300mA, Low Power, Low Dropout, 3 -Terminal, Linear Regulators SGM2013 GENERAL DESCRIPTION FEATURES The SGM2013 low-power, low-dropout, CMOS linear voltage regulators operate from a 2.5V to 5.5V input and deliver up to 300mA. They are perfect choice for low voltage, low power applications. An ultra low ground current (200µA at 300mA output) makes them attractive for battery operated power systems. The SGM2013 series also offer ultra low dropout voltage (300mV at 300mA output) to prolong battery life in portable electronics - Ultra-Low Dropout Voltage: The output voltage is preset to voltages in the range of 1.8V to 3.3V. Other features include foldback current limit and thermal shut-down protection. 300mV at 300mA output - Low 77µA No-Load Supply Current - Low 200µA Operating Supply Current - at 300mA Output High PSRR Thermal-Overload Protection Output Current Limit Output Voltage: Available in Fixed Outputs 1.8V, 2.5V, 2.7V, 2.8V, 2.9V, 3.0V and 3.3V SGM2013 come in 3-pin SOT23 and 3-pin SOT89 package. PIN CONFIGURATIONS（TOP VIEW） APPLICATIONS Cellular Telephones Digital Cameras MP3、MP4 USB 2.0 Modems PC Cameras Hand-Held Instruments Electronic Dictionarys Portable/Battery-Powered Equipment GND 3 SOT23-3 GND OUTPUT IN IN OUT 2 TYPICAL OPERATION CIRCUIT INPUT 1 IN 1 2 3 1 2 3 OUT GND IN GND IN OUT SOT89-3 SOT89-3(L-Type) OUT CIN 1μF COUT 1μF GND SG Microelectronics Co, Ltd Tel: 86/451/84348461 www.sg-micro.com REV. C ORDERING INFORMATION MODEL VOUT (V) PINPACKAGE SPECIFIED TEMPERATURE RANGE SOT23-3 SGM2013-1.8 1.8V SGM2013-2.5 2.5V SGM2013-2.7 2. 7V SOT89-3 - 40°C to +125°C SGM2013-3.0 3.0V SGM2013-1.8XN3/TR XD18 Tape and Reel, 3000 SGM2013-1.8XK3 Tape and Reel, 1000 SGM2013-1.8XK3/TR SOT23-3 SGM2013-2.5XN3/TR XD25 Tape and Reel, 3000 SGM2013-2.5XK3/TR SGM2013-2.5XK3 Tape and Reel, 1000 SOT89-3 - 40°C to +125°C SGM2013-1.8XK3L Tape and Reel, 1000 SOT89-3(L-Type) SGM2013-2.5XK3L/TR SOT23-3 SGM2013-2. 7XN3/TR XD27 Tape and Reel, 3000 SGM2013-2. 7XK3/TR SGM2013-2. 7XK3 Tape and Reel, 1000 SOT89-3 - 40°C to +125°C SOT89-3 SGM2013-2.5XK3L Tape and Reel, 1000 SGM2013-2. 7XK3L/TR SGM2013-2. 7XK3L Tape and Reel, 1000 - 40°C to +125°C SGM2013-2.8XN3/TR XD28 Tape and Reel, 3000 SGM2013-2.8XK3/TR SGM2013-2.8XK3 Tape and Reel, 1000 SOT89-3(L-Type) SGM2013-2.8XK3L/TR SOT23-3 SGM2013-2.9XN3/TR XD29 Tape and Reel, 3000 SGM2013-2.9XK3/TR SGM2013-2.9XK3 Tape and Reel, 1000 SOT89-3 - 40°C to +125°C SGM2013-2.8XK3L Tape and Reel, 1000 SOT89-3(L-Type) SGM2013-2.9XK3L/TR SOT23-3 SGM2013-3.0XN3/TR XD30 Tape and Reel, 3000 SGM2013-3.0XK3/TR SGM2013-3.0XK3 Tape and Reel, 1000 SOT89-3 - 40°C to +125°C SOT89-3(L-Type) SGM2013-3.0XK3L/TR SOT23-3 SGM2013-3.3 3.3V PACKAGE OPTION SGM2013-1.8XK3L/TR SOT23-3 SGM2013-2.9 2.9V PACKAGE MARKING SOT89-3(L-Type) SOT89-3(L-Type) SGM2013-2.8 2.8V ORDERING NUMBER SOT89-3 - 40°C to +125°C SOT89-3(L-Type) SGM2013-2.9XK3L Tape and Reel, 1000 SGM2013-3.0XK3L Tape and Reel, 1000 SGM2013-3.3XN3/TR XD33 Tape and Reel, 3000 SGM2013-3.3XK3/TR SGM2013-3.3XK3 Tape and Reel, 1000 SGM2013-3.3XK3L/TR SGM2013-3.3XK3L Tape and Reel, 1000 ABSOLUTE MAXIMUM RATINGS IN to GND.....................................................................- 0.3V to +6V Output Short-Circuit Duration............................................Infinite OUT to GND...................................................