AMSCO TCS3472

TAOS Inc.
is now
ams AG
The technical content of this TAOS datasheet is still valid.
Contact information:
Headquarters:
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8141 Unterpremstaetten, Austria
Tel: +43 (0) 3136 500 0
e-Mail: [email protected]
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TCS3472
COLOR LIGHT-TO-DIGITAL CONVERTER
with IR FILTER
r
r
TAOS135 − AUGUST 2012
PACKAGE FN
DUAL FLAT NO-LEAD
(TOP VIEW)
D Red, Green, Blue (RGB), and Clear Light
D
D
D
SCL 2
5 INT
GND 3
4 NC
Package Drawing Not to Scale
Applications
D RGB LED Backlight Control
D Light Color Temperature Measurement
D Ambient Light Sensing for Display
D
D
Backlight Control
Fluid and Gas Analysis
Product Color Verification and Sorting
End Products and Market Segments
D TVs, Mobile Handsets, Tablets, Computers,
D
D
D
D
Description
6 SDA
lv
D
VDD 1
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Sensing with IR Blocking Filter
− Programmable Analog Gain and
Integration Time
− 3,800,000:1 Dynamic Range
− Very High Sensitivity — Ideally Suited for
Operation Behind Dark Glass
Maskable Interrupt
− Programmable Upper and Lower
Thresholds with Persistence Filter
Power Management
− Low Power — 2.5-mA Sleep State
− 65-mA Wait State with Programmable Wait
State Time from 2.4 ms to > 7 Seconds
2
I C Fast Mode Compatible Interface
− Data Rates up to 400 kbit/s
− Input Voltage Levels Compatible with VDD
or 1.8 V Bus
Register Set and Pin Compatible with the
TCS3x71 Series
Small 2 mm 2.4 mm Dual Flat No-Lead
(FN) Package
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Features
and Monitors
Consumer and Commercial Printing
Medical and Health Fitness
Solid State Lighting (SSL) and Digital
Signage
Industrial Automation
ni
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The TCS3472 device provides a digital return of red, green, blue (RGB), and clear light sensing values. An IR
blocking filter, integrated on-chip and localized to the color sensing photodiodes, minimizes the IR spectral
component of the incoming light and allows color measurements to be made accurately. The high sensitivity,
wide dynamic range, and IR blocking filter make the TCS3472 an ideal color sensor solution for use under
varying lighting conditions and through attenuating materials.
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The TCS3472 color sensor has a wide range of applications including RGB LED backlight control, solid-state
lighting, health/fitness products, industrial process controls and medical diagnostic equipment. In addition, the
IR blocking filter enables the TCS3472 to perform ambient light sensing (ALS). Ambient light sensing is widely
used in display-based products such as cell phones, notebooks, and TVs to sense the lighting environment and
enable automatic display brightness for optimal viewing and power savings. The TCS3472, itself, can enter a
lower-power wait state between light sensing measurements to further reduce the average power consumption.
The LUMENOLOGY r Company
Copyright E 2012, TAOS Inc.
r
Texas Advanced Optoelectronic Solutions Inc.
1001 Klein Road S Suite 300 S Plano, TX 75074 S (972)
r 673-0759
www.taosinc.com
1
TCS3472
COLOR LIGHT-TO-DIGITAL CONVERTER
with IR FILTER
TAOS135 − AUGUST 2012
Functional Block Diagram
Interrupt
Wait Control
RGBC Control
Clear
Red
Green
Clear ADC
Clear Data
Red ADC
Red Data
Green ADC
Green Data
Blue ADC
Blue Data
Upper Limit
Lower Limit
SDA
Blue
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Detailed Description
lv
GND
SCL
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VDD
INT
I2C Interface
IR-Blocking
Filter
The TCS3472 light-to-digital converter contains a 3 × 4 photodiode array, four analog-to-digital converters
(ADC) that integrate the photodiode current, data registers, a state machine, and an I2C interface. The 3 × 4
photodiode array is composed of red-filtered, green-filtered, blue-filtered, and clear (unfiltered) photodiodes.
In addition, the photodiodes are coated with an IR-blocking filter. The four integrating ADCs simultaneously
convert the amplified photodiode currents to a 16-bit digital value. Upon completion of a conversion cycle, the
results are transferred to the data registers, which are double-buffered to ensure the integrity of the data. All
of the internal timing, as well as the low-power wait state, is controlled by the state machine.
Communication of the TCS3472 data is accomplished over a fast, up to 400 kHz, two-wire I2C serial bus. The
industry standard I2C bus facilitates easy, direct connection to microcontrollers and embedded processors.
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In addition to the I2C bus, the TCS3472 provides a separate interrupt signal output. When interrupts are
enabled, and user-defined thresholds are exceeded, the active-low interrupt is asserted and remains asserted
until it is cleared by the controller. This interrupt feature simplifies and improves the efficiency of the system
software by eliminating the need to poll the TCS3472. The user can define the upper and lower interrupt
thresholds and apply an interrupt persistence filter. The interrupt persistence filter allows the user to define the
number of consecutive out-of-threshold events necessary before generating an interrupt. The interrupt output
is open-drain, so it can be wire-ORed with other devices.
