TDA8948J 4-channel audio amplifier Rev. 01 — 27 February 2008 Product data sheet 1. General description The TDA8948J contains four identical audio power amplifiers. The TDA8948J can be used as four Single-Ended (SE) channels with a fixed gain of 26 dB, two times Bridge-Tied Load (BTL) channels with a fixed gain of 32 dB or two times SE channels (26 dB gain) plus one BTL channel (32 dB gain) operating as a 2.1 system. The TDA8948J comes in a 17-pin Dil-Bent-Sil (DBS) power package. The TDA8948J is pin compatible with the TDA8944AJ, TDA8946AJ and TDA8947J. The TDA8948J contains a unique protection circuit that is solely based on multiple temperature measurements inside the chip. This gives maximum output power for all supply voltages and load conditions with no unnecessary audio holes. Almost any supply voltage and load impedance combination can be made as long as thermal boundary conditions (number of channels used, external heat sink and ambient temperature) allow it. 2. Features 2.1 Functional features n SE: 1 W to 18 W, BTL: 4 W to 36 W operation possibility (2.1 system) Soft clipping. n Standby and mute mode. n No on/off switching plops. n Low standby current. n High supply voltage ripple rejection. n Outputs short-circuit protected to ground, supply and across the load. n Thermally protected. n Pin compatible with TDA8944AJ, TDA8946AJ and TDA8947J. 3. Applications n n n n Television PC speakers Boom box Mini and micro audio receivers TDA8948J NXP Semiconductors 4-channel audio amplifier 4. Quick reference data Table 1. Quick reference data SE: VCC = 17 V; Tamb = 25 °C; RL = 4 Ω; fi = 1 kHz; VMODE1 = VCC; VMODE2 = VCC; measured in test circuit Figure 11; unless otherwise specified. BTL: VCC = 17 V; Tamb = 25 °C; RL = 8 Ω; f = 1 kHz; VMODE1 = VCC; VMODE2 = VCC; measured in test circuit Figure 11; unless otherwise specified. Symbol Parameter Conditions supply voltage VCC Min Typ Max Unit operating [1] 9 17 26 V no (clipping signal) [2] - - 28 V [3] - 100 145 mA - - 10 µA THD = 10 %; RL = 4 Ω 6.5 8 - W THD = 0.5 %; RL = 4 Ω - 6 - W - 12 - W 14 16 - W - 12 - W - 24 - W Iq quiescent current VCC = 17 V; RL = ∞ Istb standby current - Po(SE) SE output power VCC = 17 V; see Figure 7: VCC = 20 V: THD = 10 %; RL = 4 Ω Po(BTL) BTL output power VCC = 17 V; see Figure 7: THD = 10 %; RL = 8 Ω THD = 0.5 %; RL = 8 Ω VCC = 20 V: THD = 10 %; RL = 8 Ω THD Gv SVRR total harmonic distortion SE; Po = 1 W - 0.1 0.5 % BTL; Po = 1 W - 0.05 0.5 % voltage gain SE 25 26 27 dB BTL 31 32 33 dB [4] - 60 - dB [4] - 60 - dB fripple = 1 kHz [4] - 65 - dB fripple = 100 Hz to 20 kHz [4] - 65 - dB supply voltage ripple SE: rejection fripple = 1 kHz fripple = 100 Hz to 20 kHz BTL: [1] A minimum load is required at supply voltages of VCC > 22 V; RL = 3 Ω for SE and RL = 6 Ω for BTL. [2] The amplifier can deliver output power with non-clipping output signals into nominal loads as long as the ratings of the IC are not exceeded. [3] With a load connected at the outputs the quiescent current will increase. TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 2 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier [4] Supply voltage ripple rejection is measured at the output with a source impedance RSOURCE = 0 Ω at the input and with a frequency range from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency fripple and an amplitude of 300 mV (RMS), which is applied to the positive supply rail. 5. Ordering information Table 2. Ordering information Type number TDA8948J Package Name Description Version DBS17P DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 6. Block diagram VCC1 3 IN1+ 8 VCC2 16 1 + + + − 4 + − 14 + + OUT1+ 60 kΩ IN2+ 6 OUT2− 60 kΩ IN3+ 9 OUT3− 60 kΩ IN4+ 12 17 OUT4+ 60 kΩ CIV SVR 13 VCC 11 SHORT-CIRCUIT AND TEMPERATURE PROTECTION 0.5VCC VREF 7 SGND MODE1 MODE2 10 5 STANDBY ALL MUTE ALL ON 1 + 2 TDA8948J MUTE 3 + 4 ON 3 + 4 2 GND1 15 GND2 010aaa049 Fig 1. Block diagram TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 3 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier 7. Pinning information 7.1 Pinning OUT1+ 1 GND1 2 VCC1 3 OUT2− 4 MODE2 5 IN2+ 6 SGND 7 IN1+ 8 IN3+ 9 TDA8948J MODE1 10 SVR 11 IN4+ 12 CIV 13 OUT3− 14 GND2 15 VCC2 16 OUT4+ 17 010aaa046 Fig 2. Pin configuration diagram 7.2 Pin description Table 3. Pin description Symbol Pin Description OUT1+ 1 non inverted loudspeaker output of channel 1 GND1 2 ground of channels 1 and 2 VCC1 3 supply voltage channels 1 and 2 OUT2− 4 inverted loudspeaker output of channel 2 MODE2 5 mode selection 2 input: Mute and On mode for channels 3 and 4 IN2+ 6 input channel 2 SGND 7 signal ground IN1+ 8 input channel 1 IN3+ 9 input channel 3 MODE1 10 mode selection 1 input: Standby, Mute and On mode for all channels SVR 11 half supply voltage decoupling (ripple rejection) IN4+ 12 input channel 4 CIV 13 common input voltage decoupling OUT3− 14 inverted loudspeaker output of channel 3 TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 4 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier Table 3. Pin description …continued Symbol Pin Description GND2 15 ground of channels 3 and 4 VCC2 16 supply voltage channels 3 and 4 OUT4+ 17 non inverted loudspeaker output of channel 4 8. Functional description 8.1 Input configuration The input cut-off frequency is: 1 f i ( cut – off ) = ----------------------------2π ( R i × C i ) (1) For SE application Ri = 60 kΩ and Ci = 220 nF: 1 f i ( cut – off ) = ---------------------------------------------------------------- = 12 Hz 3 –9 2π ( 60 × 10 × 220 × 10 ) (2) For BTL application Ri = 30 kΩ and Ci = 470 nF: 1 f i ( cut – off ) = ---------------------------------------------------------------- = 11 Hz 3 –9 2π ( 30 × 10 × 470 × 10 ) (3) As shown in Equation 2 and Equation 3, large capacitor values for the inputs are not necessary, so the switch-on delay during charging of the input capacitors can be minimized. This results in a good low frequency response and good switch-on behavior. 8.2 Power amplifier The power amplifier is a BTL and/or SE amplifier with an all-NPN output stage, capable of delivering a peak output current of 4 A. Using the TDA8948J as a BTL amplifier offers the following advantages: • • • • Low peak value of the supply current Ripple frequency on the supply voltage is twice the signal frequency No expensive DC-blocking capacitor Good low frequency performance TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 5 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier 8.2.1 Output power measurement The output power as a function of the supply voltage is measured on the output pins at THD = 10 %; see Figure 7. The maximum output power is limited by the supply voltage (VCC = 26 V) and the maximum output current (IO = 4 A repetitive peak current). For supply voltages VCC > 22 V, a minimum load is required; see Figure 5: • SE: RL = 3 Ω • BTL: RL = 6 Ω 8.2.2 Headroom Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom, compared to the average power output, for transferring the loudest parts without distortion. The Average Listening Level (ALL) music power, without any distortion, yields: • SE at Po(SE) = 5 W, VCC = 17 V, RL = 4 Ω and THD = 0.2 %: 3 5 ⋅ 10 P o ( ALL )SE = --------------- = 315 mW 15.85 (4) • BTL at Po(BTL) = 10 W, VCC = 17 V, RL = 8 Ω and THD = 0.1 %: 3 10 ⋅ 10 P o ( ALL )BTL = ------------------ = 630 mW 15.85 (5) The power dissipation can be derived from Figure 8 (SE and BTL) for a headroom of 0 dB and 12 dB, respectively. Table 4. Power rating as function of headroom Headroom Power output SE BTL Power dissipation (all channels driven) 0 dB Po = 5 W Po = 10 W P = 17 W 12 dB Po(ALL) = 315 mW Po(ALL) = 630 mW P=9W For heat sink calculation at the average listening level, a power dissipation of 9 W can be used. 8.3 Mode selection The TDA8948J has three functional modes which can be selected by applying the proper DC voltage to pin MODE1. Standby - The current consumption is very low and the outputs are floating. The device is in standby mode when VMODE1 < 0.8 V, or when the MODE1 pin is grounded. In standby