IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC 128K x36/32 and 256K x18 4Mb, ECC, SYNCHRONOUS FLOW-THROUGH SRAM FEBRUARY 2015 DESCRIPTION FEATURES • Internal self-timed write cycle • Individual Byte Write Control and Global Write • Clock controlled, registered address, data and The 4Mb product family features high-speed, low-power synchronous static RAMs designed to provide burstable, high-performance memory for communication and networking applications. The IS61(64)LF/VF12836EC are organized as 131,072 words by 36bits. The IS61(64)LF/VF12832EC are organized as 131,072 words by 32bits. The IS61(64)LF/VF25618EC are organized as 262,144 words by 18 bits. Fabricated with ISSI's advanced CMOS technology, the device integrates a 2-bit burst counter, high-speed SRAM core, and high-drive capability outputs into a single monolithic circuit. All synchronous inputs pass through registers controlled by a positive-edge-triggered single clock input. control • Burst sequence control using MODE input • Three chip enable option for simple depth expansion and address pipelining • Common data inputs and data outputs • Auto Power-down during deselect • Single cycle deselect • Snooze MODE for reduced-power standby • JEDEC 100-pin QFP, 165-ball BGA and 119-ball Write cycles are internally self-timed and are initiated by the rising edge of the clock input. Write cycles can be one to four bytes wide as controlled by the write control inputs. Separate byte enables allow individual bytes to be written. The byte write operation is performed by using the byte write enable (/BWE) input combined with one or more individual byte write signals (/BWx). In addition, Global Write (/GW) is available for writing all bytes at one time, regardless of the byte write controls. BGA packages • Power supply: • LF: VDD 3.3V (± 5%), VDDQ 3.3V/2.5V (± 5%) • VF: VDD 2.5V (± 5%), VDDQ 2.5V (± 5%) • JTAG Boundary Scan for BGA packages • Industrial and Automotive temperature support • Lead-free available • Error Detection and Error Correction Bursts can be initiated with either /ADSP (Address Status Processor) or /ADSC (Address Status Cache Controller) input pins. Subsequent burst addresses can be generated internally and controlled by the /ADV (burst address advance) input pin. The mode pin is used to select the burst sequence order. Linear burst is achieved when this pin is tied LOW. Interleave burst is achieved when this pin is tied HIGH or left floating. FAST ACCESS TIME Symbol tKQ tKC Parameter -6.5 -7.5 Units Clock Access Time Cycle time Frequency 6.5 7.5 133 7.5 8.5 117 ns ns MHz Copyright © 2014 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 1 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC BLOCK DIAGRAM Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 2 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC PIN CONFIGURATION 128K x 36, 165-Ball BGA (Top View) A B C D E F G H J K L M N P R 1 2 3 4 5 6 NC NC DQPc DQc DQc DQc DQc NC DQd DQd DQd DQd DQPd NC MODE A A NC DQc DQc DQc DQc VSS DQd DQd DQd DQd NC NC NC /CE CE2 VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A /BWc /BWd VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A /BWb /BWa VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDI TMS /CE2 CLK VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC A1* A0* 7 /BWE /GW VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDO TCK 8 /ADSC /OE VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 9 10 11 /ADV /ADSP VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A A A NC DQb DQb DQb DQb NC DQa DQa DQa DQa NC A A NC NC DQPb DQb DQb DQb DQb ZZ DQa DQa DQa DQa DQPa NC A Note: A0 and A1 are the two least significant bits (LSB) of the address field and set the internal burst counter if burst is desired PIN DESCRIPTIONS Bottom View 165-Ball, 13 mm x 15mm BGA 11 x 15 Ball Array Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 Symbol Pin Name CLK Synchronous Clock A0,A1 Synchronous Burst Address Inputs A Synchronous Address Inputs /ADV Synchronous Burst Address Advance /ADSP Synchronous Address Status Processor /ADSC Synchronous Address Status Controller MODE Burst Sequence Selection /CE,CE2,/CE2 Synchronous Chip Enable /BWE Synchronous Byte Write Enable /BWx (x=a-d) Synchronous Byte Write Inputs /GW Synchronous Global Write Enable /OE Asynchronous Output Enable DQx Synchronous Data Inputs/Outputs DQPx Synchronous Parity Data I/O TCK,TDI,TDO,TMS JTAG Pins ZZ Asynchronous Power Sleep Mode NC No Connect VDD Power Supply VDDQ I/O Power Supply VSS Ground 3 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC 128K x 32, 165-Ball BGA (Top View) A B C D E F G H J K L M N P R 1 2 3 4 5 6 7 8 9 10 11 NC NC NC DQc DQc DQc DQc NC DQd DQd DQd DQd NC NC MODE A A NC DQc DQc DQc DQc VSS DQd DQd DQd DQd NC NC NC /CE CE2 VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A /BWc /BWd VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A /BWb /BWa VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDI TMS /CE2 CLK VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC A1* A0* /BWE /GW VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDO TCK /ADSC /OE VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A /ADV /ADSP VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A A A NC DQb DQb DQb DQb NC DQa DQa DQa DQa NC A A NC NC NC DQb DQb DQb DQb ZZ DQa DQa DQa DQa NC NC A Note: A0 and A1 are the two least significant bits (LSB) of the address field and set the internal burst counter if burst is desired. PIN DESCRIPTIONS Bottom View 165-Ball, 13 mm x 15mm BGA 11 x 15 Ball Array Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 Symbol Pin Name CLK Synchronous Clock A0,A1 Synchronous Burst Address Inputs A Synchronous Address Inputs /ADV Synchronous Burst Address Advance /ADSP Synchronous Address Status Processor /ADSC Synchronous Address Status Controller MODE Burst Sequence Selection /CE,CE2,/CE2 Synchronous Chip Enable /BWE Synchronous Byte Write Enable /BWx (x=a-d) Synchronous Byte Write Inputs /GW Synchronous Global Write Enable /OE Asynchronous Output Enable DQx Synchronous Data Inputs/Outputs TCK,TDI,TDO,TMS JTAG Pins ZZ Asynchronous Power Sleep Mode NC No Connect VDD Power Supply VDDQ I/O Power Supply VSS Ground 4 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC 256K x 18, 165-Ball BGA (Top View) A B C D E F G H J K L M N P R 1 2 3 4 5 6 NC NC NC