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TCS3472
COLOR LIGHT-TO-DIGITAL CONVERTER
with IR FILTER
TAOS135 − AUGUST 2012
Terminal Functions
TERMINAL
NO.
TYPE
DESCRIPTION
GND
3
Power supply ground. All voltages are referenced to GND.
INT
5
O
Interrupt — open drain (active low).
NC
4
O
No connect — do not connect.
SCL
2
I
I2C serial clock input terminal — clock signal for I2C serial data.
SDA
6
I/O
VDD
1
I2C serial data I/O terminal — serial data I/O for I2C .
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NAME
Supply voltage.
Available Options
0x39
PACKAGE − LEADS
INTERFACE DESCRIPTION
FN−6
I2C Vbus = VDD Interface
TCS34723†
0x39
FN−6
I2C
TCS34725
0x29
FN−6
I2C Vbus = VDD Interface
TCS34727
0x29
FN−6
I2C Vbus = 1.8 V Interface
Vbus = 1.8 V Interface
ORDERING NUMBER
lv
ADDRESS
TCS34721FN
TCS34723FN
TCS34725FN
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†
DEVICE
TCS34721†
TCS34727FN
Contact TAOS for availability.
Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VDD (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8 V
Input terminal voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.8 V
Output terminal voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.8 V
Output terminal current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −1 mA to 20 mA
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
ESD tolerance, human body model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2000 V
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltages are with respect to GND.
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Recommended Operating Conditions
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Supply voltage, VDD (TCS34721 & TCS34725) (I2C Vbus = VDD)
Supply voltage, VDD (TCS34723 & TCS34727) (I2C Vbus = 1.8 V)
NOM
MAX
2.7
3
3.6
2.7
3
3.3
V
70
°C
−30
UNIT
V
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Operating free-air temperature, TA
MIN
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TCS3472
COLOR LIGHT-TO-DIGITAL CONVERTER
with IR FILTER
TAOS135 − AUGUST 2012
Operating Characteristics, VDD = 3 V, TA = 25C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
Active
Supply current
VOL
INT SDA output low voltage
INT,
I LEAK
Leakage current, SDA, SCL, INT pins
I LEAK
Leakage current, LDR pin
VIH
SCL SDA input high voltage
SCL,
VIL
SCL SDA input low voltage
SCL,
MAX
235
330
Wait state
65
Sleep state — no I2C activity
2.5
UNIT
μA
10
3 mA sink current
0
0.4
6 mA sink current
0
0.6
−5
5
μA
5
μA
−5
TCS34721 & TCS34725
0.7 VDD
TCS34723 & TCS34727
1.25
V
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IDD
TYP
V
0.3 VDD
TCS34721 & TCS34725
V
0.54
lv
TCS34723 & TCS34727
PARAMETER
Irradiance
responsivity
Red Channel
TEST
CONDITIONS
λD = 465 nm
Note 2
Re
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Optical Characteristics, VDD = 3 V, TA = 25C, AGAIN = 16, ATIME = 0xF6 (unless otherwise noted)
(Note 1)
λD = 525 nm
Note 3
λD = 615 nm
Note 4
MIN
TYP
Green Channel
MAX
MIN
0%
15%
4%
80%
TYP
Blue Channel
MAX
MIN
10%
42%
25%
60%
110%
0%
TYP
Clear Channel
MAX
MIN
TYP
MAX
65%
88%
11.0
13.8
16.6
85%
10%
45%
13.2
16.6
20.0
14%
5%
24%
15.6
19.5
23.4
UNIT
counts/
μW/
cm2
NOTES: 1. The percentage shown represents the ratio of the respective red, green, or blue channel value to the clear channel value.
2. The 465 nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics:
dominant wavelength λD = 465 nm, spectral halfwidth Δλ½ = 22 nm.
3. The 525 nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics:
dominant wavelength λD = 525 nm, spectral halfwidth Δλ½ = 35 nm.
4. The 615 nm input irradiance is supplied by a AlInGaP light-emitting diode with the following characteristics:
dominant wavelength λD = 615 nm, spectral halfwidth Δλ½ = 15 nm.
RGBC Characteristics, VDD = 3 V, TA = 25C, AGAIN = 16, AEN = 1 (unless otherwise noted)
TEST CONDITIONS
ca
PARAMETER
Dark ADC count value
ADC integration time step size
Ee = 0, AGAIN = 60×, ATIME = 0xD6 (100 ms)
ATIME = 0xFF
ADC number of integration steps
(Note 5)
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G i scaling,
Gain
li
relative
l ti to
t 1× gain
i
setting
TYP
MAX
UNIT
0
1
5
counts
2.27
2.4
2.56
ms
256
steps
0
1024
counts
0
65535
counts
1
ADC counts per step (Note 5)
ADC count value (Note 5)
MIN
ATIME = 0xC0 (153.6 ms)
4×
3.8
4
4.2
16×
15
16
16.8
16 8
58
60
63
60×
Te
NOTE 5: Parameter ensured by design and is not tested.
Copyright E 2012, TAOS Inc.
