TI LM3017

March 12, 2012
LM3017
High Efficiency Low-Side Controller with True Shutdown
General Description
Features
The LM3017 is a versatile low-side NFET controller incorporating true shutdown and input side current limiting. It is
designed for simple implementation of boost conversions in
Thunderbolt™ Technology. The LM3017 can also be configured for flyback or SEPIC designs. The input voltage range of
5V to 18V accommodates a two or three cell lithium ion battery
or a 12V rail. The enable pin accepts a single input to drive
three different modes of operation: boost, pass through, or
shutdown mode. The LM3017 draws very low current in shutdown mode, typically 40nA from the input supply.
The LM3017 provides an adjustable output from VIN to 20V in
order to drive the Power Load Switch or Mux for the host
Thunderbolt™ port. The ability to drive an external high-side
NMOS provides for true isolation of the load from the input.
Current limiting on the input ensures that inrush and shortcircuit currents are always under control. The LM3017 incorporates built in thermal shutdown, cycle-by-cycle current limit,
short circuit protection, output overvoltage protection, and
soft-start. It is available in a 10-pin QFN package.
■ Fully compliant to Thunderbolt™ Technology
pass through, or shutdown
■ Built-in charge pump for high-side NFET disconnect
■
■
■
■
■
■
switch
1A push-pull driver for low-side NFET
Peak current mode control
Simple slope compensation
Protection features: thermal shutdown, cycle-by-cycle
current limit, short circuit protection, output overvoltage
protection, and latch-off
Internal soft-start
2.4mm x 2.7mm x 0.8mm 10-pin QFN package
Applications
■ Thunderbolt Technology™ Host Ports
■ Notebook and Desktop Computers, Tablets, and Other
Key Specifications
■
■
■
■
■
specifications
■ True shutdown for short circuit protection
■ Single enable pin with three modes of operation: boost,
Input voltage range of 5V to 18V
400 kHz fixed frequency operation
±1% reference voltage accuracy over temperature
Low shutdown current (< 1µA), 40nA typical
±3% D.C. input current limit
Portable Consumer Electronics
■ Hard Disc Drives, Solid State Drives
■ Offline Power Supplies
■ Set-Top Boxes
Typical Application Circuit
30180901
Typical Boost Converter Application
© 2012 Texas Instruments Incorporated
301809 SNOSC66
www.ti.com
LM3017 High Efficiency Low-Side Controller with True Shutdown
PRELIMINARY
LM3017
Connection Diagram
30180903
Top View
10-pin QFN
Pin Descriptions
Pin
Name
1
VCC
Description
Function
Driver supply voltage pin
Output of internal regulator powering low side NMOS driver. A minimum of
0.47µF must be connected from this pin to PGND for proper operation.
2
DR
Low-side NMOS gate driver
output
Output gate drive to low side NMOS gate.
3
PGND
Power Ground
Ground for power section. External power circuit reference. Should be
connected to AGND at a single point.
4
VG
High side NMOS gate driver
output
Output gate drive to high side NMOS gate.
5
EN/MODE
Multi-function input pin
This input provides for chip enable, and mode selection. See functional
description for details.
6
FB
Feed-back input pin
Negative input to error amplifier. Connect to feed-back resistor tap to regulate
output.
7
COMP
Compensation pin
A resistor and capacitor combination connected to this pin provides frequency
compensation for the regulator control loop.
8
AGND
Analog Ground
Ground for analog control circuitry. Reference point for all stated voltages.
9
ISEN
Current sense input
Current sense input, with respect to Vin, for all current limit functions.
10
VIN
Power Supply input pin
Input supply to regulator. See applications section for recommendations on
bypass capacitors on this pin.
www.ti.com
2
If Military/Aerospace specified devices are required,
please contact the Texas Instruments Sales Office/
Distributors for availability and specifications.
VIN to PGND, AGND
FB, EN/MODE, COMP, VCC
-0.3V to 20V
1.0A
Operating Ratings
-0.3V to 20V
-0.3V to 6V
(Note 1)
VIN
Junction Temperature Range (TJ)
ESD Susceptibility (Note 2)
5V to 18V
−40°C to +125°C
±2 kV
Electrical Characteristics
Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the
junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are guaranteed through test, design or statistical
correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
Unless otherwise stated the following conditions apply: Vin = 12V.
