping Voltage -VC (V)
100
PP
100
Clamping Voltage vs. Peak Pulse Current
110
Percent of I
75
o
Pulse Duration - tp (us)
-t
50
40
td = IPP/2
30
20
10
30
Line to Line
25
20
Line to Gnd
15
Waveform
Parameters:
tr = 8µs
td = 20µs
10
5
0
0
5
10
15
20
25
0
30
0
Time (µs)
1
2
3
4
5
6
Peak Pulse Current - IPP (A)
Normalized Capacitance vs. Reverse Voltage
CJ(VR) / CJ(VR=0)
50
Ambient Temperature - TA ( C)
1.5
1.4
1.3
1.2
1.1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
ESD Clamping for +8kV pulse per IEC 61000-4-2
f = 1 MHz
0
1
 2006 Semtech Corp.
2
3
Reverse Voltage - VR (V)
4
5
4
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RClamp0522P
RClamp0524P
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics (Con’t)
Insertion Loss S21 - I/O to I/O
CH1 S21
LOG
Insertion Loss S21 - I/O to GND
6 dB / REF 0 dB
CH1 S21
LOG
6 dB / REF 0 dB
1: -0.076 dB
900 MHz
3
0 dB
1
2
1: -0.086 dB
900 MHz
2: -0.062 dB
1.8 GHz
3
0 dB
1
3: -0.1087 dB
2.5 GHz
-6 dB
-12 dB
-18 dB
-18 dB
-24 dB
-24 dB
-30 dB
-30 dB
-36 dB
-36 dB
-42 dB
-42 dB
-48 dB
1
MHz
START . 030 MHz
 2006 Semtech Corp.
10
MHz
100
MHz
-48 dB
3
1
GHz GHz
STOP 3000. 000000 MHz
1
MHz
START . 030 MHz
5
2: -0.0336 dB
1.8 GHz
3: -0.126 dB
2.5 GHz
-6 dB
-12 dB
2
10
MHz
100
MHz
3
1
GHz GHz
STOP 3000. 000000 MHz
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RClamp0522P
RClamp0524P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Design Recommendations for HDMI Protection
Adding external ESD protection to HDMI ports can be
challenging. First, ESD protection devices have an
inherent junction capacitance. However, adding even a
small amount of capacitance will cause the impedance
of the differential pair to drop. Second, large packages
and land pattern requirements cause discontinuities that
adversely affect signal integrity. The RClamp0524P and
RClamp0522P are specifically designed for protection
of high-speed interfaces such as HDMI. They present
<0.4pF capacitance between the pairs while being rated
to handle >±8kV ESD contact discharges (>±15kV air
discharge) as outlined in IEC 61000-4-2. Each device is
in a leadless SLP package that is less than 1.1mm wide.
They are designed such that the traces flow straight
through the device. The narrow package and flowthrough design reduces discontinuities and minimizes
impact on signal integrity. This becomes even more
critical as signal speeds increase.
HDMI Connector
12
11
10
1
GND
GND
9
8
7
6
5
4
1
GND
GND
3
2
1
Pin Configuration
Figure 1. Flow through Layout Using RClamp0524P
Figure 1 is an example of how to route the high speed
differential traces through the RClamp0524P. The solid
line represents the PCB trace. The PCB traces are used
to connect the pin pairs for each line (pin 1 to pin 10, pin
2 to pin 9, pin 4 to pin 7, pin 5 to pin 6). For example,
line 1 enters at pin 1 and exits at Pin 10 and the PCB
trace connects pin 1 and 10 together. This is true for
lines connected at pins 2, 4, and 5 also. Ground is
connected at pins 3 and 8. One large ground pad should
be used in lieu of two separate pads. The same layout
rules apply for the RClamp0522P.
TDR Measurements for HDMI
The combination of low capacitance, small package, and
flow-through design means it is possible to use these
devices to meet the HDMI impedance requirements of
100 Ohms ±15% without any PCB board modification.
Figures 2 and 3 show impedance test results for a TDR
risetime of 200ps and 100ps respectively, using a Semtech
evaluation board with 100 Ohm traces throughout.
Measurements were taken using a TDR method as outlined in the HDMI Compliance Test Specification (CTS).
In each case, the device meets the HDMI CTS require-
 2006 Semtech Corp.
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RClamp0522P
RClamp0524P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
ment of 100 Ohm ±15% with plenty of margin.
For signal integrity purposes, the best results will be
obtained by using the RClamp0524P to protect the highspeed differential pairs. This is because the
device is designed such that the data lines from the
connector line up with the I/O pins of the device without
altering the trace routing. Either the RClamp0522P or
RClamp0524P may be used to protect the remaining
lines (I2C, CEC, and hot plug) depending on layout constraints.
