SKYWORKS SKY65131

DATA SHEET
SKY65131: WLAN Power Amplifier Module
Applications
Description
• IEEE802.11 b/g WLAN
The Skyworks SKY65131 is a Microwave Monolithic Integrated
Circuit (MMIC) Power Amplifier (PA) with superior output power,
linearity, and efficiency. These features make the SKY65131 ideal
for Wireless Local Area Network (WLAN) applications.
• ISM band transmitters
• WCS fixed wireless
• Wireless access nodes
Features
• Single 3.3 V supply
• Linear output power of +28 dBm for IEEE802.11b mask
• Linear output power of +26 dBm for IEEE802.11g mask
• High PAE of 38 percent
The device is fabricated using Skyworks high reliability Indium
Gallium Phosphide (InGaP) Heterojunction Bipolar Transistor (HBT)
technology. The device is internally matched and mounted in a
4 x 4 mm, Multi-Chip Module (MCM) Surface-Mounted
Technology (SMT) package, which allows for a highly
manufacturable low cost solution.
The device package and pinout are shown in Figure 1. A block
diagram of the SKY65131 is shown in Figure 2.
• Output power detector: 20 dB dynamic range
V_DET
• Small MCM (16-pin, 4 x 4 mm), Pb-free SMT package (MSL3,
250 °C per JEDEC J-STD-020)
VCC_DET
• Internal RF match and bias circuits
GND
• Superior gain flatness
16
15
14
13
VDET_CNTL
2
12
RF_OUT
RF_IN
3
11
RF_OUT
VCC1
4
10
GND
VC_BIAS
5
9
VCC2
GND
1
RF_IN
6
7
8
VREF2
PA_ON
Skyworks offers lead (Pb)-free “environmentally
friendly” packaging that is RoHS compliant
(European Parliament for the Restriction of
Hazardous Substances).
VREF1
• PA shutdown control
S106
Figure 1. SKY65131 Pinout – 16-Pin MCM
(Top View)
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1
DATA SHEET • SKY65131
VCC1
VREF1
VC_BIAS
RF_IN
Input
Match
VREF2
VCC2
PA_ON
VCC_DET
Active Bias
Detector
V_DET
Inter-Stage
Match
Output
Match
RF_OUT
Stage 1
PA
Stage 2
PA
S107
Figure 2. SKY65131 Block Diagram
Technical Description
The SKY65131 PA contains all of the needed RF matching and DC
biasing circuits. The device also provides an output power
detector voltage and the ability to switch the PA on or off with a
simple control signal.
The SKY65131 is a two-stage, HBT InGaP device optimized for
high linearity and power efficiency. These features make the
device suitable for wideband digital applications, where PA
linearity and power consumption are of critical importance (e.g.,
WLANs).
The device has been characterized with the highest specified data
rates for 802.11b (11 Mbps) and 802.11g (54 Mbps). Under these
stringent test conditions, the device exhibits excellent spectral
purity and power efficiency.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKY65131 is rated to Moisture Sensitivity Level 3 (MSL3) at
250 °C. It can be used for lead or lead-free soldering. Care must
be taken when attaching this product, whether it is done manually
or in a production solder reflow environment.
precaution should be taken to ensure that the part is not
subjected to temperatures exceeding 250 °C for more than
10 seconds.
For details on both attachment techniques, precautions, and
handling procedures recommended by Skyworks, please refer to
Skyworks Application Note, PCB Design and SMT
Assembly/Rework Guidelines for MCM-L Packages, document
number 101752. Additional information on standard SMT reflow
profiles can also be found in the JEDEC Standard J-STD-020.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the Skyworks
Application Note, Tape and Reel, document number 101568.
Electrical and Mechanical Specifications
Signal pin assignments and functional pin descriptions are
described in Table 1. The absolute maximum ratings of the
SKY65131 are provided in Table 2. Electrical specifications are
provided in Table 3.
Typical performance characteristics are shown in Figures 3
through 9. A schematic diagram of the SKY65131 Evaluation
Board is shown in Figure 10. Package dimensions for the
SKY65131 16-pin MCM are shown in Figure 14, and tape and reel
dimensions are shown in Figure 15.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 5 °C per second. Maximum temperature
should not exceed 250 °C. If the part is manually attached,
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DATA SHEET • SKY65131
Evaluation Board Description
Electrostatic Discharge (ESD) Sensitivity
The Skyworks SKY65131 Evaluation Board is used to test the
performance of the SKY65131 power amplifier driver. An
assembly drawing for the Evaluation Board is shown in Figure 11.
The layer detail is provided in Figure 12 and Figure 13 identifies
the physical characteristics of each layer.
The SKY65131 is a static-sensitive electronic device. Do not
operate or store near strong electrostatic fields. Take proper ESD
precautions.