mode, the function of pin MODE2 has been disabled. Mute - The amplifier is DC-biased, but not operational (no audio output). This allows the input coupling capacitors to be charged to avoid pop-noise. The device is in mute mode when 4.5 V < VMODE1 < (VCC - 3.5 V). TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 6 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier On - The amplifier is operating normally. The on mode is activated at VMODE1 > (VCC − 2.0 V). The output of channels 3 and 4 can be set to mute or on mode. The output channels 3 and 4 can be switched on/off by applying a proper DC voltage to pin MODE2, under the condition that the output channels 1 and 2 are in the on mode (see Figure 3). Table 5. Mode selection Voltage on pin Channel 1 and 2 Channel 3 and 4 (sub woofer) MODE1 MODE2 0 V to 0.8 V 0 V to VCC Standby mode Standby mode 4.5 V to (VCC − 3.5 V) 0 V to VCC Mute mode Mute mode (VCC − 2.0 V) to VCC 0 V to (VCC − 3.5 V) On mode Mute mode (VCC − 2 V) to VCC On mode On mode all standby channels 1 + 2: on channels 3 + 4: on or mute all mute 0.8 4.5 VCC −3.5 VCC −2.0 VCC VMODE1 channels 3 + 4: mute channels 3 + 4: on VCC −3.5 mdb016 Fig 3. VCC −2.0 VCC VMODE2 Mode selection 8.4 Supply voltage ripple rejection The Supply Voltage Ripple Rejection (SVRR) is measured with an electrolytic capacitor of 150 µF on pin SVR using a bandwidth of 20 Hz to 22 kHz. Figure 10 illustrates the SVRR as function of the frequency. A larger capacitor value on pin SVR improves the ripple rejection behavior at the lower frequencies. TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 7 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier 8.5 Built-in protection circuits The TDA8948J contains two types of detection sensors: one measures local temperatures of the power stages and one measures the global chip temperature. At a local temperature of approximately 185 °C or a global temperature of approximately 150 °C, this detection circuit switches off the power stages for 2 ms. High-impedance of the outputs is the result. After this time period the power stages switch on automatically and the detection will take place again; still a too high temperature switches off the power stages immediately. This protects the TDA8948J against shorts to ground, to the supply voltage and across the load, and against too high chip temperatures. The protection will only be activated when necessary, so even during a short-circuit condition, a certain amount of (pulsed) current will still be flowing through the short, just as much as the power stage can handle without exceeding the critical temperature level. 9. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VCC supply voltage operating no (clipping) signal [1] Min Max Unit −0.3 +26 V −0.3 +28 V VI input voltage - −0.3 VCC + 0.3 V IORM repetitive peak output current - - 4 A Tstg storage temperature non-operating −55 +150 °C Tamb ambient temperature - −40 +85 °C Ptot total power dissipation - - 69 W VCC(sc) supply voltage (short circuit) - - 24 V [1] The amplifier can deliver output power with non-clipping output signals into nominal loads as long as the ratings of the IC are not exceeded. 10. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air 40 K/W Rth(j-c) thermal resistance from junction to case all channels driven 2 K/W TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 8 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier 11. Static characteristics Table 8. Static characteristics VCC = 17 V; Tamb = 25 °C; RL = 8 Ω; VMODE1 = VCC; VMODE2 = VCC; VI = 0 V; measured in test circuit Figure 11; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit supply voltage operating [1] 9 17 26 V no (clipping) signal [2] - - 28 V [3] - 100 145 mA - - 10 µA [4] - 9 - V [5] - - 170 mV on mode VCC − 2.0 - VCC V mute mode 4.5 - VCC − 3.5 V 0 - 0.8 V V Supply VCC Iq quiescent current VCC = 17 V; RL = ∞ Istb standby current - output voltage - Output pins VO ∆VO(offset) differential output voltage offset BTL mode Mode selection pins