ETC NRF402

PRODUCT SPECIFICATION
nRF402
433MHz Single Chip RF Transmitter
APPLICATIONS
FEATURES
•
•
•
•
•
•
•
•
True single chip FSK transmitter
Few external components required
On chip UHF synthesiser
No set up or configuration
20kbit/s data rate
2 channels
Very low power consumption
Standby mode
•
•
•
•
•
•
•
•
•
•
Alarm Systems
Automatic Meter Reading (AMR)
Keyless entry
Home Automation
Remote Control
Surveillance
Automotive
Telemetry
Toys
Wireless Communication
GENERAL DESCRIPTION
nRF402 is a true single chip UHF transmitter designed to operate in the 433MHz ISM
(Industrial, Scientific and Medical) frequency band. It features Frequency Shift
Keying (FSK) modulation capability. nRF402 operates at data rates up to 20kbits/s.
Transmit power can be adjusted to a maximum of +10dBm. Antenna interface is
differential and suited for low cost PCB antennas. nRF402 operates from a single 3V
DC supply and has a standby mode which makes power saving easy and efficient.
As a primary application, nRF402 is intended for UHF radio equipment in compliance
with the European Telecommunication Standard Institute (ETSI) specification
EN 300 220-1 V1.2.1.
QUICK REFERENCE DATA
Parameter
Value
Unit
Frequency, Channel#1/Channel#2
Modulation
Frequency deviation
Max. RF output power @ 400Ω, 3V
Maximum bit rate
Supply voltage
Transmit supply current @ -10 dBm RF output power
Standby supply current
433.92 / 434.33
FSK
±15
10
20
2.7 – 3.6
8
8
MHz
kHz
dBm
kbit/s
V
mA
µA
Table 1. nRF402 quick reference data
ORDERING INFORMATION
Type number
Description
Version
nRF402-IC
nRF402-EVKIT
14 pin SSOIC
Evaluation kit with nRF402 IC
A
1.0
Table 2. nRF402 ordering information
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
BLOCK DIAGRAM
CS
DIN
PWR_UP
7
9
PLL
OSC
13
11
LOOP
FILTER
VCO
PA
10
1
14
6
LPF
4
5
ANT1
ANT2
8
VCO
INDUCTOR
RF_PWR
REFERENCE
Figure 1. nRF402 block diagram with external components
PIN FUNCTIONS
Pin
Name
Pin function
Description
1
2
3
4
5
6
7
XC1
VSS
VDD
VCO1
VCO2
LPF
CS
Input
Ground
Power
Input
Input
Test
Input
8
9
10
11
12
13
RF_PWR
DIN
ANT2
ANT1
VSS
PWR_UP
Input
Input
Output
Output
Ground
Input
14
XC2
Output
Crystal oscillator input
Ground (0V)
Power supply (+3V DC)
External inductor for VCO
External inductor for VCO
Loop filter voltage test pin *
Channel selection
CS=“0” ⇒ 433.92MHz, (Channel#1)
CS=“1” ⇒ 434.33MHz, (Channel#2)
Transmit power setting
Data input
Antenna terminal
Antenna terminal
Ground (0V)
Power on/off
PWR_UP = “1” ⇒ Power up (Transmit mode)
PWR_UP = “0” ⇒ Power down (Standby mode)
Crystal oscillator output
Table 3. nRF402 pin functions
*) This pin is only for test purposes and is intended for use when measuring the loop filter voltage.
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
ELECTRICAL SPECIFICATIONS
Conditions: VDD = +3V DC, VSS = 0V, TA= -25°C to +85°C
Symbol
VDD
VSS
IDD
IDD
PRF
VIH
VIL
IH
IL
f1
f2
∆f
fXTAL
ZI
Parameter (condition)
Supply voltage
Ground
Current consumption in transmit mode
@ -10 dBm RF power
Current consumption in standby mode
Max. RF output power @ 400Ω load
Logic “1” input voltage
Logic “0” input voltage
Logic “1” input current (VI = VDD)
Logic “0” input current (VI = VSS)
Channel#1 frequency
Channel#2 frequency
Modulation type
Frequency deviation
Crystal frequency 1)
Bit rate
Recommend antenna port differential load
impedance
Spurious emission
Min.