- 0.3V to (VIN + 0.3V) Power Dissipation, PD @ TA = 25℃ SOT23-3 .....................................................................................0.4W SOT89-3 ................................................................................0.571W Package Thermal Resistance SOT23-3, θJA....................................................................... 250℃/W SOT89-3, θJA.........................................................................175°C/W Operating Temperature Range................. ..........- 40°C to +125°C Junction Temperature...........................................................+150°C Storage Temperature.............................................- 65°C to +150°C Lead Temperature (soldering, 10s).......................................260°C ESD Susceptibility HBM..........................................................................................4000V MM..............................................................................................400V Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PIN DESCRIPTION NAME IN GND OUT FUNCTION Regulator Input. Supply voltage can range from 2.5V to 5.5V. Ground. Regulator Output. ２ SGM2013 ELECTRICAL CHARACTERISTICS (VIN = VOUT (NOMINAL) + 0.5V (1), TA = - 40°C to +125°C, unless otherwise noted. Typical values are at TA = + 25°C.) PARAMETER Input Voltage SYMBOL CONDITIONS MIN VIN IOUT =1mA to 300mA, TA = +25°C VOUT + 0.5V≤VIN≤ 5.5V Output Voltage Accuracy(1) Maximum Output Current Current Limit Ground Pin Current MAX UNITS 2.5 5.5 V -3 +3 % 300 ILIM IQ Dropout Voltage (2) Line Regulation(1) ΔVLNR Load Regulation ΔVLDR Power Supply Rejection Rate TYP 310 mA 750 mA No load, 77 IOUT = 300mA, 200 IOUT = 1mA 0.8 IOUT = 300mA 300 380 0.03 0.15 %/V 0.0008 0.002 %/mA VIN = 2.5V or (VOUT + 0.5V) to 5.5V, IOUT = 1mA IOUT = 0.1mA to 300mA, COUT = 1µF 145 µA mV f = 100Hz, 75 dB f = 1KHz, 53 dB TSHDN 160 ℃ ΔTSHDN 15 ℃ PSRR ILOAD = 50mA, COUT = 1µF THERMAL PROTECTION Thermal Shutdown Temperature Thermal Shutdown Hysteresis Specifications subject to change without notice. Note 1: VIN = VOUT(NOMINAL) + 0.5V or 2.5V, whichever is greater. Note 2: The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT + 0.5V. (Only applicable for VOUT = +2.5V to +5.0V.) ３ SGM2013 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, TA = +25℃, unless otherwise noted. Output Voltage vs.Load Current 3.4 2.85 3.35 Output Voltage(V) Output Voltage(V) Output Voltage vs.Load Current 2.9 2.8 2.75 3.3 3.25 VOUT = 2.8V VOUT = 3.3V 2.7 3.2 0 100 200 Load Current(mA) 300 0 Ground Pin Current vs.Input Voltage VOUT = 2.8V VOUT = 3.3V VOUT = 2.8V 160 Iload = 50mA 120 80 No Load 40 0 0 100 200 Load Current(mA) 300 0 Ground Pin Current vs.Input Voltage 5 6 No Load Iload = 50mA Output Voltage(V) 5 120 80 2 3 4 Input Voltage(V) 6 VOUT = 3.3V 160 1 Output Voltage vs.Input Voltage 200 Ground Pin Current(µA) 300 200 Ground Pin Current(µA) Ground Pin Current(µA) Ground Pin Current vs.Load Current 200 190 180 170 160 150 140 130 120 110 100 90 80 70 100 200 Load Current(mA) No Load 40 VOUT = 3.3V 4 3 2 VOUT = 2.8V 1 0 0 0 1 2 3 4 Input Voltage(V) 5 0 6 ４ 1 2 3 4 Input Voltage(V) 5 6 SGM2013 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, TA = +25℃, unless otherwise noted. Power-Supply Rejection Ratio vs.Frequency Current limit vs.Temperature 90 1000 ILOAD = 50mA VIN = VOUT+1V 80 900 Current limit(mA) 70 PSRR(dB) 60 50 COUT = 10μF 40 30 20 10 0 0.01 COUT = 1μF 0.1 1 10 Frequency(kHz) 800 700 V OUT = 3.3V 600 500 400 300 V OUT = 2.8V 200 100 100 -40 -20 1000 ５ 0 20 40 60 80 Temperature(℃) 100 120 140 SGM2013 