NC NC NC NC NC DQb DQb DQb DQb DQPb NC MODE A A NC DQb DQb DQb DQb VSS NC NC NC NC NC NC NC /CE CE2 VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A /BWb NC VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A NC /BWa VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDI TMS /CE2 CLK VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC A1* A0* 7 /BWE /GW VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDO TCK 8 /ADSC /OE VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 9 10 11 /ADV /ADSP VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A A A NC NC NC NC NC NC DQa DQa DQa DQa NC A A A NC DQPa DQa DQa DQa DQa ZZ NC NC NC NC NC NC A Note: A0 and A1 are the two least significant bits (LSB) of the address field and set the internal burst counter if burst is desired. PIN DESCRIPTIONS Symbol Pin Name Bottom View 165-Ball, 13 mm x 15mm BGA 11 x 15 Ball Array Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 CLK Synchronous Clock A0,A1 Synchronous Burst Address Inputs A Synchronous Address Inputs /ADV Synchronous Burst Address Advance /ADSP Synchronous Address Status Processor /ADSC Synchronous Address Status Controller MODE Burst Sequence Selection /CE,CE2,/CE2 Synchronous Chip Enable /BWE Synchronous Byte Write Enable /BWx (x=a-b) Synchronous Byte Write Inputs /GW Synchronous Global Write Enable /OE Asynchronous Output Enable DQx Synchronous Data Inputs/Outputs DQPx Synchronous Parity Data I/O TCK,TDI,TDO,TMS JTAG Pins ZZ Asynchronous Power Sleep Mode NC No Connect VDD Power Supply VDDQ I/O Power Supply VSS Ground 5 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC 128K x 36, 119-Ball BGA (Top View) A B C D E F G H J K L M N P R T U 1 2 3 VDDQ NC NC DQc DQc VDDQ DQc DQc VDDQ DQd DQd VDDQ DQd DQd NC NC VDDQ A CE2 A DQPc DQc DQc DQc DQc VDD DQd DQd DQd DQd DQPd A NC TMS A A A VSS VSS VSS /BWc VSS NC VSS /BWd VSS VSS VSS MODE A TDI 4 /ADSP /ADSC VDD NC /CE /OE /ADV /GW VDD CLK NC /BWE A1* A0* VDD A TCK 5 6 7 A A A VSS VSS VSS /BWb VSS NC VSS /BWa VSS VSS VSS NC A TDO A /CE2 A DQPb DQb DQb DQb DQb VDD DQa DQa DQa DQa DQPa A NC NC VDDQ NC NC DQb DQb VDDQ DQb DQb VDDQ DQa DQa VDDQ DQa DQa NC ZZ VDDQ Note: A0 and A1 are the two least significant bits (LSB) of the address field and set the internal burst counter if burst is desired. Bottom View 119-Ball, 14 mm x 22 mm BGA 7 x 17 Ball Array Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 Symbol PIN DESCRIPTIONS Pin Name CLK Synchronous Clock A0,A1 Synchronous Burst Address Inputs A Synchronous Address Inputs /ADV Synchronous Burst Address Advance /ADSP Synchronous Address Status Processor /ADSC Synchronous Address Status Controller MODE Burst Sequence Selection /CE,CE2,/CE2 Synchronous Chip Enable /BWE Synchronous Byte Write Enable /BWx (x=a-d) Synchronous Byte Write Inputs /GW Synchronous Global Write Enable /OE Asynchronous Output Enable DQx Synchronous Data Inputs/Outputs DQPx Synchronous Parity Data I/O TCK,TDI,TDO,TMS JTAG Pins ZZ Asynchronous Power Sleep Mode NC No Connect VDD Power Supply VDDQ I/O Power Supply VSS Ground 6 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC 128K x 32, 119-Ball BGA (Top View) A B C D E F G H J K L M N P R T U 1 2 3 VDDQ NC NC DQc DQc VDDQ DQc DQc VDDQ DQd DQd VDDQ DQd DQd NC NC VDDQ A CE2 A NC DQc DQc DQc DQc VDD DQd DQd DQd DQd NC A NC TMS A A A VSS VSS VSS /BWc VSS NC VSS /BWd VSS VSS VSS MODE A TDI 4 /ADSP /ADSC VDD NC /CE /OE /ADV /GW VDD CLK NC /BWE A1* A0* VDD A TCK 5 6 7 A A A VSS VSS VSS /BWb VSS NC VSS /BWa VSS VSS VSS NC A TDO A /CE2 A NC DQb DQb DQb DQb VDD DQa DQa DQa DQa NC A NC NC VDDQ NC NC DQb DQb VDDQ DQb DQb VDDQ DQa DQa VDDQ DQa DQa NC ZZ VDDQ Note: A0 and A1 are the two least significant bits (LSB) of the address field and set the internal burst counter if burst is desired. PIN DESCRIPTIONS Bottom View 119-Ball, 14 mm x 22 mm BGA 7 x 17 Ball Array Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 Symbol Pin Name CLK Synchronous Clock A0,A1 Synchronous Burst Address Inputs A Synchronous Address Inputs /ADV Synchronous Burst Address Advance /ADSP Synchronous Address Status Processor /ADSC Synchronous Address Status Controller MODE Burst Sequence Selection /CE,CE2,/CE2 Synchronous Chip Enable /BWE Synchronous Byte Write Enable /BWx (x=a-b) Synchronous Byte Write Inputs /GW Synchronous Global Write Enable /OE Asynchronous Output Enable DQx Synchronous Data Inputs/Outputs TCK,TDI,TDO,TMS JTAG Pins ZZ Asynchronous Power Sleep Mode NC No Connect VDD Power Supply VDDQ I/O Power Supply VSS Ground 7 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC 256K x 18, 119-Ball BGA (Top View) A B C D E F G H J K L M N P R T U 1 2 3 VDDQ NC NC DQb NC VDDQ NC DQb VDDQ NC DQb VDDQ DQb NC NC NC VDDQ A CE2 A NC DQb NC DQb NC VDD DQb NC DQb NC DQPb A A TMS A A A VSS VSS VSS /BWb VSS NC VSS VSS VSS VSS VSS MODE A TDI 4 /ADSP /ADSC VDD NC /CE /OE /ADV /GW VDD CLK NC /BWE A1* A0* VDD NC TCK 5 6 7 A A A VSS VSS VSS VSS VSS NC VSS /BWa VSS VSS VSS NC A TDO A /CE2 A DQPa NC DQa NC DQa VDD NC DQa NC DQa NC A A NC VDDQ NC NC NC DQa VDDQ DQa NC VDDQ DQa NC VDDQ NC DQa NC ZZ VDDQ Note: A0 and A1 are the two least significant bits (LSB) of the address field and set the internal burst counter if burst is desired. PIN DESCRIPTIONS Bottom View 119-Ball, 14 mm x 22 mm BGA 7 x 17 Ball Array Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 Symbol Pin Name CLK Synchronous Clock A0,A1 Synchronous Burst Address Inputs A Synchronous Address Inputs /ADV Synchronous Burst Address Advance /ADSP Synchronous Address Status Processor /ADSC Synchronous Address Status Controller MODE Burst Sequence Selection /CE,CE2,/CE2 Synchronous Chip Enable /BWE Synchronous Byte Write Enable /BWx (x=a-b) Synchronous Byte Write Inputs /GW Synchronous Global Write Enable /OE Asynchronous Output Enable DQx Synchronous Data Inputs/Outputs DQPx Synchronous Parity Data I/O TCK,TDI,TDO,TMS JTAG Pins ZZ Asynchronous Power Sleep Mode NC No Connect VDD Power Supply VDDQ I/O Power Supply VSS Ground 8 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 A A /CE CE2 /BWd /BWc /BWb /BWa /CE2 VDD VSS CLK /GW /BWE /OE /ADSC /ADSP /ADV A A 128K x 36, 100PIN QFP (Top View) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 128K x 36 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 DQPb DQb DQb VDDQ VSS DQb DQb DQb DQb VSS VDDQ DQb DQb VSS NC VDD ZZ DQa DQa VDDQ VSS DQa DQa DQa DQa VSS