Typ.
Max.
Units
2.7
3
0
3.6
V
V
8
8
10
VDD
0.3⋅VDD
+20
-20
0.7⋅VDD
0
433.92
434.33
FSK
±15
4.000
0
20
400
mA
µA
dBm
V
V
µA
µA
MHz
MHz
kHz
MHz
kbit/s
Ω
Compliant with EN 300-220-1 V1.2.1 2)
Table 4. nRF402 electrical specifications
1) Crystal stability requirement must match the receiver requirement. For use with nRF401, the
crystal frequency stability should be better than ±45 ppm.
2) With PCB loop antenna or differential to single ended matching network to a 50Ω antenna.
ABSOLUTE MAXIMUM RATINGS
Supply voltages
VDD .............................. - 0.3V to +6V
VSS ................................................ 0V
Input voltage
VI ...................... - 0.3V to VDD + 0.3V
Total power dissipation
PD (TA=85°C).......................... 230 mW
Temperatures
Operating Temperature -25°C to +85°C
Storage Temperature - 40°C to +125°C
Note: Stress exceeding one or more of the limiting values may cause permanent
damage to the device.
ATTENTION!
Electrostatic Sensitive Device
Observe Precaution for handling.
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
PIN ASSIGNMENT
XC1
1
VSS
2
VDD
3
VCO1
4
11 ANT1
VCO2
5
10 ANT2
LPF
6
9
DIN
CS
7
8
RF_PWR
14 XC2
nRF402
13 PWR_UP
12 VSS
14 pin SSOIC
Figure 2. nRF402 pin assignment
PACKAGE OUTLINE
nRF402, 14 pin SSOIC. Dimensions in mm
14 13 12
E
H
1 2 3
D
α
A1 A
L
e
Package Type
14 pin SSOIC
(5.3 mm)
b
Min
Max
D
5.90
6.50
E
5.00
5.60
H
7.40
8.20
A
2.00
A1
0.05
e
0.65
b
0.22
0.38
L
0.55
0.95
Copl.
0.10
α
0°
8°
Figure 3. SSOIC-14 Package outline
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
IMPORTANT TIMING DATA
Timing information
The timing information for the different operations is summarised in Table 5.
(TX is transmit mode, Std.by is standby mode.)
Change of Mode
Std.byè TX
Name
tST
Max Delay
2ms
VDD=0 è TX
tVT
4ms
Condition
Operational
mode
Start-up
Table 5 Switching times for nRF402
Switching between standby and TX-mode.
The maximum time from the PWR_UP input is set to “1”, until the synthesised
frequency is stable is tST, see Table 5 and Figure 4.
Std.by to TX
VDD
PWR_UP
DIN
2ms
ms
0
2
4
Figure 4 Timing diagram for nRF402 when going from standby to TX-mode
Powering up to transmit-mode (start-up).
Due to spurious emission when the power supply is switched on, the PWR_UP-input
must be kept low for 2ms after VDD > 2.7 V. Data (DIN) is valid within 2ms after
PWR_UP is high.
VDD=0 to TX
VDD
PWR_UP
DIN
2ms
2ms
ms
0
2
4
Figure 5. Timing diagram for nRF402, when powering up to TX-mode
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
APPLICATION INFORMATION
Antenna output
The ANT1 and ANT2 pins provide RF output from the output stage (PA) for nRF402.
The antenna connection to nRF402 is differential and the recommended load
impedance at the antenna port is 400Ω.
Figure 11 shows a typical application schematic with a differential loop antenna on a
Printed Circuit Board (PCB). The output stage (PA) consists of two open collector
transistors in a differential pair configuration. VDD to the PA must be supplied
through the collector load. When connecting a differential loop antenna to the
ANT1/ANT2 pins, VDD should be supplied through the centre of the loop antenna as
shown in Figure 11.
