ONSEMI NCV8774

NCV8774
Ultra Low Iq 350 mA LDO
Regulator
The NCV8774 is a 350 mA LDO regulator. Its robustness allows
NCV8774 to be used in severe automotive environments. Ultra low
quiescent current as low as 18 mA typical makes it suitable for
applications permanently connected to battery requiring ultra low
quiescent current with or without load. This feature is especially critical
when modules remain in active mode when ignition is off. The NCV8774
contains protection functions as current limit, thermal shutdown and
reverse output current protection.
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MARKING
DIAGRAM
DPAK−3
DT SUFFIX
CASE 369C
Features
•
•
•
•
•
•
•
•
Output Voltage Options: 3.3 V and 5 V
Output Voltage Accuracy: ±1.5% (TJ = 25°C to 125°C)
Output Current up to 350 mA
Ultra Low Quiescent Current: typ 18 mA (max 23 mA)
Very Wide Range of Cout and ESR Values for Stability
Wide Input Voltage Operation Range: up to 40 V
Protection Features
− Current Limitation
− Thermal Shutdown
These are Pb−Free Devices
xx
A
WL, L
Y
WW
G
See detailed ordering and shipping information in the package
dimensions section on page 11 of this data sheet.
Body Control Module
Instruments and Clusters
Occupant Protection and Comfort
Powertrain
VBAT
Cin
0.1 mF
= Voltage Option
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Typical Applications
•
•
•
•
8774xxG
ALYWW
Vin
Vout
NCV8774
Vout
Cout
1 mF
GND
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2013
April, 2013 − Rev. 0
1
Publication Order Number:
NCV8774/D
NCV8774
Vin
Vout
Driver
With
Current
Limit
−
+
Thermal
Vref
Shutdown
GND
Figure 2. Simplified Block Diagram
PIN CONNECTIONS
PIN
Tab,
1. Vin
2. GND
3. Vout
1
DPAK−3
Figure 3. Pin Connections
PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
1
Vin
Description
2, TAB
GND
Power Supply Ground.
3
Vout
Regulated Output Voltage. Connect 1 mF capacitor with ESR < 100 W to ground.
Positive Power Supply Input. Connect 0.1 mF capacitor to ground.
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2
NCV8774
ABSOLUTE MAXIMUM RATINGS
Rating
Input Voltage (Note 1)
Symbol
Min
Max
Unit
Vin
−0.3
−
40
45
V
DC
Transient, t < 100 ms
Input Current
Iin
−5
−
mA
Output Voltage (Note 2)
Vout
−0.3
5.5
V
Output Current
Iout
−3
Current Limited
mA
Junction Temperature
TJ
−40
150
°C
Storage Temperature
TSTG
−55
150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. 5.5 V or (Vin + 0.3 V) (whichever is lower).
ESD CAPABILITY (Note 3)
Symbol
Rating
Min
Max
Unit
ESD Capability, Human Body Model
ESDHBM
−2
2
kV
ESD Capability, Machine Model
ESDMM
−200
200
V
ESD Capability, Charged Device Model
ESDCDM
−1
1
kV
Max
Unit
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD Charge Device Model tested per AEC−Q100−011 (EIA/JESD22−C101)
LEAD SOLDERING TEMPERATURE AND MSL (Note 4)
Symbol
Rating
Moisture Sensitivity Level
DPAK−3
Min
MSL
Lead Temperature Soldering
Reflow (SMD Styles Only), Pb−Free Versions
TSLD
1
−
−
265 peak
°C
4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
THERMAL CHARACTERISTICS (Note 5)
Symbol
Rating
Thermal Characteristics, DPAK−3
Thermal Resistance, Junction−to−Air (Note 6)
Thermal Reference, Junction−to−Case (Note 6)
Value
Unit
°C/W
56
8.4
RqJA
RYJC
5. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
6. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate.
