W3DG7232V-D1 -JD1 White Electronic Designs PRELIMINARY* 256MB - 32Mx72 SDRAM UNBUFFERED FEATURES DESCRIPTION PC100 and PC133 Compatible Burst Mode Operation Auto and Self Refresh capability LVTTL compatible inputs and outputs The W3DG7232V is a 32Mx72 synchronous DRAM module which consists of nine 32Mx8 SDRAM components in TSOP II package, and one 2K EEPROM in an 8 pin TSSOP package for Serial Presence Detect which are mounted on a 144 Pin SO-DIMM multilayer FR4 Substrate. Serial Presence Detect with EEPROM Fully synchronous: All signals are registered on the positive edge of the system clock Programmable Burst Lengths: 1, 2, 4, 8 or Full Page 3.3V ± 0.3V Power Supply 144 Pin SO-DIMM JEDEC * This product is under development, is not qualified or characterized and is subject to change without notice. • Package height options: JD1: 31.75 (1.25") PIN CONFIGURATIONS (FRONT SIDE/BACK SIDE) PIN NAMES PIN FRONT PIN BACK PIN FRONT PIN BACK PIN FRONT PIN BACK 1 VSS 2 VSS 49 DQ13 50 DQ45 97 DQ22 98 DQ54 3 DQ0 4 DQ32 51 DQ14 52 DQ46 99 DQ23 100 DQ55 5 DQ1 6 DQ33 53 DQ15 54 DQ47 101 VCC 102 VCC 7 DQ2 8 DQ34 55 VSS 56 VSS 103 A6 104 A7 9 DQ3 10 DQ35 57 CB0 58 CB4 105 A8 106 BA0 11 VCC 12 VCC 59 CB1 60 CB5 107 VSS 108 VSS 13 DQ4 14 DQ36 61 CLK0 62 CKE0 109 A9 110 BA1 15 DQ5 16 DQ37 63 VCC 64 VCC 111 A10 112 A11 17 DQ6 18 DQ38 65 RAS# 66 CAS# 113 VCC 114 VCC 19 DQ7 20 DQ39 67 WE# 68 NC 115 DQMB2 116 DQMB6 21 VSS 22 VSS 69 SO# 70 A12 117 DQMB3 118 DQMB7 23 DQMB0 24 DQB4 71 NC 72 NC 119 VSS 120 VSS 25 DQMB1 26 DQB5 73 NC 74 CLK1 121 DQ24 122 DQ56 27 VCC 28 VCC 75 VSS 76 VSS 123 DQ25 124 DQ57 29 A0 30 A3 77 CB2 78 CB6 125 DQ26 126 DQ58 31 A1 32 A4 79 CB3 80 CB7 127 DQ27 128 DQ59 33 A2 34 A5 81 VCC 82 VCC 129 VCC 130 VCC 35 VSS 36 VSS 83 DQ16 84 DQ48 131 DQ28 132 DQ60 37 DQ8 38 DQ40 85 DQ17 86 DQ49 133 DQ29 134 DQ61 39 DQ9 40 DQ41 87 DQ18 88 DQ50 135 DQ30 136 DQ62 41 DQ10 42 DQ42 89 DQ19 90 DQ51 137 DQ31 138 DQ63 43 DQ11 44 DQ43 91 VSS 92 VSS 139 VSS 140 VSS 45 VCC 46 VCC 93 DQ20 94 DQ52 141 SDA 142 SCL 47 DQ12 48 DQ44 95 DQ21 96 DQ53 143 VCC 144 VCC September 2004 Rev. 0 1 A0 – A12 BA0-1 DQ0-63 Address input (Multiplexed) Select Bank Data Input/Output CB0-7 CLK0,CK1 CKE0 CS0# RAS# CAS# WE# DQMB0-7 VCC VSS SDA SCL DNU NC Check bit (Data-in/data-out) Clock input Clock Enable input Chip select Input Row Address Strobe Column Address Strobe Write Enable DQM Power Supply (3.3V) Ground Serial data I/O Serial clock Do not use No Connect White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W3DG7232V-D1 -JD1 White Electronic Designs PRELIMINARY FUNCTIONAL BLOCK DIAGRAM WE# S0# DQMB4 DQMB0 S0# DQM DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 WE# S0# DQM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 DQ32 DQ33 DQ34 D0 DQ35 DQ36 DQ37 DQ38 DQ39 I/O 7 DQMB1 WE# D5 I/O 7 DQMB5 S0# DQM DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 WE# S0# DQM DQ43 DQ44 DQ45 DQ46 DQ47 