Symbol
VFB
Parameter
Conditions
Feedback Voltage
Vcomp = 1.4V,
5V ≤ Vin ≤ 18V
0°C to +85°C
Feedback Voltage
Vcomp = 1.4V,
Min
(Note
3)
Typ
Max
(Note
Units
(Note 3)
4)
1.2622 1.275 1.28775
5
V
1.2495 1.275
V
1.3005
5V ≤ Vin ≤ 18V
-40°C to +125°C
ΔVLINE
Feedback Voltage Line Regulation
5V ≤ Vin ≤ 18V
TBD
%/V
ΔVLOAD
Output Voltage Load Regulation
Vin = 12V
TBD
%/A
Input Under Voltage Lock-Out reference
Voltage
Ramping up
VUVLO
Input Under Voltage Lock-Out reference
Voltage Hysteresis
Fnom
RDS(ON)
VDR (max)
Dmax
Tmin(on)
Nominal Switching Frequency
(Note 5)
TBD
4.5
TBD
V
TBD
300
TBD
mV
360
400
440
kHz
Low side NMOS driver resistance; top switch Vin = 5V, IDR = 0.2A
4
Ω
Low side NMOS driver resistance; bottom
switch
Vin = 5V, IDR = 0.2A
2
Ω
Maximum Driver Voltage Supply
Vin < 6V
Vin
V
Vin ≥ 6V
6
Maximum Duty Cycle
85
Minimum On Time
250
Irun
Supply Current in Boost Mode - No-load
EN/MODE pin = 1.6V
FEEDBACK pin = 1.4V
IQ
Supply Current in Shutdown Mode
EN/MODE pin = 0.3V
Istby
Supply Current in Stand-by mode
EN/MODE pin = 2.6V
Stand-by Mode Threshold
EN/MODE pin thresholds
TBD
Shut-down Mode Threshold
EN/MODE pin thresholds
Run Mode Window
EN/MODE pin thresholds
EN/MODE pin bias current
Cycle-by-Cycle Current Limit Threshold
during boost mode
Ven-stby
Ven-shutdown
Ven-run
Ien
VSENSE
VSL
%
4
ns
TBD
mA
1
µA
1.2
TBD
mA
2.6
TBD
V
TBD
0.4
TBD
V
1.6
1.9
2.2
V
EN/MODE = 1.6V
TBD
±1.0
TBD
µA
EN/MODE = 1.6V
FB = 0.5V
153
170
187
mV
Internal Ramp Compensation Voltage
90
mV
VLIM1
Input Current Limit Threshold Voltage in
Stand-by mode
EN/MODE = 2.6V (Note 7)
82
85
88
mV
VLIM2
Input Current Limit Threshold Voltage in
Stand-by Mode (during Start-up)
EN/MODE = 2.6V(Note 7)
TBD
102
TBD
mV
3
www.ti.com
LM3017
ISEN, DR, VG to PGND,
AGND
Peak low side driver output
current
Absolute Maximum Ratings (Note 1)
LM3017
Symbol
Min
(Note
3)
Typ
Max
(Note
Units
(Note 3)
4)
Parameter
Conditions
VOVP
Output-Over Voltage Protection Threshold
Measured with respect to FB pin.
VCOMP = 1.4V
TBD
85
TBD
mV
VOVP(HYS)
Output-Over Voltage Protection Threshold
Hysteresis
Measured with respect to FB pin.
VCOMP = 1.4V
TBD
70
TBD
mV
VSC
Short Circuit Current Limit Threshold during
boost mode
200
Gm
Error Amplifier Transconductance
VCOMP = 1.4V
VG-max
Maximum Drive voltage at VG pin
Vin = 5V, Isense = 5V
IG = 0A
10
V
VG-min
Minimum Drive voltage at VG pin
Vin = 5V, Isense = Vin - 200mV
IG = 0A
100
mV
IG
Maximum Drive current at VG pin
Vin = 5V, Isense = 5V
VG = Vin
500
µA
AVOL
Error Amplifier Open Loop Voltage Gain
IEAO
Error Amplifier Output Current Limits
VEAO
Tss
Error Amplifier Output Voltage Limits
216
450
mV
690
µA/V
35
60
66
V/V
SOURCING:
VCOMP = 1.4V
VFB = 1.1V
475
640
837
µA
SINKING:
VCOMP = 1.4V
VFB = 1.4V
31
65
100
µA
UPPER LIMIT:
VFB = 0V
2.45
2.7
2.93
V
LOWER LIMIT:
VFB = 1.4V
0.32
0.6
0.9
V
Internal Soft-Start Delay
VFB = 1.2V
10
ms
TLIM1
Current Limit time at VLIM1
(Note 7)
TBD
ms
TLIM2
Current Limit time at VLIM2
(Note 7)
TBD
Tsc
Short-Circuit Time in Boost
(Note 7)
TBD
TDELAY
Time delay to transition between stand-by
and boost
(Note 7)
TBD
TBLANK
TBD
ms
Current Limit Latch-off Blank Time
(Note 7)
Tr
Drive Pin Rise Time
Cload = 3nF
VDR = 0V to 3V
25
ns
Tf
Drive Pin Fall Time
Cload = 3nF
VDR = 3V to 0V
25
ns
Thermal Shutdown Threshold
165
°C
Thermal Shutdown Threshold Hysteresis
10
°C
TSD
TSD-hyst
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings indicates conditions for which the device is
intended to be functional, but does not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics.
