® Innovasic Product Reflow Profiles Extended Life Semiconductor Solutions Recommended Reflow Profile A PCBA reflow profile depends on the thermal mass of the entire populated board. The actual temperature used in the reflow oven is a function of: Solder paste types Board density Component location Component mass Board finish Temperature – – – – – 1 ® Innovasic Product Reflow Profiles Extended Life Semiconductor Solutions Profile Preheat and soak Min. temperature (Tsmin) Max. temperature (Tsmax) Time (tsmin to tsmax) (ts) Sn-Pb Eutectic Assembly Pb-Free Assembly 100°C 150°C 60 ~ 120 seconds 150°C 200°C 60 ~ 120 seconds Average ramp-up rate (Tsmax to Tp) 3°C/second (Max.) 3°C/second (Max.) Liquid temperature (TL) Time at liquid (tL) 183°C 60 ~ 150 seconds 217°C 60 ~ 150 seconds Peak package body temperature (Tp)* Please refer to the classification temperature IPC/JEDEC J-STD-020D at http://www.smta.org/files/JSTD020D-01.pdf. Time (tp)** within 5°C of the specified classification temperature (Tc) 20** seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6°C/second (Max.) 6°C/second (Max.) Time to peak temperature from 25°C 6 minutes (Max.) 8 minutes (Max.) * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Note 1: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow (e.g., live-bug). If parts are reflowed in other than the normal live-bug assembly reflow orientation (i.e., dead-bug), Tp shall be within ±2°C of the live-bug Tp and still meet the Tc requirements, otherwise, the profile shall be adjusted to achieve the latter. To accurately measure actual peak package body temperatures, please refer to JEP140 for recommended thermocouple use. Note 2: All components in the test load shall meet the classification profile requirements. Note 3: SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020, JESD22-A112 (Rescinded), IPC-SM-786 (Rescinded) do not need to be reclassified to the current revision unless a change in classification level or a higher peak classification temperature is desired. 2