Revision 1.1 ATP Industrial Grade CFast Specification ATP Industrial Grade CFast Card Specification Revision 1.1 Your Ultimate Memory Solution! 1 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification Disclaimer: ATP Electronics Inc. shall not be liable for any errors or omissions that may appear in this document, and disclaims responsibility for any consequences resulting from the use of the information set forth herein. The information in this manual is subject to change without notice. ATP general policy does not recommend the use of its products in life support applications where in a failure or malfunction of the product may directly threaten life or injury. All parts of the ATP documentation are protected by copyright law and all rights are reserved. This documentation may not, in whole or in part, be copied, photocopied, reproduced, translated, or reduced to any electronic medium or machine-readable form without prior consent, in writing, from ATP Corporation. The information set forth in this document is considered to be “Proprietary” and “Confidential” property owned by ATP. Revision History Date Version Mar.22nd, 2012 Mar.28th, 2012 May 31st, 2012 Jul. 5th, 2012 0.1 0.2 1.0 1.1 Changes compared to previous issue - Preliminary version - Update S.M.A.R.T. tool screenshot - Official released version - Add TBW Sequential write information - Add NCQ/TRIM Command information Your Ultimate Memory Solution! 2 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification Table of Contents 1 ATP INDUSTRIAL GRADE CFAST CARD OVERVIEW ....................................................................................... 4 1.1 1.2 1.3 1.4 2 ATP PRODUCT AVAILABILITY ................................................................................................................................. 4 INTRODUCTION ........................................................................................................................................................ 5 APPLICATION ........................................................................................................................................................... 5 MAIN FEATURES ...................................................................................................................................................... 6 PRODUCT SPECIFICATION...................................................................................................................................... 7 2.1 2.2 2.3 2.4 2.5 2.6 2.6.1 2.6.2 2.7 2.8 2.9 2.10 2.11 2.12 2.13 3 SUPPLY VOLTAGE .................................................................................................................................................... 7 CURRENT CONSUMPTION......................................................................................................................................... 7 ENVIRONMENT SPECIFICATION ................................................................................................................................ 7 RELIABILITY ............................................................................................................................................................ 8 CFAST CARD CAPACITY .......................................................................................................................................... 8 PERFORMANCE ........................................................................................................................................................ 9 IOPS................................................................................................................................................................... 9 Read/Write Performance ................................................................................................................................... 9 CERTIFICATION AND COMPLIANCE ........................................................................................................................... 9 GLOBAL WEAR LEVELING- LONGER LIFE EXPECTANCY ........................................................................................ 10 SATICDATAREFRESH TECHNOLOGY – ENSURE DATA INTEGRITY.......................................................................... 10 ATP POWERPROTECTOR – BUILT-IN POWER FAILURE DATA PROTECTION ........................................................... 10 NCQ/TRIM COMMAND SUPPORT ......................................................................................................................... 11 PHYSICAL DIMENSION SPECIFICATION ................................................................................................................... 12 MECHANICAL FORM FACTOR (UNITS IN MM) ....................................................................................................... 12 ELECTRICAL INTERFACE ..................................................................................................................................... 