MSK/MSH Series

MSK/MSH Series
Safety Certified Multilayer
Ceramic Chip Capacitor
(X1/Y2, X2/Y3)
MERITEK
RoHS
FEATURES
 X1Y2/X2Y3 class, size 1808~2220, COG(NPO)/X7R, 250VAC
 High reliability and stability.
 Small size and high capacitance.
 Safety standard approval by UL60384-14.
 HALOGEN compliant
APPLICATION
 Modem, Facsimile, Telephone
 Other electronic equipment for lighting or surge protection and
isolation.
PART NUMBER SYSTEM
MSK
08
X
101 K
302
Series number
Code
Type
MSK
X1/Y2
MSH
X2/Y3
Dimension
Code
Size (inch)
08
1808
12
1812
21
2211
Dielectric
Code
N
NPO
X
X7R
MERITEK capacitors are designed for surge or
lightning immunity in moderm facsimile and other
equipments.The capacitors of series MSK are
class X1/Y2 compliant respectively.
The green type capacitors in MSK and MSH
series are manufactured by using environmentally
friendly materials without lead or cadmium.
The terminations are composed of plated nickel
and pure tin to feature the superior leaching
resistance during soldering
Capacitance
Capacitance express in microfarads (pF)
First two digits are significant figures
Third digit denoted number of zero
i.e. 101=100pF
C
Capacitance Tolerance
Code
Tolerance
F
±1.0%
G
±2.0%
J
±5.0%
K
±10%
US
File Number - E197475
M
±20%
Safety Class
Code
302
X2/Y3
(impulse 2.5kV)
502
X1/Y2
(impluse 5.0kV)
SPECIFICATIONS
Dielectric
Size
Rated voltage (WVDC)
Capacitance range*
Capacitance tolerance
Tan δ*(Tangent of loss angle)
Insulation resistance at 500VDC for 60
seconds
Operating temperature
Capacitance characteristic
Termination
C0G(NPO)
X7R
1808
1808, 1812, 2211
250VAC
250VAC
X1/Y2 Class 3pF ~ 270pF
X1/Y2 Class 130pF ~ 2200pF
X2/Y3 Class 3pF ~ 1000pF
X2/Y3 Class 150pF ~ 5600pF
Cap≤5pF: B (±0.1pF), C (±0.25pF)
5pF<Cap<10pF: C (±0.25pF), D (±0.5pF)
K (±10%), M (±20%)
Cap≥10pF: F (±1%), G (±2%), J (±5%),K (±10%)
Cap<30pF: D.F≤1/(400+20C)
≤2.5%
Cap≥30pF: D.F≤0.10%
≥100GΩ or R·C≥1000
≥10GΩ or R·C≥500Ω-F whichever
whichever is smaller
is smaller
-55 to +125°C
±30ppm / ºC
±15%
(Cu or Ag) / Ni / Sn (lead-free termination)
* C0G(NPO): Apply 1.0±0.2Vrms, 1.0MHz±10%, at 25°C ambient temperature
X7R: Apply 1.0±0.2Vrms, 1.0kHz±10%, at 25°C ambient temperature
Rev. 7
MSK/MSH Series
Safety Certified Multilayer
Ceramic Chip Capacitor
(X1/Y2, X2/Y3)
MERITEK
RoHS
DIMENSIONS
BH
Size inch(mm)
BW
BL
BL
BW
1808(4520)
4.6±0.3
2.0±0.2
1812(4532)
4.6±0.3
3.2±0.3
2211(5728)
5.7±0.4
2.8±0.3
BH
1.25±0.1
1.40±0.15
1.60±0.20
2.00±0.20
1.25±0.10
1.60±0.20
2.00±0.20
2.50±0.30
1.60±0.20
2.00±0.20
2.50±0.30
2.80±0.30
LW
C
D
E
F
C
E
F
G
E
F
G
H
0.26
0.26
0.30
All dimension is mm
LW
CAPACITANCE RANGE
Capacitance
Class
Rated Voltage
Dielectric
Certificated
Size
Impulse
3.0pF (3R0)
3.3pF (3R3)
4.0pF (4R0)
4.7pF (4R7)
5.0pF (5R0)
5.6pF (5R6)
6.8pF (6R8)
8.2pF (8R2)
10pF (100)
12pF (120)
15pF (150)
18pF (180)
22pF (220)
27pF (270)
33pF (330)
39pF (390)
47pF (470)
56pF (560)
68pF (680)
82pF (820)
100pF (101)
120pF (121)
130pF (131)
150pF (151)
160pF (161)
180pF (181)
220pF (221)
270pF (271)
330pF (331)
390pF (391)
470pF (471)
560pF (561)
680pF (681)