RECOMMENDED OPERATING RANGE (Note 7)
Rating
Symbol
Min
Max
Unit
Input Voltage (Note 8)
Vin
4.5
40
V
Junction Temperature
TJ
−40
150
°C
7. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
8. Minimum Vin = 4.5 V or (Vout + VDO), whichever is higher.
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3
NCV8774
ELECTRICAL CHARACTERISTICS Vin = 13.2 V, Cin = 0.1 mF, Cout = 1 mF, for typical values TJ = 25°C, for min/max values
TJ = −40°C to 150°C; unless otherwise noted. (Notes 9 and 10)
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
3.2505
4.925
(−1.5 %)
3.3
5.0
3.3495
5.075
(+1.5%)
3.234
3.234
4.9
4.9
(−2 %)
3.3
3.3
5.0
5.0
3.366
3.366
5.1
5.1
(+2%)
3.234
4.9
(−2 %)
3.3
5.0
3.366
5.1
(+2%)
Regline
−20
0
20
mV
Regload
−35
0
35
mV
−
−
250
440
500
875
−
−
18
−
22
23
REGULATOR OUTPUT
Output Voltage (Accuracy %)
Output Voltage (Accuracy %)
Output Voltage (Accuracy %)
Line Regulation
Load Regulation
Dropout Voltage (Note 11)
TJ = 25 °C to 125 °C
3.3 V Vin = 4.5 V to 16 V, Iout = 0.1 mA to 200 mA
5.0 V Vin = 5.575 V to 16 V, Iout = 0.1 mA to 200 mA
3.3 V Vin = 4.5 V to 40 V, Iout = 0.1 mA to 200 mA
Vin = 4.5 V to 16 V, Iout = 0.1 mA to 350 mA
5.0 V Vin = 5.6 V to 40 V, Iout = 0.1 mA to 200 mA
Vin = 5.975 V to 16 V, Iout = 0.1 mA to 350 mA
TJ = −40°C to 125°C
3.3 V Vin = 4.5 V to 28 V, Iout = 0 mA to 350 mA
5.0 V Vin = 5.975 V to 28 V, Iout = 0 mA to 350 mA
3.3 V Vin = 4.5 V to 28 V, Iout = 5 mA
5.0 V Vin = 6 V to 28 V, Iout = 5 mA
Iout = 0.1 mA to 350 mA
Vout
Vout
Vout
VDO
5.0 V Iout = 200 mA
Iout = 350 mA
V
V
V
mV
QUIESCENT CURRENT
Quiescent Current (Iq = Iin − Iout)
Iout = 0.1 mA, TJ = 25°C
Iout = 0.1 mA to 350 mA, TJ ≤ 125°C
Iq
mA
CURRENT LIMIT PROTECTION
Current Limit
Vout = 0.96 x Vout_nom
ILIM
400
−
1100
mA
Short Circuit Current Limit
Vout = 0 V
ISC
400
−
1100
mA
PSRR
−
54
−
dB
Thermal Shutdown Temperature
(Note 12)
TSD
150
175
195
°C
Thermal Shutdown Hysteresis
(Note 12)
