GS74104AGP TSOP Commercial Temp Industrial Temp 8, 10, 12 ns 3.3 V VDD Center VDD and VSS 1M x 4 4Mb Asynchronous SRAM Features TSOP-II 1M x 4-Pin Configuration • Fast access time: 8, 10, 12 ns • CMOS low power operation: 120/95/85 mA at minimum cycle time • Single 3.3 V power supply • All inputs and outputs are TTL-compatible • Fully static operation • Industrial Temperature Option: –40° to 85°C • Package line up GP:RoHS-compliant 400 mil, 44-pin TSOP Type II package Description The GS74104A is a high speed CMOS Static RAM organized as 1,048,576 words by 4 bits. Static design eliminates the need for external clocks or timing strobes. The GS74104A operates on a single 3.3 V power supply and all inputs and outputs are TTL-compatible. The GS74104A is available in a RoHScompliant 400 mil TSOP Type-II package. Pin Descriptions Symbol Description A0–A19 Address input DQ1–DQ4 Data input/output CE Chip enable input WE Write enable input OE Output enable input VDD +3.3 V power supply VSS Ground NC No connect Rev: 1.08 1/2013 NC 1 44 NC NC 43 42 NC NC 2 3 A4 4 41 A5 A3 5 40 A6 A2 6 39 A7 A1 7 38 A8 A0 8 37 A9 CE 9 36 OE DQ1 10 35 11 44-pin DQ4 VDD 34 12 400 mil TSOP II 33 VSS VSS DQ2 13 32 VDD DQ3 WE 14 31 A10 A19 15 30 A11 A18 16 29 A12 A17 17 28 A13 A16 18 27 A15 19 26 A14 NC NC NC 20 25 NC NC 21 24 NC NC 22 23 NC 1/10 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2001, GSI Technology GS74104AGP Block Diagram A0 Address Input Buffer Row Decoder Memory Array Column Decoder A19 CE WE OE I/O Buffer Control DQ1 DQ4 Truth Table CE OE WE DQ1 to DQ8 VDD Current H X X Not Selected ISB1, ISB2 L L H Read L X L Write L H H High Z IDD Note: X: “H” or “L” Rev: 1.08 1/2013 2/10 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2001, GSI Technology GS74104AGP Absolute Maximum Ratings Parameter Symbol Rating Unit Supply Voltage VDD –0.5 to +4.6 V Input Voltage VIN –0.5 to VDD +0.5 (≤ 4.6 V max.) V Output Voltage VOUT –0.5 to VDD +0.5 (≤ 4.6 V max.) V Allowable power dissipation PD 0.7 W Storage temperature TSTG –55 to 150 o C Note: Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Recommended Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device reliability. Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Supply Voltage for -8/-10/-12 VDD 3.0 3.3 3.6 V Input High Voltage VIH 2.0 — VDD +0.3 V Input Low Voltage VIL –0.3 — 0.8 V Ambient Temperature, Commercial Range TAc 0 — 70 oC Ambient Temperature, Industrial Range TAI –40 — 85 o C Notes: 1. Input overshoot voltage should be less than VDD +2 V and not exceed 20 ns. 2. Input undershoot voltage should be greater than –2 V and not exceed 20 ns. Capacitance Parameter Symbol Test Condition Max Unit Input Capacitance CIN VIN = 0 V 5 pF Output Capacitance COUT VOUT = 0 V 7 pF Notes: 1. Tested at TA = 25°C, f = 1 MHz 2. These parameters are sampled and are not 100% tested. Rev: 1.08 1/2013 3/10 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2001, GSI Technology GS74104AGP DC I/O Pin Characteristics Parameter Symbol Test Conditions Min Max Input Leakage Current IIL VIN = 0 to VDD – 1 uA 1 uA Output Leakage Current ILO Output High Z VOUT = 0 to VDD –1 uA 1 uA Output High Voltage VOH IOH = –4mA 2.4 — Output Low Voltage VOL ILO = +4mA — 0.4 V Power Supply Currents Parameter Symbol Test Conditions 0 to 70°C –40 to 85°C 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns IDD CE ≤ VIL All other inputs ≥ VIH or ≤ VIL Min. cycle time IOUT = 0 mA 120 mA 95 mA 85 mA 130 mA 105 mA 95 mA Standby Current ISB1 CE ≥ VIH All other inputs ≥ VIH or ≤VIL Min. cycle time 30 mA 25 mA 22 mA 40 mA 35 mA 32 mA Standby Current ISB2 CE ≥ VDD - 0.2V All other inputs ≥ VDD - 0.2V or ≤ 0.2V Operating Supply Current Rev: 1.08 1/2013 10 mA 4/10 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. 20 mA © 2001, GSI Technology GS74104AGP AC Test Conditions Output Load 1 Parameter Conditions Input high level VIH = 2.4 V Input low level VIL = 0.4 V 50Ω Input rise time tr = 1 V/ns VT = 1.4 V Input fall time tf = 1 V/ns Input reference level 1.4 V Output Load 2 Output reference level 1.4 V 3.3 V Output load Fig. 1& 2 DQ 589Ω DQ Notes: 1. Include scope and jig capacitance. 2. Test conditions as specified with output loading as shown in Fig. 1 unless otherwise noted. 