VDDQ DQa DQa DQPa MODE A A A A A1 A0 NC NC VSS VDD NC NC A A A A A A A 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 DQPc DQc DQc VDDQ VSS DQc DQc DQc DQc VSS VDDQ DQc DQc NC VDD NC VSS DQd DQd VDDQ VSS DQd DQd DQd DQd VSS VDDQ DQd DQd DQPd Note: A0 and A1 are the two least significant bits (LSB) of the address field and set the internal burst counter if burst is desired. PIN DESCRIPTIONS Symbol Pin Name Symbol Pin Name CLK Synchronous Clock /GW Synchronous Global Write Enable A0,A1 Synchronous Burst Address Inputs /OE Asynchronous Output Enable A Synchronous Address Inputs DQx Synchronous Data Inputs/Outputs /ADV Synchronous Burst Address Advance DQPx Synchronous Parity Data I/O /ADSP Synchronous Address Status Processor ZZ Asynchronous Power Sleep Mode /ADSC Synchronous Address Status Controller NC No Connect MODE Burst Sequence Selection VDD Power Supply /CE,CE2,/CE2 Synchronous Chip Enable VDDQ I/O Power Supply /BWE Synchronous Byte Write Enable VSS Ground /BWx (x=a-d) Synchronous Byte Write Inputs Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 9 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 A A /CE CE2 /BWd /BWc /BWb /BWa /CE2 VDD VSS CLK /GW /BWE /OE /ADSC /ADSP /ADV A A 128K x 32, 100PIN QFP (Top View) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 128K x 32 NC DQb DQb VDDQ VSS DQb DQb DQb DQb VSS VDDQ DQb DQb VSS NC VDD ZZ DQa DQa VDDQ VSS DQa DQa DQa DQa VSS VDDQ DQa DQa NC MODE A A A A A1 A0 NC NC VSS VDD NC NC A A A A A A A 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 NC DQc DQc VDDQ VSS DQc DQc DQc DQc VSS VDDQ DQc DQc NC VDD NC VSS DQd DQd VDDQ VSS DQd DQd DQd DQd VSS VDDQ DQd DQd NC Note: A0 and A1 are the two least significant bits (LSB) of the address field and set the internal burst counter if burst is desired. PIN DESCRIPTIONS Symbol Pin Name Symbol Pin Name CLK Synchronous Clock /BWx (x=a-d) Synchronous Byte Write Inputs A0,A1 Synchronous Burst Address Inputs /GW Synchronous Global Write Enable A Synchronous Address Inputs /OE Asynchronous Output Enable /ADV Synchronous Burst Address Advance DQx Synchronous Data Inputs/Outputs /ADSP Synchronous Address Status Processor ZZ Asynchronous Power Sleep Mode /ADSC Synchronous Address Status Controller NC No Connect MODE Burst Sequence Selection VDD Power Supply /CE,CE2,/CE2 Synchronous Chip Enable VDDQ I/O Power Supply /BWE Synchronous Byte Write Enable VSS Ground Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 10 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 A A /CE CE2 NC NC /BWb /BWa /CE2 VDD VSS CLK /GW /BWE /OE /ADSC /ADSP /ADV A A 256K x 18, 100PIN QFP (Top View) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 256K x 18 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 A NC NC VDDQ VSS NC DQPa DQa DQa VSS VDDQ DQa DQa VSS NC VDD ZZ DQa DQa VDDQ VSS DQa DQa NC NC VSS VDDQ NC NC NC MODE A A A A A1 A0 NC NC VSS VDD NC NC A A A A A A A 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 NC NC NC VDDQ VSS NC NC DQb DQb VSS VDDQ DQb DQb NC VDD NC VSS DQb DQb VDDQ VSS DQb DQb DQPb NC VSS VDDQ NC NC NC Note: A0 and A1 are the two least significant bits (LSB) of the address field and set the internal burst counter if burst is desired. PIN DESCRIPTIONS Symbol Pin Name Symbol Pin Name CLK Synchronous Clock /GW Synchronous Global Write Enable A0,A1 Synchronous Burst Address Inputs /OE Asynchronous Output Enable A Synchronous Address Inputs DQx Synchronous Data Inputs/Outputs /ADV Synchronous Burst Address Advance DQPx Synchronous Parity Data I/O /ADSP Synchronous Address Status Processor ZZ Asynchronous Power Sleep Mode /ADSC Synchronous Address Status Controller NC No Connect MODE Burst Sequence Selection VDD Power Supply /CE,CE2,/CE2 Synchronous Chip Enable VDDQ I/O Power Supply /BWE Synchronous Byte Write Enable VSS Ground /BWx (x=a-b) Synchronous Byte Write Inputs Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 11 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC TRUTH TABLE SYNCHRONOUS TRUTH TABLE OPERATION ADDRESS /CE /CE2 CE2 ZZ ADSP ADSC ADV WRITE /OE CLK DQ Deselect Cycle, Power-Down None H X X L X L X X X L-H High-Z Deselect Cycle, Power-Down None L X L L L X X X X L-H High-Z Deselect Cycle, Power-Down None L H X L L X X X X L-H High-Z Deselect Cycle, Power-Down None L X L L H L X X X L-H High-Z Deselect Cycle, Power-Down None L H X L H L X X X L-H High-Z Snooze Mode, Power-Down None X X X H X X X X X X High-Z Read Cycle, Begin Burst External L L H L L X X X L L-H Q Read Cycle, Begin Burst External L L H L L X X X H L-H High-Z Write Cycle, Begin Burst External L L H L H L X L X L-H D Read Cycle, Begin Burst External L L H L H L X H L L-H Q Read Cycle, Begin Burst External L L H L H L X H H L-H High-Z Read Cycle, Continue Burst Next X X X L H H L H L L-H Q Read Cycle, Continue Burst Next X X X L H H L H H L-H High-Z Read Cycle, Continue Burst Next H X X L X H L H L L-H Q Read Cycle, Continue Burst Next H X X L X H L H H L-H High-Z Write Cycle, Continue Burst Next X X X L H H L L X L-H D Write Cycle, Continue Burst Next H X X L X H L L X L-H D Read Cycle, Suspend Burst Current X X X L H H H H L L-H Q Read Cycle, Suspend Burst Current X X X L H H H H H L-H High-Z Read Cycle, Suspend Burst Current H X X L X H H H L L-H Q Read Cycle, Suspend Burst Current H X X L X H H H H L-H High-Z Write Cycle, Suspend Burst Current X X X L H H H L X L-H D Write Cycle, Suspend Burst Current H X X L X H H L X L-H D NOTE: 1. X means “Don’t Care.” H means logic HIGH. L means logic LOW. 2. For WRITE, L means one or more byte write enable signals (/BWa-d) and /BWE are LOW or /GW is LOW. /WRITE = H for all /BWx, /BWE, /GW HIGH. 3. /BWa enables WRITEs to DQa’s and DQPa. /BWb enables WRITEs to DQb’s and DQPb. /BWc enables WRITEs to DQc’s and DQPc. /BWd enables WRITEs to DQd’s and DQPd. DQPa and DQPb are available on the x18 version. DQPa-DQPd are available on the x36 version. 4. All inputs except /OE and ZZ must meet setup and hold times around the rising edge (LOW to HIGH) of CLK. 5. Wait states are inserted by suspending burst. 6. For a WRITE operation following a READ operation, /OE must be HIGH before the input data setup time and held HIGH during the input data hold time. 7. This device contains circuitry that will ensure the outputs will be in High-Z during power-up. 8. /ADSP LOW always initiates an internal READ at the L-H edge of CLK. A WRITE is performed by setting one or more byte write enable signals and /BWE LOW or /GW LOW for the subsequent L-H edge of CLK. See WRITE timing diagram for clarification. Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 12 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC PARTIAL TRUTH TABLE Operation /GW /BWE /BWa /BWb /BWc /BWd READ READ H H H L X H X H X H X H WRITE BYTE a WRITE BYTE b H H L L L H H L H H H H WRITE BYTE c WRITE BYTE d H H L L H H H H L H H L WRITE ALL BYTEs WRITE ALL BYTEs H L L X L X L X L X L X Notes: X means "Don't Care". 1. 2. All inputs in this table must beet setup and hold time around the rising edge of CLK. ADDRESS SEQUENCE IN BURST MODE INTERLEAVED BURST ADDRESS TABLE (MODE = Vdd or NC) External Address A1 A0 00 01 10 11 1st Burst Address A1 A0 01 00 11 10 2nd Burst Address A1 A0 10 11 00 01 3rd Burst Address A1 A0 11 10 01 00 LINEAR BURST ADDRESS TABLE (MODE = Vss ) 0,0 A1', A0' = 1,1 0,1 1,0 Power Up Sequence Vddq ’ Vdd1 ’ I/O Pins2 Notes: 1. Vdd can be applied at the same time as Vddq 2. Applying I/O inputs is recommended after Vddq is stable. The inputs of the I/O pins can be applied at the same time as Vddq as long as Vih (level of I/O pins) is lower than Vddq. Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 13 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC ERROR DETECTION AND CORRECTION • • • • Independent ECC with Hamming code for each byte. Detect and correct one bit error per byte. Better reliability than parity code schemes that could detect error bit but NOT correct it. Backward compatible : Drop in replacement to current in industry standard devices without ECC. ABSOLUTE MAXIMUM RATINGS AND OPERATING RANGE ABSOLUTE MAXIMUM RATINGS Symbol Tstg Pd Iout Vin, Vout Vin Parameter Storage Temperature Power Dissipation Output Current (per I/O) Voltage Relative to Vss for I/O Pins Voltage Relative to Vss for Address and Control Inputs LF Value –65 to +150 1.6 100 –0.5 to Vddq+0.3 –0.3 to Vdd+0.5 VF Value –65 to +150 1.6 100 –0.5 to Vddq + 0.3 –0.3 to Vdd + 0.3 Unit °C W mA V V Notes: 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields; however, precautions may be taken to avoid application of any voltage higher than maximum rated voltages to this high-impedance circuit. 3. This device contains circuitry that will ensure the output devices are in High-Z at power up. OPERATING RANGE Option IS61LFXXXXX IS61VFXXXXX IS64LFXXXXX IS64VFXXXXX Range Commercial Industrial Commercial Industrial Automotive Automotive VDD 3.3V ± 5% 3.3V ± 5% 2.5V ± 5% 2.5V ± 5% 3.3V ± 5% 2.5V ± 5% Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 VDDQ 3.3V / 2.5V ± 5% 3.3V / 2.5V ± 5% 2.5V ± 5% 2.5V ± 5% 3.3V / 2.5V ± 5% 2.5V ± 5% Ambient Temperature 0°C to +70°C -40°C to +85°C 0°C to +70°C -40°C to +85°C -40°C to +125°C -40°C to +125°C 14 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC CHARACTERISTICS DC ELECTRICAL CHARACTERISTICS (Over operating temperature range) Symbol Parameter Test Conditions Voh Output HIGH Voltage Vol Output LOW Voltage Vih Vil Ili Ilo Input HIGH Voltage Input LOW Voltage Input Leakage Current Output Leakage Current Ioh=-4.0 mA(3.3V) Ioh=–1.0 mA(2.5V) Iol=8.0 mA(3.3V) Iol=1.0 mA(2.5V) VssdVindVdd VssdVoutdVddq,/OE=Vih 3.3V 2.5V Unit Min. 2.4 Max. — Min. 2.0 Max. — V — 0.4 — 0.4 V 2.0 –0.3 –5 –5 Vdd+0.3 0.8 5 5 1.7 –0.3 –5 –5 Vdd+0.3 0.7 5 5 V V µA µA Notes: 1. All voltages referenced to ground. 2. Overshoot: 3.3V and 2.5V: Vih (AC) d Vdd + 1.5V (Pulse width less than tkc /2) 1.8V: Vih (AC) d Vdd + 0.5V (Pulse width less than tkc /2) 3. Undershoot: 3.3V and 2.5V: Vil (AC) e -1.5V (Pulse width less than tkc /2) 1.8V: Vil (AC) e -0.5V (Pulse width less than tkc /2) POWER SUPPLY CHARACTERISTICS (Over Operating Range) Symbol Parameter Test Conditions Icc AC Operating, Supply Current Device Selected, OE = Vih, ZZ d Vil,All Inputs d 0.2V or e Vdd – 0.2V,Cycle Time e tkc min. Isb Standby Current TTL Input Device Deselected,Vdd = Max.,All Inputs d Vil or e Vih,ZZ d Vil, f = Max. Standby Current CMOS Input Device Deselected,Vdd = Max.,Vin d Vss + 0.2V or eVdd – 0.2V,f = 0 Isb1 Temp. range -6.5 -7.5 Com. Ind. Auto Com. x18 175 180 190 100 MAX x36/32 175 180 190 100 x18 155 160 175 100 MAX x36/32 155 160 175 100 Ind. Auto Com. Ind. Auto 110 130 80 85 100 110 130 80 85 100 110 130 80 85 100 110 130 80 85 100 Unit mA mA mA Note: 1. MODE pin has an internal pullup and should be tied to Vdd or Vss . It exhibits ±100¼A maximum leakage current when tied to dVss+0.2V or eVdd–0.2V. CAPACITANCE Symbol Cin Cout Parameter Input Capacitance Input/Output Capacitance Conditions Vin = 0V Vout = 0V Max. 6 8 Unit pF pF Notes: 1. Tested initially and after any design or process changes that may affect these parameters. 2. Test conditions: Ta = 25°C, f = 1 MHz, Vdd = 3.3V. Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 15 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC READ/WRITE CYCLE SWITCHING CHARACTERISTICS (Over Operating Range) Symbol Parameter fmax tkc tkh tkl tkq tkqx(2) tkqlz(2,3) tkqhz(2,3) toeq toelz(2,3) toehz(2,3) tas tws tces tse tadvs tds tah the twh tceh tadvh tdh tpower(4) Clock Frequency Cycle Time Clock High Time Clock Low Time Clock Access Time Clock High to Output Invalid Clock High to Output Low-Z Clock High to Output High-Z Output Enable to Output Valid Output Enable to Output Low-Z Output Disable to Output High-Z Address Setup Time Read/Write Setup Time Chip Enable Setup Time Clock Enable Setup Time Address Advance Setup Time Data Setup Time Address Hold Time Clock Enable Hold Time Write Hold Time Chip Enable Hold Time Address Advance Hold Time Data Hold Time Vdd (typical) to First Access -6.5 Min. — 7.5 2.2 2.2 — 2.5 2.5 — — 0 — 1.5 1.5 1.5 1.5 1.5 1.5 0.5 0.5 0.5 0.5 0.5 0.5 1 -7.5 Max. 133 — — — 6.5 — — 3.8 3.2 — 3.5 — — — — — — — — — — — — — Min. — 8.5 2.5 2.5 — 2.5 2.5 — — 0 — 1.5 1.5 1.5 1.5 1.5 1.5 0.5 0.5 0.5 0.5 0.5 0.5 1 Unit Max. 117 — — — 7.5 — — 4.0 3.4 — 3.5 — — — — — — — — — — — — — MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ms Notes: 1. Configuration signal MODE is static and must not change during normal operation. 2. Guaranteed but not 100% tested. This parameter is periodically sampled. 3. Tested with load in Figure 2. 4. tpower is the time that the power needs to be supplied above Vdd (min) initially before READ or WRITE operation can be initiated. Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 16 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC 3.3V I/O AC TEST CONDITIONS Parameter Input Pulse Level Input Rise and Fall Times Input and Output Timing and Reference Level VTT VLOAD R1, R2 Output Load Unit 0V to 3.0V 1.5 ns 1.5V 1.5V 3.3V 317©, 351© See Figures 1 and 2 2.5V I/O AC TEST CONDITIONS Parameter Input Pulse Level Input Rise and Fall Times Input and Output Timing and Reference Level VTT VLOAD R1, R2 Output Load Unit 0V to 2.5V 1.5 ns 1.25V 1.25V 2.5V 1667©, 1538© See Figures 1 and 2 I/O OUTPUT LOAD EQUIVALENT R1 VLOAD OUTPUT ZO=50& OUTPUT 50& R2 5 pF Including jig and scope VTT Figure1 Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 Figure2 17 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC READ/WRITE CYCLE TIMING tKC CLK /ADSP tSS tSH tKH /ADSP is blocked by /CE inactive tKL tSS /ADSC tSH /ADV Address tAS tAH RD1 /GW /BWE WR1 tWS tWH tWS tWH RD2 RD3 tWH tWS WR1 /BWd-/BWa tCES tCEH tCES tCEH tCES tCEH /CE /CE Masks /ADSP CE2 and /CE2 only sampled with /ADSP or /ADSC CE2 Unselected with /CE2 /CE2 tOELZ tOEQ /OE tOEHZ tKQX DATAOUT High-Z tKQLZ High-Z tKQLZ tKQ 1a tKQ DATAIN 2a 2b tKQX 2c 2d tKQHZ 1a High-Z Single Read Flow-through tDH tDS Single Write Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 Burst Read Unselected 18 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC WRITE CYCLE TIMING tKC CLK tSS tKH tSH /ADSP is blocked by /CE inactive tKL /ADSP /ADSC initiates Write /ADSC /ADV must be inactive for /ADSP Write tAVS tAVH /ADV tAS Address tAH WR1 WR2 tWS tWH tWS tWH tWS tWH WR3 /GW /BWE /BWx tWS WR1 tCES tCEH tCES tCEH tCES tCEH tWH WR2 WR3 /CE Masks /ADSP /CE Unselected with CE2 CE2 and /CE2 only sampled with /ADSP or/ ADSC CE2 /CE2 /OE DATAOUT High-Z tDS DATAIN High-Z tDH 1a Single Write Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 /BW1-/BW4 only are applied to first cycle of WR2 2a 2b Burst Write 2c 2d 3a Write Unselected 19 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC SNOOZE MODE ELECTRICAL CHARACTERISTICS Symbol Parameter Isb2 Current during SNOOZE MODE tpds tpus tzzi trzzi Conditions ZZ e Vih ZZ active to input ignored ZZ inactive to input sampled ZZ active to SNOOZE current ZZ inactive to exit SNOOZE current Temperature Range Com. Ind. Auto. — — — — Min. — — — — 2 — 0 Max. 35 40 60 2 — 2 — Unit mA cycle cycle cycle ns SLEEP MODE TIMING CLK tPDS ZZ setup cycle tPUS ZZ recovery cycle ZZ tZZI Isupply ISB2 tRZZI All Inputs (except ZZ) Deselect or Read Only Deselect or Read Only Normal operation cycle Outputs (Q) High-Z Don't Care Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 20 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC IEEE 1149.1 TAP and Boundary Scan The SRAM provides a limited set of JTAG functions to test the interconnection between SRAM I/Os and printed circuit board traces or other components. There is no multiplexer in the path from I/O pins to the RAM core. In conformance with IEEE Standard 1149.1, the SRAM contains a TAP controller, instruction register, boundary scan register, bypass register, and ID register. The TAP controller has a standard 16-state machine that resets internally on power-up. Therefore, a TRST signal is not required Disabling the JTAG feature The SRAM can operate without using the JTAG feature. To disable the TAP controller, TCK must be tied LOW (VSS) to prevent clocking of the device. TDI and TMS are internally pulled up and may be left disconnected. They may alternately be connected to VDD through a pull-up resistor. TDO should be left disconnected. On power-up, the device will come up in a reset state, which will not interfere with device operation. Test Access Port Signal List: 1. Test Clock (TCK) This signal uses VDD as a power supply. The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK. 2. Test Mode Select (TMS) This signal uses VDD as a power supply. The TMS input is used to send commands to the TAP controller and is sampled on the rising edge of TCK. 3. Test Data-In (TDI) This signal uses VDD as a power supply. The TDI input is used to serially input test instructions and information into the registers and can be connected to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. TDI is connected to the most significant bit (MSB) of any register. For more information regarding instruction register loading, please see the TAP Controller State Diagram. 4. Test Data-Out (TDO) This signal uses VDDQ as a power supply. The TDO output ball is used to serially clock test instructions and data out from the registers. The TDO output driver is only active during the Shift-IR and Shift-DR TAP controller states. In all other states, the TDO pin is in a High-Z state. The output changes on the falling edge of TCK. TDO is connected to the least significant bit (LSB) of any register. For more information, please see the TAP Controller State Diagram. Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 21 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC TAP Controller State and Block Diagram ... Boundary Scan Register (75 bits) TDI Bypass Register (1 bit) TDO Identification Register (32 bits) Instruction Register (3 bits) Control Signals TMS TAP Controller TCK TAP Controller State Machine 1 Test Logic Reset 0 Run Test Idle 1 Select DR 1 Select IR 0 1 0 0 1 1 Capture DR 0 Capture IR 0 0 Shift DR 1 1 1 1 Exit1 DR Exit1 IR 0 0 0 Pause DR 1 Exit2 DR 0 Exit2 IR 1 0 1 Update DR Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 0 Pause IR 1 1 0 Shift IR Update IR 0 1 0 22 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC Performing a TAP Reset A Reset is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. RESET may be performed while the SRAM is operating and does not affect its operation. At power-up, the TAP is internally reset to ensure that TDO comes up in a high-Z state. TAP Registers Registers are connected between the TDI and TDO pins and allow data to be scanned into and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction registers. Data is serially loaded into the TDI pin on the rising edge of TCK and output on the TDO pin on the falling edge of TCK. 1. Instruction Register This register is loaded during the update-IR state of the TAP controller. At power-up, the instruction register is loaded with the IDCODE instruction. It is also loaded with the IDCODE instruction if the controller is placed in a reset state as described in the previous section. When the TAP controller is in the capture-IR state, the two LSBs are loaded with a binary “01” pattern to allow for fault isolation of the board-level serial test data path. 2. Bypass Register The bypass register is a single-bit register that can be placed between the TDI and TDO balls. This allows data to be shifted through the SRAM with minimal delay. The bypass register is set LOW (VSS) when the BYPASS instruction is executed. 