TSH
−
25
−
°C
PSRR
Power Supply Ripple Rejection (Note 12) f = 100 Hz, 0.5 Vpp
THERMAL SHUTDOWN
9. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
10. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [ TJ. Low duty
cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
11. Measured when output voltage falls 100 mV below the regulated voltage at Vin = 13.2 V.
12. Values based on design and/or characterization.
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4
NCV8774
TYPICAL CHARACTERISTICS
100
Vin = 13.2 V
Iout = 100 mA
23
Iq, QUIESCENT CURRENT (mA)
Iq, QUIESCENT CURRENT (mA)
24
22
21
20
19
18
17
16
15
14
−40 −20
0
20
40
60
80
Iout = 100 mA
TJ = 25°C
80
60
40
20
0
100 120 140 160
0
5
10
Figure 4. Quiescent Current vs. Temperature
20
25
30
35
40
Figure 5. Quiescent Current vs. Input Voltage
24
Iq, QUIESCENT CURRENT (mA)
15
Vin, INPUT VOLTAGE (V)
TJ, JUNCTION TEMPERATURE (°C)
Vin = 13.2 V
23
22
TJ = 150°C
21
20
TJ = −40°C
19
TJ = 25°C
18
17
16
15
14
0
50
100
150
200
250
300
350
IOUT, OUTPUT CURRENT (mA)
Figure 6. Quiescent Current vs. Output Current
Vin = 13.2 V
Iout = 100 mA
5.08
5.05
5.03
3.36
Vout, OUTPUT VOLTAGE (V)
Vout, OUTPUT VOLTAGE (V)
5.10
Vin = 13.2 V
Iout = 100 mA
3.34
3.32
5.00
4.98
4.95
3.3
3.28
4.93
4.90
−40 −20
0
20
40
60
80
3.26
−40 −20
100 120 140 160
TJ, JUNCTION TEMPERATURE (°C)
0
20
40
60
80
100 120 140 160
TJ, JUNCTION TEMPERATURE (°C)
Figure 7. Output Voltage vs. Temperature
(5 V Option)
Figure 8. Output Voltage vs. Temperature
(3.3 V Option)
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5
NCV8774
TYPICAL CHARACTERISTICS
4.0
6
5
Vout, OUTPUT VOLTAGE (V)
Vout, OUTPUT VOLTAGE (V)
Iout = 1 mA
4
3 TJ = 150°C
TJ = 25°C
2
1
TJ = −40°C
0
0
2
4
6
8
10
Vin, INPUT VOLTAGE (V)
12
3.0
2.5
2.0 TJ = 150°C
1.5
TJ = 25°C
1.0
TJ = −40°C
0.5
0.0
14
Iout = 1 mA
3.5
0
800
800
700
700
TJ = 150°C
600
500
400
TJ = 25°C
300
200
TJ = −40°C
100
0
0
50
100
150
200
250
300
4
6
8
10
Vin, INPUT VOLTAGE (V)
12
14
Figure 10. Output Voltage vs. Input Voltage
(3.3 V Option)
VDO, DROPOUT VOLTAGE (mV)
VDO, DROPOUT VOLTAGE (mV)
Figure 9. Output Voltage vs. Input Voltage
(5 V Option)
2
Iout = 350 mA
600
500
400
Iout = 200 mA
300
200
100
0
−40 −20
350
Iout, OUTPUT CURRENT (mA)
0
20 40 60 80 100 120 140 160
TJ, JUNCTION TEMPERATURE (°C)
Figure 12. Dropout vs. Temperature
(5 V Option)
Figure 11. Dropout vs. Output Current
(5 V Option)
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6
NCV8774
TYPICAL CHARACTERISTICS
800
TJ = 25°C
ILIM, ISC, CURRENT LIMIT (mA)
ILIM, ISC, CURRENT LIMIT (mA)
700
ISC @ Vout = 0 V
600
ILIM @ Vout = 4.8 V
500
400
300
200
0
5
10
15
20
25
30
Vin, INPUT VOLTAGE (V)
35
TJ = 25°C
700
600
ISC @ Vout = 0 V
500
ILIM @ Vout = 3.17 V
400
300
200
100
0
40
0
Figure 13. Output Current Limit vs. Input
Voltage (5 V Option)
ILIM, ISC, CURRENT LIMIT (mA)
ISC @ Vout = 0 V
ILIM @ Vout = 4.8 V
550
500
−40 −20
0
20
40
60
80
15
20
25
30
Vin, INPUT VOLTAGE (V)
35
40
700
650
600
10
Figure 14. Output Current Limit vs. Input
Voltage (3.3 V Option)
Vin = 13.2 V
Vin = 13.2 V
650
600
ISC @ Vout = 0 V
ILIM @ Vout = 3.17 V
550
500
−40 −20
100 120 140 160
0
20
40
60
80
100 120 140 160
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 15. Output Current Limit vs. Temperature
(5 V Option)
Figure 16. Output Current Limit vs. Temperature
(3.3 V Option)
100
ESR, STABILITY REGION (W)
ILIM, ISC, CURRENT LIMIT (mA)
700
5
Vin = 13.2 V
TJ = −40°C to 150°C
Cout = 1 mF − 100 mF
10
1
STABLE REGION
0.1
0.01
0
50
100
150
200
250
300
350
Iout, OUTPUT CURRENT (mA)
Figure 17. Cout ESR Stability Region vs. Output
Current
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7
NCV8774
TYPICAL CHARACTERISTICS
TJ = 25°C
Iout = 1 mA
Cout = 10 mF
trise/fall = 1 ms (Vin)
14.2 V
Vin
(1 V/div)
13 V
Vin
(1 V/div)
TJ = 25°C
Iout = 1 mA
Cout = 10 mF
trise/fall = 1 ms (Vin)
13 V
12.2 V
12.2 V
3.4 V