13 3.1 PIN ASSIGNMENTS AND PIN TYPE .......................................................................................................................... 13 3.2 ELECTRICAL DESCRIPTION..................................................................................................................................... 14 3.3 ELECTRICAL SPECIFICATION .................................................................................................................................. 15 3.3.1 Maximum input current ................................................................................................................................... 15 4 ATA COMMAND DESCRIPTION............................................................................................................................ 17 4.1 4.2 5 ATA COMMAND SET ............................................................................................................................................. 17 IDENTIFY DEVICE DATA ........................................................................................................................................ 18 S.M.A.R.T. FUNCTION .............................................................................................................................................. 20 5.1 5.2 5.3 5.4 S.M.A.R.T. FEATURE ............................................................................................................................................ 20 S.M.A.R.T. FEATURE REGISTER VALUES .............................................................................................................. 20 S.M.A.R.T. DATA STRUCTURE.............................................................................................................................. 21 ATP S.M.A.R.T. TOOL ......................................................................................................................................... 22 Your Ultimate Memory Solution! 3 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification 1 ATP Industrial Grade CFast Card Overview 1.1 ATP Product Availability Figure 1-1: ATP Product Availability Table 1-1: Capacities ATP P/N CAPACITY AF2GCSI-OAAXP 2GB AF4GCSI-OAAXP 4GB AF8GCSI-OAAXP 8GB AF16GCSI-OAAXP 16GB AF32GCSI-OAAXP 32GB Note: ” P” stands for PowerProtector feature Your Ultimate Memory Solution! 4 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification 1.2 Introduction With a form factor similar to CompactFlash card and a faster and more advanced SATA interface, ATP Industrial Grade CFast card is the ideal replacement of CompactFlash card. ATP Industrial Grade CFast card is fully compliant with CFA CFast specification version 1.1 with a SATA 3Gb/s interface. The CFast card contains a 24-pin connector consisting of a SATA compatible 7-pin signal connector and a 17-pin power and control connector. Compared to traditional CompactFlash card with ATA/IDE interface, ATP CFast card features high-speed data transfer capability of up to 142MB/s read speed, and a 112MB/s write speed. By utilizing SLC NAND flash memory and Global Wear Leveling technology, the ATP Industrial Grade CFast cards have enhanced endurance levels and longer product life spans. The produce line implements ECC (Error Correction Code) and StaticDataRefresh technologies, which correct and monitor the error bit levels to ensure data integrity. Incorporating the S.M.A.R.T. (Self-Monitoring, Analysis, and Reporting Technology) function, users are able to monitor various parameters of endurance and reliability. This information helps to predict storage failure with preventative action. ATP PowerProtector technology guarantees reliable controller and lasting NAND flash operation with a back power circuit during a power outage. The standalone design of PowerProtector ensures a sufficient amount of backup power during any power abnormalities such as unstable voltages. 1.3 Application The new CFast specification, a combination of CF and ATA serial Transport (AST), is recommended as new boot and storage device in embedded and industrial markets. These markets include military/aerospace, automation, marine navigation, embedded system, telecommunication equipment/ networking and medical equipment where mission-critical data requires the highest level of reliability, durability, and data integrity. Your Ultimate Memory Solution! 