720pF (721)
820pF (821)
1,000pF (102)
1,200pF (122)
1,500pF (152)
1,800pF (182)
2,200pF (222)
2,700pF (272)
X1/Y2(MSK series)
C0G(NPO)
UL
1808
5kV
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
E
E
E
E
E
F
F
F
F
F
F
F
F
X2/Y3(MSH series)
X7R
UL
1812
UL
2211
250VAC
C0G(NPO)
UL
1808
5kV
E
E
E
E
E
E
E
E
E
F
F
F
G
E
E
E
E
E
E
E
E
F
F
F
F
F
G
G
G
G
G
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
E
E
E
E
E
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
X7R
UL
1808
2.5kV
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
F
UL
1812
E
E
E
E
E
E
E
E
E
E
F
F
G
G
Rev. 7
MSK/MSH Series
Safety Certified Multilayer
Ceramic Chip Capacitor
(X1/Y2, X2/Y3)
MERITEK
RoHS
3,300pF (332)
3,900pF (392)
2,700pF (272)
4,700pF (472)
5,600pF (562)
G
G
G
G
G
RELIABILITY
Standard
Method
1. Visual
IEC 60384-1
examination 4.1
and
Dimensions
2. Capacitance IEC 60384-1
4.2.2
No.
Item
3. D.F.
(Dissipation
Factor)
Tangent of
loos angle
4. Temperature
Coefficient
IEC 60384-1
4.2.3
IEC
60384-21/22
4.6
Test Condition
Requirements
* No remarkable defect.
* Dimensions to confirm to individual specification sheet.
Class I (C0G/NPO): 1.0±0.2Vrms,
1MHz±10% For CR ≤100pF
1KHz±10% For CR > 100pF
Class II (X7R): 1.0±0.2Vrms, 1KHz±10%
With no electrical load.
T.C.
Operating Temp
C0G(NPO) -55~125°C at 25°C
X7R
-55~125°C at 25°C
* Capacitance is within specified tolerance
* CR means rated capacitance for conform to the E6 series of preferred
values given in IEC 60063.
Class I (C0G/NPO): Cap≥30pF, D.F≤0.1%;
Cap<30pF, D.F≤1/(400+20C)
Class II (X7R): ≤2.5%
T.C.
C0G(NPO)
X7R
Capacitance C ange
Within ±30ppm/℃
Within ±15%
IEC
* To apply voltage at 500VDC for 60 sec.
Class I (NP0)
: ≥ 100GΩ or RxC ≥ 1000 Ω-F whichever is
60384-21/22 * The charge current shall not exceed 0.05A. smaller.
4.5.3
Class II (X7R)
: ≥ 10GΩ or RxC ≥ 500 Ω-F whichever is smaller.
Voltage
IEC 60384-14 * To apply voltage:
* No evidence of damage or flashover during test.
proof
4.2.1
X Capacitor: 1075VDC (4.3UR)
* The voltage shall be raised from the near zero to the test voltage a
(Dielectric
Y Capacitor: 1500VAC
rate not exceeding 150V(r.m.s.)/sec.
Strength)
* Duration: 60 sec.
* The charge current shall not exceed
0.05A.
Solderability IEC
* Solder temperature: 245±5°C
75% min. coverage of all metalized area.
60384-21/22 * Dipping time: 2±0.2 sec.
4.10
Resistance IEC 60384-14 * Solder temperature: 260±5°C
* No visible damage.
to Soldering 4.4
* Dipping time: 10±1 sec
* Cap change:
Heat
IEC
* Preheating: 120 to 150°C for 1 minute
NP0:
within ±2.5% or ±0.25pF whichever is larger.
60384-21/22
before immerse the capacitor in a eutectic
I.R: More than 1GΩ
4.9
solder.
* Before initial measurement (Class II only): X7R:
within ±10%
Perform 150+0/-10°C for 1 hr and then set
I.R: More than 1GΩ
for 48±4 hrs at room temp.
* Measurement to be made after keeping at
room temp. for 24±2 hrs (Class I) and 48±
4 hrs (Class II)
Humidity
IEC 60384-14 * Test temp.: 40±2°C
* No remarkable damage.
(Damp Heat) 4.12
* Humidity: 90~95% RH
* Cap change:
Steady State
* Test time: 500+24/-0hrs.
