19-3866; Rev 0; 4/06 KIT ATION EVALU E L B A AVAIL 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications The MAX1214N is a monolithic, 12-bit, 210Msps analog-to-digital converter (ADC) optimized for outstanding dynamic performance at high-IF frequencies beyond 300MHz. The product operates with conversion rates up to 210Msps while consuming only 799mW. At 210Msps and an input frequency up to 100MHz, the MAX1214N achieves an 81.3dBc spurious-free dynamic range (SFDR) with excellent 67dB signal-to-noise ratio (SNR) that remains flat (within 2dB) for input tones up to 250MHz. This makes it ideal for wideband applications such as communications receivers, cable-head end receivers, and power-amplifier predistortion in cellular base-station transceivers. The MAX1214N operates from a single 1.8V power supply. The analog input is designed for AC-coupled differential or single-ended operation. The ADC also features a selectable on-chip divide-by-2 clock circuit that accepts clock frequencies as high as 420MHz. A lowvoltage differential signal (LVDS) sampling clock is recommended for best performance. The converter provides LVDS-compatible digital outputs with data format selectable to be either two’s complement or offset binary. The MAX1214N is available in a 68-pin QFN package with exposed paddle (EP) and is specified over the industrial (-40°C to +85°C) temperature range. See the Pin-Compatible Versions table for a complete selection of 8-bit, 10-bit, and 12-bit high-speed ADCs in this family. Features ♦ 210Msps Conversion Rate ♦ Excellent Low-Noise Characteristics SNR = 67dB at fIN = 100MHz SNR = 65dB at fIN = 250MHz ♦ Excellent Dynamic Range SFDR = 81.3dBc at fIN = 100MHz SFDR = 84.9dBc at fIN = 250MHz ♦ Single 1.8V Supply ♦ 799mW Power Dissipation at fSAMPLE = 210Msps and fIN = 100MHz ♦ On-Chip Track-and-Hold Amplifier ♦ Internal 1.24V-Bandgap Reference ♦ On-Chip Selectable Divide-by-2 Clock Input ♦ LVDS Digital Outputs with Data Clock Output ♦ MAX1214NEVKIT Available Ordering Information PART TEMP RANGE MAX1214NEGK-D -40°C to +85°C 68 QFN-EP* G6800-4 G6800-4 *EP = Exposed paddle. +Denotes lead-free package. D = Dry pack. Pin-Compatible Versions Base-Station Power-Amplifier Linearization RESOLUTION (BITS) SPEED GRADE (Msps) ON-CHIP BUFFER MAX1121 8 250 Yes MAX1122 10 170 Yes MAX1123 10 210 Yes MAX1124 10 250 Yes MAX1213 12 170 Yes MAX1214 12 210 Yes MAX1215 12 250 Yes MAX1213N 12 170 No MAX1214N 12 210 No MAX1215N 12 250 No PART Wireless and Wired Broadband Communications Communications Test Equipment Radar and Satellite Subsystems PKG CODE MAX1214NEGK+D -40°C to +85°C 68 QFN-EP* Applications Cable-Head End Receivers PINPACKAGE Pin Configuration appears at end of data sheet. ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX1214N General Description MAX1214N 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications ABSOLUTE MAXIMUM RATINGS AVCC to AGND ......................................................-0.3V to +2.1V OVCC to OGND .....................................................-0.3V to +2.1V AVCC to OVCC .......................................................-0.3V to +2.1V AGND to OGND ....................................................-0.3V to +0.3V INP, INN to AGND ....................................-0.3V to (AVCC + 0.3V) All Digital Inputs to AGND........................-0.3V to (AVCC + 0.3V) REFIO, REFADJ to AGND ........................-0.3V to (AVCC + 0.3V) All Digital Outputs to OGND ....................-0.3V to (OVCC + 0.3V) Current into Any Pin..........................................................±50mA Continuous Power Dissipation (TA = +70°C, multilayer board) 68-Pin QFN-EP (derate 41.7mW/°C above +70°C)....3333mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature .....................................................+150°C Storage Temperature Range ............................-60°C to +150°C Lead Temperature (soldering,10s) ..................................+300°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (AVCC = OVCC = 1.8V, AGND = OGND = 0, fSAMPLE = 210MHz, differential clock input drive, 0.1µF capacitor on REFIO, internal reference, digital output pins differential RL = 100Ω. Limits are for TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC ACCURACY Resolution 12 Bits fIN = 10MHz (Note 2) -2.1 ±0.75 +2.1 LSB DNL No missing codes (Note 2) -1.0 ±0.3 +1.3 LSB VOS (Note 2) Integral Nonlinearity INL Differential Nonlinearity Transfer Curve Offset -3 +3 Offset Temperature Drift mV ±15 µV/°C 1390 mVP-P ±60 ppm/°C ANALOG INPUTS (INP, INN) Full-Scale Input Voltage Range VFS 1150 Full-Scale Range Temperature Drift Common-Mode Input Voltage VCM Differential Input Capacitance CIN Differential Input Resistance Full-Power Analog Bandwidth Internally self-biased 0.7 V 2.5 pF RIN 1.8 kΩ FPBW 700 MHz REFERENCE (REFIO, REFADJ) Reference Output Voltage VREFIO REFADJ = AGND 1.18 1.24 Reference Temperature Drift REFADJ Input High Voltage 90 VREFADJ Used to disable the internal reference AVCC - 0.3 1.30 V ppm/°C V SAMPLING CHARACTERISTICS Maximum Sampling Rate fSAMPLE Minimum Sampling Rate fSAMPLE Clock Duty Cycle 210 MHz 20 40 to 60 % Aperture Delay tAD Figures 5, 11 620 ps Aperture Jitter tAJ Figure 11 0.15 psRMS 2 Set by clock-management circuit MHz _______________________________________________________________________________________ 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications (AVCC = OVCC = 1.8V, AGND = OGND = 0, fSAMPLE = 210MHz, differential clock input drive, 0.1µF capacitor on REFIO, internal reference, digital output pins differential