VMODE1 voltage on pin MODE1 standby mode VMODE2 voltage on pin MODE2 VCC − 2.0 - VCC mute mode: channels 3 and 4 0 - VCC − 3.5 V on mode: channels 3 and 4 [6] IMODE1 current on pin MODE1 0 V < VMODE1 < (VCC − 3.5 V) - - 20 µA IMODE2 current on pin MODE2 0 V < VMODE2 < (VCC − 3.5 V) - - 20 µA [1] A minimum load is required at supply voltages of VCC > 22 V: RL = 3 Ω for SE and RL = 6 Ω for BTL. [2] The amplifier can deliver output power with non-clipping output signals into nominal loads as long as the ratings of the IC are not exceeded. [3] With a load connected at the outputs the quiescent current will increase. [4] The DC output voltage, with respect to ground, is approximately 0.5 VCC. [5] ∆VO(offset) = |VOUT+ − VOUT−| [6] Channels 3 and 4 can only be set to mute or on mode by MODE2 when VMODE1 > VCC − 2.0 V. 12. Dynamic characteristics Table 9. Dynamic characteristics SE VCC = 17 V; Tamb = 25 °C; RL = 4 Ω; fi = 1 kHz; VMODE1 = VCC; VMODE2 = VCC; measured in test circuit Figure 11; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Po(SE) SE output power VCC = 17 V; see Figure 7 THD = 10 %; RL = 4 Ω 6.5 8 - W THD = 0.5 %; RL = 4 Ω - 6 - W - 12 - W Po = 1 W - 0.1 0.5 % VCC = 20 V THD = 10 %; RL = 4 Ω THD total harmonic distortion Gv voltage gain - 25 26 27 dB Zi input impedance - 40 60 - kΩ TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 9 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier Table 9. Dynamic characteristics SE …continued VCC = 17 V; Tamb = 25 °C; RL = 4 Ω; fi = 1 kHz; VMODE1 = VCC; VMODE2 = VCC; measured in test circuit Figure 11; unless otherwise specified. Symbol Vn(o) SVRR Parameter Conditions output noise voltage supply voltage ripple rejection Min Typ Max Unit - [1] - 150 - µV fripple = 1 kHz [2] - 60 - dB fripple = 100 Hz to 20 kHz [2] - 60 - dB [3] - - 150 µV Vo(mute) mute output voltage - αcs channel separation RSOURCE = 0 Ω 50 60 - dB |∆Gv| voltage gain difference - - - 1 dB [1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance RSOURCE = 0 Ω at the input. [2] Supply voltage ripple rejection is measured at the output, with a source impedance RSOURCE = 0 Ω at the input and with a frequency range from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency fripple and an amplitude of 300 mV (RMS), which is applied to the positive supply rail. [3] Output voltage in mute mode is measured with VMODE1 = VMODE2 = 7 V, and Vi = 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz, including noise. Table 10. Dynamic characteristics BTL VCC = 17 V; Tamb = 25 °C; RL = 8 Ω; f = 1 kHz; VMODE1 = VCC; VMODE2 = VCC; measured in test circuit Figure 11; unless otherwise specified. Symbol Parameter Conditions Po(BTL) BTL output power VCC = 17 V; see Figure 7 Min Typ Max Unit THD = 10 %; RL = 8 Ω 14 16 - W THD = 0.5 %; RL = 8 Ω - 12 - W - 24 - W VCC = 20 V THD = 10 %; RL = 8 Ω THD total harmonic distortion Po = 1 W - 0.05 0.5 % Gv voltage gain - 31 32 33 dB Zi input impedance - Vn(o) SVRR noise output voltage supply voltage ripple rejection 20 30 - kΩ - [1] - 200 - µV fripple = 1 kHz [2] - 65 - dB fripple = 100 Hz to 20 kHz [2] - 65 - dB [3] - - 250 µV Vo(mute) mute output voltage - αcs channel separation RSOURCE = 0 Ω 50 65 - dB |∆Gv| voltage gain difference - - - 1 dB [1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance RSOURCE = 0 Ω at the input. [2] Supply voltage ripple rejection is measured at the output, with a source impedance RSOURCE = 0 Ω at the input and with a frequency range from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency fripple and an amplitude of 300 mV (RMS), which is applied to the positive supply rail. [3] Output voltage in mute mode is measured with VMODE1 = VMODE2 = 7 V, and Vi = 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz, including noise. TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 10 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier coc005 107 Vo (µV) 106 105 104 103 102 10 1 0 4 8 20 16 VMODE1 (V) 12 a. BTL; VCC = 17 V; Vi = 50 mV. Fig 4. AC output voltage as a function of voltage on pin MODE1 010aaa111 30 Po(max) (W) 010aaa112 60 Po(max) (W) (2) 20 (3) (4) (1) 40 (4) (3) (2) (1) (5) 10 (5) 20 0 0 8 12 16 20 24 28 8 12 16 20 24 VP (V) fi =1 kHz fi = 1 kHz (1) 1 Ω SE at THD = 10 % (1) 16 Ω BTL at THD = 10 % (2) 2 Ω SE at THD = 10 % (2) 8 Ω BTL at THD = 10 % (3) 3 Ω SE at THD = 10 % (3) 6 Ω BTL at THD = 10 % (4) 4 Ω SE at THD = 10 % (4) 4 Ω BTL at THD = 10 % (5) 8 Ω SE at THD = 10 % (5) 2 Ω BTL at THD = 10 % a. SE: THD = 10 %; one channel Fig 5. 