3. Output load 2 for tLZ, tHZ, tOLZ and tOHZ 30pF1 5pF1 434Ω AC Characteristics Read Cycle Parameter Symbol Read cycle time -8 -10 -12 Unit Min Max Min Max Min Max tRC 8 — 10 — 12 — ns Address access time tAA — 8 — 10 — 12 ns Chip enable access time (CE) tAC — 8 — 10 — 12 ns Output enable to output valid (OE) tOE — 3.5 — 4 — 5 ns Output hold from address change tOH 3 — 3 — 3 — ns Chip enable to output in low Z (CE) tLZ* 3 — 3 — 3 — ns Output enable to output in low Z (OE) tOLZ* 0 — 0 — 0 — ns Chip disable to output in High Z (CE) tHZ* — 4 — 5 — 6 ns Output disable to output in High Z (OE) tOHZ* — 3.5 — 4 — 5 ns * These parameters are sampled and are not 100% tested. Rev: 1.08 1/2013 5/10 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2001, GSI Technology GS74104AGP Read Cycle 1: CE = OE = VIL, WE = VIH tRC Address tAA tOH Data Out Previous Data Data valid Read Cycle 2: WE = VIH tRC Address tAA CE tAC tHZ tLZ OE tOE Data Out Rev: 1.08 1/2013 tOLZ High impedance tOHZ DATA VALID 6/10 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2001, GSI Technology GS74104AGP Write Cycle Parameter Symbol Write cycle time -8 -10 -12 Unit Min Max Min Max Min Max tWC 8 — 10 — 12 — ns Address valid to end of write tAW 5.5 — 7 — 8 — ns Chip enable to end of write tCW 5.5 — 7 — 8 — ns Data set up time tDW 4 — 5 — 6 — ns Data hold time tDH 0 — 0 — 0 — ns Write pulse width tWP 5.5 — 7 — 8 — ns Address set up time tAS 0 — 0 — 0 — ns Write recovery time (WE) tWR 0 — 0 — 0 — ns Write recovery time (CE) tWR1 0 — 0 — 0 — ns Output Low Z from end of write tWLZ* 3 — 3 — 3 — ns Write to output in High Z tWHZ* — 3.5 — 4 — 5 ns * These parameters are sampled and are not 100% tested. Write Cycle 1: WE control tWC Address tAW tWR OE tCW CE tAS tWP WE tDW Data In DATA VALID tWHZ Data Out Rev: 1.08 1/2013 tDH tWLZ HIGH IMPEDANCE 7/10 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2001, GSI Technology GS74104AGP Write Cycle 2: CE control tWC Address tAW tWR1 OE tAS tCW CE tWP WE tDW Data In tDH DATA VALID Data Out HIGH IMPEDANCE 44-Pin, 400 mil TSOP-II Dimension in inch D c 22 e B y L L1 A1 A A2 1 A HE 23 E 44 Detail A Rev: 1.08 1/2013 Q Dimension in mm Symbol min nom max min nom max A — — 0.047 — — 1.20 A1 0.002 — — 0.05 — — A2 0.037 0.039 0.041 0.95 1.00 1.05 B 0.01 0.014 0.018 0.25 0.35 0.45 c — 0.006 — — 0.15 — D 0.721 0.725 0.729 18.31 18.41 18.51 E 0.396 0.400 0.404 10.06 10.16 10.26 e — 0.031 — — 0.80 — HE 0.455 0.463 0.471 11.56 11.76 11.96 L 0.016 0.020 0.024 0.40 0.50 0.60 L1 — 0.031 — — 0.80 — y — — 0.004 — — 0.10 Q o — o o — 5o 0 5 0 Notes: 1. Dimension D& E do not include interlead flash. 2. Dimension B does not include dambar protrusion/intrusion. 3. Controlling dimension: mm 8/10 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2001, GSI Technology GS74104AGP Ordering Information Part Number* Package Access Time Temp. Range GS74104AGP-8 RoHS-compliant 400 mil TSOP-II 8 ns Commercial GS74104AGP-10 RoHS-compliant 400 mil TSOP-II 10 ns Commercial GS74104AGP-12 RoHS-compliant 400 mil TSOP-II 12 ns Commercial GS74104AGP-8I RoHS-compliant 400 mil TSOP-II 8 ns Industrial GS74104AGP-10I RoHS-compliant 400 mil TSOP-II 10 ns Industrial GS74104AGP-12I RoHS-compliant 400 mil TSOP-II 12 ns Industrial Note: Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. For example: GS74104AGP-8T. Rev: 1.08 1/2013 9/10 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2001, GSI Technology GS74104AGP 4Mb Asynchronous Datasheet Revision History Rev. Code: Old; New 74104A_r1 Types of Changes Format or Content Content/Format Page #/Revisions/Reason • Created new datasheet 74104A_r1; 74104A_r1_01 Content • Added 6 ns speed bin • Updated all power numbers 74104A_r1_01; 74104A_r1_02 Content • Updated Recommended Operating Currents on page 3 • Added 7 ns bin to entire document • Add X package 74104A_r1_02; 74104A_r1_03 Content • Removed 6 ns speed bin from entire document • Removed all references to “X” package 74104A_r1_03; 74104A_r1_04 Content • Removed 7 ns speed bin from entire document 74104A_r1_04; 74104A_r1_05 Content/Format 74104A_r1_05; 74104A_r1_06 Content6 • Added RoHS-compliant 400 mil, 32-pin SOJ 74104A_r1_06; 74104A_r1_07 Content6 • Removed status column (all parts MP) • (Rev1.07a: Removed SOJ references due to EOL) 74104A_r1_07; 74104A_r1_08 Content6 • Removed TSOP-II 5/6 RoHS references due to EOL Rev: 1.08 1/2013 • Updated format • Added RoHS-compliant information for TSOP-II package 10/10 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2001, GSI Technology