RL = 100Ω. Limits are for TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 200 500 mVP-P 1.15 ±0.25 V CLOCK INPUTS (CLKP, CLKN) Differential Clock Input Amplitude (Note 3) Clock Input Common-Mode Voltage Range Internally self-biased Clock Differential Input RCLK 11 ±25% kΩ Clock Differential Input Capacitance CCLK 5 pF DYNAMIC CHARACTERISTICS (at AIN = -1dBFS) Signal-to-Noise Ratio Signal-to-Noise and Distortion SNR SINAD fIN = 10MHz 65.5 fIN = 100MHz 65.2 SFDR Worst Harmonics (HD2 or HD3) Two-Tone Intermodulation Distortion TTIMD 67 fIN = 200MHz 65.3 fIN = 250MHz 65.0 fIN = 10MHz 65.3 67.2 fIN = 100MHz 64.9 66.6 fIN = 200MHz dB dB 65.2 fIN = 250MHz Spurious-Free Dynamic Range 67.3 64.9 fIN = 10MHz 77.0 88.5 fIN = 100MHz 76.0 81.3 dBc fIN = 200MHz 82.8 fIN = 250MHz 84.9 fIN = 10MHz -88.5 -77.0 fIN = 100MHz -81.3 -76.0 fIN = 200MHz -82.8 fIN = 250MHz -84.9 fIN1 = 97MHz at -7dBFS, fIN2 = 100MHz at -7dBFS -79 dBc dBc LVDS DIGITAL OUTPUTS (D0P/N–D11P/N, ORP/N) Differential Output Voltage |VOD| RL = 100Ω 280 440 mV Output Offset Voltage OVOS RL = 100Ω 1.110 1.370 V _______________________________________________________________________________________ 3 MAX1214N ELECTRICAL CHARACTERISTICS (continued) MAX1214N 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications ELECTRICAL CHARACTERISTICS (continued) (AVCC = OVCC = 1.8V, AGND = OGND = 0, fSAMPLE = 210MHz, differential clock input drive, 0.1µF capacitor on REFIO, internal reference, digital output pins differential RL = 100Ω. Limits are for TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS LVCMOS DIGITAL INPUTS (CLKDIV, T/B) Digital Input-Voltage Low VIL Digital Input-Voltage High VIH 0.2 x AVCC 0.8 x AVCC V V TIMING CHARACTERISTICS CLK-to-Data Propagation Delay CLK-to-DCLK Propagation Delay DCLK-to-Data Propagation Delay tPDL Figure 5 tCPDL Figure 5 tCPDL - tPDL Figure 5 (Note 3) 2.05 ns 3.95 1.8 1.9 ns 2.0 ns LVDS Output Rise Time tRISE 20% to 80%, CL = 5pF 450 ps LVDS Output Fall Time tFALL 20% to 80%, CL = 5pF 450 ps Figure 5 11 Clock cycles Output Data Pipeline Delay tLATENCY POWER REQUIREMENTS Analog Supply Voltage Range AVCC Digital Supply Voltage Range OVCC Analog Supply Current IAVCC fIN = 100MHz Digital Supply Current IOVCC Analog Power Dissipation PDISS Power-Supply Rejection Ratio (Note 4) Note 1: Note 2: Note 3: Note 4: 4 PSRR 1.70 1.80 1.90 V 1.70 1.80 1.90 V 379 410 mA fIN = 100MHz 65 71 mA fIN = 100MHz 799 866 Offset 1.8 mV/V Gain 1.5 %FS/V mW Values at TA ≥ +25°C guaranteed by production test, values at TA < +25°C guaranteed by design and characterization. Static linearity and offset parameters are computed from an end-point curve fit. Parameter guaranteed by design and characterization: TA = -40°C to +85°C. PSRR is measured with both analog and digital supplies connected to the same potential. _______________________________________________________________________________________ 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications -60 -70 2 -80 -50 -60 -70 -80 5 3 4 -40 -90 MAX1214N toc02 5 -30 -40 -50 -60 -100 -100 -100 -110 -110 0 -40 -50 -60 -70 2 -80 3 fSAMPLE = 210MHz fIN1 = 96.8737793MHz fIN2 = 100.1550293MHz IMD = -79dBc -20 4 5 -30 -40 fIN1 fIN2 fIN2 + fIN1 -50 2fIN2 + fIN1 fIN2 - fIN1 -60 2fIN1 + fIN2 -70 -100 -100 -110 -110 10 20 30 40 50 60 70 80 90 100 ANALOG INPUT FREQUENCY (MHz) 2fIN2 - fIN1 HD2/HD3 (dBc) 80 75 -THD 65 60 55 50 45 fIN (MHz) SINAD 60 55 200 250 45 300 0 10 20 30 40 50 60 70 80 90 100 ANALOG INPUT FREQUENCY (MHz) -50 -55 -60 -65 85 150 10 20 30 40 50 60 70 80 90 100 ANALOG INPUT FREQUENCY (MHz) 65 50 100 150 200 250 300 fIN (MHz) SNR/SINAD vs. ANALOG INPUT AMPLITUDE (fSAMPLE = 210MHz, fIN = 65.087MHz) 70 60 SNR 50 -70 -75 -80 -85 -90 -95 -100 -105 -110 SNR/SINAD (dB) SFDR 100 10 SNR MAX1214N toc08 95 50 8 70 HD2/HD3 vs. ANALOG INPUT FREQUENCY (fSAMPLE = 210MHz, AIN = -1dBFS) MAX1214N toc07 100 0 7 50 0 SFDR/(-THD) vs. ANALOG INPUT FREQUENCY (fSAMPLE = 210MHz, AIN = -1dBFS) 70 6 SNR/SINAD vs. ANALOG INPUT FREQUENCY (fSAMPLE = 210MHz, AIN = -1dBFS) -90 90 5 -80 -90 0 9 4 0 SNR/SINAD (dB) -30 0 -10 AMPLITUDE (dBFS) fSAMPLE = 210MHz fIN = 249.913MHz AIN = -0.994dBFS SNR = 65dB SINAD = 64.9dB THD = -79.3dBc SFDR = 85dBc HD2 = -85dBc HD3 = -86dBc -20 10 20 30 40 50 60 70 80 90 100 ANALOG INPUT FREQUENCY (MHz) TWO-TONE IMD PLOT (8192-POINT DATA RECORD) MAX1214N toc04 0 -10 3 -80 -110 10 20 30 40 50 60 70 80 90 100 ANALOG INPUT FREQUENCY (MHz) 2 -70 -90 FFT PLOT (8192-POINT DATA RECORD) AMPLITUDE (dBFS) 3 -90 0 SFDR/(-THD) (dBc) -20 MAX1214N toc06 -50 -30 fSAMPLE = 210MHz fIN = 199.771MHz AIN = -0.961dBFS SNR = 65.4dB SINAD = 65.1dB THD = -78.5dBc SFDR = 82.8dBc HD2 = -82.8dBc HD3 = -84.6dBc MAX1214N toc9 -40 -20 AMPLITUDE (dBFS) -30 0 -10 MAX1214N toc05 AMPLITUDE (dBFS) -20 fSAMPLE = 210MHz fIN = 100.155MHz AIN = -0.954dBFS SNR = 67dB SINAD = 66.6dB THD = -76.8dBc SFDR = 81.2dBc HD2 = -81.2dBc HD3 = -81.8dBc 2 4 -10 AMPLITUDE (dBFS) fSAMPLE = 210MHz fIN = 12.484MHz AIN = -0.97dBFS SNR = 67.3dB SINAD = 67.2dB THD = -83.4dBc SFDR = 88.5dB HD2 = -90.4dBc HD3 = -96.7dBc -10 FFT PLOT (8192-POINT DATA RECORD) 0 MAX1214N toc01 0 FFT PLOT (8192-POINT DATA RECORD) MAX1214N toc03 FFT PLOT (8192-POINT DATA RECORD) HD2 40 SINAD 30 20 HD3 10 0 0 50 100 150 fIN (MHz) 200 250 300 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 ANALOG INPUT AMPLITUDE (dBFS) _______________________________________________________________________________________ 5 MAX1214N Typical Operating Characteristics (AVCC = OVCC = 1.8V, AGND = OGND = 0, fSAMPLE = 210MHz, AIN = -1dBFS; see each TOC for detailed information