A single ended antenna or 50Ω test instrument may be connected to nRF402 by using
a differential to single ended matching network (BALUN) as shown in Figure 6.
VDD
180nH
RF out 50 ohm
22nH
ANT1
470pF
nRF402
1.8pF
1.5pF
VDD
ANT2
22nH
1nF
22nH
Figure 6. Connection of nRF402 to single ended antenna by using
a differential to single ended matching network
The 180nH inductor to VDD in Figure 6, need to have a Self-Resonance Frequency
(SRF) above 433 MHz to be effective. Suitable inductors are listed in Table 6.
Vendors
WWW address
Stetco
Coilcraft
muRata
http://www.stetco.com
http://www.coilcraft.com
http://www.murata.com
Part. no., 180 nH inductors,
0603 size
0603G181KTE
0603CS-R18XJBC
LQW1608AR18J00
Table 6. Vendors and part. no. for suitable 180nH inductors.
A single ended antenna may also be connected to nRF402 using an 8:1 impedance RF
transformer. The RF transformer must have a centre tap at the primary side for VDD
supply.
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
RF output power
The external bias resistor R3 connected between the RF_PWR pin and VSS sets the
output power. The RF output power may be set to levels up to +10dBm. In Figure 7
the output power is plotted for power levels down to, but not limited to, –8.5dBm for
a differential load of 400Ω. DC power supply current versus external bias resistor
value is shown in Figure 8.
RF Output Power
10
22
8
27
33
6
39
4
Power [dBm]
47
2
56
0
68
82
-2
100
-4
120
-6
150
-8
180
-10
0
20
40
60
80
100
120
140
160
180
200
Ω]
Resistor Value [kΩ
Figure 7. RF Output power vs. external power setting resistor (R3) for nRF402
Total Chip Current
30,0
22
Current Consumption [mA]
25,0
27
20,0
33
39
47
15,0
56
68
82
10,0
100
120
150
180
5,0
0,0
0
20
40
60
80
100
120
140
160
180
200
Resistor Value [kΩ
Ω]
Figure 8. Total chip current consumption vs. external power setting resistor (R3) for
nRF402
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
VCO inductor
An external 22nH inductor connected between the VCO1 and VCO2 pins is required
for the on-chip voltage controlled oscillator (VCO). This inductor should be a high
quality chip inductor, Q > 45 @ 433 MHz, with a maximum tolerance of ± 2%. The
following 22 nH inductors (0603) are suitable for use with nRF402, see Table 7.
Vendors
WWW address
Pulse
Coilcraft
muRata
Stetco
KOA
http://www.pulseeng.com
http://www.coilcraft.com
http://www.murata.com
http://www.stetco.com
http://www.koaspeer.com
Part. no., 22 nH inductors,
0603 size
PE-0603CD220GTT
0603CS-22NXGBC
LQW1608A22NG00
0603G220GTE
KQ0603TE22NG
Table 7. Vendors and part no. of suitable 22 nH inductors
See page 10 for PCB layout guidelines regarding placement of the inductor.
Crystal specification
To achieve an active crystal oscillator (XOSC) with low power consumption, certain
requirements apply for crystal loss and capacitive load.
The crystal specification is:
f= 4.0000 MHz
Co ≤ 5 pF
ESR ≤150 ohm .
C L ≤ 14 pF
Crystal parallel resonant frequency
Crystal parallel equivalent capacitance
Crystal equivalent series resistance
Total crystal load capacitance, including capacitance in
PCB layout.
For the crystal oscillator shown in Figure 9 the load capacitance becomes
CL =
C1´⋅ C 2´
,
C1´ + C 2 ´ Where C1´ = C1 + CPCB1 and C2´ = C2 + CPCB2
C1 and C2 are 0603 SMD capacitors as shown in the application schematic, see
Figure 11 and Table 8. CPCB1 and CPCB2 are the layout parasitic capacitance on the
circuit board.