B
A
Layout Guidelines for Optimum ESD Protection
Good circuit board layout is critical not only for signal
integrity, but also for effective suppression of ESD
induced transients. For optimum ESD protection, the
following guidelines are recommended:
Place the device as close to the connector as
possible. This practice restricts ESD coupling into
adjacent traces and reduces parasitic inductance.
The ESD transient return path to ground should be
kept as short as possible. Whenever possible, use
multiple micro vias connected directly from the
device ground pad to the ground plane.
Avoid running critical signals near board edges.
Protecting MDDI Ports with RClamp0524P and
RClamp0522P
The small package size and low capacitance of the
RClamp0522P and RClamp0524P make them ideal
for high-speed lines in portable applications. One such
application is the protection of MDDI ports in cellular
phones. MDDI is a serial data interface operating
at 480Mb/s per line pair. The lines are scalable for
increased speed and display resolution. A MDDI
port protection example is shown in Figure 4. The
RClamp0524P is used to protect two differential line
pairs while an RClamp0522P is used to protect the
MDDI strobe lines. Note that devices are used on both
the main board and LCD side of the MDDI port. Devices
on the main board are needed to protect the MDDI
controller in the Baseband processor. Devices on the
LCD board are needed to protect MDDI controller in
the LCD module. A TVS such as the uClamp0501P is
used to protect the MDDI power line. The protection
devices should be placed close to the connector of each
board. Traces are routed directly through each device,
minimizing parasitic inductance. Connections to the
ground plane should be made with multiple micro vias
when possible.
 2006 Semtech Corp.
X-axis
Y-axis
A
1.905
101.0
B
2.081
107.0
(nsec)
(Ohm)
Figure 2 - TDR Measurement with 200ps risetime using Semtech Evaluation Board
B
A
X-axis
Y-axis
A
1.80
96
B
2.076
108.0
(nsec)
(Ohm)
Figure 3 - TDR Measurement with 100ps risetime using Semtech Evaluation Board
7
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RClamp0522P
RClamp0524P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
MDDI_Data0+
MDDI_Data0Gnd
MDDI Link
Controller
Gnd
MDDI_Data1+
MDDI Link
Controller
MDDI_Data1-
RClamp0524P
RClamp0524P
MDDI_Stb+
MDDI_StbGnd
Gnd
RClamp0522P
RClamp0522P
Hos t Pw r
HOST
Hos t Gnd
uClamp0501P
uClamp0501P
DISPLAY
Figure 4. MDDI Port Protection
 2006 Semtech Corp.
8
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RClamp0522P
RClamp0524P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information Spice Model
RClamp0522P Spice Model
RClamp0522P Spice Parameters
 2006 Semtech Corp.
Parameter
Unit
D1
D2 (LCRD)
D3 (TVS)
IS
Amp
1E-20
1E-20
2E-12
BV
Volt
100
100
9.36
VJ
Volt
0.7
0.7
0.6
RS
Ohm
0.458
1.0
2.6
IBV
Amp
1E-3
1E-3
1E-3
CJO
Farad
0.6E-12
0.6E-12
56E-12
TT
sec
2.541E-9
2.541E-9
2.541E-9
M
--
0.01
0.01
0.23
N
--
1.1
1.1
1.1
EG
eV
1.11
1.11
1.11
9
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RClamp0522P
RClamp0524P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information Spice Model
RClamp0524P Spice Model
RClamp0524P Spice Parameters
 2006 Semtech Corp.
Parameter
Unit
D1
D2 (LCRD)
D3 (TVS)
IS
Amp
1E-20
1E-20
2E-12
BV
Volt
100
100
9.36
VJ
Volt
0.7
0.7
0.6
RS
Ohm
0.458
1.0
2.6
IBV
Amp
1E-3
1E-3
1E-3
CJO
Farad
0.6E-12
0.6E-12
56E-12
TT
sec
2.541E-9
2.541E-9
2.541E-9
M
--
0.01
0.01
0.23
N
--
1.1
1.1
1.1
EG
eV
1.11
1.11
1.11
10
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RClamp0522P
RClamp0524P
PRELIMINARY
PROTECTION PRODUCTS
Outline Drawing
Drawing -- SLP1610P4
SO-8
Outline
A
D
B
DIM
E
PIN 1
INDICATOR
(LASER MARK)
A
SEATING
PLANE
aaa C
A2
b1xN
bbb
1
2
.020 .023 .026
0.00 .001 .002
(.005)
.006 .008 .010
.014 .016 .018
.059 .063 .067
.035 .039 .043
.020 BSC
.012 .015 .017
6
.003
.004
0.50 0.58 0.65
0.00 0.03 0.05
(0.13)
0.15 0.20 0.25
0.35 0.40 0.45
1.50 1.60 1.70
0.90 1.00 1.10
0.50 BSC
0.30 0.38 0.425
6
0.08
0.10
C
A1
bxN
C A B
bbb
A
A1
A2
b
b1
D
E
e
L
N
aaa
bbb
DIME NS IONS
INCHE S
MILLIME T E RS
MIN NOM MA X MIN NOM MA X
C A B
R0.125
E/2 LxN
N
2X R0.075
3 PLACES
e
D/2
NOT E S :
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP1610P4
P1
P
DIMENSIONS
DIM
C
G
P
P1
X
X1
Y
Y1
Z
Y
Z (C) G
(Y1)
X
X1
INCHES
(.034)
.008
.020
.039
.008
.016
.027
(.061)
.061
MILLIMET ERS
(0.875)
0.20
0.50
1.00
0.20
0.40
0.675
(1.55)