on test conditions, differential input drive, differential sine-wave clock input drive, 0.1µF capacitor on REFIO, internal reference, digital output pins differential RL = 100Ω, TA = +25°C.) Typical Operating Characteristics (continued) (AVCC = OVCC = 1.8V, AGND = OGND = 0, fSAMPLE = 210MHz, AIN = -1dBFS; see each TOC for detailed information on test conditions, differential input drive, differential sine-wave clock input drive, 0.1µF capacitor on REFIO, internal reference, digital output pins differential RL = 100Ω, TA = +25°C.) HD2/HD3 vs. ANALOG INPUT AMPLITUDE (fSAMPLE = 210MHz, fIN = 65.087MHz) SNR 70 65 SNR/SINAD (dB) HD2/HD3 (dBc) 75 -60 -70 HD2 -80 SINAD 60 55 50 -90 45 -100 -110 40 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 MAX1214N toc12 -50 -THD SNR/SINAD vs. SAMPLE FREQUENCY (fIN = 65.087MHz, AIN = -1dBFS) MAX1214N toc11 HD2 -40 SFDR -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 0 20 40 60 80 100 120 140 160 180 200 220 ANALOG INPUT AMPLITUDE (dBFS) ANALOG INPUT AMPLITUDE (dBFS) fSAMPLE (MHz) SFDR/(-THD) vs. SAMPLE FREQUENCY (fIN = 65.087MHz, AIN = -1dBFS) HD2/HD3 vs. SAMPLE FREQUENCY (fIN = 65.087MHz, AIN = -1dBFS) TOTAL POWER DISSIPATION vs. SAMPLE FREQUENCY (fIN = 65.087MHz, AIN = -1dBFS) HD2/HD3 (dBc) 85 80 -THD 70 65 60 0.850 HD3 0.825 50 0.725 0.700 0 20 40 60 80 100 120 140 160 180 200 220 20 39 58 77 96 115 134 153 172 191 210 20 40 60 80 100 120 140 160 180 200 220 fSAMPLE (MHz) fSAMPLE (MHz) fSAMPLE (MHz) INTEGRAL NONLINEARITY vs. DIGITAL OUTPUT CODE DIFFERENTIAL NONLINEARITY vs. DIGITAL OUTPUT CODE GAIN BANDWIDTH PLOT (fSAMPLE = 210MHz, AIN = -1dBFS) 0.7 MAX1214N toc16 0.4 DNL (LSB) 0.5 0.2 -0.1 -0.4 -0.5 0 -1 0.1 -0.2 1 GAIN (dB) 0.8 MAX1214N toc17 0 0.775 0.750 HD2 -110 -115 -120 55 0.800 MAX1214N toc18 75 -75 -80 -85 -90 -95 -100 -105 MAX1214N toc15 SFDR 90 0.875 PDISS (W) 95 -60 -65 -70 MAX1214N toc14 100 SFDR/(-THD) (dBc) -30 MAX1214N toc10 100 95 90 85 80 75 70 65 60 55 50 45 40 35 30 MAX1214N toc13 SFDR/(-THD) (dBc) SFDR/(-THD) vs. ANALOG INPUT AMPLITUDE (fSAMPLE = 210MHz, fIN = 65.087MHz) INL (LSB) MAX1214N 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications -2 -3 -4 -5 -6 -0.8 -0.7 0 512 1024 1536 2048 2560 3072 3584 4096 DIGITAL OUTPUT CODE 6 -7 0 512 1024 1536 2048 2560 3072 3584 4096 DIGITAL OUTPUT CODE 1 10 100 ANALOG INPUT FREQUENCY (MHz) ______________________________________________________________________________________ 1000 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications SFDR/(-THD) vs. TEMPERATURE (fSAMPLE = 210MHz, fIN = 100MHz, AIN = -1dBFS) 66.5 65.5 SINAD 64.5 63.5 62.5 SFDR 95 HD2 90 85 80 75 HD2/HD3 (dBc) SFDR/(-THD) (dBc) 67.5 -THD 70 80 75 HD3 70 65 60 65 55 61.5 50 60 60.5 10 35 60 -40 85 -15 10 35 60 -15 SNR/SINAD vs. SUPPLY VOLTAGE (fIN = 65.087MHz, AIN = -1dBFS) 69 SNR 100 SINAD 65 97 94 SFDR/(-THD) (dBc) 67 66 35 60 85 SFDR/(-THD) vs. SUPPLY VOLTAGE (fIN = 65.087MHz, AIN = -1dBFS) MAX1214N toc22 70 10 TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C) 68 -40 85 64 63 MAX1214N toc23 -15 SFDR 91 88 85 82 -THD 79 62 76 61 73 60 70 1.70 1.75 1.80 1.85 1.90 1.70 1.75 1.80 1.85 1.90 SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) HD2/HD3 vs. SUPPLY VOLTAGE (fIN = 65.087MHz, AIN = -1dBFS) REFERENCE VOLTAGE vs. SUPPLY VOLTAGE (fIN = 65.087MHz, AIN = -1dBFS) 1.248 MAX1214N toc24 -70 -75 -80 1.247 1.246 HD3 VREFIO (V) -85 -90 -95 -100 HD2 MAX1214N toc25 SNR/SINAD (dB) -40 HD2/HD3 (dBc) SNR/SINAD (dB) SNR 85 100 MAX1214N toc20 69.5 68.5 90 MAX1214N toc19 70.5 HD2/HD3 vs. TEMPERATURE (fSAMPLE = 210MHz, fIN = 100MHz, AIN = -1dBFS) MAX1214N toc21 SNR/SINAD vs. TEMPERATURE (fSAMPLE = 210MHz, fIN = 100MHz, AIN = -1dBFS) 1.245 1.244 1.243 -105 1.242 -110 1.241 -115 1.240 -120 1.70 1.75 1.80 1.85 SUPPLY VOLTAGE (V) 1.90 1.70 1.75 1.80 1.85 1.90 SUPPLY VOLTAGE (V) _______________________________________________________________________________________ 7 MAX1214N Typical Operating Characteristics (continued) (AVCC = OVCC = 1.8V, AGND = OGND = 0, fSAMPLE = 210MHz, AIN = -1dBFS; see each TOC for detailed information on test conditions, differential input drive, differential sine-wave clock input drive, 0.1µF capacitor on REFIO, internal reference, digital output pins differential RL = 100Ω, TA = +25°C.) MAX1214N 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications Pin Description PIN NAME FUNCTION 1, 6, 11–14, 20, 25, 62, 63, 65 AVCC Analog Supply Voltage. Bypass AVCC to AGND with a parallel combination of 0.1µF and 0.22µF capacitors for best decoupling results. Connect all AVCC inputs together. See the Grounding, Bypassing, and Board Layout Considerations section. 2, 5, 7, 10, 15, 16, 18, 19, 21, 24, 64, 66, 67 AGND Analog Converter Ground. Connect all AGND inputs together. 3 REFIO Reference Input/Output. Pull REFADJ high to allow REFIO to accept an external reference. Pull REFADJ low to activate the internal 1.24V-bandgap reference. Connect a 0.1µF capacitor from REFIO to AGND for both internal and external reference. 4 REFADJ 8 INP Reference Adjust Input. REFADJ allows for FSR adjustments by placing a resistor or trim potentiometer between REFADJ and AGND (decreases FSR) or REFADJ and REFIO (increases FSR). Connect REFADJ to AVCC to override the internal reference with an external source connected to REFIO. Connect REFADJ to AGND to allow the internal reference to determine the FSR of the data converter. See the FSR Adjustment Using the Internal Bandgap Reference section. Positive Analog Input Terminal. Internally self-biased to 0.7V. 9 INN Negative Analog Input Terminal. Internally self-biased to 0.7V. Clock Divider Input. CLKDIV controls the sampling frequency relative to the input clock frequency. CLKDIV has an internal pulldown resistor. CLKDIV = 0: Sampling frequency is at one-half the input clock frequency. CLKDIV = 1: Sampling frequency is equal to the input clock frequency. 