Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C) Reflow Parameter Minimum preheat temperature (TsMIN) Maximum preheat temperature (TsMAX) Preheat time TsMAX to TL ramp-up rate Time above temperature TL (tL ) Peak temperature (TP) Time 25 °C to TP Time within 5 ° of peak TP Ramp-down rate Lead Free Assembly 150 °C 200 °C 60-180 seconds 3 °C/second maximum 217 °C 60-120 seconds 245 °C ~260 °C(recommended 250 °C ) 6 minute maximum 10-20 seconds 4 °C/second maximum IR/Convection Reflow Profile (IPC/JEDEC J-STD-020C) Wave soldering Maximum peak temperature: 250 °C – 260 °C for 3-5 seconds max. (250 °C max. recommended)