SKYWORKS TW16-D280-031

DATA SHEET
SKY65152-11: 2.4-2.5 GHz WLAN Power Amplifier
Applications
Description
x IEEE 802.11 b/g WLANs
x ISM band transmitters
x WCS fixed wireless
x Wireless access nodes
The SKY65152-11 is a Microwave Monolithic Integrated Circuit
(MMIC) Power Amplifier (PA) with superior output power, linearity,
and efficiency. These features make the SKY65152-11 ideal for
Wireless Local Area Network (WLAN) applications. The high
linearity (low EVM) and high efficiency of this device makes it
ideal for use in the transmit chain of WLAN access points or
modems.
Features
The SKY65152-11 is fabricated using Skyworks high reliability
Heterojunction Bipolar Transistor (HBT) InGaP process, which
allows for single supply operation while maintaining high
efficiency and good linearity. The device is internally matched and
mounted in a 20-pin, 6 x 6 mm Multi-Chip Module (MCM)
Surface-Mounted Technology (SMT) package, which allows for a
highly manufacturable low cost solution.
RREF3
VCC1
Detector
InterStage
Match
VCC2
GND
17
16
VCC1
2
15
VCC_DET
PA_ENB
3
14
V_DET
Output
Match
VCC3
Figure 1. SKY65152-11 Block Diagram
V_DET
VC_BIAS
4
13
VCC2
VREF1
5
12
N/C
VREF2
6
11
VCC3
RF_OUT
S1503
7
8
9
10
GND
InterStage
Match
Input
Match
18
VREF3 VCC_DET
Active Bias
RF_IN
19
RF_OUT
RREF2
RREF1
GND
20
GND
VREF2 PA_ENB
1
VREF3
VREF1 VC_BIAS
GND
RF_IN
Skyworks offers lead (Pb)-free RoHS (Restriction of
Hazardous Substances) compliant packaging.
GND
x Small, MCM (20-pin, 6 x 6 mm) package (MSL3, 260 qC per
JEDEC J-STD-020)
A functional block diagram is shown in Figure 1. The pin
configuration and package are shown in Figure 2. Signal pin
assignments and functional pin descriptions are provided in
Table 1.
GND
x EVM < 2.5% for POUT > +27 dBm
x High gain = 32 dB
x Internal RF match with DC block and active bias circuits
x Internal on/off control circuit
x Internal, high dynamic range power detector
x Single DC supply = +5 V
x Operating temperature = –40 °C to +85 °C
S1504
Figure 2. SKY65152-11 Pinout – 20-Pin MCM
(Top View)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200968F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 19, 2009
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DATA SHEET • SKY65152-11 POWER AMPLIFIER
Table 1. SKY65152-11 Signal Descriptions
Pin #
1
GND
Description
Ground
Pin #
11
Name
VCC3
Description
Stage 3 collector voltage
2
GND
Ground
12
N/C
No connection
3
PA_ENB
PA on/off control signal (on = +3 V to VCC;
off = 0 to 0.5 V)
13
VCC2
Stage 2 collector voltage
4
VC_BIAS
Bias voltage
14
V_DET
Detector output signal
5
VREF1
Bias reference voltage 1
15
VCC_DET
Detector supply voltage
6
VREF2
Bias reference voltage 2
16
VCC1
Stage 1 collector voltage
7
VREF3
Bias reference voltage 3
17
GND
Ground
8
GND
Ground
18
RF_IN
RF input
9
RF_OUT
RF output
19
GND
Ground
GND
Ground
20
GND
Ground
10
Note:
Name
The center attachment pad must have a low inductance and low thermal resistance connection to the printed circuit board ground plane.
Functional Description
The SKY65152-11 is a three-stage, HBT InGaP device optimized
for high linearity and power efficiency. It contains all of the
needed RF matching and DC biasing circuits. An in-module active
bias circuit is included within the device for all three amplifier
stages, which provides excellent gain tracking over temperature
and voltage variations.
through the VCC_DET signal (pin 15). The maximum voltage for
this pin is 4 V. Resistor R5 on the Evaluation Board sets the
correct bias to this pin when attached to a 5 V power supply.
Pin 18 is the RF input and Pin 9 is the RF output. External DC
blocking or RF matching is not required on the RF input and
output. Grounding is through several ground pins and the package
center ground.