17 CLKDIV 22 CLKP True Clock Input. Apply an LVDS-compatible input level to CLKP. Internally self-biased to 1.15V. 23 CLKN Complementary Clock Input. Apply an LVDS-compatible input level to CLKN. Internally selfbiased to 1.15V. 26, 45, 61 OGND Digital Converter Ground. Ground connection for digital circuitry and output drivers. Connect all OGND inputs together. 27, 28, 41, 44, 60 OVCC Digital Supply Voltage. Bypass OVCC with a 0.1µF capacitor to OGND. Connect all OVCC inputs together. See the Grounding, Bypassing, and Board Layout Considerations section. 29 D0N Complementary Output Bit 0 (LSB) 30 D0P True Output Bit 0 (LSB) 31 D1N Complementary Output Bit 1 32 D1P True Output Bit 1 33 D2N Complementary Output Bit 2 34 D2P True Output Bit 2 35 D3N Complementary Output Bit 3 36 D3P True Output Bit 3 8 _______________________________________________________________________________________ 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications PIN NAME FUNCTION 37 D4N Complementary Output Bit 4 38 D4P True Output Bit 4 39 D5N Complementary Output Bit 5 40 D5P True Output Bit 5 42 DCLKN Complementary Clock Output. This output provides an LVDS-compatible output level and can be used to synchronize external devices to the converter clock. 43 DCLKP True Clock Output. This output provides an LVDS-compatible output level and can be used to synchronize external devices to the converter clock. 46 D6N Complementary Output Bit 6 47 D6P True Output Bit 6 48 D7N Complementary Output Bit 7 49 D7P True Output Bit 7 50 D8N Complementary Output Bit 8 51 D8P True Output Bit 8 52 D9N Complementary Output Bit 9 53 D9P True Output Bit 9 54 D10N Complementary Output Bit 10 55 D10P True Output Bit 10 56 D11N Complementary Output Bit 11 (MSB) 57 D11P True Output Bit 11 (MSB) 58 ORN Complementary Out-of-Range Control Bit Output. If an out-of-range condition is detected, bit ORN flags this condition by transitioning low. 59 ORP True Out-of-Range Control Bit Output. If an out-of-range condition is detected, bit ORP flags this condition by transitioning high. 68 T/B Output Format Select. This LVCMOS-compatible input controls the digital output format of the MAX1214N. T/B has an internal pulldown resistor. T/B = 0: Two’s-complement output format. T/B = 1: Binary output format. — EP Exposed Paddle. The exposed paddle is located on the backside of the chip and must be connected to AGND. _______________________________________________________________________________________ 9 MAX1214N Pin Description (continued) MAX1214N 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications OVCC AVCC INP 12-BIT PIPELINE ADC T/H MAX1214N INN 900Ω 900Ω DCLKP DCLKN COMMONMODE BUFFER REFIO REFERENCE REFADJ DIV1/DIV2 D0P/N CLOCK MANAGEMENT D1P/N LVDS DATA PORT D2P/N D11P/N CLKP ORP/ORN CLKN CLKDIV T/B AGND OGND Figure 1. Block Diagram Detailed Description— Theory of Operation The MAX1214N uses a fully differential pipelined architecture that allows for high-speed conversion, optimized accuracy, and linearity while minimizing power consumption. Both positive (INP) and negative/complementary analog input terminals (INN) are centered around a 0.7V common-mode voltage, and accept a differential analog input voltage swing of ±VFS / 4 each, resulting in a typical 1.39V P-P differential full-scale signal swing. Inputs INP and INN are sampled when the differential sampling clock signal transitions high. When using the clock-divide mode, the analog inputs are sampled at every other high transition of the differential sampling clock. Each pipeline converter stage converts its input voltage to a digital output code. At every stage, except the last, the error between the input voltage and the digital output code is multiplied and passed along to the next 10 pipeline stage. Digital error correction compensates for ADC comparator offsets in each pipeline stage and ensures no missing codes. The result is a 12-bit parallel digital output word in user-selectable two’s-complement or offset binary output formats with LVDS-compatible output levels. See Figure 1 for a more detailed view of the MAX1214N architecture. Analog Inputs (INP, INN) INP and INN are the fully differential inputs of the MAX1214N. Differential inputs usually feature good rejection of even-order harmonics, which allows for enhanced AC performance as the signals are progressing through the analog stages. The MAX1214N analog inputs are self-biased at a 0.7V common-mode voltage and allow a 1.39VP-P differential input voltage swing (Figure 2). Both inputs are self-biased through 900Ω resistors, resulting in a typical differential input resistance of 1.8kΩ. Drive the analog inputs of the MAX1214N in AC-coupled configuration to achieve the best dynamic performance. See the TransformerCoupled, Differential Analog Input Drive section. ______________________________________________________________________________________ 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications MAX1214N AVCC T/H MAX1214N INP CP 900Ω CS 12-BIT PIPELINE ADC 900Ω CS INN CP FROM CLOCKMANAGEMENT BLOCK TO COMMON MODE CS IS THE SAMPLING CAPACITANCE. CP IS THE PARASITIC CAPACITANCE ~ 1pF. VCM + VFS / 4 INP VCM INN VCM - VFS / 4 GND +VFS / 2 GND 1.39V DIFFERENTIAL FSR INP - INN -VFS / 2 Figure 2. Simplified Analog Input Architecture