28 VP (V) b. BTL: THD = 10 %; one channel Maximum output power as a function of supply voltage at various loads TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 11 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier mce488 102 THD + N (%) THD + N (%) 10 10 1 1 10−1 10−1 10−2 10−1 1 10 Po (W) 102 10−2 10−1 VCC = 17 V; fi = 1 kHz; RL = 4 Ω. 10 Po (W) 102 b. BTL Total harmonic distortion-plus-noise as a function of output power mce489 10 THD + N (%) mce490 10 THD + N (%) 1 1 10−1 10−1 10−2 10 102 103 VCC = 17 V; Po = 1 W; RL = 4 Ω. a. SE Fig 7. 1 VCC = 17 V; fi = 1 kHz; RL = 8 Ω. a. SE Fig 6. mce487 102 104 f (Hz) 105 10−2 10 102 103 104 f (Hz) 105 VCC = 17 V; Po = 1 W; RL = 8 Ω. b. BTL Total harmonic distortion-plus-noise as a function of frequency TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 12 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier 010aaa430 20 Ptot (W) 16 Ptot (W) 16 12 12 8 8 4 4 0 0 0 8 4 12 16 Po (W) 20 0 4 8 12 VCC = 17 V; RL = 4 Ω. 20 VCC = 17 V; RL = 8 Ω. b. BTL Total power dissipation as a function of channel output power per channel (worst case, all channels driven) mce495 0 αcs (dB) −20 −20 −40 −40 −60 −60 −80 −80 −100 10 102 103 104 105 mce496 0 αcs (dB) −100 10 102 103 f (Hz) VCC = 17 V; RL = 4 Ω. a. SE Fig 9. 16 Po (W) a. SE Fig 8. 010aaa432 20 104 105 f (Hz) VCC = 17 V; RL = 8 Ω. b. BTL Channel separation as a function of frequency (no band-pass filter applied) TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 13 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier mce497 0 SVRR (dB) SVRR (dB) −20 −20 −40 −40 −60 −60 −80 10 102 103 104 f (Hz) 105 mce498 0 −80 10 102 103 104 f (Hz) 105 VCC = 17 V; RSOURCE = 0 Ω; Vripple = 300 mV (RMS). VCC = 17 V; RSOURCE = 0 Ω; Vripple = 300 mV (RMS). A band-pass filter of 20 Hz to 22 kHz has been applied. A band-pass filter of 20 Hz to 22 kHz has been applied. Inputs short-circuited. Inputs short-circuited. a. SE b. BTL Fig 10. Supply voltage ripple rejection as a function of frequency TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 14 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier 13. Application information 13.1 Application diagrams VCC VCC1 3 220 nF IN1+ 8 Vi VCC2 1000 µF 100 nF 16 + 1 OUT1+ + + 60 kΩ 220 nF − IN2+ 6 Vi 4 OUT2− − + RL4 Ω − 60 kΩ RL4 Ω + IN3+ 9 14 OUT3− − + − 470 nF 60 kΩ Vi IN4+ 12 RL8 Ω + 17 OUT4+ + + 470 µF 60 kΩ CIV 13 VCC SHORT-CIRCUIT AND TEMPERATURE PROTECTION VCC 10 kΩ 50 kΩ 22 µF 100 kΩ 270 Ω BC547 7.5 V microcontroller 2.2 µF SVR 11 0.5V CC VREF 47 µF BC547 SGND 7 1.5 kΩ MODE1 10 VCC MODE2 5 STANDBY ALL MUTE ALL ON 1 + 2 MUTE 3 + 4 ON 3 + 4 TDA8948J 2 GND1 15 GND2 010aaa050 Fig 11. Typical application diagram without on/off switching plops Table 11. Amplifier selection by microcontroller Microcontroller with open-collector output; see Figure 11. Microcontroller Channels 1 and 2 Channels 3 and 4 LOW On mode On mode HIGH Mute mode Mute mode TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 15 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier VCC VCC1 3 220 nF IN1+ 8 Vi VCC2 1000 µF 100 nF 16 + 1 OUT1+ + + 60 kΩ 220 nF RL4 Ω − IN2+ 6 Vi 4 OUT2− − + − 60 kΩ RL4 Ω + IN3+ 9 14 OUT3− − + − 470 nF 60 kΩ Vi IN4+ 12 RL8 Ω + 17 OUT4+ + + 470 µF 60 kΩ CIV 13 VCC SHORT-CIRCUIT AND TEMPERATURE PROTECTION 22 µF SVR 11 0.5V CC 150 µF VREF SGND 7 MODE1 10 MICROCONTROLLER VCC MODE2 5 STANDBY ALL MUTE ALL ON 1 + 2 MUTE 3 + 4 ON 3 + 4 TDA8948J 2 GND1 15 GND2 010aaa051 Fig 12. Application diagram with one pin control and reduction of capacitor Remark: Because of switching inductive loads, the output voltage can rise beyond the maximum supply voltage of 28 V. At high supply voltages, it is recommended to use (Schottky) diodes to the supply voltage and ground. TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 16 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier 13.2 Printed-circuit board 13.2.1 Layout and grounding To obtain a high-level system performance, certain grounding techniques are essential. The input reference grounds have to be tied with their respective source grounds and must have separate tracks from the power ground tracks; this will prevent the large (output) signal currents from interfering with the small AC input signals. The small signal ground tracks should be physically located as far as possible from the power ground tracks. Supply and output tracks should be as wide as possible for delivering maximum output power. AUDIO POWER CS NIJMEGEN PF / 3002 .naJ 72 TVA 220 nF 220 nF 100 nF 4Ω 1 4Ω 1 BTL4/3 4Ω 220 nF BTL1/2 4Ω 220 nF 4Ω 220 nF CIV 4.7 nF 220 nF +SE3− 4Ω 1000 µF 22 220 µF µF 1000 µF 1000 µF +SE2− 1000 µF SVF −SE4+ MODE1 BTL3/4 MODE2 +SE1− 150 µF OFF 10 kΩ +Vp IN2+ IN1+ IN3+ IN4+ VOL.Sgnd 10 kΩ SB ON MUTE ON mce483 Fig 13. Printed-circuit board layout (single-sided); components view 13.2.2 Power supply decoupling Proper supply bypassing is critical for low-noise performance and high supply voltage ripple rejection. The respective capacitor location should be as close as possible to the device and grounded to the power ground. Proper power supply decoupling also prevents oscillations. For suppressing higher frequency transients (spikes) on the supply line a capacitor with low Equivalent Series Resistance (ESR), typical 100 nF, has to be placed as close as possible to the device. For suppressing lower frequency noise and ripple signals, a large electrolytic capacitor, e.g. 1000 µF or greater, must be placed close to the device. The bypass capacitor on pin SVR reduces the noise and ripple on the mid rail voltage. For good Total Harmonic Distortion (THD) and noise performance a low ESR capacitor is recommended. TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 17 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier 13.3 Thermal behavior and heat sink calculation The measured maximum thermal resistance of the IC package, Rth(j-mb), is 1.3 K/W. A calculation for the heat sink can be made, with the following parameters: Tamb(max) = 60 °C (example) VCC = 17 V and RL = 4 Ω (SE) Tj(max) = 150 °C (specification) Rth(tot) is the total thermal resistance between the junction and the ambient including the heat sink. This can be calculated using the maximum temperature increase divided by the power dissipation: Rth(tot) = (Tj(max) − Tamb(max))/P At VCC = 17 V and RL = 4 Ω (4 × SE) the measured worst-case sine-wave dissipation is 17 W; see Figure 8. For Tj(max) = 150 °C the temperature raise, caused by the power dissipation, is: 150 °C − 60 °C = 90 °C: P × Rth(tot) = 90 °C Rth(tot) = 90/17 K/W = 5.29 K/W Rth(h-a) = Rth(tot) − Rth(j-mb) = 5.29 K/W − 2 K/W = 3.29 K/W This calculation is for an application at worst-case (stereo) sine-wave output signals. In practice music signals will be applied, which decreases the maximum power dissipation to approximately half of the sine-wave power dissipation of 9 W (see Section 8.2.2). This allows for the use of a smaller heat sink: P × Rth(tot) = 90 °C Rth(tot) = 90/9 K/W = 10 K/W Rth(h-a) = Rth(tot) − Rth(j-mb) = 10 K/W - 2 K/W = 8 K/W TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 18 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier mce499 150 Tj (˚C) mce500 150 Tj (˚C) (1) (2) (3) (4) (5) (1) 100 100 50 50 0 (2) (3) (4) (5) 0 8 12 16 20 24 28 VCC (V) Tamb = 25 °C; external heat sink of 4.3 K/W. 8 12 20 24 28 VCC (V) Tamb = 25 °C; external heat sink of 4.3 K/W. (1) RL = 1 Ω. (1) RL = 2 Ω. (2) RL = 2 Ω. (2) RL = 4 Ω. (3) RL = 3 Ω. (3) RL = 6 Ω. (4) RL = 4 Ω. (4) RL = 8 Ω. (5) RL = 8 Ω. (5) RL = 16 Ω. a. 4 times various SE loads with music signals. 