The LUMENOLOGY r Company
r
r
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TCS3472
COLOR LIGHT-TO-DIGITAL CONVERTER
with IR FILTER
TAOS135 − AUGUST 2012
Wait Characteristics, VDD = 3 V, TA = 25C, WEN = 1 (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Wait step size
CHANNEL
WTIME = 0xFF
Wait number of integration steps (Note 1)
MIN
TYP
MAX
2.27
2.4
2.56
ms
256
steps
1
UNIT
AC Electrical Characteristics, VDD = 3 V, TA = 25C (unless otherwise noted)
PARAMETER†
TEST CONDITIONS
MIN
Clock frequency
t(BUF)
Bus free time between start and stop condition
only)
1.3
0
t(HDSTA)
Hold time after (repeated) start condition. After
this period, the first clock is generated.
0.6
t(SUSTA)
Repeated start condition setup time
t(SUSTO)
Stop condition setup time
t(HDDAT)
Data hold time
t(SUDAT)
MAX
UNIT
400
kHz
μs
μs
lv
f(SCL)
TYP
0.6
μs
0.6
μs
0
μs
Data setup time
100
ns
t(LOW)
SCL clock low period
1.3
μs
t(HIGH)
SCL clock high period
0.6
μs
tF
Clock/data fall time
300
ns
tR
Clock/data rise time
300
ns
Ci
Input pin capacitance
10
pF
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†
(I2C
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NOTE 1: Parameter ensured by design and is not tested.
Specified by design and characterization; not production tested.
PARAMETER MEASUREMENT INFORMATION
t(LOW)
VIH
SCL
VIL
t(R)
t(F)
t(HIGH)
ca
t(HDSTA)
t(BUF)
t(HDDAT)
t(SUSTA)
t(SUSTO)
t(SUDAT)
VIH
SDA
ni
VIL
P
S
S
P
Start
Condition
ch
Stop
Condition
Te
Figure 1. Timing Diagrams
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TCS3472
COLOR LIGHT-TO-DIGITAL CONVERTER
with IR FILTER
TAOS135 − AUGUST 2012
TYPICAL CHARACTERISTICS
NORMALIZED RESPONSIVITY
vs.
ANGULAR DISPLACEMENT
PHOTODIODE SPECTRAL RESPONSIVITY
RGBC
1
1.0
Clear
Normalized to
Clear
@ 755 nm
0.9
0.5
0.4
Blue
0.3
0.6
0.4
0.2
0.2
0.1
0
300
500
700
900
λ − Wavelength − nm
0
−90
1100
-Q
RESPONSIVITY TEMPERATURE
COEFFICIENT
10,000
106%
ca
104%
Temperature Coefficient — ppm/ C
75C
108%
25C
102%
50C
ni
100%
0C
ch
98%
90
Figure 3
NORMALIZED IDD
vs.
VDD and TEMPERATURE
110%
+Q
−60
−30
0
30
60
Q − Angular Displacement − °
Figure 2
IDD Normalized @ 3 V, 25C
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Red
0.6
Optical Axis
0.7
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Relative Responsivity
TA = 25°C
Normalized Responsivity
0.8
0.8
96%
1000
94%
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92%
2.7
2.8
Copyright E 2012, TAOS Inc.
2.9
3
3.1
3.2
3.3
100
400
600
500
800
900
1000
λ − Wavelength − nm
VDD — V
Figure 4
Figure 5
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TCS3472
COLOR LIGHT-TO-DIGITAL CONVERTER
with IR FILTER
TAOS135 − AUGUST 2012
PRINCIPLES OF OPERATION
System States
An internal state machine provides system control of the RGBC and power management features of the device.
At power up, an internal power-on-reset initializes the device and puts it in a low-power Sleep state.
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When a start condition is detected on the I2C bus, the device transitions to the Idle state where it checks the
Enable Register (0x00) PON bit. If PON is disabled, the device will return to the Sleep state to save power.
Otherwise, the device will remain in the Idle state until the RGBC function is enabled (AEN). Once enabled, the
device will execute the Wait and RGBC states in sequence as indicated in Figure 5. Upon completion and return
to Idle, the device will automatically begin a new Wait-RGBC cycle as long as PON and AEN remain enabled.
Sleep
lv
I2C
Start
!PON
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Idle
WEN &
AEN
!WEN
& AEN
Wait
RGBC
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Figure 6. Simplified State Diagram
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TCS3472
COLOR LIGHT-TO-DIGITAL CONVERTER
with IR FILTER
TAOS135 − AUGUST 2012
RGBC Operation
ATIME(r0x0 1)
2.4 ms to 614 ms
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The RGBC engine contains RGBC gain control (AGAIN) and four integrating analog-to-digital converters (ADC)
for the RGBC photodiodes. The RGBC integration time (ATIME) impacts both the resolution and the sensitivity
of the RGBC reading. Integration of all four channels occurs simultaneously and upon completion of the
conversion cycle, the results are transferred to the color data registers. This data is also referred to as channel
count.
The transfers are double-buffered to ensure that invalid data is not read during the transfer. After the
transfer, the device automatically moves to the next state in accordance with the configured state machine.