and Allowable Input Voltage Range ______________________________________________________________________________________ 11 MAX1214N 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications The MAX1214N also features an internal clock-management circuit (duty-cycle equalizer) that ensures the clock signal applied to inputs CLKP and CLKN is processed to provide a 50% duty-cycle clock signal that desensitizes the performance of the converter to variations in the duty cycle of the input clock source. Note that the clock duty-cycle equalizer cannot be turned off externally and requires a minimum 20MHz clock frequency to allow the device to meet data sheet specifications. On-Chip Reference Circuit The MAX1214N features an internal 1.24V-bandgap reference circuit (Figure 3), which, in combination with an internal reference-scaling amplifier, determines the FSR of the MAX1214N. Bypass REFIO with a 0.1µF capacitor to AGND. To compensate for gain errors or increase/decrease the ADC’s FSR, the voltage of this bandgap reference can be indirectly adjusted by adding an external resistor (e.g., 100kΩ trim potentiometer) between REFADJ and AGND or REFADJ and REFIO. See the Applications Information section for a detailed description of this process. To disable the internal reference, connect REFADJ to AVCC. Apply an external, stable reference to set the converter’s full scale. To enable the internal reference, connect REFADJ to AGND. Data Clock Outputs (DCLKP, DCLKN) The MAX1214N features a differential clock output, which can be used to latch the digital output data with an external latch or receiver. Additionally, the clock output can be used to synchronize external devices (e.g., FPGAs) to the ADC. DCLKP and DCLKN are differential outputs with LVDS-compatible voltage levels. There is a 3.95ns delay time between the rising (falling) edge of CLKP (CLKN) and the rising edge of DCLKP (DCLKN). See Figure 5 for timing details. Clock Inputs (CLKP, CLKN) Drive the clock inputs of the MAX1214N with an LVDS- or LVPECL-compatible clock to achieve the best dynamic performance. The clock signal source must be of high quality and low phase noise to avoid any degradation in the noise performance of the ADC. The clock inputs (CLKP, CLKN) are internally biased to 1.15V and accept a typical 0.5VP-P differential signal swing (Figure 4). See the Differential, AC-Coupled LVPECL-Compatible Clock Input section for more circuit details on how to drive CLKP and CLKN appropriately. Although not recommended, the clock inputs also accept a single-ended input signal. Divide-by-2 Clock Control (CLKDIV) The MAX1214N offers a clock control line (CLKDIV), which supports the reduction of clock jitter in a system. Connect CLKDIV to OGND to enable the ADC’s internal divide-by-2 clock divider. Data is now updated at onehalf the ADC’s input clock rate. CLKDIV has an internal pulldown resistor and can be left open for applications that require this divide-by-2 mode. Connecting CLKDIV to OVCC disables the divide-by-2 mode. REFT ADC FULL SCALE = REFT - REFB 1V G REFERENCESCALING AMPLIFIER REFB REFERENCE BUFFER REFIO 0.1µF REFADJ* CONTROL LINE TO DISABLE REFERENCE BUFFER 100Ω* MAX1214N AVCC AVCC / 2 REFT: TOP OF REFERENCE LADDER. REFB: BOTTOM OF REFERENCE LADDER. Figure 3. Simplified Reference Architecture 12 ______________________________________________________________________________________ *REFADJ MAY BE SHORTED TO AGND DIRECTLY. 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications Digital outputs D0P/N–D11P/N, DCLKP/N, and ORP/N are LVDS compatible, and data on D0P/N–D11P/N is presented in either binary or two’s-complement format (Table 1). The T/B control line is an LVCMOS-compatible input, which allows the user to select the desired output format. Pulling T/B low outputs data in two’s complement and pulling it high presents data in offset binary format on the 12-bit parallel bus. T/B has an internal pulldown resistor and may be left unconnected in applications using only two’s-complement output format. All LVDS outputs provide a typical 0.325V voltage swing around a 1.2V common-mode voltage, and must be terminated at the far end of each transmission line pair (true and complementary) with 100Ω. Apply a 1.7V to 1.9V voltage supply at OVCC to power the LVDS outputs. The MAX1214N offers an additional differential output pair (ORP, ORN) to flag out-of-range conditions, where out-of-range is above positive or below negative full scale. An out-of-range condition is identified with ORP (ORN) transitioning high (low). 2.89kΩ CLKP 5.35kΩ 5.35kΩ CLKN 5.35kΩ AGND Figure 4. Simplified Clock Input Architecture System Timing Requirements Figure 5 shows the relationship between the clock input and output, analog input, sampling event, and data output. The MAX1214N samples on the rising (falling) edge of CLKP (CLKN). Output data is valid on the next rising (falling) edge of the DCLKP (DCLKN) clock, but has an internal latency of 11 clock cycles. SAMPLING EVENT SAMPLING EVENT Note: Although a differential LVDS output architecture reduces single-ended transients to the supply and ground planes, capacitive loading on the digital outputs should still be kept as low as possible. Using LVDS buffers on the digital outputs of the ADC when driving larger loads may improve overall performance and reduce system-timing constraints. SAMPLING EVENT SAMPLING EVENT SAMPLING EVENT N + 11 N + 12 INP INN tAD CLKN N N+1 N + 10 CLKP tCH tCL tCPDL DCLKN N - 11 N - 10 N-1 N+1 N DCLKP tLATENCY tPDL D0P/D0N– D11P/D11N ORP/N N - 11 N - 10 N-9 N-1 N N+1 tCPDL - tPDL~ 0.4 