The first, second, and output stages are independently supplied
using the VCC1, VCC2, and VCC3 signals (pins 16, 13 and
11,respectively). The DC control voltage that sets the bias for all
three stages is supplied by the VC_BIAS signal (pin 4). The
Evaluation Board includes shunt decoupling capacitors on these
pins to suppress any possible bias affect on the RF signal at low
frequencies.
These features make the device suitable for wideband digital
applications where PA linearity and power consumption are of
critical importance (e.g., WLANs). The device has been
characterized with the highest specified data rates for 802.11b
(11 Mbps) and 802.11g (54 Mbps). Under these stringent test
conditions, the device exhibits excellent spectral purity and power
efficiency.
The bias reference voltages for stages 1, 2, and 3 are supplied
using the common lines VREF1, VREF2, and VREF3 (pins 5, 6, and
7, respectively). The maximum voltage for these pins is 4 V.
Resistors R1, R2, and R3 on the Evaluation Board set the correct
bias to these pins when attached to a 5 V power supply.
Electrical and Mechanical Specifications
The SKY65152-11 includes an internal PA enable control pin (pin
3) for fast RF on/off control. Zero volts turns off the PA while 3 to
5 V enables the PA. The device also provides an output power
detector voltage, V_DET, at pin 14. A bias voltage is required to
operate the detector. The detector supply voltage is provided
The absolute maximum ratings of the SKY65152-11 are provided
in Table 2. The recommended operating conditions are specified
in Table 3 and electrical specifications are provided in Table 4.
Performance characteristics for the SKY65152-11 are illustrated
in Figures 3 through 14.
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DATA SHEET • SKY65152-11 POWER AMPLIFIER
Table 2. SKY65152-11 Absolute Maximum Ratings (Note 1)
Parameter
Symbol
RF output power
POUT
Supply voltage (VCC, VC_BIAS, and PA_ENB)
(Note 2)
VCC
Minimum
4.5
Maximum
Units
+30
dBm
5.5
V
Total supply current
ICC
850
mA
Reference voltage (Note 2)
VREF
4
V
4
V
Detector supply voltage (VCC_DET) (Note 2)
Power dissipation
PD
Case temperature
TC
–40
Storage temperature
TSTG
–55
Junction temperature
TJ
Thermal resistance
ΘJC
3.3
W
+85
qC
+125
qC
+150
qC
20
°C/W
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
Note 2: Voltage levels measured at the pins of the package. The Evaluation Board supply voltage levels may be different. Refer to the Evaluation Board schematic diagram in this document.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY65152-11 Recommended Operating Conditions
Parameter
Symbol
RF output power
POUT
Supply voltage (Note 1)
VCC, VC_BIAS
Minimum
Typical
Maximum
Units
+27
dBm
5
V
Reference voltage (Note 1)
VREF
2.5
V
Detector supply voltage (Note 1)
VCC_DET
3.6
V
Operating frequency
f
2412
Case temperature
TC
–40
+25
2462
MHz
+85
qC
Note 1: Voltage levels measured at the pins of the package. The Evaluation Board supply voltage levels may be different. Refer to the Evaluation Board schematic diagram in this document.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200968F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 19, 2009
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DATA SHEET • SKY65152-11 POWER AMPLIFIER
Table 4. SKY65152-11 Electrical Specifications (Note 1)
(VCC1 = VCC2 = VCC3 = VREF1 = VREF2 = VREF3 = VC_BIAS = VCC_DET = PA_ENB = 5 V, Characteristic Impedance [ZO] = 50 Ω,
TC = 25 °C, Frequency = 2.442 GHz, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
2
2.5
%
IEEE 802.11g Orthogonal Frequency Division Multiplexing Input Signal, Data Rate = 54 Mbps
Error Vector Magnitude
EVM
POUT = +27 dBm
Small signal gain
G
PIN = –25 dBm
Gain flatness over band
POUT
2.4 GHz to 2.5 GHz
1.0
1.4
dB
Gain flatness over channel
POUT_EVM
Over any 16.25 MHz
within band
±0.10
±0.15
dB
–12
–10
dB
–16.5
–14.0
dBm
0.79
0.83
0.87
V
790
830
+32
+33
Continuous Wave Input Signal
Input return loss
|S11|
2nd harmonics
2fo
CW input
Detector voltage
VDET
POUT = +27 dBm
Operational current
ICC
Peak POUT = +27 dBm
Output power @ 1 dB compression
P1dB
Quiescent current
ICCQ
Noise Figure
NF
30
No RF
32
dB
mA
dBm
490
510
mA
5
6.5
dB
Power Up/Down Control
Power up
PA_ENB on
Power down
PA_ENB off
Standby current
ISB
3
PA_ENB = 0 V
5
V
0
0.5
V
3
5
μA
Note 1: Performance is guaranteed only under the conditions listed in this Table and is not guaranteed over the full operating or storage temperature ranges. Operation at elevated
temperatures may reduce reliability of the device.
