G5193

G5193
Global Mixed-mode Technology
High Efficiency, 3A Output, Synchronous Step Down
Features
„
„
„
„
„
„
„
„
„
„
General Description
Two 45mΩ (typical) MOSFETs for high efficiency at 3A loads
300kHz to 2MHz Switching Frequency
0.827V±1% Voltage Reference Over Temperature
Synchronizes to External Clock
Adjustable Soft Start
UV and OV Power Good Output
Low Operating and Shutdown Quiescent Current
Safe Start-up into Pre-Biased Output
Cycle by Cycle Current Limit, Thermal and
Frequency Fold Back Protection
Thermally Enhanced 3mm × 3mm 16-pin QFN
The G5193 device is a full featured 5.5V, 3A synchronous step down current mode converter with two integrated MOSFETs.
The G5193 enables small designs by integrating the
MOSFETs, implementing current mode control to reduce external component count, reducing inductor size
by enabling up to 2MHz switching frequency, and
minimizing the IC footprint with a small 3mm x 3mm
thermally enhanced QFN package.
The G5193 provides accurate regulation for a variety
of loads with an accurate ±1% Voltage Reference
(VREF) over temperature.
Efficiency is maximized through the integrated 45mΩ
MOSFETs and 350µA typical supply current. Using the
enable pin, shutdown supply current is reduced to 2µA
by entering a shutdown mode.
Applications
Low-Voltage, High-Density Power Systems
Point of Load Regulation for High Performance
DSPs, FPGAs, ASICs and Microprocessors
„ Broadband, Networking and Optical Communication Infrastructure
„
„
Under voltage lockout is internally set at 2.6V, but can
be increased by programming the threshold with a
resistor network on the enable pin. The output voltage
startup ramp is controlled by the soft start pin. An open
drain power good signal indicates the output is within
93% to 107% of its nominal voltage.
Ordering Information
ORDER
NUMBER
Marking
TEMP.
RANGE
PACKAGE
(Green)
G5193R41U
5193
-40°C to +85°C TQFN3X3-16
G5193R41D
5193
-40°C to +85°C TQFN3X3-16
Frequency fold back and thermal shutdown protects
the device during an over-current condition.
Note: R4: TQFN3X3-16
1: Bonding Code
U & D: Tape & Reel
VIN
EN
PG
BS
15
14
13
2
7
8
RT
4
COMP
GND
6
3
VIN
3.3V to 5.5V
11
Thermal
Pad
FB
GND
Typical Application Circuit
12
5
VIN
1
AGND
VINA
16
Pin Configuration
LX
R5
100KΩ
LX
9
SS
G5193
VIN
CI
10µF
C2
0.1µF
EN
PG
CSS
0.01µF
RT
182KΩ
CZ*
G5193 TQFN3X3-16
Note: Recommend connecting the Thermal Pad to
the Ground for excellent power dissipation.
BS
LX
R4
32.4KΩ
LX
10
R3
48.7KΩ
SS
RT
COMP
FB
(0.827V)
CBS
0.1µF
LO
1.0µH
CO
22*2µF
VOUT
1.8V
CD*
R1
100KΩ
R2
80KΩ
GND
AGND
EP
RC
20KΩ
CC
470PF
* Option
* VINA must connect to VIN
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 0.2
Jul 18, 2012
1