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
Crystal
oscillator
Crystal
equivalent
Co
Internal
R
External
components
ESR
Cs
L
Crystal
C1
C2
Figure 9. Crystal oscillator and crystal equivalent
Sharing a reference crystal with a micro-controller
Figure 10 shows circuit diagram of a typical application where nRF402 and a micro
controller share the reference crystal.
micro
controller
X1
1.0M
R
XC1
nRF402
C
X2
XC2
5.6pF
C1
22pF
4.0 MHz
C2
22pF
Figure 10. nRF402 and a micro-controller sharing the reference crystal
The crystal reference line from the micro-controller should not be routed close to full
swing digital data or control signals.
Channel#1 / Channel#2 selection
CS is a digital input for selection of either channel#1 (f1=433.92MHz)
or channel#2 (f2=434.33MHz).
CS = “0” selects channel#1.
CS = “1” selects channel#2.
DIN (data input)
The DIN pin is the input to the digital modulator of the transmitter. The input signal
to this pin should be standard CMOS logic level at data rates up to 20 kbit/s.
DIN = “1” → f = f0 + ∆f
DIN = “0” → f = f0 - ∆f
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
Power up
PWR_UP is a digital input for selection of normal operating mode or standby mode.
PWR_UP = “1” selects normal operating mode.
PWR_UP = “0” selects standby mode.
LPF pin
LPF is the loop filter test pin. This may be used for measurement of the loop filter
voltage. In a normal application this pin should only be connected to a solder pad. No
PCB lines should be connected to this pin.
Frequency difference between transmitter and receiver
Assuming the nRF401 transceiver chip is used for demodulation, the total frequency
difference between transmitter and receiver should not exceed 70 ppm (30 kHz). This
yields a crystal stability requirement of ±35 ppm for the transmitter and receiver.
Frequency difference exceeding this will result in a 12dB/octave drop in receiver
sensitivity. The functional window of the transmission link is typically 450 ppm (200
kHz).
Example: A crystal with ±20 ppm frequency tolerance and ±25 ppm frequency
stability over temperature has a worst case frequency difference of ±45 ppm. If the
transmitter and receiver operate in different temperature environments, the resulting
worst-case frequency difference may be as high as 90 ppm. Resulting drop in
sensitivity due to the extra 20 ppm, is then approx. 5dB.
PCB layout and decoupling guidelines
A well-designed PCB is necessary to achieve good RF performance. A PCB with a
minimum of two layers including a ground plane is recommended for optimum
performance.
The nRF402 DC supply voltage should be decoupled as close as possible to the VDD
pins with high performance RF capacitors, see Table 8. It is preferable to mount a
large surface mount capacitor (e.g. 2.2 µF ceramic) in parallel with the smaller value
capacitors. The nRF402 supply voltage should be filtered and routed separately from
the supply voltages of any digital circuitry.
Long power supply lines on the PCB should be avoided. All device grounds, VDD
connections and VDD bypass capacitors must be connected as close as possible to the
nRF402 IC. For a PCB with a topside RF ground plane, the VSS pins should be
connected directly to the ground plane. For a PCB with a bottom ground plane, the
best technique is to have via holes in or close to the VSS pads.
Full swing digital data or control signals should not be routed close to the external
VCO inductor or the LPF pin.
The VCO inductor placement is important. The optimum placement of the VCO
inductor gives a PLL loop filter voltage of 1.1 ±0.2 V, which can be measured at LPF
(pin 6). For a 22nH, 0603 size inductor the length between the centre of the
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
VCO1/VCO2 pad and the centre of the inductor pad should be 5.4 mm, see Figure 12
(c) (layout, top view), for a 2 layer, 1.6 mm thick FR4 PCB.
PCB layout example
Figure 12 shows a PCB layout example for the application schematic in Figure 11.
A double-sided FR-4 board of 1.6mm thickness is used. This PCB has a continuous
ground plane on the bottom layer. Additionally, there are ground areas on the
component side of the board to ensure sufficient grounding of critical components. A
large number of via holes connect the top layer ground areas to the bottom layer
ground plane. There is no ground plane beneath the antenna.