AGAIN(r 0x0F, b1:0)
1, 4, 16, 60 Gain
Clear
lv
RGBC Control
Clear ADC
Clear Data
CDATAH(r 0x15), CDATA(r 0x14)
Red ADC
Red Data
RDATAH(r 0x17), RDATA(r 0x16)
Green ADC
Green Data
GDATAH(r 0x19), GDATA(r 0x18)
Blue ADC
Blue Data
BDATAH(r 0x1B), BDATA(r 0x1A)
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Red
Green
Blue
Figure 7. RGBC Operation
NOTE: In this document, the nomenclature uses the bit field name in italics followed by the register address
and bit number to allow the user to easily identify the register and bit that controls the function. For example,
the power on (PON) is in register 0x00, bit 0. This is represented as PON (r0x00:b0).
The registers for programming the integration and wait times are a 2’s compliment values. The actual time can
be calculated as follows:
ATIME = 256 − Integration Time / 2.4 ms
Inversely, the time can be calculated from the register value as follows:
Integration Time = 2.4 ms × (256 − ATIME)
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For example, if a 100-ms integration time is needed, the device needs to be programmed to:
256 − (100 / 2.4) = 256 − 42 = 214 = 0xD6
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Conversely, the programmed value of 0xC0 would correspond to:
(256 − 0xC0) × 2.4 = 64 × 2.4 = 154 ms.
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TCS3472
COLOR LIGHT-TO-DIGITAL CONVERTER
with IR FILTER
TAOS135 − AUGUST 2012
Interrupts
The interrupt feature simplifies and improves system efficiency by eliminating the need to poll the sensor for
light intensity values outside of a user-defined range. While the interrupt function is always enabled and its
status is available in the status register (0x13), the output of the interrupt state can be enabled using the RGBC
interrupt enable (AIEN) field in the enable register (0x00).
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Two 16-bit interrupt threshold registers allow the user to set limits below and above a desired light level. An
interrupt can be generated when the Clear data (CDATA) is less than the Clear interrupt low threshold (AILTx)
or is greater than the Clear interrupt high threshold (AIHTx).
It is important to note that the thresholds are evaluated in sequence, first the low threshold, then the high
threshold. As a result, if the low threshold is set above the high threshold, the high threshold is ignored and only
the low threshold is evaluated.
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To further control when an interrupt occurs, the device provides a persistence filter. The persistence filter allows
the user to specify the number of consecutive out-of-range Clear occurrences before an interrupt is generated.
The persistence filter register (0x0C) allows the user to set the Clear persistence filter (APERS) value. See the
persistence filter register for details on the persistence filter value. Once the persistence filter generates an
interrupt, it will continue until a special function interrupt clear command is received (see command register).
AIHTH(r0x 07), AIHTL(r0x 06)
Upper Limit
Clear
ADC
APERS(r 0x0C, b3:0)
Clear Persistence
Clear
Data
Lower Limit
Clear
AILTH(r 0x05), AILTL(r0x 04)
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Figure 8. Programmable Interrupt
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TCS3472
COLOR LIGHT-TO-DIGITAL CONVERTER
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TAOS135 − AUGUST 2012
System Timing
The system state machine shown in Figure 5 provides an overview of the states and state transitions that
provide system control of the device. This section highlights the programmable features, which affect the state
machine cycle time, and provides details to determine system level timing.
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When the power management feature is enabled (WEN), the state machine will transition to the Wait state. The
wait time is determined by WLONG, which extends normal operation by 12× when asserted, and WTIME. The
formula to determine the wait time is given in the box associated with the Wait state in Figure 9.
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When the RGBC feature is enabled (AEN), the state machine will transition through the RGBC Init and RGBC
ADC states. The RGBC Init state takes 2.4 ms, while the RGBC ADC time is dependent on the integration time
(ATIME). The formula to determine RGBC ADC time is given in the associated box in Figure 9. If an interrupt
is generated as a result of the RGBC cycle, it will be asserted at the end of the RGBC ADC.
Sleep
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!PON
I2C Start
(Note 1)
RGBC
Idle
RGBC
ADC
WEN
& AEN
!WEN
& AEN
RGBC
Init
Wait
Time: 2.4 ms
WTIME: 1 ~ 256 steps
WLONG = 0
WLONG = 1
2.4 ms/step
28.8 ms/step
2.4 ms ~ 614 ms
28.8 ms ~ 7.37s
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Time:
Range:
ATIME: 1 ~ 256 steps
Time: 2.4 ms/step
Range: 2.4 ms ~ 614 ms
Notes: 1. There is a 2.4 ms warm-up delay if PON is enabled. If PON is not enabled, the device will return to the Sleep state as shown.
2. PON, WEN, and AEN are fields in the Enable register (0x00).
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Figure 9. Detailed State Diagram
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COLOR LIGHT-TO-DIGITAL CONVERTER
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Power Management
Power consumption can be managed with the Wait state, because the Wait state typically consumes only 65 μA
of IDD current. An example of the power management feature is given below. With the assumptions provided
in the example, average IDD is estimated to be 152 μA.
