CYPRESS CY7C1020-15VC

7C10
CY7C1020
32K x 16 Static RAM
Features
(BLE) is LOW, then data from I/O pins (I/O 1 through I/O8), is
written into the location specified on the address pins (A0
through A14). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O 9 through I/O16) is written into the location
specified on the address pins (A0 through A14).
• 5.0V operation (± 10%)
• High speed
— tAA = 10 ns
• Low active power
— 825 mW (max., 10 ns, “L” version)
• Very Low standby power
— 550 µW (max., “L” version)
• Automatic power-down when deselected
• Independent Control of Upper and Lower bytes
• Available in 44-pin TSOP II and 400-mil SOJ
Reading from the device is accomplished by taking Chip Enable (CE) and Output Enable (OE) LOW while forcing the Write
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then
data from the memory location specified by the address pins
will appear on I/O1 to I/O 8. If Byte High Enable (BHE) is LOW,
then data from memory will appear on I/O 9 to I/O16. See the
truth table at the back of this data sheet for a complete description of read and write modes.
Functional Description
The CY7C1020 is a high-performance CMOS static RAM organized as 32,768 words by 16 bits. This device has an automatic power-down feature that significantly reduces power
consumption when deselected.
The input/output pins (I/O 1 through I/O16) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
are disabled (BHE, BLE HIGH), or during a write operation (CE
LOW, and WE LOW).
The CY7C1020 is available in standard 44-pin TSOP type II
and 400-mil-wide SOJ packages.
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
Logic Block Diagram
Pin Configuration
SOJ / TSOP II
Top View
SENSE AMPS
A6
A5
A4
A3
A2
A1
A0
ROW DECODER
DATA IN DRIVERS
32K x 16
RAM Array
I/O1 – I/O 8
I/O9 – I/O 16
COLUMN DECODER
A7
A8
A9
A10
A11
A12
A13
A14
BHE
WE
CE
OE
BLE
1020-1
NC
A 14
A 13
A 12
A11
CE
I/O1
I/O2
I/O3
I/O4
VCC
VSS
I/O5
I/O6
I/O7
I/O8
WE
A10
A9
A8
A7
NC
1
44
2
3
43
42
4
41
40
39
38
5
6
7
8
9
10
11
12
37
36
35
34
33
32
31
30
29
28
27
13
14
15
16
17
18
19
20
21
22
26
25
24
23
A0
A1
A2
OE
BHE
BLE
I/O16
I/O15
I/O14
I/O13
VSS
VCC
I/O12
I/O11
I/O10
I/O9
NC
A3
A4
A5
A6
NC
1020-2
Selection Guide
7C1020-10
7C1020-12
7C1020-15
7C1020-20
Maximum Access Time (ns)
10
12
15
20
Maximum Operating Current (mA)
180
170
160
160
150
140
130
130
3
3
3
3
0.1
0.1
0.1
0.1
L
Maximum CMOS Standby Current (mA)
L
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
October 18, 1999
CY7C1020
Current into Outputs (LOW)......................................... 20 mA
Maximum Ratings
Static Discharge Voltage ........................................... >2001V
(per MIL-STD-883, Method 3015)
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature ................................. –65°C to +150°C
Latch-Up Current ..................................................... >200 mA
Ambient Temperature with
Power Applied ............................................. –55°C to +125°C
Operating Range
Supply Voltage on VCC to Relative GND[1] .... –0.5V to +7.0V
Range
DC Voltage Applied to Outputs
in High Z State[1] .....................................–0.5V to VCC +0.5V
Commercial
Ambient
Temperature[2]
VCC
0°C to +70°C
4.5V–5.5V
[1]
DC Input Voltage ..................................–0.5V to VCC +0.5V
Electrical Characteristics Over the Operating Range
Parameter
Description
Test Conditions
VOH
Output HIGH Voltage
VCC = Min., IOH = –4.0 mA
VOL
Output LOW Voltage
VCC = Min., IOL = 8.0 mA
VIH
Input HIGH Voltage
Input LOW Voltage
IIX
Input Load Current
IOZ
Output Leakage
Current
ICC
VCC Operating
Supply Current
VCC = Max.,
IOUT = 0 mA,
f = fMAX = 1/tRC
Automatic CE
Power-Down Current
— TTL Inputs
Max. VCC, CE > V IH
VIN > VIH or
VIN < VIL, f = fMAX
Automatic CE
Power-Down Current
— CMOS Inputs
Max. VCC,
CE > VCC – 0.3V,
VIN > VCC – 0.3V,
or VIN < 0.3V, f = 0
ISB1
ISB2
GND < VI < VCC
GND < VI < VCC,
Output Disabled
2
7C1020-15
Min.
Min.
Min.
Max.
2.4
Max.
2.4
Max.