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 DQ48 DQ49 DQ50 DQ51 DQ52 DQ53 DQ54 DQ55 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ63 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 DQ40 DQ41 DQ42 D1 WE# D6 DQMB6 S0# DQM CB0 CB1 CB2 CB3 CB4 CB5 CB6 CB7 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 WE# S0# DQM D2 DQMB2 WE# D7 DQMB7 S0# DQM DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 WE# S0# DQM D3 WE# D8 DQMB3 S0# DQM DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 WE# NOTE: DQ wiring may differ than described in this drawing, however DQ/DQMB/CKE/S relationships must be maintained as shown. D4 *CLOCK WIRING CLOCK INPUT RAS# CAS# CKE0 BA0-BA1 A0-A12 VCC VSS RAS#: SDRAM D0-D8 CAS#: SDRAM D0-D8 CKE: SDRAM D0-D8 BA0-BA1: SDRAM D0-D8 A0-A12: SDRAM D0-D8 SDRAMS *CLK0 4 OR 5 SDRAMS *CLK1 4 OR 5 SDRAMS *Wire per Clock Loading Table/Wiring Diagrams D0-D8 SERIAL PD SDA SCL D0-D8 A0 September 2004 Rev. 0 2 A1 A2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W3DG7232V-D1 -JD1 White Electronic Designs PRELIMINARY ABSOLUTE MAXIMUM RATINGS Parameter Symbol Value Units Voltage on any pin relative to VSS VIN, VOUT -1.0 ~ 4.6 V Voltage on VCC supply relative to VSS VCC, VCCQ -1.0 ~ 4.6 V TSTG -55 ~ +150 °C Storage Temperature Power Dissipation PD 9 W Short Circuit Current IOS 50 mA Note: Permanent device damage may occur if “ABSOLUTE MAXIMUM RATINGS” are exceeded. Functional operation should be restricted to recommended operating condition. Exposure to higher than recommended voltage for extended periods of time could affect device reliability. RECOMMENDED DC OPERATING CONDITIONS Voltage Referenced to: VSS = 0V, 0°C ≤ TA ≤ +70°C Parameter Symbol Min Typ Max Unit Supply Voltage VCC 3.0 3.3 3.6 V Note Input High Voltage VIH 2.0 3.0 VCCQ+0.3 V 1 Input Low Voltage VIL -0.3 — 0.8 V 2 Output High Voltage VOH 2.4 — — V IOH = -2mA Output Low Voltage VOL — — 0.4 V IOL= -2mA Input Leakage Current ILI -10 — 10 µA 3 Note: 1. VIH (max)= 5.6V AC. The overshoot voltage duration is ≤ 3ns. 2. VIL (min)= -2.0V AC. The undershoot voltage duration is ≤ 3ns. 3. Any input 0V ≤ VIN ≤ VCCQ Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs. CAPACITANCE TA = 25°C, f = 1MHz, VCC = 3.3V, VREF = 1.4V ± 200mV Parameter Symbol Max Unit Input Capacitance (A0-A12) CIN1 50 pF Input Capacitance (RAS#,CAS#,WE#) CIN2 50 pF Input Capacitance (CKE0) CIN3 50 pF Input Capacitance (CK0) CIN4 22 pF Input Capacitance (CS0#) CIN5 50 pF Input Capacitance (DQM0-DQM7) CIN6 8 pF Input Capacitance (BA0-BA1) CIN7 50 pF Data Input/Output Capacitance (DQ0-DQ63) COUT 9.5 pF Data input/output capacitance (CB0-CB7) COUT1 9.5 pF September 2004 Rev. 0 3 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W3DG7232V-D1 -JD1 White Electronic Designs PRELIMINARY OPERATING CURRENT CHARACTERISTICS VCC = 3.3V, 0°C ≤ TA ≤ +70°C Version Parameter Operating Current (One bank active) Precharge Standby Current in Power Down Mode Precharge