16 b. 2 times various BTL loads with music signals. Fig 14. Junction temperature as a function of supply voltage for various loads with music signals 14. Test information 14.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable. TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 19 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier 15. Package outline DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L3 L Q c 1 v M 17 e1 Z bp e e2 m w M 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) mm 17.0 15.5 4.6 4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 e e2 Eh j L L3 m Q v w x Z (1) 5.08 6 3.4 3.1 12.4 11.0 2.4 1.6 4.3 2.1 1.8 0.8 0.4 0.03 2.00 1.45 e1 2.54 1.27 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-17 03-03-12 SOT243-1 Fig 15. Package outline SOT243-1 (DBS17P) TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 20 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 16.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 16.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 16.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 21 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier 16.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 16) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 12 and 13 Table 12. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 13. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 16. TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 22 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 16. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 23 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier 17. Revision history Table 14. Revision history Document ID Release date Data sheet status Change notice Supersedes TDA8948J_1 20080227 Product data sheet - - TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 24 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 18.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] TDA8948J_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 27 February 2008 25 of 26 TDA8948J NXP Semiconductors 4-channel audio amplifier 20. Contents 1 2 2.1 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.2.1 8.2.2 8.3 8.4 8.5 9 10 11 12 13 13.1 13.2 13.2.1 13.2.2 13.3 14 14.1 15 16 16.1 16.2 16.3 16.4 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Functional features . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Input configuration . . . . . . . . . . . . . . . . . . . . . . 5 Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 5 Output power measurement . . . . . . . . . . . . . . . 6 Headroom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 6 Supply voltage ripple rejection . . . . . . . . . . . . . 7 Built-in protection circuits . . . . . . . . . . . . . . . . . 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 Thermal characteristics. . . . . . . . . . . . . . . . . . . 8 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 Application information. . . . . . . . . . . . . . . . . . 15 Application diagrams . . . . . . . . . . . . . . . . . . . 15 Printed-circuit board . . . . . . . . . . . . . . . . . . . . 17 Layout and grounding . . . . . . . . . . . . . . . . . . . 17 Power supply decoupling . . . . . . . . . . . . . . . . 17 Thermal behavior and heat sink calculation . . 18 Test information . . . . . . . . . . . . . . . . . . . . . . . . 19 Quality information . . . . . . . . . . . . . . . . . . . . . 19 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20 Soldering of SMD packages . . . . . . . . . . . . . . 21 Introduction to soldering . . . . . . . . . . . . . . . . . 21 Wave and reflow soldering . . . . . . . . . . . . . . . 21 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 24 Legal information. . . . . . . . . . . . . . . . . . . . . . . 25 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Contact information. . . . . . . . . . . . . . . . . . . . . 25 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 27 February 2008 Document identifier: TDA8948J_1