The guaranteed specifications apply only for the test conditions.
Note 2: The human body model is a 100 pF capacitor discharged through a 1.5kΩ resistor into each pin. Test method is per JESD-22-114.
Note 3: Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlation using Statistical
Quality Control (SQC) methods. Limits are used to calculate National's Average Quality Level (AOQL).
Note 4: Typical numbers are at 25°C and represent the most likely parametric norm.
Note 5: Typical values are programmed by metal mask options. The following options are available: 100 kHz, 200 kHz, 340 kHz, 400 kHz, 500 kHz, 750 kHz, 1
MHz. Consult the factory for details.
Note 6: The bias current flowing through this pin is compensated and can flow either in-to or out-of this pin.
Note 7: See text for details of current limit operation.
www.ti.com
4
LM3017
Functional Block Diagram
30180906
Under extremely light load or no-load conditions, the energy
delivered to the output capacitor when the external MOSFET
is on during the blank-out time is more than what is delivered
to the load. An over-voltage comparator inside the LM3017
prevents the output voltage from rising under these conditions
by sensing the feedback (FB pin) voltage and resetting the
RS latch. The latch remains in a reset state until the output
decays to the nominal value. Thus the operating frequency
decreases at light loads, resulting in excellent efficiency.
Functional Description
The LM3017 uses a fixed frequency, Pulse Width Modulated
(PWM), current mode control architecture. In a typical application circuit, the peak current through the external high side
MOSFET is sensed through an external sense resistor. The
voltage across this resistor is fed into the ISEN pin. This voltage
is then level shifted and fed into the positive input of the PWM
comparator. The output voltage is also sensed through an
external feedback resistor divider network and fed into the
error amplifier (EA) negative input (feedback pin, FB). The
output of the error amplifier (COMP pin) is added to the slope
compensation ramp and fed into the negative input of the
PWM comparator.
At the start of any switching cycle, the oscillator sets a high
signal on the DR pin (gate of the external MOSFET) and the
external MOSFET turns on. When the voltage on the positive
input of the PWM comparator exceeds the negative input, the
Drive Logic is reset and the external MOSFET turns off.
The voltage sensed across the sense resistor generally contains spurious noise spikes, as shown in Figure 1. These
spikes can force the PWM comparator to reset the RS latch
prematurely. To prevent these spikes from resetting the latch,
a blank-out circuit inside the IC prevents the PWM comparator
from resetting the latch for a short duration after the latch is
set. This duration, called the blank-out time, is typically 250
ns and is specified as Tmin (on) in the electrical characteristics
section.
30180907
FIGURE 1. Basic Operation of the PWM comparator
5
www.ti.com
LM3017
OPERATION OF THE EN/MODE PIN
The EN/MODE pin drives the high side gate (VG pin) to enable or disable the output through the high side MOSFET
(pass MOSFET), furthermore it defines the current limit for
each operation mode (see next section).
BOOST MODE
The boost regulator can be turned on by bringing the EN/
MODE pin to greater than 1.6V, but less than 2.2V. This is the
run mode for the boost regulator. Note that the LM3017 will
always start in stand-by and transition to boost mode, after a
delay of TDELAY=XXms (typ); see typical waveforms. If the
EN/MODE pin is taken to a value >2.6V, the part will enter
stand-by mode.
