89KB

Nowadays, single fiber bidirectional optic modules used in FTTH system are
expected to be miniaturized and have a low cost of production. Conventional
BOSA products use laser diode (LD)/photodiode (PD) canned packages in
rugged metal housings. Thus, lowering the product cost is almost saturated in the
market today.
We have developed micro-bidirectional optical subassembly (µ-BOSA) using
novel silicon platform architecture that combines LD and PD chips on a small
silicon base. Product appearance is shown in Fig. 1. Table 1 summarizes the
typical specifications, and Figs. 2 and 3 show the typical optical performance of
this µ-BOSA product.
The features of the products are as follows:
1. Realization of miniaturization and reduced cost by adapting silicon platform
technology. Conventional optic modules use hermetic sealed can packages for
LD and PD, independently. On the contrary, µ-BOSA module uses silicon chip
inside one hermetic sealed can package. Thus, the total number of parts can be
reduced, and µ-BOSA makes it possible to miniaturize and reduce cost at the
same time. The coaxial structure also reduces the cost of driving electric circuit.
2. Lining up receptacle type and pigtail type for µ-BOSA module responding for
use.
New Products
Micro-Bidirectional
Optical Subassembly
(µ-BOSA)
Table 1. µ-BOSA module specifications.
Pigtail type
Items
Contents
Data rate
1.25 Gbit/s
Transmission wavelength
1280−1350 nm
Reception wavelength
1480−1500 nm
Operating current
20−70 mA (2.8 mW)
Minimum sensitivity
Less than −26 dBm
Current consumption
50 mA
Size
6.75 mm(φ) × 16 mm(L)
*Receptacle type,
exclude pin length
Receptacle type
Fig. 1. Appearance.
10−4
200 ps/div
Error rate
10−5
10−6
10−7
10−8
10−9
10−10
10−11
10−12
10−13
−32 −30 −28 −26 −24 −22
−31 −29 −27 −25 −23
Input power (dBm)
Fig. 3. Optical waveform (1.25 Gbit/s).
Fig. 2. Minimum sensitivity.
[Information]
Optical Module Engineering Department
Tel : +81 3 5606 1477
E-mail : opt_modules@fujikura.co.jp
Fujikura Technical Review, 2008
55