Plastic Packages for Integrated Circuits Thin Plastic Quad Flatpack Exposed Pad Plastic Packages (EPTQFP) Q64.10x10C (JEDEC MS-026ACD-HU ISSUE D) 64 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED PAD PACKAGE D D1 -D- MILLIMETERS SYMBOL EJECTOR PIN MARK NOT PIN #1 ID -B- -A- E E1 e PIN 1 TOP VIEW MIN MAX NOTES A - 1.20 - A1 0.05 0.15 - A2 0.95 1.05 - b 0.16 0.28 6 b1 0.17 0.23 - D 11.80 12.20 3 D1 9.90 10.10 4, 5 D2 2.90 3.10 - E 11.80 12.20 3 E1 9.90 10.10 4, 5 E2 2.90 3.10 - L 0.45 0.75 - N 64 7 e 0.50 BSC Rev. 0 10/08 NOTES: 11o-13o 0.020 0.008 MIN 1. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 0o MIN 2. All dimensions and tolerances per ANSI Y14.5M-1982. A2 A1 GAGE PLANE 0o-7o L 3. Dimensions D and E to be determined at seating plane -C- . 4. Dimensions D1 and E1 to be determined at datum plane -H- . 11o-13o 5. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm (0.010 inch) per side. 0.25 0.010 6. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed the maximum b dimension by more than 0.08mm (0.003 inch). PIN 1 7. “N” is the number of terminal positions. EJECTOR PIN MARK NOT PIN #1 ID -H- A SEATING PLANE 0.08 0.003 E2 -C0.08 M 0.003 D S C A-B S b EJECTOR PIN MARK NOT PIN #1 ID b1 0.09/0.16 0.004/0.006 D2 BOTTOM VIEW 1 BASE METAL WITH PLATING 0.09/0.20 0.004/0.008