Table 1. Power Management
PROGRAMMABLE
PARAMETER
PROGRAMMED VALUE
Wait
WTIME
0xEE
WLONG
0
ATIME
0xEE
DURATION
43 2 ms
43.2
RGBC Init
2.40 ms
43.2 ms
0 065 mA
0.065
0.235 mA
0.235 mA
lv
RGBC ADC
TYPICAL
CURRENT
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SYSTEM STATE MACHINE
STATE
Average IDD Current = ((43.2 × 0.065) + (43.2 × 0.235) + (2.40 × 0.235)) / 89 152 μA
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Keeping with the same programmed values as the example, Table 2 shows how the average IDD current is
affected by the Wait state time, which is determined by WEN, WTIME, and WLONG. Note that the worst-case
current occurs when the Wait state is not enabled.
Table 2. Average IDD Current
WEN
0
1
1
1
WLONG
WAIT STATE
AVERAGE IDD CURRENT
n/a
n/a
0 ms
291 μA
0xFF
0
2.40 ms
280 μA
0xEE
0
43.2 ms
152 μA
0x00
0
614 ms
82 μA
0x00
1
7.37 s
67 μA
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1
WTIME
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I2C Protocol
Interface and control are accomplished through an I2C serial compatible interface (standard or fast mode) to
a set of registers that provide access to device control functions and output data. The devices support the 7-bit
I2C addressing protocol.
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The I2C standard provides for three types of bus transaction: read, write, and a combined protocol (Figure 10).
During a write operation, the first byte written is a command byte followed by data. In a combined protocol, the
first byte written is the command byte followed by reading a series of bytes. If a read command is issued, the
register address from the previous command will be used for data access. Likewise, if the MSB of the command
is not set, the device will write a series of bytes at the address stored in the last valid command with a register
address. The command byte contains either control information or a 5-bit register address. The control
commands can also be used to clear interrupts.
...
Acknowledge (0)
Not Acknowledged (1)
Stop Condition
Read (1)
Start Condition
Repeated Start Condition
Write (0)
Continuation of protocol
Master-to-Slave
Slave-to-Master
1
am
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nt
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A
N
P
R
S
Sr
W
lv
The I2C bus protocol was developed by Philips (now NXP). For a complete description of the I2C protocol, please
review the NXP I2C design specification at http://www.i2c−bus.org/references/.
7
S
1
Slave Address
W
1
8
A
1
Command Code
8
A
1
Data Byte
A
8
1
1
...
P
I2C Write Protocol
1
7
S
1
Slave Address
R
1
8
A
1
Data
A
Data
1
...
A
P
I2C Read Protocol
1
S
Slave Address
W
1
8
1
1
7
1
1
Command Code
A
Sr
Slave Address
R
A
ca
7
A
8
1
Data
A
8
Data
1
A
1
...
P
I2C Read Protocol — Combined Format
Figure 10. I2C Protocols
Te
ch
ni
1
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Register Set
The TCS3472 is controlled and monitored by data registers and a command register accessed through the
serial interface. These registers provide for a variety of control functions and can be read to determine results
of the ADC conversions. The register set is summarized in Table 3.
Table 3. Register Address
ADDRESS
RESISTER NAME
R/W
−−
COMMAND
W
REGISTER FUNCTION
0x00
ENABLE
R/W
Enables states and interrupts
0x01
ATIME
R/W
RGBC time
0x03
WTIME
R/W
Wait time
0x04
AILTL
R/W
Clear interrupt low threshold low byte
0x05
AILTH
R/W
Clear interrupt low threshold high byte
0x06
AIHTL
R/W
Clear interrupt high threshold low byte
RESET VALUE
0x00
al
id
Specifies register address
0x00
0xFF
0xFF
0x00
lv
0x00
0x00
AIHTH
R/W
Clear interrupt high threshold high byte
PERS
R/W
Interrupt persistence filter
0x00
0x0D
CONFIG
R/W
Configuration
0x00
0x0F
CONTROL
R/W
Control
0x00
0x12
ID
R
Device ID
0x13
STATUS
R
Device status
0x00
0x14
CDATAL
R
Clear data low byte
0x00
0x15
CDATAH
R
Clear data high byte
0x00
0x16
RDATAL
R
Red data low byte
0x00
0x17
RDATAH
R
Red data high byte
0x00
0x18
GDATAL
R
Green data low byte
0x00
0x19
GDATAH
R
Green data high byte
0x00
0x1A
BDATAL
R
Blue data low byte
0x00
0x1B
BDATAH
R
Blue data high byte
0x00
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0x07
0x0C
0x00
ID
Te
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ni
ca
The mechanics of accessing a specific register depends on the specific protocol used. See the section on I2C
protocols on the previous pages. In general, the COMMAND register is written first to specify the specific
control-status-data register for subsequent read/write operations.
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Command Register
The command register specifies the address of the target register for future write and read operations.
Table 4. Command Register
4
3
TYPE
FIELD
BITS
CMD
7
TYPE
6:5
2
1
0
−−
ADDR/SF
DESCRIPTION
Select Command Register. Must write as 1 when addressing COMMAND register.