5 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification 1.4 Main Features Single-Level-Cell (SLC) NAND Flash Host Interface: Compliant with SATA Specification 2.6 and CFast Specification 1.1 SATA 3.0Gb/s interface 24-pin connector: 7-pin signal connector and 17-pin power and control connector High performance: Sequential read up to 142MB/s Sequential write up to 112MB/s Capacity: 2GB to 32GB Industrial grade operating temp.: -40oC to 85oC Endurance: Enhanced endurance by Global Wear Leveling algorithm and bad block management BCH-ECC engine can correct up to 40 bit errors per 1,024 Bytes data TBW (Total Bytes Written): up to 640 Terabyte random write (32GB CFast card) StaticDataRefresh technology to ensure data integrity in read operations. ATP PowerProtector, built-in hardware power-down data protection S.M.A.R.T. function support for life time monitor Support NCQ/TRIM command (require OS/HW/Driver support) Your Ultimate Memory Solution! 6 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification 2 Product Specification 2.1 Supply Voltage Table 2.1 Supply Voltage Parameter Supply Voltage Symbol Vcc Min 3.15 Typ 3.3 Max 3.45 Unit V 2.2 Current Consumption Table 2.2 Current Consumption Current Consumption Read (typ/max) Write (typ/max) Idle 3.3V 270 / 310 330 / 410 194 Unit mA mA mA Note: The value is measured based on 32GByte CFast card at 25oC and normal supply voltage. The consumption of each CFast card may be different and the maximum value is for reference purpose. 2.3 Environment Specification Table 2-3: Environment Specification TYPE Temperature Humidity Random Vibration Test (JESD22-B103) Shock Test (JESD22-B110) UV Light Exposure Test (ISO 7816-1) MEASUREMENT Operation Non-Operation Storage o o -40 C to +85 C -40oC to +85oC +40ºC, 93% RH / 500hrs +85ºC, 85% RH / 1000hrs Non-Operation 20G Peak, 20~2000Hz Non-Operation 1500G, 0.5ms duration, half sine wave Non-Operation 254nm, 15Ws/cm2 Drop Test Non-Operation 120cm/Free fall/9 times ESD (IEC 61000-4-2) Non-Operation non-contact pad (Coupling plane discharge) +/- 8KV non-contact pad (Air discharge) +/- 15KV Your Ultimate Memory Solution! 7 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification 2.4 Reliability Table 2-4: Reliability Type Number of insertions Endurance CFast Endurance TBW (Total Bytes Written) MTBF (25℃) Measurement 10,000 minimum Global Wear Leveling algorithm SLC block endurance: 100,000 P/E cycles 40 terabyte random write 2GB 80 terabyte sequential write 80 terabyte random write 4GB 160 terabyte sequential write 160 terabyte random write 8GB 320 terabyte sequential write 320 terabyte random write 16GB 640 terabyte sequential 640 terabyte random write 32GB 1,280 terabyte sequential write >5,000,000 hours Note: Endurance for flash products can be predicted based on the usage conditions applied to the device, the internal NAND flash cycles, the write amplification factor, and the wear leveling efficiency of the flash devices. 2.5 CFast Card Capacity Table 2-5: CFast Card Capacity Product Capacity LBA (Sectors) Physical Capacity (Bytes) 2GB 3864576 1,978,195,968 4GB 7839744 4,013,678,592 8GB 15458304 7,914,332,160 16GB 30916608 15,829,303,296 32GB 61849600 31,666,995,200 Your Ultimate Memory Solution! 8 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification 2.6 Performance 2.6.1 IOPS Table 2-61: IOPS Type 4K Random Read IOPS (32GB) Value 4,609 IOPS Notes: IOPS: Input / Output Operations per Second 2.6.2 Read/Write Performance Table 2-62: Read/Write Performance AF2GCSI-OAAXP Seq. Read (KB/s) 31950 Seq. Write (KB/s) 14808 Random Read (KB/s) 30117 Random Write (KB/s) 6361 AF4GCSI-OAAXP 63900 30095 56888 9426 AF8GCSI-OAAXP 127601 69861 90319 13865 AF16GCSI-OAAXP 137912 113777 93515 18584 AF32GCSI-OAAXP 141485 111455 90319 18980 Model P/N Note: Tested by HDBench 3.40 beta6 with 40MB file size. The performance may vary based on different testing environments. 2.7 Certification and compliance Table 2-7: Certification table Mark/Approval Documentation Certification The CE marking (also known as CE mark) is a mandatory conformance mark on many products placed on the single market in the European Economic Area (EEA). The CE marking certifies that a product has met EU consumer safety, health or environmental requirements. CE stands for Conformité Européenne, "European conformity" in French. Yes FCC Part 15 Class B was used for Evolution of United States (US) Emission Standards for Commercial Electronic Products, The United States (US) covers all types of unintentional radiators under Subparts A and B (Sections 15.1 through 15.199) of FCC 47 CFR Part 15, usually called just FCC Part 15 Yes RoHS is the acronym for Restriction of Hazardous Substances. RoHS, also known as Directive 2002/95/EC, originated in the European Union and restricts the use of specific hazardous materials found in electrical and electronic products. All applicable products in the EU market after July 1, 2006 must pass RoHS compliance. For the complete directive, see Directive 2002/95/EC of the European Parliament. Yes Your Ultimate Memory Solution! 