Table 1. SKY65131 Signal Descriptions
Pin #
1
Name
GND
Description
Pin #
Ground
9
Name
VCC2
Description
Stage 2 collector voltage
2
RF_IN
RF input
10
GND
Ground
3
RF_IN
RF input
11
RF_OUT
RF output
4
VCC1
Stage 1 collector voltage
12
RF_OUT
RF output
5
VC_BIAS
Bias voltage
13
VDET_CNTL
Detector voltage control
6
VREF1
Bias referance voltage 1
14
V_DET
Detector output signal
7
VREF2
Bias referance voltage 2
15
VCC_DET
Detector supply voltage
8
PA_ON
PA on/off control signal
16
GND
Ground
Table 2. SKY65131 Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
RF input power
PIN
4
dBm
Supply voltage
VCC1, VC_BIAS, VREF1,
VREF2, VCC2, and
VCC_DET
4
V
Supply current (ID + IBIAS)
ICC
500
mA
Power dissipation
2
W
Case operating temperature
TC
–40
+85
°C
Storage temperature
TST
–55
+125
°C
Junction temperature
TJ
+150
°C
Note:
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value.
Table 3. SKY65131 Recommended Operating Conditions
Parameter
Symbol
Minimum
Maximum
Units
–3
dBm
3.6
V
–40
+85
°C
–55
+125
°C
RF input power
PIN
Supply voltage
VCC1, VC_BIAS,
VREF1, VREF2,
VCC2, and VCC_DET
3.0
Case operating temperature
TC
Storage temperature
TST
Typical
3.3
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DATA SHEET • SKY65131
Table 4. SKY65131 Electrical Specifications
(VCC = 3.3 V, TC = +25 °C, Test Frequency = 2.442 GHz unless otherwise noted)
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
Using IEEE802.11b Complimentary Code Keying Input Signal, Data Rate = 11 Mbps
Supply current
ICC
490
mA
Output power (Note 1)
POUT
27
dBm
Power added efficiency (Note 2)
PAE
41
%
Ramp-up/ramp-down (Note 3)
TS
<0.5
µs
Using IEEE802.11g Orthogonal Frequency Division Multiplexing Input Signal, Data Rate = 54 Mbps
Supply current
ICC
400
mA
Output power (Note 4)
POUT
26
dBm
Power added efficiency (Note 2)
PAE
33
%
26
dB
Using Continuous Wave Input Signals
Small signal gain
G
PIN = –15 dBm
Gain flatness over band
From 2.4 GHz to 2.5 GHz
±1.0
dB
Gain flatness over channel (16.25 MHz)
Over any 16.25 MHz
within band
±0.2
dB
Output power @ 1 dB compression
P1dB
28
dBm
Quiescent Current
IQ
150
mA
Noise Figure
NF
5
dB
Power added efficiency
PAE
Thermal resistance (junction-to-case)
RTH,J-C
PIN = 3 dBm
PIN = 3 dBm
38
%
50
C/W
3.3
V
Power Up/Down Control
Power up
PA_ON/OFF
Power down
PA_ON/OFF
2.7
0.5
V
Note 1: Defined as the maximum power level for which the IEEE802.11b transmit mask requirements are met.
Note 2: Measured at the specified average output RF power and modulation type.
Note 3: Ramp-up and ramp-down times are defined from the 10% to 90% power points.
30
27.0
28
26.8
26
26.6
24
26.4
22
26.2
Gain (dB)
Output Power (dBm)
Note 4: Defined as the maximum power level for which the IEEE802.11g transmit mask requirements are met.