Selects type of transaction to follow in subsequent data transfers:
FIELD VALUE
INTEGRATION TIME
00
Repeated byte protocol transaction
01
Auto-increment protocol transaction
10
Reserved — Do not use
11
Special function — See description below
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CMD
5
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COMMAND
6
lv
7
Byte protocol will repeatedly read the same register with each data access.
Block protocol will provide auto-increment function to read successive bytes.
ADDR/SF
4:0
Address field/special function field. Depending on the transaction type, see above, this field either
specifies a special function command or selects the specific control-status-data register for subsequent
read and write transactions. The field values listed below only apply to special function commands:
FIELD VALUE
READ VALUE
00110
Clear channel interrupt clear
other
Reserved — Do not write
Te
ch
ni
ca
The Clear channel interrupt clear special function clears any pending interrupt and is self-clearing.
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Enable Register (0x00)
The Enable register is used primarily to power the TCS3472 device on and off, and enable functions and
interrupts as shown in Table 5.
Table 5. Enable Register
6
5
Reserved
ENABLE
4
3
2
1
0
AIEN
WEN
Reserved
AEN
PON
DESCRIPTION
Address
0x00
al
id
7
FIELD
BITS
Reserved
7:5
AIEN
4
RGBC interrupt enable. When asserted, permits RGBC interrupts to be generated.
WEN
3
Wait enable. This bit activates the wait feature. Writing a 1 activates the wait timer. Writing a 0 disables the
wait timer.
Reserved
2
Reserved. Write as 0.
AEN
1
RGBC enable. This bit actives the two-channel ADC. Writing a 1 activates the RGBC. Writing a 0 disables
the RGBC.
PON 1, 2
0
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Reserved. Write as 0.
Power ON. This bit activates the internal oscillator to permit the timers and ADC channels to operate.
Writing a 1 activates the oscillator. Writing a 0 disables the oscillator.
Te
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ca
NOTES: 1. See Power Management section for more information.
2. A minimum interval of 2.4 ms must pass after PON is asserted before an RGBC can be initiated.
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RGBC Timing Register (0x01)
The RGBC timing register controls the internal integration time of the RGBC clear and IR channel ADCs in
2.4-ms increments. Max RGBC Count = (256 − ATIME) × 1024 up to a maximum of 65535.
Table 6. RGBC Timing Register
7:0
DESCRIPTION
VALUE
INTEG_CYCLES
TIME
0xFF
1
2.4 ms
0xF6
10
24 ms
0xD5
42
101 ms
0xC0
64
154 ms
0x00
256
700 ms
MAX COUNT
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BITS
1024
10240
43008
65535
65535
lv
FIELD
ATIME
Wait Time Register (0x03)
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Wait time is set 2.4 ms increments unless the WLONG bit is asserted, in which case the wait times are 12×
longer. WTIME is programmed as a 2’s complement number.
Table 7. Wait Time Register
BITS
WTIME
7:0
DESCRIPTION
REGISTER VALUE
WAIT TIME
TIME (WLONG = 0)
TIME (WLONG = 1)
0xFF
1
2.4 ms
0.029 sec
0xAB
85
204 ms
2.45 sec
0x00
256
614 ms
7.4 sec
Te
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ca
FIELD
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RGBC Interrupt Threshold Registers (0x04 − 0x07)
The RGBC interrupt threshold registers provides the values to be used as the high and low trigger points for
the comparison function for interrupt generation. If the value generated by the clear channel crosses below the
lower threshold specified, or above the higher threshold, an interrupt is asserted on the interrupt pin.
Table 8. RGBC Interrupt Threshold Registers
BITS
0x04
7:0
RGBC clear channel low threshold lower byte
DESCRIPTION
AILTH
0x05
7:0
RGBC clear channel low threshold upper byte
AIHTL
0x06
7:0
RGBC clear channel high threshold lower byte
AIHTH
0x07
7:0
RGBC clear channel high threshold upper byte
al
id
ADDRESS
AILTL
lv
REGISTER
Persistence Register (0x0C)
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The persistence register controls the filtering interrupt capabilities of the device. Configurable filtering is
provided to allow interrupts to be generated after each integration cycle or if the integration has produced a result
that is outside of the values specified by the threshold register for some specified amount of time.
Table 9. Persistence Register
7
6
PERS
5
4
3
Reserved
BITS
7:4
APERS
3:0
0
Address
0x0C
DESCRIPTION
Reserved
Interrupt persistence. Controls rate of interrupt to the host processor.
FIELD VALUE
MEANING
0000
Every
0001
1
1 clear channel value outside of threshold range
0010
2
2 clear channel consecutive values out of range
INTERRUPT PERSISTENCE FUNCTION
Every RGBC cycle generates an interrupt
0011
3
3 clear channel consecutive values out of range
0100
5
5 clear channel consecutive values out of range
0101
10
10 clear channel consecutive values out of range
0110
15
15 clear channel consecutive values out of range
0111
20
20 clear channel consecutive values out of range
1000
25
25 clear channel consecutive values out of range
1001
30
30 clear channel consecutive values out of range
1010
35
35 clear channel consecutive values out of range
1011
40
40 clear channel consecutive values out of range
1100
45
45 clear channel consecutive values out of range
1101
50
50 clear channel consecutive values out of range
1110
55
55 clear channel consecutive values out of range
1111
60
60 clear channel consecutive values out of range
ni
ch
Te
The LUMENOLOGY r Company
1
APERS
ca
FIELD
PPERS
2
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Configuration Register (0x0D)
The configuration register sets the wait long time.