2.4
0.4
Unit
V
0.4
V
V
2.2
6.0
2.2
6.0
2.2
6.0
–0.5
0.8
–0.5
0.8
–0.5
0.8
V
–1
+1
–1
+1
–1
+1
µA
–2
+2
–2
+2
–2
+2
µA
mA
180
170
160
L
150
140
130
20
20
20
L
10
10
10
3
3
3
mA
100
100
100
µA
L
Notes:
1. VIL (min.) = –2.0V for pulse durations of less than 20 ns.
2. TA is the case temperature.
7C1020-12
0.4
[1]
VIL
7C1020-10
mA
CY7C1020
Electrical Characteristics Over the Operating Range (continued)
7C1020-20
Parameter
Description
Test Conditions
VOH
Output HIGH Voltage
VCC = Min., IOH = –4.0 mA
VCC = Min., IOL = 8.0 mA
Min.
Max.
Unit
2.4
V
VOL
Output LOW Voltage
0.4
V
VIH
Input HIGH Voltage
2.2
6.0
V
VIL
Input LOW Voltage[1]
–0.5
0.8
V
IIX
Input Load Current
GND < VI < VCC
–1
+1
µA
IOZ
Output Leakage Current
GND < VI < VCC, Output Disabled
–2
ICC
VCC Operating
Supply Current
VCC = Max.,
IOUT = 0 mA,
f = fMAX = 1/tRC
Automatic CE
Power-Down Current
— TTL Inputs
Max. V CC, CE > VIH
VIN > V IH or
VIN < V IL, f = fMAX
Automatic CE
Power-Down Current
— CMOS Inputs
Max. V CC,
CE > VCC – 0.3V,
VIN > V CC – 0.3V,
or VIN < 0.3V, f = 0
ISB1
ISB2
L
+2
µA
160
mA
130
20
L
mA
10
L
3
mA
100
µA
Capacitance[3]
Parameter
Description
CIN
Input Capacitance
COUT
Output Capacitance
Test Conditions
Max.
Unit
8
pF
8
pF
TA = 25°C, f = 1 MHz,
VCC = 5.0V
Note:
3. Tested initially and after any design or process changes that may affect these parameters.
AC Test Loads and Waveforms
R 481 Ω
R 481 Ω
5V
ALL INPUT PULSES
5V
OUTPUT
3.0V
90%
OUTPUT
30 pF
R2
255Ω
INCLUDING
JIG AND
SCOPE
(a)
OUTPUT
Equivalent to: THÉVENIN
EQUIVALENT
R2
255Ω
5 pF
INCLUDING
JIG AND
SCOPE
167Ω
GND
<3 ns
(b)
10%
90%
10%
<3 ns
1020-3
1020-4
1.73V
30 pF
3
CY7C1020
Switching Characteristics[4] Over the Operating Range
Parameter
Description
7C1020-10
7C1020-12
7C1020-15
7C1020-20
Min.
Min.
Min.
Min.
Max.
Max.
Max.
Max.
Unit
READ CYCLE
tRC
Read Cycle Time
tAA
Address to Data Valid
tOHA
Data Hold from Address Change
tACE
CE LOW to Data Valid
tDOE
OE LOW to Data Valid
tLZOE
OE LOW to Low Z
tHZOE
10
12
10
3
10
7
0
3
20
3
15
6
ns
ns
20
ns
9
ns
0
7
ns
8
CE LOW to Low Z
CE HIGH to High Z[5, 6]
tPU
CE LOW to Power-Up
tPD
CE HIGH to Power-Down
12
12
15
20
ns
tDBE
Byte enable to Data Valid
5
6
7
9
ns
tLZBE
Byte enable to Low Z
tHZBE
Byte disable to High Z
0
6
0
0
7
0
0
5
3
ns
tHZCE
5
3
ns
tLZCE
WRITE CYCLE
3
15
5
0
5
20
3
12
5
[5, 6]
[6]
12
3
0
OE HIGH to High Z
15
0
0
6
ns
8
ns
0
7
ns
ns
9
ns
[7]
tWC
Write Cycle Time
10
12
15
12
ns
tSCE
CE LOW to Write End
8
9
10
12
ns
tAW
Address Set-Up to Write End
7
8
10
12
ns
tHA
Address Hold from Write End
0
0
0
0
ns
tSA
Address Set-Up to Write Start
0
0
0
0
ns
tPWE
WE Pulse Width
7
8
10
12
ns
tSD
Data Set-Up to Write End
5
6
10
10
ns
tHD
Data Hold from Write End
0
0
0
0
ns
[6]
tLZWE
WE HIGH to Low Z
tHZWE
WE LOW to High Z[5, 6]
tBW
Byte enable to end of write
3
3
5
7
3
6
8
3
7
9
ns
9
12
ns
ns
Notes:
4. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
I OL/IOH and 30-pF load capacitance.
5. t HZOE, tHZBE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage.
6. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.