Standby Current in Non-Power Down Mode Active Standby Current in Power-Down Mode Active Standby Current in Non-Power Down Mode Symbol Conditions 100/133 Units Note 1 ICC1 Burst Length = 1 tRC ≤ tRC(min) IOL = 0mA 900 mA mA ICC2P CKE ≤ VIL(max), tCC = 10ns 18 ICC2PS CKE & CK ≤ VIL(max), tCC = ∞ 18 ICC2N CKE ≥ VIH(min), CS ≥ VIH(min), tcc =10ns Input signals are charged one time during 20 180 ICC2NS CKE ≥ VIH(min), CK ≥VIL(max), tCC = ∞ Input signals are stable 90 mA ICC3P CKE ≥ VIL(max), tCC = 10ns 54 ICC3PS CKE & CK ≤ VIL(max), tCC = ∞ 54 ICC3N CKE ≥ VIH(min), CS ≥ VIH(min), tcc = 10ns Input signals are changed one time during 20ns 270 ICC3NS CKE ≥ VIH(min), CK ≤ VIL(max), tcc = ∞ Input signals are stable 225 Io = mA Page burst 4 Banks activated tCCD = 2CK 990 mA 1 1980 mA 2 27 mA ICC4 Operating Current (Burst mode) Refresh Current ICC5 tRC ≥ tRC(min) Self Refresh Current ICC6 CKE ≤ 0.2V mA mA mA Notes: 1. Measured with outputs open. 2. Refresh period is 64ms. September 2004 Rev. 0 4 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W3DG7232V-D1 -JD1 White Electronic Designs PRELIMINARY PACKAGE DIMENSIONS FOR JD1 Ordering Information Speed CAS Latency Height* W3DG7232V10JD1 100MHz CL=2 31.75 (1.25”) W3DG7232V7JD1 133MHz CL=2 31.75 (1.25”) W3DG7232V75JD1 133MHz CL=3 31.75 (1.25”) Note: For industrial temperature range product, add an "I" to the end of the part number. PACKAGE DIMENSIONS FOR JD1 67.72 (2.661 Max) 3.81 (0.150) MAX. 2.01 (0.079 Min) WEDC 301 31.75 (1.25) Max 3.99 (0.157) 19.99 (0.787) 23.14 (0.913) 0.99 (0.039) (± 0.004) 32.79 (1.291) 4.60 (0.181) 28.2 (1.112) 1.50 (0.059) * ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES). September 2004 Rev. 0 5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W3DG7232V-D1 -JD1 White Electronic Designs PRELIMINARY PACKAGE DIMENSIONS FOR D1 Ordering Information Speed CAS Latency Height* W3DG7232V10D1 100MHz CL=2 31.75 (1.25”) W3DG7232V7D1 133MHz CL=2 31.75 (1.25”) W3DG7232V75D1 133MHz CL=3 31.75 (1.25”) Note: For industrial temperature range product, add an "I" to the end of the part number. PACKAGE DIMENSIONS FOR D1 67.72 (2.661 Max) 3.81 (0.150) MAX. 2.01 (0.079 Min) 31.75 (1.25) Max 3.99 (0.157) 19.99 (0.787) 23.14 (0.913) 0.99 (0.039) (± 0.004) 32.79 (1.291) 4.60 (0.181) 28.2 (1.112) 1.50 (0.059) * ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES). September 2004 Rev. 0 6 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W3DG7232V-D1 -JD1 White Electronic Designs PRELIMINARY Document Title 256MB - 32Mx72 SDRAM UNBUFFERED Revision History Rev # History Release Date Status Rev A A.1 Changed the module height to 1.095" 6-2-03 Advanced 9-04 Preliminary A.2 Changed part number to WED3DG7232V-AD1 Rev 0 0.1 Updated CAP and IDD Spec. 0.2 Created document title page 0.3 Moved from Advanced to Preliminary 0.4 Removed "ED" from part number September 2004 Rev. 0 7 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com