3. Boundary Scan Register The boundary scan register is connected to all the input and bidirectional balls on the SRAM. Several balls are also included in the scan register to reserved balls. The boundary scan register is loaded with the contents of the SRAM Input and Output ring when the TAP controller is in the capture-DR state and is then placed between the TDI and TDO balls when the controller is moved to the shift-DR state. Each bit corresponds to one of the balls on the SRAM package. The MSB of the register is connected to TDI, and the LSB is connected to TDO. 4. Identification (ID) Register The ID register is loaded with a vendor-specific, 32-bit code during the capture-DR state when the IDCODE command is loaded in the instruction register. The IDCODE is hardwired into the SRAM and can be shifted out when the TAP controller is in the shift-DR state. Scan Register Sizes Register Name Instruction Bypass ID Boundary Scan Bit Size 3 1 32 75 TAP Instruction Set Many instructions are possible with an eight-bit instruction register and all valid combinations are listed in the TAP Instruction Code Table. All other instruction codes that are not listed on this table are reserved and should not be used. Instructions are loaded into the TAP controller during the Shift-IR state when the instruction register is placed between TDI and TDO. During this state, instructions are shifted from the instruction register through the Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 23 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC TDI and TDO pins. To execute an instruction once it is shifted in, the TAP controller must be moved into the Update-IR state. 1. EXTEST The EXTEST instruction allows circuitry external to the component package to be tested. Boundary-scan register cells at output balls are used to apply a test vector, while those at input balls capture test results. Typically, the first test vector to be applied using the EXTEST instruction will be shifted into the boundary scan register using the PRELOAD instruction. Thus, during the update-IR state of EXTEST, the output driver is turned on, and the PRELOAD data is driven onto the output balls. 2. IDCODE The IDCODE instruction causes a vendor-specific, 32-bit code to be loaded into the instruction register. It also places the instruction register between the TDI and TDO balls and allows the IDCODE to be shifted out of the device when the TAP controller enters the shift-DR state. The IDCODE instruction is loaded into the instruction register upon power-up or whenever the TAP controller is given a test logic reset state. 3. SAMPLE Z If the SAMPLE-Z instruction is loaded in the instruction register, all SRAM outputs are forced to an inactive drive state (high-Z), moving the TAP controller into the capture-DR state loads the data in the SRAMs input into the boundary scan register, and the boundary scan register is connected between TDI and TDO when the TAP controller is moved to the shift-DR state. 4. SAMPLE/PRELOAD When the SAMPLE/PRELOAD instruction is loaded into the instruction register and the TAP controller is in the capture-DR state, a snapshot of data on the inputs and bidirectional balls is captured in the boundary scan register. The user must be aware that the TAP controller clock can only operate at a frequency up to 50 MHz, while the SRAM clock operates significantly faster. Because there is a large difference between the clock frequencies, it is possible that during the capture-DR state, an input or output will undergo a transition. The TAP may then try to capture a signal while in transition. This will not harm the device, but there is no guarantee as to the value that will be captured. Repeatable results may not be possible. To ensure that the boundary scan register will capture the correct value of a signal, the SRAM signal must be stabilized long enough to meet the TAP controller’s capture setup plus hold time. The SRAM clock input might not be captured correctly if there is no way in a design to stop (or slow) the clock during a SAMPLE/ PRELOAD instruction. If this is an issue, it is still possible to capture all other signals and simply ignore the value of the CK and CK# captured in the boundary scan register. Once the data is captured, it is possible to shift out the data by putting the TAP into the shift-DR state. This places the boundary scan register between the TDI and TDO balls. 6. BYPASS When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a shift-DR state, the bypass register is placed between TDI and TDO. The advantage of the BYPASS instruction is that it shortens the boundary scan path when multiple devices are connected together on a board. 7. PRIVATE Do not use these instructions. They are reserved for future use and engineering mode. Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 24 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC JTAG TAP DC ELECTRICAL CHARACTERISTICS (VDDQ=3.3V Operating Range) Parameter Symbol Min Max Units JTAG Input High Voltage VIH1 2.0 VDD+0.3 V JTAG Input Low Voltage VIL1 –0.3 0.8 V JTAG Output High Voltage VOH1 2.4 V JTAG Output Low Voltage VOL1 0.4 V JTAG Output High Voltage VOH2 2.9 V JTAG Output Low Voltage VOL2 0.2 V JTAG Input Load Current -10 +10 uA IX Notes |IOH1|=2mA IOL1=2mA |IOH2|=100uA IOL2=100uA 0 d Vin d VDD Notes: 1. All voltages referenced to VSS (GND); All JTAG inputs and outputs are LVTTL-compatible. JTAG TAP DC ELECTRICAL CHARACTERISTICS (VDDQ=2.5V Operating Range) Parameter Symbol Min Max Units JTAG Input High Voltage VIH1 1.7 VDD+0.3 V JTAG Input Low Voltage VIL1 –0.3 0.7 V JTAG Output High Voltage VOH1 2.0 V JTAG Output Low Voltage VOL1 0.4 V JTAG Output High Voltage VOH2 2.1 V JTAG Output Low Voltage VOL2 0.2 V JTAG Input Load Current -10 +10 uA IX Notes |IOH1|=2mA IOL1=2mA |IOH2|=100uA IOL2=100uA 0 d Vin d VDD Notes: 2. All voltages