9 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification 2.8 Global Wear Leveling- Longer Life Expectancy The program / erase cycle of each sector/page/block is finite. Writing constantly on the same spot will cause the flash to wear out quickly. Furthermore, bit errors are not proportioned to P/E cycles; sudden death may occur when the block is close to its P/E cycle limit. Then unrecoverable bit errors will cause fatal data loss (especially for system data or FAT). Global Wear Leveling algorithm evenly distributes the P/E cycles of each block to minimize the possibility of one block exceeding its max P/E cycles before the rest. In return, the life expectancy of memory storage device is prolonged and the chance/occurrence of unrecoverable bit errors could be reduced. 2.9 SaticDataRefresh Technology – Ensure Data Integrity Over time the error bits accumulate to the threshold in the flash memory cell and eventually become uncorrectable despite using the ECC engine. In the traditional handling method, the data is moved to a different location in the flash memory; despite the corrupted data is beyond repaired before the transition. To prevent data corruption, ATP Industrial Grade CFast card monitors the error bit levels in each read operation. When it reaches the preset threshold value, StaticDataRefresh is activated by erasing and re-programming the data into another block. After the re-programming operation is completed, the controller reads the data and compares the data/parity to ensure data integrity. 2.10 ATP PowerProtector – Built-in Power Failure Data Protection ATP PowerProtector technology ensures a sufficient amount of reserve power during any power abnormalities such as unstable voltages and power outages. PowerProtector’s patent pending technology is a stand alone hardware design that does not require specific controllers or customized firmware. This feature provides greater flexibility during the design of a smaller form factor such as CFast cards. Your Ultimate Memory Solution! 10 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification During a sudden power failure, the drive then draws power from PowerProtector’s solid state capacitors for reserve power, which guarantees reliable drive operations. The solid state capacitors allow the flash to finish processing the last command or data. SuperCap, the traditional power protection design, is well known for its sensitivity to temperature change and has a tendency of losing its capacitance and functionality at extreme temperatures. The average life span of SuperCap is less than two years; the capacitance will degrade over time and eventually fail to perform. ATP PowerProtector surpasses the natural limitations of SuperCap designs by supporting wide temperature and an average life span of over five years without capacitance degradation. PowerProtector offers an advanced level of protection ensuring that data integrity is not compromised during a power failure scenario, and preserves critical data in mission critical applications. 2.11 NCQ/TRIM Command Support NCQ (Native Command Queuing) is to optimize the order in which received read and write commands are executed. Under certain circumstances, it could enhance performance up to 30%. TRIM command is to allow an operating system to inform a SATA device which blocks of data are no longer considered in use and can be wiped internally. The result is the SATA device will have more free space enabling lower write amplification and higher performance. It enables garbage collection, which prevents performance from slowing down due to invalid blocks after using for a period of time. NCQ and TRIM command require OS/HW/Driver support from host device. Your Ultimate Memory Solution! 11 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification 2.12 Physical Dimension Specification Table 2-12: Physical Specifications Type I Type Length Width Thickness Weight Measurement 36.4 ± 0.15 mm 42.80 ± 0.10 mm 3.6 mm maximum 9.0 g typical 2.13 Mechanical Form Factor (Units in MM) Figure 2-13: ATP CFast Physical Dimensions Your Ultimate Memory Solution! 12 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification 3 Electrical Interface 3.1 Pin Assignments and Pin Type The signal/pin assignments are listed in Table 3-1: Pin Assignments and Pin Type Low active signals have a “-” prefix. Pin types are Input, Output or Input/Output. Section 3.3 defines the DC characteristics for all input and output type structures. Table 3-1: Pin Assignments and Pin Type Number Segment Name Type Description Mate Sequence S1 SATA SGND Signal GND Ground for signal integrity S2 SATA A+ SATA Differential Signal Pair A S3 SATA A- SATA Differential S4 SATA SGND Signal GND Ground for signal integrity 1st S5 SATA B- SATA Differential Signal Pair B 2nd S6 SATA B+ SATA Differential S7 SATA SGND Signal GND Ground for signal integrity 1st Card Detect In 3rd 1st 2nd 2nd 2nd Key Key PC1 PWR/CTL CDI CMOS Input PC2 PWR/CTL GND Device GND 1st PC3 PWR/CTL TBD TBD 2nd PC4 PWR/CTL TBD TBD 2nd PC5 PWR/CTL TBD TBD 2nd PC6 PWR/CTL TBD TBD 2nd PC7 PWR/CTL GND Device GND 1st PC8 PWR/CTL LED1 LED Output LED Output 2nd PC9 PWR/CTL LED2 LED Output LED Output 2nd PC10 PWR/CTL IO1 CMOS Input/Output Reserved Input/Output 2nd PC11 PWR/CTL IO2 CMOS Input/Output Reserved Input/Output 2nd PC12 PWR/CTL IO3 CMOS Input/Output Reserved Input/Output 2nd PC13 PWR/CTL PWR 3.3V Device Power (3.3V) 2nd PC14 PWR/CTL PWR 3.3V Device Power (3.3V) 2nd PC15 PWR/CTL PGND Device GND Device Ground 1st PC16 PWR/CTL PGND Device GND Device Ground 1st PC17 PWR/CTL CDO CMOS Output Card Detect Out 3rd Your Ultimate Memory Solution! 