x tSAMPLE WITH tSAMPLE = 1 / fSAMPLE NOTE: THE ADC SAMPLES ON THE RISING EDGE OF CLKP. THE RISING EDGE OF DCLKP CAN BE USED TO EXTERNALLY LATCH THE OUTPUT DATA. Figure 5. System and Output Timing Diagram ______________________________________________________________________________________ 13 MAX1214N Digital Outputs (D0P/N–D11P/N, DCLKP/N, ORP/N) and Control Input T/B AVDD MAX1214N 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications Table 1. MAX1214N Digital Output Coding INP ANALOG INPUT VOLTAGE LEVEL INN ANALOG INPUT VOLTAGE LEVEL OUT-OF-RANGE ORP (ORN) BINARY DIGITAL OUTPUT CODE (D11P/N–D0P/N) TWO’S-COMPLEMENT DIGITAL OUTPUT CODE (D11P/N–D0P/N) > VCM + VFS / 4 < VCM - VFS / 4 1 (0) 1111 1111 1111 (exceeds +FS, OR set) 0111 1111 1111 (exceeds +FS, OR set) VCM + VFS / 4 VCM - VFS / 4 0 (1) 1111 1111 1111 (+FS) 0111 1111 1111 (+FS) VCM VCM 0 (1) 1000 0000 0000 or 0111 1111 1111 (FS/2) 0000 0000 0000 or 1111 1111 1111 (FS/2) VCM - VFS / 4 VCM + VFS / 4 0 (1) 0000 0000 0000 (-FS) 1000 0000 0000 (-FS) 1 (0) 0000 0000 0000 (exceeds -FS, OR set) 1000 0000 0000 (exceeds -FS, OR set) < VCM + VFS / 4 > VCM - VFS / 4 CONFIGURATION TO INCREASE THE FSR OF THE MAX1214N CONFIGURATION TO DECREASE THE FSR OF THE MAX1214N REFERENCESCALING AMPLIFIER ADC FULL SCALE = REFT - REFB REFT REFERENCESCALING AMPLIFIER ADC FULL SCALE = REFT - REFB REFT G G REFERENCE REFB BUFFER REFERENCE REFB BUFFER 1V 1V REFIO REFIO 0.1µF REFADJ 0.1µF 13kΩ TO 1MΩ REFADJ CONTROL LINE TO DISABLE REFERENCE BUFFER MAX1214N AVCC CONTROL LINE TO DISABLE REFERENCE BUFFER MAX1214N AVCC / 2 AVCC 13kΩ TO 1MΩ AVCC / 2 REFT: TOP OF REFERENCE LADDER. REFB: BOTTOM OF REFERENCE LADDER. Figure 6a. Circuit Suggestions to Adjust the ADC’s Full-Scale Range Applications Information FSR Adjustments Using the Internal Bandgap Reference The MAX1214N supports a 10% (±5%) full-scale adjustment range. To decrease the full-scale signal range, add an external resistor value ranging from 13kΩ to 1MΩ between REFADJ and AGND. Adding a variable resistor, potentiometer, or predetermined resis14 tor value between REFADJ and REFIO increases the FSR of the data converter. Figure 6a shows the two possible configurations and their impact on the overall full-scale range adjustment of the MAX1214N. Do not use resistor values of less than 13kΩ to avoid instability of the internal gain regulation loop for the bandgap reference. See Figure 6b for the resulting FSR for a series of resistor values. ______________________________________________________________________________________ 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications The MAX1214N dynamic performance depends on the use of a very clean clock source. The phase noise floor of the clock source has a negative impact on the SNR performance. Spurious signals on the clock signal source also affect the ADC’s dynamic range. The preferred method of clocking the MAX1214N is differentially with LVDS- or LVPECL-compatible input levels. The fast data transition rates of these logic families minimize the clock-input circuitry’s transition uncertainty, thereby improving the SNR performance. To accomplish this, a 50Ω reverse-terminated clock signal source with low phase noise is AC-coupled into a fast differential receiver such as the MC100LVEL16 (Figure 7). The receiver produces the necessary LVPECL output levels to drive the clock inputs of the data converter. FS VOLTAGE vs. ADJUST RESISTOR MAX1214N fig06b 1.34 1.32 RESISTOR VALUE APPLIED BETWEEN REFADJ AND REFIO INCREASES VFS 1.30 VFS (V) 1.28 1.26 1.24 1.22 RESISTOR VALUE APPLIED BETWEEN REFADJ AND AGND DECREASES VFS 1.20 1.18 1.16 1.14 0 100 200 300 400 500 600 700 800 900 1000 FS ADJUST RESISTOR (kΩ) Transformer-Coupled, Differential Analog Input Drive The MAX1214N provides the best SFDR and THD with fully differential input signals and it is not recommended to drive the ADC inputs in single-ended configuration. In differential input mode, even-order harmonics are usually lower since INP and INN are balanced, and Figure 6b. FS Adjustment Range vs. FS Adjustment Resistor VCLK 0.1µF 10kΩ SINGLE-ENDED INPUT TERMINAL 8 0.1µF 0.1µF 2 7 150Ω 50Ω MC100LVEL16D 0.1µF 6 3 510Ω 150Ω 510Ω AVCC OVCC 4 5 0.01µF INP CLKN CLKP D0P/N–D11P/N, 0RP/N MAX1214N INN 12 AGND OGND Figure 7. Differential, AC-Coupled, PECL-Compatible Clock Input Configuration ______________________________________________________________________________________ 15 MAX1214N Differential, AC-Coupled, LVPECL-Compatible Clock Input MAX1214N 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications each of the ADC inputs only requires half the signal swing compared to a single-ended configuration. Wideband RF transformers provide an excellent solution to convert a single-ended signal to a fully differential signal, required by the MAX1214N to reach its optimum dynamic performance. Apply a secondaryside termination of a 1:1 transformer (e.g., Mini-Circuit’s ADT1-1WT) into two separate 24.9Ω resistors. Higher source impedance values can be used at the expense of degradation in dynamic performance. This configuration optimizes THD and SFDR performance of the ADC by reducing the effects of transformer parasitics. However, the source impedance combined with the shunt capacitance provided by a PC board and the ADC’s parasitic capacitance limit the ADC’s full-power input bandwidth. To further enhance THD and SFDR performance at high input frequencies (> 100MHz), a second transformer (Figure 8) should be placed in series with the singleended-to-differential conversion transformer. This transformer reduces the