20
18
26.0
25.8
16
25.6
14
25.4
12
25.2
10
–15
25.0
–13
–11
–9
–7
–5
–3
–1
+1
+3
Input Power (dBm)
Figure 3. Typical POUT and Gain vs PIN @ 2.442 GHz
+5
2.40
2.41
2.42
2.43
2.44
2.45
2.46
2.47
2.48
Frequency (GHz)
Figure 4. Typical Gain vs Frequency Response
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2.49
2.50
DATA SHEET • SKY65131
+10
6.0
5.8
Relative Power (dB)
5.4
Noise Figure (dB)
IEEE 802.11g
Specification Mask
0
5.6
5.2
5.0
4.8
4.6
4.4
–10
–20
–30
Pout = +26.0 dBm
–40
4.2
–50
2.411
4.0
2.40
2.41
2.42
2.43
2.44
2.45
2.46
2.47
2.48
2.49
2.50
2.417
2.423
2.430
2.448
2.454
2.461
2.467
2.473
1.8
+10
1.6
Detector Output Voltage (V)
IEEE 802.11b
Specification Mask
0
Relative Power (dB)
2.442
Figure 6. Output Spectrum Response for 802.11g
(64 Quadrature Amplitude Modulated, 54 Mbps Input Signal)
Figure 5. Typical Noise Figure Performance vs Frequency
–10
–20
–30
–40
Pout = +27.5 dBm
–50
–60
2.411
2.436
Frequency (GHz)
Frequency (GHz)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
2.417
2.423
2.430
2.436
2.442
2.448
2.454
2.461
2.467
2.473
10
12
14
16
18
20
22
24
26
28
30
Output Power (dBm)
Frequency (GHz)
Figure 7. Output Spectrum Response for 802.11b CCK-Coded
(11 Mbps Input Signal)
Figure 8. Detector Output Voltage vs RF Output Power
9
8
7
EVM (%)
6
5
4
3
2
1
0
17
18
19
20
21
22
23
24
25
26
Output Power (dBm)
Figure 9. EVM vs Pout for 802.11g
(64 Quadrature Amplitude Modulated, 54 Mbps Input Signal)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY65131
L4
10 nH
L6
10 nH
V_DET
VCC_DET
C7
3300 pF
C14
8.2 pF
3
L1
10 nH
4
VCC1
C8
10 µF
C2
3300 pF
C1
DNI
5
V_DET
VCC_DET
C13
43 pF
VDET_CNTL
RF_OUT
RF_IN
SKY65131
RF_IN
GND
10
L2
10 nH
VC_BIAS
6
VCC2
7
R3
51 Ω
L3
1.5 nH
12
11
VCC1
VC_BIAS
13
RF_OUT
PA_ON
RF In
14
VREF2
2
GND
VREF1
1
15
GND
16
RF Out
9
VCC2
C12
10 µF
C6
3300 pF
8
C3
3300 pF
PA_ON
VREF1
VREF2
R2
150 Ω
R1
200 Ω
C4
3300 pF
C5
3300 pF
Note: Evaluation Board material: four-layer Rogers 4003-12, εr = 3.38
S324
Figure 10. SKY65131 Evaluation Board Schematic
C8
C2
L1
C1
C3
L2
C4
J4
L4
R1
C7
L6
R2
C13
C14
J3
L3
C5
C12
R3
C9
S581
Figure 11. Evaluation Board Assembly Drawing
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DATA SHEET • SKY65131
Layer 1: Top Metal
Layer 2: Ground
Layer 3: Inner Traces
Layer 4: Ground
S580
Figure 12. Evaluation Board Layer Detail
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DATA SHEET • SKY65131
Cross Section
Name Thickness (mils) Material
εr
L1
1.4
Cu, 1 oz.
–
Lam1
12
Rogers 4003-12
3.38
L2_GND
1.4
Cu, 1 oz
–
4
FR4-4
4.35
L3_GND
1.4
Cu, 1 oz.
–
Lam3
12
FR4-12
4.35
L4
1.4
Cu, 1 oz.
–
Lam2
S573
Figure 13. Layer Detail Physical Characteristics
1.90
1.00
4.0
R0.2
0.85
Metal Pad
Pin 1 Indicator
Pin 1
Indicator
1.70
A
4.0
0.85
1.00
1.90
B
Top View
Bottom View
Solder Mask Opening
0.5 ± 0.03
0.4 ± 0.03
Metal Pad Edge
Metal Pad Edge
Mold
0.4 ± 0.03
1.5 ± 0.1
0.4 ± 0.03
0.5 ± 0.03
0.1
Side View
Detail A
0.1
Detail B
All dimensions are in millimeters
S108
Figure 14. SKY65131 16-Pin MCM Package Dimensions
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DATA SHEET • SKY65131
4.00 ± 0.10
2.00 ± 0.05
1.50 ± 0.10
1.75 ± 0.10
B
A
A
4.35 ± 0.10
7o Max
B
12.00 +0.30/–0.10
8.00 ± 0.10
5.50 ± 0.05
1.73 ± 0.10
Pin #1
Indicator
1.50 ± 0.25
0.229 ± 0.02
B
8o Max
Notes:
1. Carrier tape material: black conductive polycarbonate
or polysterene
2. Cover tape material: transparent conductive PSA
3. Cover tape size: 9.3 mm width
4. All measurements are in millimeters
4.30 ± 0.10
A
S187
Figure 15. SKY65131 16-Pin MCM Tape and Reel Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY65131
Ordering Information
Model Name
SKY65131 WLAN Power Amplifier Module
Manufacturing Part Number
SKY65131-21
Evaluation Kit Part Number
TW13-D341
Copyright © 2003, 2004, 2005 Skyworks Solutions, Inc. All Rights Reserved.
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used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its documentation, products,
specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts,
incompatibilities, or other difficulties arising from future changes to its documentation, products, specifications and product descriptions.
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