For more layout information, please refer to application note nAN400-06,
“nRF402 RF and antenna layout”.
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
APPLICATION SCHEMATIC
+3V
R1
1M
0603
C5
2.2uF
1206
C1
22pF
0603
X1
4.000 MHz
C2
22pF
0603
REFERENCE
U1
L1
22nH
0603
C3
4.7nF
0603
CS
1
2
3
4
5
6
7
XC1
VSS
VDD
VCO1
VCO2
LPF
CS
XC2
PWR_UP
VSS
ANT1
ANT2
DIN
RF_PWR
14
13
12
11
10
9
8
C7
5.6pF
0603
PWR_UP
DIN
C6
100pF
0603
nRF402
433MHz Single chip RF Transmitter
SSOIC14
C4
100pF
0603
R3
22K
0603
C8
10pF
0603
aaaaaaaa
R2
18K
0603
J1
Loop antenna
18x10mm
Q=55
Figure 11. nRF402 application Schematic
Component
C1
C2
C3
C4
C5
C6
C7
C8
L1
R1
R2
R3
X1
Description
Size
Value
NP0 ceramic chip capacitor, (Crystal oscillator)
NP0 ceramic chip capacitor, (Crystal oscillator)
X7R ceramic chip capacitor, (Supply decoupling)
NP0 ceramic chip capacitor, (Supply decoupling)
X7R ceramic chip capacitor, (Supply decoupling)
NP0 ceramic chip capacitor, (Supply decoupling)
NP0 ceramic chip capacitor, (Antenna tuning)
NP0 ceramic chip capacitor, (Antenna tuning)
VCO inductor, Q>45 @ 433 MHz (See table 6.)
1/8W chip resistor, (Crystal oscillator)
1/8W chip resistor, (Antenna Q reduction)
1/8W chip resistor, (Transmitter power setting)
Crystal
0603
0603
0603
0603
1206
0603
0603
0603
0603
0603
0603
0603
-
22
22
4.7
100
2.2
100
5.6
10
22
1.0
18
22
4.000
Tolerance
±0.25
±0.25
±2%
Units
pF
pF
nF
pF
µF
pF
pF
pF
nH
MΩ
kΩ
kΩ
MHz
Table 8 Recommended External Components
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
a) Top silk screen
b) Bottom silk screen
c) Top view
d) Bottom view
Figure 12. PCB layout (example) for nRF402 with loop antenna
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
DEFINITIONS
Data sheet status
Objective product specification
Preliminary product
specification
Product specification
This datasheet contains target specifications for product development.
This datasheet contains preliminary data; supplementary data may be
published from Nordic VLSI ASA later.
This datasheet contains final product specifications. Nordic VLSI ASA
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Limiting values
Stress above one or more of the limiting values may cause permanent damage to the device. These are stress
ratings only and operation of the device at these or at any other conditions above those given in the
Specifications sections of the specification is not implied. Exposure to limiting values for extended periods may
affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Table 9. Definitions
Nordic VLSI ASA reserves the right to make changes without further notice to the
product to improve reliability, function or design. Nordic VLSI does not assume any
liability arising out of the application or use of any product or circuits described
herein.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems
where malfunction of these products can reasonably be expected to result in personal
injury. Nordic VLSI ASA customers using or selling these products for use in such
applications do so at their own risk and agree to fully indemnify Nordic VLSI ASA
for any damages resulting from such improper use or sale.
Product specification: Revision Date: 29.02.2000.
Datasheet order code: 290200nRF402.
All rights reserved ®. Reproduction in whole or in part is prohibited without the prior
written permission of the copyright holder.
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PRODUCT SPECIFICATION
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YOUR NOTES
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PRODUCT SPECIFICATION
nRF402 Single Chip RF Transmitter
Nordic VLSI - World Wide Distributors
For Your nearest dealer, please see http://www.nvlsi.no
Main Office:
Vestre Rosten 81, N-7075 Tiller, Norway
Phone: +47 72 89 89 00, Fax: +47 72 89 89 89
E-mail: [email protected]
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