increase of even-order harmonics at high frequencies. Single-Ended, AC-Coupled Analog Inputs Although not recommended, the MAX1214N can be used in single-ended mode (Figure 9). AC-couple the analog signals to the positive input INP through a 0.1µF capacitor terminated with a 49.9Ω resistor to AGND. Terminate the negative input INN with a 49.9Ω resistor in series with a 0.1µF capacitor to AGND. In single-ended mode, the input range is limited to approximately half of the FSR of the device, and dynamic performance usually degrades. AVCC SINGLE-ENDED INPUT TERMINAL 0.1µF 0.1µF 6 1 ADT1-1WT 4 OVCC INP 3 ADT1-1WT 5 2 5 2 3 6 1 4 12 24.9Ω D0P/N–D11P/N, 0RP/N 10Ω MAX1214N 24.9Ω 10Ω 12 INN 0.1µF AGND OGND Figure 8. Analog Input Configuration with Back-to-Back Transformers and Secondary-Side Termination AVCC SINGLE-ENDED INPUT TERMINAL 0.1µF OVCC INP D0P/N–D11P/N, 0RP/N 49.9Ω 1% 0.1µF MAX1214N INN 12 49.9Ω 1% AGND OGND Figure 9. Single-Ended, AC-Coupled Analog Input Configuration 16 ______________________________________________________________________________________ 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications The MAX1214N requires board-layout design techniques suitable for high-speed data converters. This ADC provides separate analog and digital power supplies. The analog and digital supply voltage pins accept 1.7V to 1.9V input voltage ranges. Although both supply types can be combined and supplied from one source, it is recommended to use separate sources to cut down on performance degradation caused by digital switching currents, which can couple into the analog supply network. Isolate analog and digital supplies (AVCC and OVCC) where they enter the PC board with separate networks of ferrite beads and capacitors to their corresponding grounds (AGND, OGND). To achieve optimum performance, provide each supply with a separate network of a 47µF tantalum capacitor and parallel combinations of 10µF and 1µF ceramic capacitors. Additionally, the ADC requires each supply pin to be bypassed with separate 0.1µF ceramic capacitors (Figure 10). Locate these capacitors directly at the ADC supply pins or as close as possible to the MAX1214N. Choose surface-mount capacitors, whose preferred location should be on the same side as the converter to save space and minimize the inductance. If close placement on the same side is not possible, these bypassing capacitors may be routed through vias to the bottom side of the PC board. Multilayer boards with separated ground and power planes produce the highest level of signal integrity. Consider the use of a split ground plane arranged to match the physical location of analog and digital ground on the ADC’s package. The two ground planes should be joined at a single point so the noisy digital ground currents do not interfere with the analog ground plane. The dynamic currents that may need to travel long distances before they are recombined at a common source ground, resulting in large and undesirable ground loops, are a major concern with this approach. Ground loops can degrade the input noise by coupling back to the analog front-end of the converter, resulting in increased spurious activity, leading to decreased noise performance. Alternatively, all ground pins could share the same ground plane, if the ground plane is sufficiently isolated from any noisy, digital systems ground. To minimize the coupling of the digital output signals from the analog input, segregate the digital output bus carefully from the analog input circuitry. To further minimize the effects of digital noise coupling, ground return vias can be positioned throughout the layout to divert digital switching currents away from the sensitive analog sections of the ADC. This approach does not require split ground planes, but can be accomplished by placing substantial ground connections between the analog front-end and the digital outputs. The MAX1214N is packaged in a 68-pin QFN-EP package (package code: G6800-4), providing greater design flexibility, increased thermal dissipation, and optimized AC performance of the ADC. The exposed paddle (EP) must be soldered down to AGND. In this package, the data converter die is attached to an EP lead frame with the back of this frame exposed BYPASSING—ADC LEVEL BYPASSING—BOARD LEVEL OVCC AVCC 0.1µF AVCC 0.1µF 1µF AGND 10µF 47µF ANALOG POWERSUPPLY SOURCE 10µF 47µF DIGITAL/OUTPUT DRIVER POWERSUPPLY SOURCE OGND D0P/N–D11P/N, 0RP/N OVCC MAX1214N 12 1µF AGND OGND NOTE: EACH POWER-SUPPLY PIN (ANALOG AND DIGITAL) SHOULD BE DECOUPLED WITH AN INDIVIDUAL 0.1µF CAPACITOR AS CLOSE AS POSSIBLE TO THE ADC. Figure 10. Grounding, Bypassing, and Decoupling Recommendations for the MAX1214N ______________________________________________________________________________________ 17 MAX1214N Grounding, Bypassing, and Board Layout Considerations MAX1214N 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications at the package bottom surface, facing the PC board side of the package. This allows a solid attachment of the package to the board with standard infrared (IR) flow soldering techniques. Thermal efficiency is one of the factors for selecting a package with an exposed paddle for the MAX1214N. The exposed paddle improves thermal and ensures a solid ground connection between the ADC and the PC board’s analog ground layer. Considerable care must be taken when routing the digital output traces for a high-speed, high-resolution data converter. Keep trace lengths at a minimum and place minimal capacitive loading (less than 5pF) on any digital trace to prevent coupling to