Table 10. Configuration Register
7
6
5
4
CONFIG
3
2
0
WLONG
Reserved
Address
0x0D
al
id
Reserved
1
FIELD
BITS
Reserved
7:2
DESCRIPTION
WLONG
1
Wait Long. When asserted, the wait cycles are increased by a factor 12× from that programmed in the
WTIME register.
Reserved
0
Reserved. Write as 0.
lv
Reserved. Write as 0.
am
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Control Register (0x0F)
The Control register provides eight bits of miscellaneous control to the analog block. These bits typically control
functions such as gain settings and/or diode selection.
Table 11. Control Register
7
6
CONTROL
5
4
3
2
1
0
Reserved
FIELD
BITS
Reserved
7:2
Reserved.
AGAIN
1:0
RGBC Gain Control.
DESCRIPTION
Write bits as 0
FIELD VALUE
RGBC GAIN VALUE
00
1× gain
01
4× gain
10
16× gain
11
60× gain
ca
ID Register (0x12)
Address
0x0F
AGAIN
ni
The ID Register provides the value for the part number. The ID register is a read-only register.
6
5
ch
7
Table 12. ID Register
ID
ID
3
7:0
Copyright E 2012, TAOS Inc.
2
1
DESCRIPTION
0x44 = TCS34721 and TCS34725
Part number identification
0x4D = TCS34723 and TCS34727
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18
0
Address
0x12
ID
BITS
Te
FIELD
4
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Status Register (0x13)
The Status Register provides the internal status of the device. This register is read only.
Table 13. Status Register
6
STATUS
5
Reserved
BIT
7:5
AINT
4
Reserved
3:1
AVALID
0
3
AINT
2
1
Reserved
0
AVALID
Address
0x13
DESCRIPTION
Reserved.
RGBC clear channel Interrupt.
Reserved.
RGBC Valid. Indicates that the RGBC channels have completed an integration cycle.
lv
FIELD
Reserved
4
al
id
7
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RGBC Channel Data Registers (0x14 − 0x1B)
Clear, red, green, and blue data is stored as 16-bit values. To ensure the data is read correctly, a two-byte read
I2C transaction should be used with a read word protocol bit set in the command register. With this operation,
when the lower byte register is read, the upper eight bits are stored into a shadow register, which is read by a
subsequent read to the upper byte. The upper register will read the correct value even if additional ADC
integration cycles end between the reading of the lower and upper registers.
Table 14. ADC Channel Data Registers
ADDRESS
BITS
CDATA
0x14
7:0
Clear data low byte
DESCRIPTION
CDATAH
0x15
7:0
Clear data high byte
RDATA
0x16
7:0
Red data low byte
RDATAH
0x17
7:0
Red data high byte
GDATA
0x18
7:0
Green data low byte
GDATAH
0x19
7:0
Green data high byte
BDATA
0x1A
7:0
Blue data low byte
BDATAH
0x1B
7:0
Blue data high byte
Te
ch
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REGISTER
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APPLICATION INFORMATION: HARDWARE
PCB Pad Layout
Suggested PCB pad layout guidelines for the Dual Flat No-Lead (FN) surface mount package are shown in
Figure 11.
1000
al
id
2500
Note: Pads can be
extended further if hand
soldering is needed.
1000
400
lv
650
1700
am
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st
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650
400
NOTES: A. All linear dimensions are in micrometers.
B. This drawing is subject to change without notice.
Te
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Figure 11. Suggested FN Package PCB Layout
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PACKAGE INFORMATION
PACKAGE FN
Dual Flat No-Lead
TOP VIEW
877 75
PIN OUT
TOP VIEW
PIN 1
al
id
871
75
369
VDD 1
6 SDA
406
SCL 2
5 INT
lv
2400 75
4 NC
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GND 3
2000 75
Photodiode Array Area
SIDE VIEW
END VIEW
650 50
295
nominal
BOTTOM VIEW
650
50
750 100
203 8
300
50
300 50
Pb
ch
PIN 1
ni
ca
650 50
All linear dimensions are in micrometers. Dimension tolerance is ± 20 μm unless otherwise noted.
The die is centered within the package within a tolerance of ± 3 mils.
Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
This package contains no lead (Pb).
This drawing is subject to change without notice.
Te
NOTES: A.
B.
C.
D.
E.
F.
Lead Free
Figure 12. Package FN — Dual Flat No-Lead Packaging Configuration
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CARRIER TAPE AND REEL INFORMATION
TOP VIEW
2.00 0.05
1.75
1.50
4.00
al
id
4.00
B
+ 0.30
8.00
− 0.10
0.50
0.05
DETAIL A
B
A
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A
lv
3.50 0.05
DETAIL B
5 Max
5 Max
0.254
0.02
2.21 0.05
Ao
2.61 0.05
0.83 0.05
Bo
All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481−B 2001.