7. The internal write time of the memory is defined by the overlap of CE LOW, WE LOW and BHE / BLE LOW. CE, WE and BHE / BLE must be LOW to initiate a write,
and the transition of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write.
4
CY7C1020
Switching Waveforms
Read Cycle No. 1
[8, 9]
tRC
ADDRESS
tAA
tOHA
DATA OUT
PREVIOUS DATA VALID
DATA VALID
1020-5
Read Cycle No. 2 (OE Controlled)
[9, 10]
ADDRESS
tRC
CE
tACE
OE
tHZOE
tDOE
BHE, BLE
tLZOE
tHZCE
tDBE
tLZBE
DATA OUT
tHZBE
HIGH IMPEDANCE
DATA VALID
tLZCE
V CC
SUPPLY
CURRENT
HIGH
IMPEDANCE
tPD
tPU
IICC
CC
50%
50%
IISB
SB
1020-6
Notes:
8. Device is continuously selected. OE, CE, BHE and/or BHE = VIL.
9. WE is HIGH for read cycle.
10. Address valid prior to or coincident with CE transition LOW.
5
CY7C1020
Switching Waveforms (continued)
Write Cycle No. 1 (CE Controlled)
[11, 12]
tWC
ADDRESS
CE
tSA
tSCE
tAW
tHA
tPWE
WE
tBW
BHE, BLE
tSD
tHD
DATAI/O
1020-7
Write Cycle No. 2 (BLE or BHE Controlled)
tWC
ADDRESS
BHE, BLE
tSA
tBW
tAW
tHA
tPWE
WE
tSCE
CE
tSD
tHD
DATAI/O
1020-8
Notes:
11. Data I/O is high impedance if OE or BHE and/or BLE= VIH.
12. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.
6
CY7C1020
Switching Waveforms (continued)
Write Cycle No. 3 (WE Controlled, OE LOW)
tWC
ADDRESS
tSCE
CE
tAW
tHA
tSA
tPWE
WE
tBW
BHE, BLE
tHZWE
tSD
tHD
DATA I/O
tLZWE
1020-10
Truth Table
CE
OE
WE
H
X
L
L
L
X
BLE
BHE
X
X
X
High Z
High Z
Power-Down
Standby (ISB)
H
L
L
Data Out
Data Out
Read - All bits
Active (ICC)
L
H
Data Out
High Z
Read - Lower bits only
Active (ICC)
H
L
High Z
Data Out
Read - Upper bits only
Active (ICC)
L
L
Data In
Data In
Write - All bits
Active (ICC)
L
H
Data In
High Z
Write - Lower bits only
Active (ICC)
L
I/O1–I/O8
I/O9–I/O 16
Mode
Power
H
L
High Z
Data In
Write - Upper bits only
Active (ICC)
L
H
H
X
X
High Z
High Z
Selected, Outputs Disabled
Active (ICC)
L
X
X
H
H
High Z
High Z
Selected, Outputs Disabled
Active (ICC)
7
CY7C1020
Ordering Information
Speed
(ns)
10
12
15
20
Ordering Code
Package
Name
CY7C1020-10VC
V34
CY7C1020L-10VC
CY7C1020-10ZC
Package Type
Operating
Range
44-Lead (400-Mil) Molded SOJ
Commercial
V34
44-Lead (400-Mil) Molded SOJ
Commercial
Z44
44-Lead TSOP Type II
Commercial
CY7C1020L-10ZC
Z44
44-Lead TSOP Type II
Commercial
CY7C1020-12VC
V34
44-Lead (400-Mil) Molded SOJ
Commercial
CY7C1020L-12VC
V34
44-Lead (400-Mil) Molded SOJ
Commercial
CY7C1020-12ZC
Z44
44-Lead TSOP Type II
Commercial
CY7C1020L-12ZC
Z44
44-Lead TSOP Type II
Commercial
CY7C1020-15VC
V34
44-Lead (400-Mil) Molded SOJ
Commercial
CY7C1020L-15VC
V34
44-Lead (400-Mil) Molded SOJ
Commercial
CY7C1020-15ZC
Z44
44-Lead TSOP Type II
Commercial
CY7C1020L-15ZC
Z44
44-Lead TSOP Type II
Commercial
CY7C1020-20VC
V34
44-Lead (400-Mil) Molded SOJ
Commercial
CY7C1020L-20VC
V34
44-Lead (400-Mil) Molded SOJ
Commercial
CY7C1020-20ZC
Z44
44-Lead TSOP Type II
Commercial
CY7C1020L-20ZC
Z44
44-Lead TSOP Type II
Commercial
Document #: 38-00542-C
Package Diagrams
44-Lead (400-Mil) Molded SOJ V34
51-85082-B
8
CY7C1020
Package Diagrams (continued)
44-Pin TSOP II Z44
51-85087-A
© Cypress Semiconductor Corporation, 1999. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.