5.16 V
Vout
(100 mV/div)
5V
Vout
(100 mV/div)
4.95 V
3.28 V
TIME (1 ms/div)
TJ = 25°C
Vin = 13.2 V
Cout = 10 mF
trise/fall = 1 ms (Iout)
Iout
(50 mA/div)
TIME (100 ms/div)
14.2 V
Figure 18. Line Transients
(5 V Option)
100 mA
3.24 V
Figure 19. Line Transients
(3.3 V Option)
TJ = 25°C
Vin = 13.2 V
Cout = 10 mF
trise/fall = 1 ms (Iout)
100 mA
Iout
(50 mA/div)
0.1 mA
0.1 mA
3.42 V
5.15 V
3.3 V
5V
Vout
(100 mV/div)
Vout
(100 mV/div)
4.88 V
3.11 V
TIME (50 ms/div)
TIME (50 ms/div)
Figure 20. Load Transients
(5 V Option)
Figure 21. Load Transients
(3.3 V Option)
TJ = 25°C
Iout = 1 mA
Cout = 10 mF
TJ = 25°C
Iout = 1 mA
Cout = 10 mF
Vin
(5 V/div)
Vin
(5 V/div)
Vout
(2 V/div)
Vout
(2 V/div)
TIME (100 ms/div)
TIME (100 ms/div)
Figure 22. Power Up/Down Response
(5 V Option)
Figure 23. Power Up/Down Response
(3.3 V Option)
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8
NCV8774
TYPICAL CHARACTERISTICS
100
80
80
70
60
60
50
50
40
40
30
30
20
20
10
10
100
1000
10000
100000
0
10
100
1000
10000
f, FREQUENCY (Hz)
f, FREQUENCY (Hz)
Figure 24. PSRR vs. Frequency
(5 V Option)
Figure 25. PSRR vs. Frequency
(3.3 V Option)
5000
TJ = 25°C
Vin = 13.2 V
Cout = 1 mF
Iout = 350 mA
4500
NOISE DENSITY (nV/√Hz)
0
10
TJ = 25°C
Vin = 13.2 V $ 0.5 Vpp
Cout = 1 mF
Iout = 1.0 mA
90
PSRR (dB)
70
PSRR (dB)
100
TJ = 25°C
Vin = 13.2 V $ 0.5 Vpp
Cout = 1 mF
Iout = 1.0 mA
90
4000
3500
3000
2500
2000
1500
1000
500
0
10
100
1000
10000
f, FREQUENCY (Hz)
Figure 26. Noise vs. Frequency
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9
100000
100000
NCV8774
DEFINITIONS
General
Current Limit and Short Circuit Current Limit
All measurements are performed using short pulse low
duty cycle techniques to maintain junction temperature as
close as possible to ambient temperature.
Current Limit is value of output current by which output
voltage drops below 96% of its nominal value. Short Circuit
Current Limit is output current value measured with output
of the regulator shorted to ground.
Output voltage
The output voltage parameter is defined for specific
temperature, input voltage and output current values or
specified over Line, Load and Temperature ranges.
PSRR
Power Supply Rejection Ratio is defined as ratio of output
voltage and input voltage ripple. It is measured in decibels
(dB).
Line Regulation
The change in output voltage for a change in input voltage
measured for specific output current over operating ambient
temperature range.
Line Transient Response
Typical output voltage overshoot and undershoot
response when the input voltage is excited with a given
slope.
Load Regulation
The change in output voltage for a change in output
current measured for specific input voltage over operating
ambient temperature range.
Load Transient Response
Typical output voltage overshoot and undershoot
response when the output current is excited with a given
slope between low−load and high−load conditions.
Dropout Voltage
The input to output differential at which the regulator
output no longer maintains regulation against further
reductions in input voltage. It is measured when the output
drops 100 mV below its nominal value. The junction
temperature, load current, and minimum input supply
requirements affect the dropout level.
Internal thermal shutdown circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated at typically 175°C,
the regulator turns off. This feature is provided to prevent
failures from accidental overheating.
Quiescent and Disable Currents
Maximum Package Power Dissipation
Quiescent Current (Iq) is the difference between the input
current (measured through the LDO input pin) and the
output load current.
The power dissipation level is maximum allowed power
dissipation for particular package or power dissipation at
which the junction temperature reaches its maximum
operating value, whichever is lower.