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DATA SHEET • SKY65152-11 POWER AMPLIFIER
Typical Performance Characteristics
(VCC1 = VCC2 = VCC3 = VREF1 = VREF2 = VREF3 = VC_BIAS = VCC_DET = PA_ENB = 5 V, CW, Characteristic Impedance [ZO] = 50 Ω,
TC = 25 °C, Frequency = 2.442 GHz, Unless Otherwise Noted)
34.0
34
33.5
33
33.0
Gain (dB)
Gain (dB)
32
31
30
32.0
2462 MHz
2442 MHz
2412 MHz
29
31.5
28
27
+12
+14
+16
32.5
+18
+20
+22
+24
+26
+28
+30
+32
+34
+36
31.0
2400
+38
2410
2420
2430
2440
2460
2470
2480
2490
2500
Figure 4. Small Signal Gain vs Frequency
Figure 3. Gain vs Output Power Over Frequency
3.0
1200
2.5
ICC1
ICC2
ICC3
Total
1000
Current (mA)
EVM (%)
2450
Frequency (MHz)
POUT (dBm)
2.0
1.5
2462 MHz
2442 MHz
2412 MHz
1.0
0.5
+14
+15
+16
+17 +18
+19
+20
+21 +22
+23
+24
800
600
400
200
0
+12
+25 +26 +27 +28
+16
+20
+24
+28
+32
POUT (dBm)
POUT (dBm)
Figure 6. Current vs Output Power
Figure 5. EVM vs Output Power Over Frequency
(802.11g, OFDM, 64 QAM @ 54 Mbps)
+40
+40
+30
+30
+20
<2.0 μs @ 90% Peak RF Power
<2.0 μs @ 90% Peak RF Power
RF Power (dBm)
RF Power (dBm)
+20
+10
0
–10
+10
0
–10
–20
–20
–30
–30
–40
–40
0
0.5
1.0
1.5
2.0
2.5
3.0
Time (μs)
Figure 7. Output Power vs Enable Time
3.5
4.0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Time (μs)
Figure 8. Output Power vs Disable Time
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY65152-11 POWER AMPLIFIER
+10
0
–10
–20
–30
–40
–50
–60
–70
2.412
Normalized POUT (dBc)
Normalized POUT (dBc)
+10
0
–10
–20
–30
–40
–50
2.412
2.422
2.432
2.442
2.452
2.462
2.472
2.422
2.432
2.442
2.452
2.462
2.472
Frequency (GHz)
Frequency (GHz)
Figure 10. Spectral Response @ POUT = +31 dBm
(802.11b, CCK @ 11 Mbps)
Figure 9. Spectral Response @ POUT = + 30 dBm
(802.11g, OFDM, 64 QAM @ 54 Mbps)
40
35
–10
30
–15
2nd Harmonic Level (dBm)
PAE (%)
25
20
15
10
5
0
+12
–20
–25
–30
802.11b
CW
–35
–40
+14
+16
+18
+20
+22
+24
+26
+28
+30
+32
+34
–45
+20
+36
+21
+22
+23
POUT (dBm)
+24
+25
+26
+27
+28
+29
+30
Output Power (dBm)
Figure 11. PAE vs Output Power
Figure 12. Second Harmonic vs Output Power
1.6
–40
Detector Voltage (V)
3rd Harmonic Level (dBm)
1.4
–45
–50
–55
802.11b
CW
–60
–65
+24.0
+24.5
+25.0
+25.5
+26.0
+26.5
Output Power (dBm)
Figure 13. Third Harmonic vs Output Power
1.2
1.0
0.8
0.6
2462 MHz
2442 MHz
2412 MHz
0.4
0.2
+27.0
0
+10 +12 +14
+16 +18
+20 +22 +24
+26 +28
Figure 14. Detector Voltage vs Output Power
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+30 +32
POUT (dBm)
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+34
DATA SHEET • SKY65152-11 POWER AMPLIFIER
NOTE: A poor connection between the slug and ground increases
junction temperature (TJ), which reduces the lifetime of the
device.