1.55
NOT ES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
 2006 Semtech Corp.
11
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RClamp0522P
RClamp0524P
PRELIMINARY
PROTECTION PRODUCTS
Outline Drawing
Drawing -- SLP2510P8
SO-8
Outline
A
D
B
DIM
E
PIN 1
INDICATOR
(LASER MARK)
A
SEATING
PLANE
aaa C
A2
R0.125
1
.020 .023 .026
0.00 .001 .002
(.005)
.006 .008 .010
.014 .016 .018
.094 .098 .102
.035 .039 .043
.020 BSC
.012 .015 .017
10
.003
.004
0.50 0.58 0.65
0.00 0.03 0.05
(0.13)
0.15 0.20 0.25
0.35 0.40 0.45
2.40 2.50 2.60
0.90 1.00 1.10
0.50 BSC
0.30 0.38 0.425
10
0.08
0.10
C
A1
b1xN
bbb
A
A1
A2
b
b1
D
E
e
L
N
aaa
bbb
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
C A B
2
E/2 LxN
2X R0.075
7 PLACES
N
bxN
e
bbb
D/2
C A B
NOTES:
1. CO NTRO LLING DIMENSIO NS ARE IN MILLIMETERS (ANG LES IN DEGREES).
2. CO PLANARITY APPLIES TO THE EXPO SED PAD AS W ELL AS THE TERMINALS.
Land Pattern - SLP2510P8
P1
P
DIMENSIONS
Y
Z (C)
(Y1)
G
X
X1
DIM
C
G
P
P1
X
X1
Y
Y1
Z
INCHES
(.034)
.008
.020
.039
.008
.016
.027
(.061)
.061
MILLIMET ERS
(0.875)
0.20
0.50
1.00
0.20
0.40
0.675
(1.55)
1.55
NOT ES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
 2006 Semtech Corp.
12
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RClamp0522P
RClamp0524P
PRELIMINARY
PROTECTION PRODUCTS
Marking Codes
RClamp0522P
RClamp0524P
0522P
PIN 1
INDICAT O R
0524P
PIN 1
IND ICATOR
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
Part Number
A0
B0
K0
RClamp0522P
1.12 +/-0.05 mm
1.30 +/-0.05 mm
0.76 +/-0.05 mm
RClamp0524P
1.23 +/-0.05 mm
2.70 +/-0.05 mm
0.70 +/-0.05 mm
Tape
Width
B, (Max)
D
8 mm
4.2 mm
1.5 + 0.1 mm
- 0.0 mm )
D1
E
0.5 mm
±0.05
1.750±.10
mm
F
K
(MAX)
P
P0
P2
T(MAX)
3.5±0.05
mm
2.4 mm
4.0±0.1
mm
4.0±0.1
mm
2.0±0.05
mm
0.4 mm
W
8.0 mm
+ 0.3 mm
- 0.1 mm
Contact Information for Semtech International AG
Taiwan Branch
Korea Branch
Shanghai Office
Tel: 886-2-2748-3380
Fax: 886-2-2748-3390
Semtech Switzerland GmbH
Japan Branch
Tel: 82-2-527-4377
Fax: 82-2-527-4376
Semtech Limited (U.K.)
Tel: 44-1794-527-600
Fax: 44-1794-527-601
Tel: 86-21-6391-0830
Fax: 86-21-6391-0831
Semtech France SARL
Tel: 33-(0)169-28-22-00
Fax: 33-(0)169-28-12-98
Semtech Germany GmbH
Tel: 49-(0)8161-140-123
Fax: 49-(0)8161-140-124
Semtech International AG is a wholly-owned subsidiary of
Semtech Corporation, which has its headquarters in the U.S.A.
 2006 Semtech Corp.
Tel: 81-3-6408-0950
Fax: 81-3-6408-0951
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