sensitive analog sections of the ADC. It is recommended running the LVDS output traces as differential lines with 100Ω matched impedance from the ADC to the LVDS load device. Static Parameter Definitions Integral Nonlinearity (INL) Integral nonlinearity is the deviation of the values on an actual transfer function from a straight line. This straight line can be either a best straight-line fit or a line drawn between the end points of the transfer function, once offset and gain errors have been nullified. The static linearity parameters for the MAX1214N are measured using the histogram method with a 10MHz input frequency. Differential Nonlinearity (DNL) Differential nonlinearity is the difference between an actual step width and the ideal value of 1 LSB. A DNL error specification of less than 1 LSB guarantees no missing codes and a monotonic transfer function. The MAX1214N’s DNL specification is measured with the histogram method based on a 10MHz input tone. Signal-to-Noise Ratio (SNR) For a waveform perfectly reconstructed from digital samples, the theoretical maximum SNR is the ratio of the fullscale analog input (RMS value) to the RMS quantization error (residual error). The ideal, theoretical minimum analog-to-digital noise is caused by quantization error only and results directly from the ADC’s resolution (N bits): SNR[max] = 6.02 x N + 1.76 In reality, other noise sources such as thermal noise, clock jitter, signal phase noise, and transfer function nonlinearities also contribute to the SNR calculation and should be considered when determining the signal-tonoise ratio in ADC. The SNR for the MAX1214N is specified in decibels (dB), however, SNR can also be specified in dBFS. To obtain the SNR in dBFS, simply subtract the amplitude of the input tone (this number is given in dBFS) at which the SNR is measured from the SNR number in dB. For example, an ADC having an SNR of 67dB resulting from an input tone with amplitude -1dBFS will have an SNR of 67 - (-1) = 68dBFS. Signal-to-Noise Plus Distortion (SINAD) SINAD is computed by taking the ratio of the RMS signal to all spectral components excluding the fundamental and the DC offset. In the case of the MAX1214N, SINAD is computed from a curve fit. CLKP CLKN ANALOG INPUT tAD Dynamic Parameter Definitions Aperture Jitter tAJ SAMPLED DATA (T/H) Figure 11 shows the aperture jitter (tAJ), which is the sample-to-sample variation in the aperture delay. Aperture Delay Aperture delay (tAD) is the time defined between the rising edge of the sampling clock and the instant when an actual sample is taken (Figure 11). 18 T/H TRACK HOLD TRACK Figure 11. Aperture Jitter/Delay Specifications ______________________________________________________________________________________ 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications The fundamental input tone amplitudes (V1 and V2) are at -7dBFS. The intermodulation products are the amplitudes of the output spectrum at the following frequencies: • Second-order intermodulation products: fIN1 + fIN2, fIN2 - fIN1 • Third-order intermodulation products: 2 x fIN1 - fIN2, 2 x fIN2 - fIN1, 2 x fIN1 + fIN2, 2 x fIN2 + fIN1 • Fourth-order intermodulation products: 3 x fIN1 - fIN2, 3 x fIN2 - fIN1, 3 x fIN1 + fIN2, 3 x fIN2 + fIN1 • Fifth-order intermodulation products: 3 x fIN1 - 2 x fIN2, 3 x fIN2 - 2 x fIN1, 3 x fIN1 + 2 x fIN2, 3 x fIN2 + 2 x fIN1 Intermodulation Distortion (IMD) IMD is the ratio of the RMS sum of the intermodulation products to the RMS sum of the two fundamental input tones. This is expressed as: VIM12 + VIM22 + ...... + VIM32 + VIMn2 IMD = 20 × log V12 + V22 Full-Power Bandwidth A large -1dBFS analog input signal is applied to an ADC and the input frequency is swept up to the point where the amplitude of the digitized conversion result has decreased by 3dB. The -3dB point is defined as the full-power input bandwidth frequency of the ADC. Pin Configuration 63 62 61 60 59 58 D9P D9N D10N D10P D11N D11P ORN ORP OVCC OGND AVCC 67 66 65 64 AVCC AGND 68 AVCC AGND AGND T/B TOP VIEW 57 56 55 54 53 52 AVCC 1 51 D8P AGND 2 50 D8N REFIO 3 49 D7P REFADJ 4 48 D7N AGND 5 47 D6P AVCC 6 46 D6N AGND 7 45 OGND INP 8 44 OVCC INN 9 43 DCLKP AGND 10 42 DCLKN AVCC 11 41 OVCC AVCC 12 40 D5P AVCC 13 39 D5N D4P EP MAX1214N AVCC 14 38 AGND 15 37 D4N AGND 16 36 D3P 35 D3N CLKDIV 17 D2P D2N D1P D1N D0P D0N OVCC OVCC AVCC OGND AGND CLKN CLKP AVCC AGND AGND AGND 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 QFN EP = EXPOSED PADDLE ______________________________________________________________________________________ 19 MAX1214N Spurious-Free Dynamic Range (SFDR) SFDR is the ratio of the RMS amplitude of the carrier frequency (maximum signal component) to the RMS value of the next-largest noise or harmonic distortion component. SFDR is usually measured in dBc with respect to the carrier frequency amplitude or in dBFS with respect to the ADC’s full-scale range. Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) For the MAX1214N, the package code is G6800-4. 68L QFN.EPS MAX1214N 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications PACKAGE OUTLINE, 68L QFN, 10x10x0.9 MM 1 C 21-0122 2 20 ______________________________________________________________________________________ 1.8V, Low-Power, 12-Bit, 210Msps ADC for Broadband Applications PACKAGE OUTLINE, 68L QFN, 10x10x0.9 MM 1 C 21-0122 2 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 21 © 2005 Maxim Integrated Products Heaney Printed USA is a registered trademark of Maxim Integrated Products, Inc. MAX1214N Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)