Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Thin Plastic Quad Flatpack Packages (TQFP)
Q32.7x7 (JEDEC MS-026ABA ISSUE B)
32 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
INCHES
D
D1
-D-
-B-
-A-
E E1
e
PIN 1
SEATING
A PLANE
-H-
0.08
0.003
-C-
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.047
-
1.20
-
A1
0.002
0.005
0.05
0.15
-
A2
0.038
0.041
0.95
1.05
-
b
0.012
0.018
0.30
0.45
6
b1
0.012
0.016
0.30
0.40
-
D
0.350
0.358
8.90
9.10
3
D1
0.272
0.280
6.90
7.10
4, 5
E
0.350
0.358
8.90
9.10
3
E1
0.272
0.280
6.90
7.10
4, 5
L
0.018
0.029
0.45
0.75
N
32
32
e
0.031 BSC
0.80 BSC
7
Rev. 0 10/06
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane -C- .
0.08
0.003 M
D S
C A-B S
b
11o-13o
0.020
0.008 MIN
b1
0o MIN
A2 A1
GAGE
PLANE
0o-7o
0.25
0.010
11o-13o
1
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm (0.003
inch).
0.09/0.16
0.004/0.006
BASE METAL
WITH PLATING
L
4. Dimensions D1 and E1 to be determined at datum plane
-H- .
0.09/0.20
0.004/0.008
7. ā€œNā€ is the number of terminal positions.