NP0 within ±5% or ±0.5pF whichever is larger
* Applied Voltage:250VAC
X7R within ±15%
* Measurement to be made after keeping at * D.F Value:
room temp. for 24±2 hrs (Class I) and 48± NP0 ≤ 0.25%
4 hrs (Class II)
X7R: ≤5.0%
* I.R. ≥1GΩ
* Dielectric strength satisfies the specified initial value
5. Insulation
Resistance
6.
7.
8.
9.
Rev. 7
MSK/MSH Series
Safety Certified Multilayer
Ceramic Chip Capacitor
(X1/Y2, X2/Y3)
MERITEK
RoHS
No.
Item
10. Endurance
Standard
Method
IEC
60384-14
4.14
Test Condition
Requirements
* Impulse Voltage:
Each individual capacitor shall be subjected to a Vp
= 5.0kV (X1Y2 Class Impulse 5kV) & Vp = 6.0kV
(X1Y2 Class Impulse 6kV) impulse for three times
before applied to endurance test.
Additional pulse test 10/700µs before endurance test
for Y3 class (IEC60950)
*Test Temp.: 125±3°C
* Test time:: 1000+48/-0 hrs.
* Applied Voltage:
X capacitor: 1.25UR (312.5VAC)
Y capacitor: 1.70UR (425VAC)
Once every hour the voltage shall be increased to
1000Vrms for 0.1 sec.
* Measurement to be made after keeping at room
temp. for 24±2 hrs (Class I) and 48±4 hrs (Class II)
11. Resistance IEC
* Capacitors mounted on a substrate. The board shall
to Flexure of 60384-21/22 be bent 1mm with a rate of 1mm/sec.
Substrate
4.8
20
R = 230
* Appearance :
No mechanical damage.
* Cap change:
NP0 within ±5% or ±0.5pF whichever is larger
X7R within ±20%
* D.F Value:
NP0 ≤ 0.25%
X7R: ≤5.0%
* I.R. ≥1GΩ
* Dielectric strength satisfies the specified initial value
* No remarkable damage.
* Cap change is less than 10%.
(This capacitance change means the change of capacitance
under specified flexure of substrate from the capacitance
measured before the test.)
50
1mm
45±1
12. Robustness
of
terminations
(Adhesive
Strength of
Termination)
45±1
IEC
* Capacitors mounted on a substrate. A force of 5N * No remarkable damage or removal of the terminations.
60384-21/22 applied perpendicular to the place of substrate and
4.15
parallel the line joining the center of terminations for
IEC 60384-1 10±1 sec.
4.13
5N
PC Board
Capacitor
13. Passive
IEC
* Volume sample: 21.56 mm3
Flammability 60384-14
* Flame exposure time: 5 sec Max.
4.17
* Category of flammability : C.
IEC 60384-1
4.38
* Capacitor didn’t burn at all
14. Active
IEC
* The capacitors applied UR (250VAC). Then each
* The cheese cloth shall not burn with a flame.
Flammability 60384-21/22 sample shall be subjected to 20 discharges from a
4.18
tank capacitor, charge to a voltage that, when
discharged, plase Ui 2500V for X2Y3, Ui 5000V for
X1Y2 across the capacitor under test. The interval
between successive discharges shall be 5 sec.
15. Impulse
IEC
* X1 : 4.0kV, X2 : 2.5kV.
*There shall be no permanent breakdown or flashover.
Voltage
60384-14
* Y2 : 5.0kV, Y3 : None.
4.13
* Number of impulse : 24 max.
Rev. 7
MSK/MSH Series
Safety Certified Multilayer
Ceramic Chip Capacitor
(X1/Y2, X2/Y3)
MERITEK
RoHS
REFLOW PROFILES
Chip Size
1808, 1812,
2211, 2220
Soldering
Reflow
ΔT
50ºC
Solder
Temp.(Tc)
235 – 260ºC
Soldering
Time (tp)
< 15 sec.
Note : For example , Tc is 260ºC and time tp is
15sec.
for user : The peak temperature must not exceed
260ºC. The time above 255ºC must not exceed 15
seconds.
ΔT
Cooling
After soldering, cool the chips and the substrate gradually to room temperature. Natural cooling in air is recommended to minimize
stress in the solder joint. A cooling rate not exceeding 4ºC per second should be used when forced cooling is necessary.
Cleaning
All flux residues must be removed by using suitable electronic-grade vapor-cleaning solvents to eliminate contamination that could
cause electrolytic surface corrosion. Good results can be obtained by using ultrasonic cleaning of the solvent. The choice of the proper
system is depends upon many factors such as component mix, flux, and solder paste and assembly method. The ability of the cleaning
system to remove flux residues and contamination from under the chips is very important.
Rev. 7