Thermal Protection
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10
NCV8774
APPLICATIONS INFORMATION
The NCV8774 regulator is self−protected with internal
thermal shutdown and internal current limit. Typical
characteristics are shown in Figures 4 to 26.
Since TJ is not recommended to exceed 150°C, then the
NCV8774 soldered on 645 mm2, 1 oz copper area, FR4 can
dissipate up to 2.35 W when the ambient temperature (TA)
is 25°C. See Figure 27 for RqJA versus PCB area. The power
dissipated by the NCV8774 can be calculated from the
following equations:
Input Decoupling (Cin)
A ceramic or tantalum 0.1 mF capacitor is recommended
and should be connected close to the NCV8774 package.
Higher capacitance and lower ESR will improve the overall
line and load transient response.
If extremely fast input voltage transients are expected then
appropriate input filter must be used in order to decrease
rising and/or falling edges below 50 V/ms for proper
operation. The filter can be composed of several capacitors
in parallel.
P D + V inǒI q@I outǓ ) I outǒV in * V outǓ
or
V in(max) +
NOTE:
P D(max) ) ǒV out
I outǓ
I out ) I q
(eq. 3)
Items containing Iq can be neglected if Iout >> Iq.
100
RqJA, THERMAL RESISTANCE (°C/W)
Output Decoupling (Cout)
The NCV8774 is a stable component and does not require
a minimum Equivalent Series Resistance (ESR) for the
output capacitor. Stability region of ESR vs Output Current
is shown in Figure 17. The minimum output decoupling
value is 1 mF and can be augmented to fulfill stringent load
transient requirements. The regulator works with ceramic
chip capacitors as well as tantalum devices. Larger values
improve noise rejection and load regulation transient
response.
Thermal Considerations
As power in the NCV8774 increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and the ambient temperature
affect the rate of junction temperature rise for the part. When
the NCV8774 has good thermal conductivity through the
PCB, the junction temperature will be relatively low with
high power applications. The maximum dissipation the
NCV8774 can handle is given by:
P D(max) +
(eq. 2)
ƪTJ(max) * TAƫ
90
80
70
DPAK 1 oz
60
DPAK 2 oz
50
40
0
100
200
300
400
500
600
COPPER HEAT SPREADER (mm2)
700
Figure 27. Thermal Resistance vs. PCB Copper Area
Hints
Vin and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise or cause the regulator
to malfunction. Place external components, especially the
output capacitor, as close as possible to the NCV8774 and
make traces as short as possible.
(eq. 1)
R qJA
ORDERING INFORMATION
Output Voltage
Marking
Package
Shipping†
NCV8774DT50RKG
5.0 V
877450G
DPAK−3
(Pb−Free)
2500 /
Tape & Reel
NCV8774DT33RKG
3.3 V
877433G
DPAK−3
(Pb−Free)
2500 /
Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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11
NCV8774
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C
ISSUE D
A
E
b3
c2
B
Z
D
1
L4
A
4
L3
b2
e
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
C
H
DETAIL A
3
DIM
A
A1
b
b2
b3
c
c2
D
E
e
H
L
L1
L2
L3
L4
Z
c
b
0.005 (0.13)
M
H
C
L2
GAUGE
PLANE
C
L
L1
DETAIL A
SEATING
PLANE
A1
ROTATED 905 CW
INCHES
MIN
MAX
0.086 0.094
0.000 0.005
0.025 0.035
0.030 0.045
0.180 0.215
0.018 0.024
0.018 0.024
0.235 0.245
0.250 0.265
0.090 BSC
0.370 0.410
0.055 0.070
0.108 REF
0.020 BSC
0.035 0.050
−−− 0.040
0.155
−−−
MILLIMETERS
MIN
MAX
2.18
2.38
0.00
0.13
0.63
0.89
0.76
1.14
4.57
5.46
0.46
0.61
0.46
0.61
5.97
6.22
6.35
6.73
2.29 BSC
9.40 10.41
1.40
1.78
2.74 REF
0.51 BSC
0.89
1.27
−−−
1.01
3.93
−−−
SOLDERING FOOTPRINT*
6.20
0.244
2.58
0.102
5.80
0.228
3.00
0.118
1.60
0.063
6.17
0.243
SCALE 3:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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