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, TA = +25℃, unless otherwise noted. Output Voltage vs.Temperature Output Voltage vs.Temperature 2.9 3.4 ILOAD = 150mA Output Voltage(V) 2.85 2.8 2.75 3.35 3.3 3.25 VOUT = 3.3V VOUT = 2.8V 2.7 3.2 -40 -20 0 20 40 60 80 Temperature(℃) 100 120 140 -40 -20 440 240 400 220 360 200 VOUT = 3.3V 180 160 140 120 VOUT = 2.8V 100 20 40 60 80 Temperature(℃) 100 120 140 TA = +125℃ 320 TA = +85℃ 280 TA = +25℃ 240 200 TA = -40℃ 160 120 80 ILOAD = 150mA 80 0 Dropout Voltage vs.Load Current 260 Dropout Voltage(mV) Ground Pin Current(μA) Ground Pin Current vs.Temperature VOUT = 2.8V 40 0 60 -40 -20 0 20 40 60 80 Temperature(℃) 0 100 120 140 30 60 90 120 150 180 210 240 270 300 Load Current(mA) Dropout Voltage vs.Load Current Dropout Voltage(mV) Output Voltage(V) ILOAD = 150mA 360 330 300 270 240 210 180 150 120 90 60 30 0 TA = +125℃ TA = +85℃ TA = +25℃ TA = -40℃ VOUT = 3.3V 0 30 60 90 120 150 180 210 240 270 300 Load Current(mA) ６ SGM2013 Application Notes When LDO is used in handheld products, Attention must be paid to voltage spike which would damage SGM2013. In such applications, voltage spike will be generated at changer interface and VBUS pin of USB interface when changer adapters and USB equipments are hot-inserted. Besides this, handheld products will be tested on the production line on the condition of no battery. Test Engineer will apply power from the connector pin which connects with positive pole of the battery. When external power supply is turned on suddenly, the voltage spike will be generated at the battery connector. The voltage spike will be very high, it always exceeds the absolute maximum input voltage (6.0V) of LDO. In order to get robust design. Design Engineer needs to clear up this voltage spike. Zener diode is a cheap and effective solution to eliminate such voltage spike. For example, BZM55B5V6 is a 5.6V small package Zener diode which can be used to remove voltage spike in cell phone design. The schematic is shown in below: Vcc Input BZM55B5V6 IN 1uF C1 SGM2013 VOUT VOUT C2 4.7uF GND ７ SGM2013 PACKAGE OUTLINE DIMENSIONS SOT23-3 D θ b 0.20 Symbol L E E1 L 0 e C e1 Min Max Min Max 1.050 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.400 0.012 0.016 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 A1 e A L A2 Dimensions In Inches A e1 ８ Dimensions In Millimeters 0.950TYP 1.800 2.000 0.700REF 0.037TYP 0.071 0.079 0.028REF L1 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8° SGM2013 PACKAGE OUTLINE DIMENSIONS SOT89-3 D D1 A Symbol L E1 E A b b1 c D D1 E E1 e e1 L e b e1 c ９ Dimensions In Millimeters Min Max Dimensions In Inches Min Max 1.400 1.600 0.320 0.520 0.360 0.560 0.350 0.440 4.400 4.600 1.400 1.800 2.300 2.600 3.940 4.250 1.500TYP 2.900 3.100 0.900 1.100 0.055 0.063 0.013 0.020 0.014 0.022 0.014 0.017 0.173 0.181 0.055 0.071 0.091 0.102 0.155 0.167 0.060TYP 0.114 0.122 0.035 0.043 SGM2013 REVISION HISTORY Location Page 12/06— Data Sheet changed from REV. A to REV. B Changed to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Added Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 03/07— Data Sheet changed from REV. B to REV. C Changed to TYPICAL OPERATING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Shengbang Microelectronics Co, Ltd Unit 3, ChuangYe Plaza No.5, TaiHu Northern Street, YingBin Road Centralized Industrial Park Harbin Development Zone Harbin, HeiLongJiang 150078 P.R. China Tel.: 86-451-84348461 Fax: 86-451-84308461 www.sg-micro.com １０ SGM2013