13 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification 3.2 Electrical Description Table 3-2: Signal Description describes the I/O signals. Signals whose source is in the host are designated as inputs while signals that the CFast Card sources are outputs. NAME Table 3-2: Signal Description Description of SATA Segment Pins TYPE DESCRIPTION SGND Signal Ground These are intended to provide isolation for the high speed differential signals. A+, A-, B+, B- SATA Differential The functionality and electrical characteristics of these pins are defined in the SATA reference NAME Description of PWR/CTL Segment Pins TYPE DESCRIPTION CDI CMOS Input CDO CMOS Output LED1 LED Output This signal is driven by the CFast host, and shall be sampled by the CFast device This pin shall be shorted on a CFast device to CDO. This signal and CDO provide a mechanism for a CFast host to detect that a CFast device has been fully inserted, and so that power can be applied safely. The host may drive, and the device may sample, this pin to provide signaling to enable CFast Power Management Sleep state. This pin shall be shorted on the CFast device to CDI. It is effectively driven by CDI. LED Output LED2 LED Output LED Output IO1 CMOS Input/Output Unassigned Input/Output pin IO2 CMOS Input/Output Unassigned Input/Output pin IO3 CMOS Input/Output Unassigned Input/Output pin Your Ultimate Memory Solution! 14 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification 3.3 Electrical Specification The tables in this section define all D.C. Characteristics for the CFast Card Series. Unless otherwise stated, conditions are: Vcc = 3.3V ±5% Ta = -40°C to 85°C Table 3-3: Absolute Maximum Conditions PARAMETER Input Power Voltage on any pin except Vcc with respect to GND. SYMBOL Vcc V CONDITIONS -0.3Vmin. to 3.6Vmax. -0.5Vmin. to Vcc + 0.5Vmax. The card does not need to operate, or to meet any operating specifications outside its operating conditions. Application of absolute maximum conditions shall not damage the card. 3.3.1 Maximum input current Table 3-31: Maximum Input Current POWER LEVEL 0 1 Voltage Average Average Average Average Temperature Current Range Current Range Current Range Current Range During Test (Active) (Partial) (Slumber) (PHYSLP) 0 – 500mA 0 – 500mA 0-250mA 0-20mA 0 – 1200mA 0 – 1200mA 0-250mA 0-20mA 3.3V±1% at 23°C±1°C 3.3V±1% at 23°C±1°C To comply with this specification, current requirements shall not exceed the maximum limit. For CFast cards, two power levels are defined. Power Level 0 has a maximum average current of 500 mA, while Power Level 1 has an increased maximum current of 1200 mA for 3.3V. If the CFast card does not support the CFA Feature Set, the card shall stay within the power envelope of Power Level 1. CFast cards shall operate within the specifications for Power Level 0 at power on and after reset. CFast cards shall also support ATA Identify Device and Set Features commands in Power Level 0. This requirement allows the host device to determine the CFast card’s capabilities and which Power Levels are supported. The possibilities are: Your Ultimate Memory Solution! 15 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification Power Level 0, Power Level 1, Power Level 0 and Power Level 1. The host shall use the Set Features command to set the desired power level to the card if it is compatible with it, or reject the CFast card. An example of a CFast card using both Power Level 0 and Power Level 1 is a Flash memory card supporting both Power Levels. When set by the host to Power Level 0 (default) it shall have lower performance than when it is set to Power Level 1, but shall not exceed the Power Level 0 current consumption. Your Ultimate Memory Solution! 16 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification 4 ATA Command Description 4.1 ATA Command Set Table 4-1. ATA Command Set COMMAND CODE Check Power Mode Erase Sector(s) (CFA) Execute Drive Diagnostic Flush Cache Flush Cache Ext Identify Drive Idle Idle Immediate Initialize Drive Parameters Read DMA Read DMA Ext Read FPDMA Queued Read Log Ext Read Multiple Read Multiple Ext Read Sector(s) E5h or 98h C0h 90h E7h EAh ECh E3h E1h 91h C8h or C9h 25h 60h 2Fh C4h 29h 20h or 21h 24h 40h or 41z 42h 1Xh F6h F3h F4h F5h F1h F2h 7Xh EFh C6h E6h B0h E2h E0h CAh or CBh 35h 3Dh 61h C5h 39h CEh 30h or 31h 34h Read Sector(s) Ext Read Verify Sector(s) Read Verify Sector(s) Ext Recalibrate Security Disable Password Security Erase Prepare Security Erase Unit Security Freeze Lock Security Set Password Security Unlock Seek Set Features Set Multiple Mode Set Sleep Mode SMART Stand By Stand By Immediate Write DMA Write DMA Ext Write DMA FUA Ext Write FPDMA Queued Write Multiple Write Multiple Ext Write Multiple FUA Ext Write Sector(s) Write Sector(s) Ext FR SC CY DH Y Y Y - Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y D Y Y D D D Y Y Y Y Y Y Y Y - Y Y Y Y Y Y Y Y Y Y Y - Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y D D D D D D D Y D D D D D D Y Y Y Y Y Y Y Y Y Your Ultimate Memory Solution! 