Each reel is 178 millimeters in diameter and contains 3500 parts.
TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B.
In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
This drawing is subject to change without notice.
Te
ch
NOTES: A.
B.
C.
D.
E.
F.
G.
ni
ca
Ko
Copyright E 2012, TAOS Inc.
Figure 13. Package FN Carrier Tape
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SOLDERING INFORMATION
The FN package has been tested and has demonstrated an ability to be reflow soldered to a PCB
substrate. The process, equipment, and materials used in these test are detailed below.
Table 15. Solder Reflow Profile
PARAMETER
REFERENCE
DEVICE
Average temperature gradient in preheating
2 to 3 minutes
Time above 217°C (T1)
t1
Max 60 sec
Time above 230°C (T2)
t2
Max 50 sec
Time above Tpeak −10°C (T3)
t3
Max 10 sec
lv
tsoak
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Soak time
2.5°C/sec
Peak temperature in reflow
Tpeak
260°C
Temperature gradient in cooling
Max −5°C/sec
Not to scale — for reference only
T3
T2
Temperature (C)
T1
ca
Tpeak
al
id
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
t3
t2
tsoak
t1
Figure 14. Solder Reflow Profile Graph
Te
ch
ni
Time (sec)
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STORAGE INFORMATION
Moisture Sensitivity
al
id
Optical characteristics of the device can be adversely affected during the soldering process by the release and
vaporization of moisture that has been previously absorbed into the package. To ensure the package contains
the smallest amount of absorbed moisture possible, each device is dry-baked prior to being packed for shipping.
Devices are packed in a sealed aluminized envelope called a moisture barrier bag with silica gel to protect them
from ambient moisture during shipping, handling, and storage before use.
The Moisture Barrier Bags should be stored under the following conditions:
< 40°C
< 90%
No longer than 12 months from the date code on the aluminized envelope if
unopened.
lv
Temperature Range
Relative Humidity
Total Time
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Rebaking of the reel will be required if the devices have been stored unopened for more than 12 months and
the Humidity Indicator Card shows the parts to be out of the allowable moisture region.
Opened reels should be used within 168 hours if exposed to the following conditions:
Temperature Range
Relative Humidity
< 30°C
< 60%
If rebaking is required, it should be done at 50°C for 12 hours.
Te
ch
ni
ca
The FN package has been assigned a moisture sensitivity level of MSL 3.
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PRODUCTION DATA — information in this document is current at publication date. Products conform to
specifications in accordance with the terms of Texas Advanced Optoelectronic Solutions, Inc. standard
warranty. Production processing does not necessarily include testing of all parameters.
LEAD-FREE (Pb-FREE) and GREEN STATEMENT
al
id
Pb-Free (RoHS) TAOS’ terms Lead-Free or Pb-Free mean semiconductor products that are compatible with the current
RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous
materials. Where designed to be soldered at high temperatures, TAOS Pb-Free products are suitable for use in specified
lead-free processes.
Green (RoHS & no Sb/Br) TAOS defines Green to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and
Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
am
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lv
Important Information and Disclaimer The information provided in this statement represents TAOS’ knowledge and
belief as of the date that it is provided. TAOS bases its knowledge and belief on information provided by third parties,
and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate
information from third parties. TAOS has taken and continues to take reasonable steps to provide representative
and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and
chemicals. TAOS and TAOS suppliers consider certain information to be proprietary, and thus CAS numbers and other
limited information may not be available for release.
NOTICE
Texas Advanced Optoelectronic Solutions, Inc. (TAOS) reserves the right to make changes to the products contained in this
document to improve performance or for any other purpose, or to discontinue them without notice. Customers are advised
to contact TAOS to obtain the latest product information before placing orders or designing TAOS products into systems.
TAOS assumes no responsibility for the use of any products or circuits described in this document or customer product
design, conveys no license, either expressed or implied, under any patent or other right, and makes no representation that
the circuits are free of patent infringement. TAOS further makes no claim as to the suitability of its products for any particular
purpose, nor does TAOS assume any liability arising out of the use of any product or circuit, and specifically disclaims any
and all liability, including without limitation consequential or incidental damages.
ca
TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS, INC. PRODUCTS ARE NOT DESIGNED OR INTENDED FOR
USE IN CRITICAL APPLICATIONS IN WHICH THE FAILURE OR MALFUNCTION OF THE TAOS PRODUCT MAY
RESULT IN PERSONAL INJURY OR DEATH. USE OF TAOS PRODUCTS IN LIFE SUPPORT SYSTEMS IS EXPRESSLY
UNAUTHORIZED AND ANY SUCH USE BY A CUSTOMER IS COMPLETELY AT THE CUSTOMER’S RISK.
Te
ch
ni
LUMENOLOGY, TAOS, the TAOS logo, and Texas Advanced Optoelectronic Solutions are registered trademarks of Texas Advanced
Optoelectronic Solutions Incorporated.
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TAOS135 − AUGUST 2012
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