referenced to VSS (GND); All JTAG inputs and outputs are LVTTL-compatible. JTAG AC Test Conditions (Over the Operating Temperature Range) Parameter Input Pulse High Level Input Pulse Low Level Input rise and fall time Test load termination supply voltage Input and Output Timing Reference Level Symbol VIH1 VIL1 TR1 VREF VREF 2.5V Option 2.5 0 1.5 1.25 1.25 3.3V Option 3.0 0 1.5 1.5 1.5 Units V V ns V V TAP Output Load Equivalent VREF 50• 50• Output 20pF Test Comparator VREF Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 25 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC JTAG AC Characteristics (Over the Operating Temperature Range) Parameter TCK cycle time TCK high pulse width TCK low pulse width TMS Setup TMS Hold TDI Setup TDI Hold TCK Low to Valid Data* Symbol tTHTH tTHTL tTLTH tMVTH tTHMX tDVTH tTHDX tTLOV Min 100 40 40 10 10 10 10 – Max – – – – – – – 20 Units ns ns ns ns ns ns ns ns JTAG Timing Diagram tTHTL tTHTH tTLTH TCK tMVTH tTHMX tDVTH tTHDX TMS TDI tTLOV TDO Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 26 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC Instruction Set Code Instruction TDO Output Notes 000 EXTEST Boundary Scan Register 2, 6 001 010 IDCODE SAMPLE-Z 32-bit Identification Register Boundary Scan Register 1, 2 011 PRIVATE Do Not Use 5 100 SAMPLE(/PRELOAD) Boundary Scan Register 4 101 PRIVATE Do Not Use 5 110 PRIVATE Do Not Use 5 111 BYPASS Bypass Register 3 Notes: 1. Places Qs in high-Z in order to sample all input data, regardless of other SRAM inputs. 2. TDI is sampled as an input to the first ID register to allow for the serial shift of the external TDI data. 3. BYPASS register is initiated to VSS when BYPASS instruction is invoked. The BYPASS register also holds the last serially loaded TDI when exiting the shift-DR state. 4. SAMPLE instruction does not place Qs in high-Z. 5. This instruction is reserved. Invoking this instruction will cause improper SRAM functionality. 6. This EXTEST is not IEEE 1149.1-compliant. By default, it places Q in high-Z. If the internal register on the scan chain is set high, Q will be updated with information loaded via a previous SAMPLE instruction. The actual transfer occurs during the update IR state after EXTEST is loaded. The value of the internal register can be changed during SAMPLE and EXTEST only. ID Register Definition Instruction Field Revision Number (31:28) Device Depth (27:23) Device Width (22:18) ISSI Device ID (17:12) ISSI JEDEC ID (11:1) ID Register Presence (0) Description Reserved for version number. Defines depth of SRAM. 128K or 256K Defines Width of the SRAM. x36/32 or x18 Reserved for future use. Allows unique identification of SRAM vendor. Indicate the presence of an ID register. Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 128K x 36/32 xxxx 00110 00100 xxxxx 00011010101 1 256K x 18 xxxx 00111 00011 xxxxx 00011010101 1 27 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC Boundary Scan Order Bit # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Continue next page 165 BGA X36/32 Signal Bump ID MODE 1R NC 6N NC 11P A 8P A 8R A 9R A 9P A 10P A 10R A 11R ZZ 11H DQPa 11N DQa 11M DQa 11L DQa 11K DQa 11J DQa 10M DQa 10L DQa 10K DQa 10J DQb 11G DQb 11F DQb 11E DQb 11D DQb 10G DQb 10F DQb 10E DQb 10D DQPb 11C NC 11A A 10A A 10B /ADV 9A /ADSP 9B /ADSC 8A /OE 8B /BWE 7A /GW 7B CLK 6B NC 11B Signal MODE NC NC A A A A A A A ZZ NC NC NC NC NC DQa DQa DQa DQa DQa DQa DQa DQa DQPa NC NC NC NC A A A /ADV /ADSP /ADSC /OE /BWE /GW CLK NC 165 BGA Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 X18 Bump ID 1R 6N 11P 8P 8R 9R 9P 10P 10R 11R 11H 11N 11M 11L 11K 11J 10M 10L 10K 10J 11G 11F 11E 11D 11C 10F 10E 10D 10G 11A 10A 10B 9A 9B 8A 8B 7A 7B 6B 11B Bit # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 119 BGA X36/32 Signal Bump ID MODE 3R NC 4L NC 7R A 4T A 3T A 5B A 5C A 5A A 5T A 6R ZZ 7T DQPa 6P DQa 7N DQa 6M DQPa 7P DQa 6N DQa 7L DQa 6K DQa 6L DQa 7K DQb 6H DQb 7G DQb 7H DQb 6F DQb 7E DQb 6G DQb 6E DQb 7D DQPb 6D NC 6T A 6A A 6C /ADV 4G /ADSP 4A /ADSC 4B /OE 4F /BWE 4M /GW 4H CLK 4K NC 7C X18 Signal Bump ID MODE 3R NC 4L NC 7R A 2T A 3T A 5B A 5C A 5A A 5T A 6R ZZ 7T NC 6P NC 7N NC 6M NC 7L NC 6K DQa 7P DQa 6N DQa 6L DQa 7K DQa 6H DQa 7G DQa 6F DQa 7E DQPa 6D NC 6G NC 6E NC 7D NC 7H A 6T A 6A A 6C /ADV 4G /ADSP 4A /ADSC 4B /OE 4F /BWE 4M /GW 4H CLK 4K NC 7C 119 BGA 28 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC Bit # 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 X36/32 Signal Bump ID NC 1A /CE2 6A /BWa 5B /BWb 5A /BWc 4A /BWd 4B CE2 3B /CE 3A A 2A A 2B NC 1B DQPc 1C DQc 1D DQc 1E DQc 1F DQc 1G DQc 2D DQc 2E DQc 2F DQc 2G DQd 1J DQd 1K DQd 1L DQd 1M DQd 2J DQd 2K DQd 2L DQd 2M DQPd 1N A 3P A 3R A 4R A 4P A1 6P A0 6R Signal NC /CE2 /BWa NC /BWb NC CE2 /CE A A NC NC NC NC NC NC DQb DQb DQb DQb DQb DQb DQb DQb DQPb NC NC NC NC A A A A A1 A0 X18 Bump ID 1A 6A 5B 5A 4A 4B 3B 3A 2A 2B 1B 1C 1D 1E 1F 1G 2D 2E 2F 2G 1J 1K 1L 1M 1N 2K 2L 2M 2J 3P 3R 4R 4P 6P 6R X36/32 Bit # 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 Signal NC /CE2 /BWa /BWb /BWc /BWd CE2 /CE A A NC DQPc DQc DQc DQc DQc DQc DQc DQc DQc DQd DQd DQd DQd DQd DQd DQd DQd DQPd A A A A A1 A0 Bump ID 1B 6B 5L 5G 3G 3L 2B 4E 3A 2A 1C 2D 1E 2F 1D 2E 1G 2H 2G 1H 2K 1L 1K 2M 1N 2L 2N 1P 2P 2R 2C 3B 3C 4N 4P Signal NC /CE2 /BWa NC /BWb NC CE2 /CE A A NC NC NC NC NC NC DQb DQb DQb DQb DQb DQb DQb DQb DQPb NC NC NC NC A A A A A1 A0 X18 Bump ID 1B 6B 5L 5G 3G 3L 2B 4E 3A 2A 1C 2D 1E 2F 1G 2H 1D 2E 2G 1H 2K 1L 2M 1N 2P 2L 2N 1P 1K 2R 2C 3B 3C 4N 4P Note : DQPa, DQPb, DQPc, and DQPd pins of x36 IO option are NC of x32 IO option. Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 29 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC ORDERING INFORMATION The ordering code information of the product family Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 30 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC Commercial Range: 0°C to 70°C VDD VDD =3.3V VDDQ=2.5V or VDDQ=3.3V SPEED 6.5ns 7.5ns VDD =2.5V VDDQ=2.5V 6.5ns 7.5ns X36 X32 X18 Package IS61LF12836EC-6.5TQ IS61LF12836EC-6.5B3 IS61LF12832EC-6.5TQ IS61LF12832EC-6.5B3 IS61LF25618EC-6.5TQ IS61LF25618EC-6.5B3 100 QFP 165 BGA IS61LF12836EC-6.5B2 IS61LF12836EC-6.5TQL IS61LF12832EC-6.5B2 IS61LF12832EC-6.5TQL IS61LF25618EC-6.5B2 IS61LF25618EC-6.5TQL 119 BGA 100 QFP, Lead-free IS61LF12836EC-6.5B3L IS61LF12836EC-6.5B2L IS61LF12832EC-6.5B3L IS61LF12832EC-6.5B2L IS61LF25618EC-6.5B3L IS61LF25618EC-6.5B2L 165 BGA, Lead-free 119 BGA, Lead-free IS61LF12836EC-7.5TQ IS61LF12836EC-7.5B3 IS61LF12832EC-7.5TQ IS61LF12832EC-7.5B3 IS61LF25618EC-7.5TQ IS61LF25618EC-7.5B3 100 QFP 165 BGA IS61LF12836EC-7.5B2 IS61LF12836EC-7.5TQL IS61LF12832EC-7.5B2 IS61LF12832EC-7.5TQL IS61LF25618EC-7.5B2 IS61LF25618EC-7.5TQL 119 BGA 100 QFP, Lead-free IS61LF12836EC-7.5B3L IS61LF12836EC-7.5B2L IS61LF12832EC-7.5B3L IS61LF12832EC-7.5B2L IS61LF25618EC-7.5B3L IS61LF25618EC-7.5B2L 165 BGA, Lead-free 119 BGA, Lead-free IS61VF12836EC-6.5TQ IS61VF12836EC-6.5B3 IS61VF12832EC-6.5TQ IS61VF12832EC-6.5B3 IS61VF25618EC-6.5TQ IS61VF25618EC-6.5B3 100 QFP 165 BGA IS61VF12836EC-6.5B2 IS61VF12836EC-6.5TQL IS61VF12832EC-6.5B2 IS61VF12832EC-6.5TQL IS61VF25618EC-6.5B2 IS61VF25618EC-6.5TQL 119 BGA 100 QFP, Lead-free IS61VF12836EC-6.5B3L IS61VF12836EC-6.5B2L IS61VF12832EC-6.5B3L IS61VF12832EC-6.5B2L IS61VF25618EC-6.5B3L IS61VF25618EC-6.5B2L 165 BGA, Lead-free 119 BGA, Lead-free IS61VF12836EC-7.5TQ IS61VF12836EC-7.5B3 IS61VF12832EC-7.5TQ IS61VF12832EC-7.5B3 IS61VF25618EC-7.5TQ IS61VF25618EC-7.5B3 100 QFP 165 BGA IS61VF12836EC-7.5B2 IS61VF12836EC-7.5TQL IS61VF12832EC-7.5B2 IS61VF12832EC-7.5TQL IS61VF25618EC-7.5B2 IS61VF25618EC-7.5TQL 119 BGA 100 QFP, Lead-free IS61VF12836EC-7.5B3L IS61VF12836EC-7.5B2L IS61VF12832EC-7.5B3L IS61VF12832EC-7.5B2L IS61VF25618EC-7.5B3L IS61VF25618EC-7.5B2L 165 BGA, Lead-free 119 BGA, Lead-free Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 31 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC Industrial Range: -40°C to 85°C VDD VDD =3.3V VDDQ=2.5V or VDDQ=3.3V SPEED 6.5ns 7.5ns VDD =2.5V VDDQ=2.5V 6.5ns 7.5ns X36 X32 X18 Package IS61LF12836EC-6.5TQI IS61LF12836EC-6.5B3I IS61LF12832EC-6.5TQI IS61LF12832EC-6.5B3I IS61LF25618EC-6.5TQI IS61LF25618EC-6.5B3I 100 QFP 165 BGA IS61LF12836EC-6.5B2I IS61LF12836EC-6.5TQLI IS61LF12832EC-6.5B2I IS61LF12832EC-6.5TQLI IS61LF25618EC-6.5B2I IS61LF25618EC-6.5TQLI 119 BGA 100 QFP, Lead-free IS61LF12836EC-6.5B3LI IS61LF12836EC-6.5B2LI IS61LF12832EC-6.5B3LI IS61LF12832EC-6.5B2LI IS61LF25618EC-6.5B3LI IS61LF25618EC-6.5B2LI 165 BGA, Lead-free 119 BGA, Lead-free IS61LF12836EC-7.5TQI IS61LF12836EC-7.5B3I IS61LF12832EC-7.5TQI IS61LF12832EC-7.5B3I IS61LF25618EC-7.5TQI IS61LF25618EC-7.5B3I 100 QFP 165 BGA IS61LF12836EC-7.5B2I IS61LF12836EC-7.5TQLI IS61LF12832EC-7.5B2I IS61LF12832EC-7.5TQLI IS61LF25618EC-7.5B2I IS61LF25618EC-7.5TQLI 119 BGA 100 QFP, Lead-free IS61LF12836EC-7.5B3LI IS61LF12836EC-7.5B2LI IS61LF12832EC-7.5B3LI IS61LF12832EC-7.5B2LI IS61LF25618EC-7.5B3LI IS61LF25618EC-7.5B2LI 165 BGA, Lead-free 119 BGA, Lead-free IS61VF12836EC-6.5TQI IS61VF12836EC-6.5B3I IS61VF12832EC-6.5TQI IS61VF12832EC-6.5B3I IS61VF25618EC-6.5TQI IS61VF25618EC-6.5B3I 100 QFP 165 BGA IS61VF12836EC-6.5B2I IS61VF12836EC-6.5TQLI IS61VF12832EC-6.5B2I IS61VF12832EC-6.5TQLI IS61VF25618EC-6.5B2I IS61VF25618EC-6.5TQLI 119 BGA 100 QFP, Lead-free IS61VF12836EC-6.5B3LI IS61VF12836EC-6.5B2LI IS61VF12832EC-6.5B3LI IS61VF12832EC-6.5B2LI IS61VF25618EC-6.5B3LI IS61VF25618EC-6.5B2LI 165 BGA, Lead-free 119 BGA, Lead-free IS61VF12836EC-7.5TQI IS61VF12836EC-7.5B3I IS61VF12832EC-7.5TQI IS61VF12832EC-7.5B3I IS61VF25618EC-7.5TQI IS61VF25618EC-7.5B3I 100 QFP 165 BGA IS61VF12836EC-7.5B2I IS61VF12836EC-7.5TQLI IS61VF12832EC-7.5B2I IS61VF12832EC-7.5TQLI IS61VF25618EC-7.5B2I IS61VF25618EC-7.5TQLI 119 BGA 100 QFP, Lead-free IS61VF12836EC-7.5B3LI IS61VF12836EC-7.5B2LI IS61VF12832EC-7.5B3LI IS61VF12832EC-7.5B2LI IS61VF25618EC-7.5B3LI IS61VF25618EC-7.5B2LI 165 BGA, Lead-free 119 BGA, Lead-free Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 32 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC Automotive(A3) Range: -40°C to 125°C VDD VDD =3.3V VDDQ=2.5V or VDDQ=3.3V SPEED 6.5ns 7.5ns VDD =2.5V VDDQ=2.5V 6.5ns 7.5ns X36 X32 X18 Package IS64LF12836EC-6.5TQA3 IS64LF12836EC-6.5B3A3 IS64LF12832EC-6.5TQA3 IS64LF12832EC-6.5B3A3 IS64LF25618EC-6.5TQA3 IS64LF25618EC-6.5B3A3 100 QFP 165 BGA IS64LF12836EC-6.5B2A3 IS64LF12836EC-6.5TQLA3 IS64LF12832EC-6.5B2A3 IS64LF12832EC-6.5TQLA3 IS64LF25618EC-6.5B2A3 IS64LF25618EC-6.5TQLA3 119 BGA 100 QFP, Lead-free IS64LF12836EC-6.5B3LA3 IS64LF12836EC-6.5B2LA3 IS64LF12832EC-6.5B3LA3 IS64LF12832EC-6.5B2LA3 IS64LF25618EC-6.5B3LA3 IS64LF25618EC-6.5B2LA3 165 BGA, Lead-free 119 BGA, Lead-free IS64LF12836EC-7.5TQA3 IS64LF12836EC-7.5B3A3 IS64LF12832EC-7.5TQA3 IS64LF12832EC-7.5B3A3 IS64LF25618EC-7.5TQA3 IS64LF25618EC-7.5B3A3 100 QFP 165 BGA IS64LF12836EC-7.5B2A3 IS64LF12836EC-7.5TQLA3 IS64LF12832EC-7.5B2A3 IS64LF12832EC-7.5TQLA3 IS64LF25618EC-7.5B2A3 IS64LF25618EC-7.5TQLA3 119 BGA 100 QFP, Lead-free IS64LF12836EC-7.5B3LA3 IS64LF12836EC-7.5B2LA3 IS64LF12832EC-7.5B3LA3 IS64LF12832EC-7.5B2LA3 IS64LF25618EC-7.5B3LA3 IS64LF25618EC-7.5B2LA3 165 BGA, Lead-free 119 BGA, Lead-free IS64VF12836EC-6.5TQA3 IS64VF12836EC-6.5B3A3 IS64VF12832EC-6.5TQA3 IS64VF12832EC-6.5B3A3 IS64VF25618EC-6.5TQA3 IS64VF25618EC-6.5B3A3 100 QFP 165 BGA IS64VF12836EC-6.5B2A3 IS64VF12836EC-6.5TQLA3 IS64VF12832EC-6.5B2A3 IS64VF12832EC-6.5TQLA3 IS64VF25618EC-6.5B2A3 IS64VF25618EC-6.5TQLA3 119 BGA 100 QFP, Lead-free IS64VF12836EC-6.5B3LA3 IS64VF12836EC-6.5B2LA3 IS64VF12832EC-6.5B3LA3 IS64VF12832EC-6.5B2LA3 IS64VF25618EC-6.5B3LA3 IS64VF25618EC-6.5B2LA3 165 BGA, Lead-free 119 BGA, Lead-free IS64VF12836EC-7.5TQA3 IS64VF12836EC-7.5B3A3 IS64VF12832EC-7.5TQA3 IS64VF12832EC-7.5B3A3 IS64VF25618EC-7.5TQA3 IS64VF25618EC-7.5B3A3 100 QFP 165 BGA IS64VF12836EC-7.5B2A3 IS64VF12836EC-7.5TQLA3 IS64VF12832EC-7.5B2A3 IS64VF12832EC-7.5TQLA3 IS64VF25618EC-7.5B2A3 IS64VF25618EC-7.5TQLA3 119 BGA 100 QFP, Lead-free IS64VF12836EC-7.5B3LA3 IS64VF12836EC-7.5B2LA3 IS64VF12832EC-7.5B3LA3 IS64VF12832EC-7.5B2LA3 IS64VF25618EC-7.5B3LA3 IS64VF25618EC-7.5B2LA3 165 BGA, Lead-free 119 BGA, Lead-free Note : Not all automotive options listed are currently available. Please contact ISSI for parts Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 33 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC PACKAGE OUTLINE DRAWING 100 QFP (14x20x1.4mm) Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 34 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC 119 BGA (14x22x2.15mm) Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 35 IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC 165 BGA (13x15x1.2mm) Integrated Silicon Solution, Inc.- www.issi.com Rev. C 2/3/2015 36