17 SN ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification 4.2 Identify Device Data Table 4-2 Identify Device Data Your Ultimate Memory Solution! 18 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification Your Ultimate Memory Solution! 19 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification 5 S.M.A.R.T. Function 5.1 S.M.A.R.T. Feature Self-monitoring analysis and reporting technology (S.M.A.R.T.) is used to protect the user from unscheduled downtime. By monitoring and storing critical performance and calibration parameters, S.M.A.R.T. feature set devices attempt to predict the likelihood of near-term degradation or fault condition. Informing the host system of a negative reliability condition allows the host system to warn the user of the impending risk of a data loss and advise the user of appropriate action. 5.2 S.M.A.R.T. Feature Register Values In order to select a subcommand the host must write the subcommand code to the device's Features Register before issuing the S.M.A.R.T .Function Set command. The subcommands are listed below. Table 5-2: S.M.A.R.T. Feature Register Values Note: If the reserved size is below the threshold, the status can be read from the Cylinder Register using the Return Status command (DAh) Your Ultimate Memory Solution! 20 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification 5.3 S.M.A.R.T. Data Structure The following 512 bytes make up the device S.M.A.R.T. data structure. Users can obtain the data using the “Read Data” command (D0h). Table 5-3: S.M.A.R.T. Data Structure Byte F/V Description 0~1 X Revision code 2~361 X Vendor specific 362 V Off-line data collection status 363 X Self-test execution status byte 364~365 V Total time in seconds to complete off-line data collection activity 366 X Vendor specific 367 F Off-line data collection capability 368~369 F S.M.A.R.T. capability 370 F Error logging capability：7-1 Reserved 0 1 = Device error logging supported 371 X Vendor specific 372 F Short self-test routine recommended polling time(in minutes) 373 F Extended self-test routine recommended polling time(in minutes) 374 F Conveyance self-test routine recommended polling time(in minutes) 375~385 R Reserved 386~395 F Firmware Version/Date Code 396~397 F Reserved 398~399 V Reserved 400~406 F Controller 407~415 X Vendor specific 416 F Reserved 417 F Program/write the strong page only 418~419 V Number of spare block 420~423 V Average erase count 424~510 X Vendor specific 511 V Data structure checksum Notes: F=content (byte) is fixed and does not change V=content (byte) is variable and maybe change depending on the state of the device or the command executed by the device X= content (byte) is vendor specific and maybe fixed or variable R=content (byte) is reserved and shall be zero Your Ultimate Memory Solution! 21 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification 5.4 ATP S.M.A.R.T. Tool ATP provides S.M.A.R.T. Tool for Windows 2000/XP/Vista/7 and Linux, It can monitor the state of Industrial Grad CFast card, and the following picture shows S.M.A.R.T. tool operation. This tool supports that users read spare and bad block information. Users can thus evaluate drive health at run time and receive an early warning before the drive life ends. Figure 5-4: ATP S.M.A.R.T. tool operation Note: The S.M.A.R.T. tool version will be updated from time to time. Please check with sales for the latest version. Your Ultimate Memory Solution! 22 ATP Confidential & Proprietary Revision 1.1 ATP Industrial Grade CFast Specification ATP Electronics Inc. ATP Electronics Taiwan, Inc. ATP Electronics Europe B.V. ATP Electronics Japan office ATP Electronics Shangha, Inc 750 North Mary Ave. Sunnyvale, CA 94085 USA 10F, No. 185, Tiding Blvd. Sec. 2 Neihu, Taipei, Taiwan 114 Corkstraat 46 Rotterdam 3047 AC The Netherlands #1007, 10F, 1-8-4, Kandasakuma-cho Chiyoda-ku, 101-0025, Japan B102, #500 Bibo Rd. Zhangjiang High-Tech Park,Pudong, Shanghai,China [email protected] Phone: +1-408-7325000 ext. 5859 Fax: +1-408-732-5055 http://www.atpinc.com [email protected] Phone: +886-2-26596368 Fax: +886-2-2659-4982 http://www.atpinc.com [email protected] Phone: +31 (0) 88 287 0000 Fax: +31 (0) 88 287 0099 http://www.atpinc.com [email protected] [email protected] Phone: +86-2150802220 Fax: +86-21-50802219 http://www.atpinc.com Your Ultimate Memory Solution! 23 ATP Confidential & Proprietary http://www.atpinc.com