1) VEN/MODE < 0.4V Shutdown mode
2) 0.4V < VEN/MODE < 2.6V Boost mode
3) VEN/MODE > 2.6V Standby mode
STANDBY MODE
Pulling the EN/MODE pin to greater than 2.6V, for more than
50µS, during any mode of operation, will place the part in
stand-by mode. The boost regulator will be off and the highside NMOS FET will be on. During this mode, the load is
connected to the input supply through the inductor.
SHUTDOWN MODE
Pulling the EN/MODE pin to less than 0.4V, for more than
50µS, during any mode of operation, will place the part in full
shutdown mode. The boost regulator and high-side NMOS
FET will be off and the load will be disconnected from the input
supply. In this mode, the regulator will draw a maximum of
1µA from the input supply.
30180951
30180917
30180996
30180993
www.ti.com
6
LM3017
CURRENT LIMIT AND SHORT CIRCUIT PROTECTION
Boost Mode
In boost mode the LM3017 features both cycle-by-cycle current limit and short circuit protection. Unlike most boost regulators, the LM3017 can protect itself from short circuits on
the output by shutting off the pass FET. The boost current
limit, defined by VCL=170mV in the electrical characteristics
table, turns off the boost FET for normal overloads on a cycleby-cycle basis. The current is limited to VCL/RSEN until the
overload is removed. Should the output be shorted, or otherwise pulled below VIN, the inductor current will have a tendency to "run-away". This is prevented by the short circuit
protection feature, defined as VSC = 200mV in the electrical
characteristics table. When this current limit is tripped, the
current is limited to VSC/RSEN by controlling the pass FET. If
the short persists for TSC > 450µs the pass FET will be latched
off. In this way, the current is limited to VSC/Rsen until the
short is removed or the time of TSC = 450µs is completed.
Pulling the EN/MODE pin low (<0.4V, typ) is required to reset
this short circuit latch-off mode. The delay of TSC = 450µs
helps to prevent nuisance latch-off during a momentary short
on the output.
Standby Mode
In stand-by mode the power path is protected from shorts and
overloads by the current limit defined as VLIM1 = 85mV in the
electrical characteristics table. When this current limit is
tripped, the current is limited to VLIM1/RSEN by controlling the
pass FET. If the short persists for TLIM1 > 900µs the pass FET
will be latched off. In this way, the current is limited to VLIM1/
RSEN until the short is removed or the time of TLIM1 = 900µs is
completed. Pulling the EN/MODE pin low (<0.4V, typ) is required to reset this latch-off mode.
Start-up Stand-bye Mode
During start-up in stand-by mode, the current limit is defined
by VLIM2 = 100mV in the electrical characteristics table, for the
first TLIM2 = 3.6ms. The current is limited to VLIM2/RSEN, for this
period . Once the TLIM2 = 3.6ms timer has finished, the current
limit is reduced to VLIM1 = 85mV . For the first TLIM2 = 3.6ms
of the start-up, the latch-off feature is not enabled, however
the current will always be limited to VLIM2/RSEN. This allows
the part to start-up normally. If the current limit is still tripped
at the end of TLIM2 = 3.6ms, the TLIM1 = 900µs timer is started.
Once the TLIM1= 900µs time has expired, the pass FET is
latched off. This gives a total current-limited time of TLIM1+
TLIM2 = 4.5ms, in cases where the LM3017 is started into a
short circuit at the output.
30180944
FIGURE 2. Current Limit / Short Circuit protection
OVER VOLTAGE PROTECTION
The LM3017 has over voltage protection (OVP) for the output
voltage. OVP is sensed at the feedback pin (FB). If at anytime
the voltage at the feedback pin rises to VFB + VOVP, OVP is
triggered. See the electrical characteristics section for limits
on VFB and VOVP.
OVP will cause the drive pin (DR) to go low, forcing the power
MOSFET off. With the MOSFET off, the output voltage will
drop. The LM3017 will begin switching again when the feedback voltage reaches VFB + (VOVP - VOVP(HYS)). See the electrical characteristics section for limits on VOVP(HYS).
Start-up Boost Mode
During start-up in boost mode, the current limit is defined by
VLIM2 = 100mV (typ) in the electrical characteristics table, for
the first TLIM2 = 3.6ms. The current is limited to VLIM2/RSEN, for
this period . Once the TLIM2 = 3.6ms timer has finished, the
current limit is increased to VSC = 200mV. For the first TLIM2
= 3.6ms of the start-up, the latch-off feature is not enabled,
however the current will always be limited to VLIM2/RSEN. This
allows the part to start-up normally. If the current limit is still
tripped at the end of TLIM2 = 3.6ms, the TSC = 450µs timer is
started. Once the TSC = 450µs time has expired, the pass FET
is latched off. This gives a total current-limited time of TSC +
TLIM2 = 4.05ms, in cases where the LM3017 is started into a
short circuit at the output.