Evaluation Board Description
The SKY65152-11 Evaluation Board is used to test the
performance of the SKY65152-11 PA. An Evaluation Board
schematic diagram is provided in Figure 15. An assembly drawing
for the Evaluation Board is shown in Figure 16.
Evaluation Board Test Procedure
An Evaluation Board layer detail drawing is shown in Figure 17.
Layer detail physical characteristics are noted in Figure 18.
Table 5 provides the Bill of Materials (BOM) list for Evaluation
Board components.
Step 1: Connect a +5 V supply to the VCC1, VCC2, VCC3, VREF1,
VREF2, VREF3, VC_BIAS, VCC_DET, and PA_ENB pins. If
available, enable the current limiting function of the
power supply to 1000 mA.
Step 2: If desired, connect a voltage meter to the V_DET pin.
Circuit Design Considerations
Step 3: Connect a signal generator to the RF signal input port.
Set it to the desired RF frequency at a power level of
–15 dBm or less to the Evaluation Board. DO NOT enable
the RF signal.
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
1. Paths to ground should be made as short as possible.
Step 4: Connect a spectrum analyzer to the RF signal output port.
2. The ground pad of the SKY65152-11 has special electrical
and thermal grounding requirements. This pad is the main
thermal conduit for heat dissipation. Since the circuit board
acts as the heat sink, it must shunt as much heat as possible
from the device. Therefore, design the connection to the
ground pad to dissipate the maximum wattage produced by
the circuit board. Multiple vias to the grounding layer are
required.
Step 5: Enable the power supply.
Step 6: Enable the RF signal.
Step 7: Take measurements.
CAUTION: If the input signal exceeds the rated power, the
SKY65152-11 Evaluation Board can be permanently
damaged.
3. Bypass capacitors should be used on the DC supply lines. An
RF inductor is required on the VCC supply line to block RF
signals from the DC supply. Refer to the schematic drawing in
Figure 15 for further details.
NOTE: It is important to adjust the VCC voltage source so that
+5 V is measured at the board. The high collector currents
will drop the collector voltage significantly if long leads are
used. Adjust the bias voltage to compensate.
4. The RF lines should be well separated from each other with
solid ground in between traces to maximize input-to-output
isolation.
RF Input
Bias Voltage (5 V)
C11
10 μF
C1
3300 pF
Reference Voltage (5 V)
R1
560 Ω
R2
180 Ω
C2
3300 pF
5
6
GND
RF_IN
GND
GND
VCC1
VCC_DET
PA_ENB
V_DET
SKY65152-11
VC_BIAS
VCC2
VREF1
N/C
VREF2
7
8
9
C5
8.2 pF
16
C15
10 μF
R5
300 Ω
15
C6
3300 pF
14
C7
8.2 pF
L2
27 nH
13
Collector Voltage 1 (5 V)
Detector Supply Voltage (5 V)
Detector Output
Collector Voltage 2 (5 V)
12
×
C8
8.2 pF
C16
10 μF
C10
8.2 pF
C17
10 μF
11
VCC3
GND
4
17
RF_OUT
3
PA Enable (0-5 V)
GND
GND
2
18
VREF3
1
19
GND
20
Collector Voltage 3 (5 V)
10
R3
180 Ω
RF Output
S1502
Figure 15. SKY65152-11 Evaluation Board Schematic
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY65152-11 POWER AMPLIFIER
C15
C5
PA_ENB
VCC1
C6
C11
R5
C7
VC_BIAs
VREF
C1
J3
U1
VCC_DET
L2
R1
GND
GND
C2
C16
R3
C10
VDET
VCC2
C8
R2
J4
C17
VCC3
S1505
Figure 16. SKY65152-11 Evaluation Board Assembly Diagram
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DATA SHEET • SKY65152-11 POWER AMPLIFIER
Layer 1: Silk Screen
Layer 1: Top Metal
Layer 2 and 3: Ground
Layer 4: Backside Ground
S1508
Figure 17. SKY65152-11 Evaluation Board Layer Detail
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200968F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 19, 2009
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DATA SHEET • SKY65152-11 POWER AMPLIFIER
Cross Section
Name Thickness (mils) Material
εr
L1
1.4
Cu
–
Lam1
12
Rogers 4003-12
3.38
L2 GND
1.4
Cu, 1 oz.
–
4
FR4-4
4.35
L3 GND
1.4
Cu, 1 oz.
–
Lam3
12
FR4-12
4.35
L4
1.4
Cu, 1 oz.
–
Lam2
Figure 18. Evaluation Board Layer Detail Physical Characteristics
Table 5. SKY65152-11 Evaluation Board Bill of Materials
Component
Value
C1, C2, C6
Size
Product #
Manufacturer
Manufacturer’s Part #
0603
5404R28-015
Murata
C5, C7, C8, C10
8.2 pF
0603
5404R98-010
Murata
GRM1885C1H8R2CZ01D
C0G, 50 V, ±0.25 pF
C11, C15, C16, C17
10 μF
0603
5404R91-005
TDK
C3216X5R0J106KT
X5R, 6 V, ±10%
L2
27 nH
0603
5332R34-030
Taiyo-Yuden
HK160827NJ-T
±5%, SRF 2200 MHz
R1
560 Ω
0603
5424R20-045
Rohm
MCR03EZHUJ680
50 V, 0.063 W, ±5%
R2, R3
180 Ω
0603
5424R20-031
Rohm
MCR03EZHUJ180
50 V, 0.063 W, ±5%
R5
300 Ω
0603
5424R20-036
Rohm
MCR03EZHUJ300
50 V, 0.063 W, ±5%
Application Circuit Notes
Center Ground. It is extremely important to sufficiently ground
the bottom ground pad of the device for both thermal and stability
reasons. Multiple small vias are acceptable and will work well
under the device if solder migration is an issue.
GND (pins 1, 2, 8, 10, 17, 19, and 20). Attach all ground pins to
the RF ground plane with the largest diameter and lowest
inductance via that the layout allows. Multiple small vias are
acceptable and will work well under the device if solder migration
is an issue.
PA_ENB (pin 3). Internal PA enable control pin for fast on/off
control (on = +3 V to VCC; off = 0 to 0.5 V).
VC_BIAS (pin 4). The bias supply voltage for stages 1 and 2,
typically set to +5 V.
VREF1 (pin 5). Bias reference voltage for amplifier stage 1. This
signal should be operated over the same voltage range as VCC
with a nominal voltage of +5 V.
VREF2 (pin 6). Bias reference voltage for amplifier stage 2. This
signal should be operated over the same voltage range as VCC
with a nominal voltage of +5 V.
VREF3 (pin 7). Bias reference voltage for amplifier stage 3. This
signal should be operated over the same voltage range as VCC
with a nominal voltage of +5 V.
GRM188R71H332KD01J
Characteristics
3300 pF
X7R, 50 V, ±10%
RF_OUT (pin 9). Amplifier RF output pin (ZO = 50 Ω). The module
includes an onboard internal DC blocking capacitor. All
impedance matching is provided internal to the module.
VCC3 (pin 11). Supply voltage for the output (final) stage collector
bias (typically +5 V). To bypass VCC3, capacitors C10 and C17
(see Figure 15) should be placed in the approximate location
shown on the Evaluation Board, although exact placement is not
critical.
N/C (pin 12). This pin is open and may or may not be connected
to ground.
VCC2 (pin 13). Supply voltage for the second stage collector bias
(typically +5 V). To bypass VCC2, capacitors C8 and C16 (see
Figure 15) should be placed in the approximate location shown on
the Evaluation Board, although exact placement is not critical.
V_DET (pin 14). The output power detector voltage signal. The
detector load and settling time constant are set external to the
device. Inductor L2 and capacitor C7 (see Figure 15) are set to
yield a settling time of < 0.5 μs.
VCC_DET (pin 15). The power detector supply voltage signal.
Resistor R5 and capacitor C5 (see Figure 15) are used for proper
bias and bypassing of this pin. VCC_DET (pin 15) may be
connected to the PA_ENB supply (pin 3). The benefit of this is that
the current draw consumed by the detector will not be wasted
with the device in the off state.
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DATA SHEET • SKY65152-11 POWER AMPLIFIER
Package and Handling Information
VCC1 (pin 16). Supply voltage for the first stage collector bias
(typically +5 V). To bypass VCC1, capacitors C5 and C15 (see
Figure 15) should be placed in the approximate location shown on
the Evaluation Board, although exact placement is not critical.
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
RF_IN (pin 18). Amplifier RF input pin (ZO = 50 Ω). The module
includes an onboard internal DC blocking capacitor. All
impedance matching is provided internal to the module.
THE SKY65152-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 qC. It can be used for lead or lead-free soldering.
Package Dimensions
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the Skyworks
Application Note, Tape and Reel Information – RF Modules,
document number 101568.
The PCB layout footprint for the SKY65152-11 is shown in
Figure 19. Typical case markings are shown in Figure 20.
Package dimensions for the 20-pin MCM are shown in Figure 21,
and tape and reel dimensions are provided in Figure 22.
Thermal Via Array Ø0.3 mm
On 0.6 mm Pitch
Improves Thermal Performance
13X 0.75
Pin 20
0.25 Typ.
Pin 1
13X 0.5
0.6 Typ.
6.3
1 Typ.
Package Outline
0.6 Typ.
6.3
Metallization
Top View
Pin 20
Pin 20
20X 0.85
20X 0.75
Pin 1
Pin 1
20X 0.5
20X 0.6
2X 1.7
2X 1.7
6.3
6.4
1 Typ.
1 Typ.
Package Outline
2X 1.7
Stencil Aperture Size of
80 to 100% of the
Module/Pkg. Solder
Mask Opening
Package Outline
2X 1.7
6.3
6.4
Stencil Aperture
Top View
Solder Mask Opening
Top View
All dimensions are in millimeters
S1507
Figure 19. SKY65152-11 PCB Layout Footprint
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200968F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 19, 2009
11
DATA SHEET • SKY65152-11 POWER AMPLIFIER
Pin 1
Identifier
Manufacturing Part Number
Revision Number
Lot Number
Y = Manufacture Year
WW = Week Packaged Sealed
MX = Country Code
SKY65152-11
EXXXXX.XX
YYWW MX
6
Pin 1
12X 0.5
12X 1.5
12X 2.9
Figure 20. SKY65152-11 Typical Case Markings
Pin 20
See Detail B
B
C
Pin 1
4X 2.5
12X 1.5
12X 0.5
0
6
A
8X 2.9
1.05 ± 0.1
16X Solder Mask Opening
See Detail C
0.2 A B C
A
0.15 A B C
0.1
Top View
20X SMT Pad
0.15 A B C
Bottom View
Side View
0.5 ± 0.1
(0.1)
0.875
0.875
0.2 x 0.2
0.5 ± 0.05
0.875
0.875
Metal Pad
Edge
Detail A
Pad Scale: 3X
All dimensions are in millimeters
Dimensioning and tolerancing according
to ASME Y14.5M-1994
Solder Mask Edges
Solder Mask Edges
Detail B
15X Detail C
Scale: 2X
Scale: 2X
6X This rotation
6X Rotated 180o
4X Rotated 90o CW
4X Rotated 90o CCW
Figure 21. SKY65152-11 20-Pin MCM Package Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
12
October 19, 2009 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200968F
S1679
DATA SHEET • SKY65152-11 POWER AMPLIFIER
2.00 ± 0.05
4.00
8.00
∅1.50 ± 0.10
0.30 ± 0.02
B
6.35
A
12.00 ± 0.30
A
1.75 ± 0.10
5.50 ± 0.05
Pin #1 Indicator
(see Notes)
7o Max.
B
∅1.50 Min.
1.59
6.35
B
8o Max.
Notes:
1. Carrier tape: black conductive polystyrene
2. Cover tape material: transparent conductive PSA
3. Cover tape size: 9.3 mm width
4. All dimensions are in millimeters
5. Pin 1 orientation is in top left corner for the following Skyworks products:
A
SKY73022-21, -31
SKY73023-21, -31
For all other 6 x 6 mm MCM/RFLGA products, pin 1 orientation is
in top right corner.
S1183
Figure 22. SKY65152-11 20-Pin MCM Tape and Reel Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200968F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 19, 2009
13
DATA SHEET • SKY65152-11 POWER AMPLIFIER
Ordering Information
Model Name
SKY65152-11 WLAN Power Amplifier
Manufacturing Part Number
SKY65152-11 (Pb-free package)
Evaluation Kit Part Number
TW16-D280-031
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October 19, 2009 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200968F