SLOPE COMPENSATION RAMP
The LM3017 uses a current mode control scheme. The main
advantages of current mode control are inherent cycle-by-cycle current limit for the switch, simpler control loop characteristics and excellent line and load transient response. However
there is a natural instability that will occur for duty cycles, D,
7
www.ti.com
LM3017
greater than 50% if additional slope compensation is not addressed as described below.
slope of the compensation ramp externally, if the need arises.
Adding a single external resistor, RS (as shown in Figure 4)
increases the amplitude of the compensation ramp as shown
in Figure 3.
MC > M2 / 2
For the boost topology:
M1 = [VIN / L] x RSEN x A
M2 = [(VOUT − VIN) / L] x RSEN x A
Where:
• MC is the slope of the compensation ramp.
• M1 is the slope of the inductor current during the ON time.
• M2 is the slope of the inductor current during the OFF time.
• RSEN is the sensing resistor value.
• VOUT represents the output voltage.
• VIN represents the input voltage.
• A is equal to 0.86 and it is the internal sensing amplification
of the LM3017.
The compensation ramp has been added internally in the
LM3017. The slope of this compensation ramp has been selected to satisfy most applications, and its value depends on
the switching frequency. This slope can be calculated using
the formula:
301809a1
FIGURE 3. Additional Slope Compensation Added Using
External Resistor RS
Where,
ΔVSL = K x RS
K = 40 µA typically and changes slightly as the switching frequency changes.
A more general equation for the slope compensation ramp,
MC, is shown below to incluse ΔVSL cause by the resistor
RS.
MC = VSL x fS
In the above equation, VSL is the amplitude of the internal
compensation ramp and fS is the controller's switching frequency. Limits for VSL have been specified in the electrical
characteristics section.
In order to provide the user additional flexibility, a patented
scheme has been implemented inside the IC to increase the
MC = (VSL + ΔVSL) x fS
30180913
FIGURE 4. Increasing the Slope of the Compensation Ramp
www.ti.com
8
LM3017
Application Circuits
30180943
FIGURE 5. Typical High Efficiency Step-Up (Boost) Converter
Bill of Materials (BOM)
Designation
Description
Size
Manufacturer Part #
Vendor
CIN1
Cap 22µF 25V X5R
1206
GRM31CR61E226KE15L
Murata
CO1,CO2, CO3
Cap 22µF 25V X5R
1206
GRM31CR61E226KE15L
Murata
CCOMP
Cap 0.022µF
0603
CCOMP2
Cap 1000pF
0603
CBYP
Cap 0.1µF 25V X7R
0603
06033C104KAT2A
AVX
CVCC
Cap 0.47µF 16V X7R
0805
C2012X7R1C474K
TDK
RCOMP
RES, 10k ohm, 1%, 0.1W
0603
CRCW060310K0FKEA
Vishay
RFBT
RES, 21.5k ohm, 1%, 0.1W
0603
CRCW060321K5FKEA
Vishay
RFBB
RES, 2k ohm, 1%, 0.1W
0603
CRCW06032K00FKEA
Vishay
RS
RES, 100 ohm, 1%, 0.1W
0603
CRCW0603100RFKEA
Vishay
RSEN
RES, 0.03 ohm, 1%, 1W
1206
WSLP1206R0300FEA
Vishay
Q1
NexFET™ N-CH, 25V, 60A, RDS(on)= 4.4mohm
8-SON
CSD16323Q3
TI
Q2
NexFET™ N-CH, 25V, 60A, RDS(on)= 4.3mohm
8-SON
CSD16340Q3
TI
D1
Diode Schottky, 30V, 2A
SMB
20BQ030TRPBF
Vishay
L1
Shielded Inductor, 2.2µH, 3.4A
4.45mm L x
4.06mm W x
1.85mm H
MPI4040R3
Cooper
U1
LM3017
TI
9
www.ti.com
LM3017
Physical Dimensions inches (millimeters) unless otherwise noted
10-Lead QFN Package
NS Package Number LEK10A
www.ti.com
10
LM3017
Notes
11
www.ti.com
LM3017 High Efficiency Low-Side Controller with True Shutdown
Notes
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated