CPC1590 (R1)

CPC1590
Optically Isolated Gate Driver
INTEGRATED CIRCUITS DIVISION
Driver Characteristics
Description
Parameter
Rating
Units
Input Current
2.5
mA
Switching Speed (IF=5mA, MOS Input Capacitance=4nF)
td(on)
12
td(off1) (VGS=2V)
125
td(off2) (VGS=1V)
210
s
Features
•
•
•
•
•
•
•
•
•
3750Vrms Input-to-Output Isolation
Drives External Power MOSFET
Low LED Current (2.5mA)
Requires No External Power Supply
Load Voltages up to 200V
High Reliability
Small 8-pin Surface Mount Flatpack Package
Machine Insertable, Wave Solderable
Tape and Reel Version Available
Applications
•
•
•
•
•
•
The CPC1590 is a MOSFET Gate Driver that requires
no external power supply: it regulates the input voltage
drawn from the load (up to 200V), down to 12.2V for
internal use. It is specifically designed for low duty
cycle switching applications that drive up to 4nF of
gate capacitance.
Industrial Controls
Instrumentation
Medical Equipment Isolation
Electronic Switching
I/O Subsystems
Appliances
The CPC1590 accomplishes very fast MOSFET
turn-on by supplying stored charge, from an external
capacitor, to the MOSFET gate when input control
current is applied to the device’s LED. After the
MOSFET is turned on, photocurrent from the input
optocoupler keeps it on for as long as sufficient input
control current flows, so there is no low-frequency
operating limit. When the MOSFET is turned off, the
storage capacitor charges from the device’s regulated
internal voltage in preparation for the next turn-on.
Because it is provided in a small, 8-pin Flatpack
package and requires no separate power supply, the
CPC1590 provides a flexible design solution that
consumes the least amount of PCB land area.
Approvals
• UL Recognized Component: File E76270
Ordering Information
e3
Pb
Part
Description
CPC1590P
8-Pin Flatpack (50/Tube)
CPC1590PTR
8-Pin Flatpack (1000/Reel)
Figure 1. CPC1590 Block Diagram
8
1
4
CAP
7
NC
A
NC
5
LED +
LED -
G
2
3
6
B
DS-CPC1590-R01
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1
CPC1590
INTEGRATED CIRCUITS DIVISION
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 General Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.7 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.8 Performance Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
3
3
3
3
3
4
4
5
2. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4. Device Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1 LED resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2 Storage Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3 Transistor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7
7
7
8
5. CPC1590 Used as an AC Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6. Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
7. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2
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R01
CPC1590
INTEGRATED CIRCUITS DIVISION
1. Specifications
1.1 Package Pinout
N/C
LED +
LED N/C
1.2 Pin Description
1
8
2
7
3
6
4
5
CAP
A
B
G
Blocking Voltage (VDS)
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
Total Package Dissipation
Isolation Voltage (Input to Output)
Operational Temperature
Storage Temperature
Rating
Units
200
5
50
1
20
200
VP
3750
-40 to +110
-40 to +125
V
mA
A
mW
mW
Vrms
°C
°C
Absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
R01
Name
Description
1
2
3
4
5
LED +
LED VG
6
VL2
-Load Voltage DC, ±Load Voltage AC
7
VL1
+Load Voltage DC, ±Load Voltage AC
8
VCAP
Not connected
Positive input to LED
Negative input to LED
Not connected
Output, MOSFET Gate Control
Storage Capacitor Voltage
1.4 ESD Rating
1.3 Absolute Maximum Ratings
Parameter
Pin#
ESD Rating
(Human Body Model)
1000 V
1.5 Recommended Operating Conditions
Parameter
Symbol
Min
Max
Units
Load Voltage
VL
15
200
V
Input Control Current
IF
2.5
10
mA
Forward Voltage Drop
VF
1
1.4
V
Operating Temperature
TA
-40
+110
°C
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3
CPC1590
INTEGRATED CIRCUITS DIVISION
1.6 General Conditions
Unless otherwise specified, minimum and maximum values are guaranteed by production testing.
Typical values are characteristic of the device at 25°C and are the result of engineering evaluations. They are
provided for informational purposes only and are not part of the manufacturing testing requirements.
Unless otherwise noted, all electrical specifications are listed for TA=25°C.
1.7 Electrical Specifications
Parameter
Conditions
Symbol
Min
Typ
7.0
7.3
Max
Units
Load Side Characteristics
Gate Voltage
IF=2.5mA
IF=5mA
IF=10mA
8.0
VGS
12
7.5
8.4
4.2
-
14.4
V
IF=2.5mA
-40°C<TA<110°C
Capacitor Voltage
Gate Drive Capability
10V<VDS<200V
VCAP
10
12.2
16
IF=2.5mA, VGS=0V, VCAP=15V
IG_source
2
3.3
7
4.0
9.0
14
1.5
3.3
6
0.5
1.2
2
40
140
12
40
5
20
IF=0mA, VGS=8V, VCAP=8V
IF=0mA, VGS=4V, VCAP=4V
IG_sink
IF=0mA, VGS=2V, VCAP=2V
Turn-On Delay
mA
VDS=48V, VGS=4V, CVG=4nF
IF=2.5mA
IF=5mA
ton
1
IF=10mA
Turn-Off Delay
V
s
VDS=48V, VGS=2V, CVG=4nF
IF=2.5mA
IF=5mA
110
toff1
40
IF=10mA
400
s
600
s
-
1
A
125
130
VDS=48V, VGS=1V, CVG=4nF
IF=2.5mA
IF=5mA
200
toff2
40
IF=10mA
Off-State Leakage Current
210
220
VDS=200V
IDS
-
LED Characteristics
Forward Voltage Drop
IF=5mA
VF
1
1.27
1.4
V
Input Dropout Current
VGS=1V
IF
0.2
0.75
1
mA
Reverse Bias Leakage Current
VR=5V
IR
-
-
10
A
-
CI/O
-
3
-
pF
Common Characteristics
Input to Output Capacitance
4
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R01
CPC1590
INTEGRATED CIRCUITS DIVISION
1.8 Performance Data
td(on) vs. Temperature
(VGS=4V)
180
80
140
IF=5mA
120
IF=2.5mA
IF=5mA
20
IF=10mA
1.40
-20
0
20
40
60
Temperature (ºC)
100
60
-40
100
LED Forward Voltage Drop
vs. Temperature
(IF=5mA)
120
1.35
110
1.30
100
τ (μs)
1.20
1.15
0
20
40
60
Temperature (ºC)
80
Time Constant (τ) vs. Temperature
(IF=5mA)
40
-20
0
20
40
60
80
Temperature (ºC)
30
-40
100 120
3.5
0
20
40
60
Temperature (ºC)
80
100
Gate Source Current vs. Temperature
(IF=5mA, VCAP=15V)
4.5
VGS=4V
4.0
3.5
3.0
-20
0
20
40
60
Temperature (ºC)
80
100
2.5
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Gate Sink Current vs. Temperature
(IF=0mA, VGS=VCAP)
3.0
IG_sink (mA)
5.5
-20
VGS=2V
60
1.05
200
5.0
70
50
220
160
-40
100
80
1.10
1.00
-40
-20
90
1.25
mA
I F=5
A
.5m
I F=2
240
180
80
80
A
0m
1
I F=
260
IG_source (mA)
40
0
-40
LED VF (V)
td(off1) (μs)
160
td(on) (μs)
100
60
td(off2) vs. Temperature
(VGS=1V)
280
IF=10mA
IF=2.5mA
td(off2) (μs)
120
td(off1) vs. Temperature
(VGS=2V)
VGS=4V
2.5
2.0
1.5
VGS=2V
1.0
0.5
-40
-20
0
20
40
60
Temperature (ºC)
80
100
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in
the written specifications, please contact our application department.
R01
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5
CPC1590
INTEGRATED CIRCUITS DIVISION
2. Introduction
The CPC1590 is a MOSFET Gate Driver that requires
no external power supply. It can regulate an input
voltage, up to 200V, down to 12.2V for internal use. It
is specifically designed for low-duty-cycle switching
frequencies that drive 4nF of gate capacitance.
3. Functional Description
The CPC1590 is used in conjunction with a single
MOSFET transistor for remote switching of DC loads
(Figure 2), and two MOSFETS and a diode for remote
switching of low-frequency AC loads (Figure 3) where
isolated power is unavailable.
The device uses external components, most notably a
charge storage capacitor, to satisfy design switching
and over-voltage protection requirements. Because of
this design flexibility, the designer may choose a great
number of MOSFETs for use in a wide variety of
applications. The designer simply needs to know the
MOSFET total gate charge (QG), and with this
information a capacitor can be chosen. The
capacitance of the storage capacitor should be greater
than, or equal to, QG/0.5V.
The CPC1590 has two states of operation:
(1) sufficient input control current is flowing, the LED is
turned on, and the gate current is being applied. The
light from the LED is being reflected onto the
photovoltaic, which then produces a photocurrent that
turns on the NPN bipolar transistor and provides the
charge (I x t = Q), or the gate current that is being
applied to turn on the MOSFET. (2) Sufficient input
control current is not flowing, the LED is turned off,
and gate current is not flowing. The LED is off
because VF << the minimum forward voltage required,
and not enough current is being applied. This turns on
the PNP bipolar transistor, providing a path for gate
current to discharge to VL2.
When VLOAD is first applied, the external storage
capacitor begins to charge. The charge is sent through
a bootstrap diode to prevent the charge from escaping
and discharging through a turned-on MOSFET. The
J-FET then regulates the voltage between 10V and
16V. The input control current is applied, then the
charge is transferred from the storage capacitor
through the NPN bipolar transistor, along with the
charge from the photovoltaic, to the MOSFET gate to
accomplish a rapid turn-on. After the capacitor has
discharged and the MOSFET has turned on, the
photocurrent from the input optocoupler continues to
flow into the gate to keep the MOSFET turned on.
When the input control current is removed, the gate
current stops flowing and the PNP bipolar transistor is
on and is discharging the MOSFET gate. The
MOSFET is now off. At this point the capacitor begins
to recharge for the next turn on cycle.
The circuit below does not include over-voltage
protection.
Figure 2. CPC1590 DC Application Circuit
CPC1590
8
1
4
7 A
NC
LOAD
NC
CST
5
LED +
LED -
6
CAP
+VLOAD
G
2
3
6 B
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-VLOAD
R01
CPC1590
INTEGRATED CIRCUITS DIVISION
4. Device Configuration
CPC1590
8
VIN
1
4
CAP
7 A
NC
LOAD
NC
+VLOAD
CST
RLED
5
G
2
3
6 B
4.1 LED resistor
The input resistor is required to limit LED current to a
value set by Recommended Operating Conditions in
“Recommended Operating Conditions” on page 3. In some
cases, higher LED operating current would improve
driver speed; however, this higher current could also
reduce LED lifespan, which would cause reliability
issues.
The general equation used to calculate the resistor
value is:
RLED =
When the LED resistor value is selected by the above
formula, the RLED power dissipation, PD, can be
obtained from the following equation:
PD = IF2 • RLED
With power dissipation calculated, it is now possible to
select an appropriate resistor size that can be used in
the particular application circuit. It is recommended
that a resistor with at least twice the calculated power
rating should be selected.
VIN - (VF + VOL)
4.2 Storage Capacitor
IF
• IF = Input Control Current
• VOL = Low-level output of the driving logic gate or the
collector-emitter voltage of the driving logic transistor. (This parameter is provided in the manufacturer’s
data sheet.)
• VIN = Input Power Source
• VF = Forward Voltage Drop of LED
• RLED = Input Resistor
When calculating the resistor value, the designer
should take into consideration power-supply
variations, which can range about ±10%, temperature
variations from -40°C to +85°C, LED forward voltage
drop over the temperature range, and the resistor’s
tolerance and temperature stability rating.
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-VLOAD
The storage capacitor (CST) enables the gate driver to
turn on a power MOSFET faster by delivering a
reservoir of charge to the gate. Selection of the
storage capacitor is given by the following equation:
CST > QG / 0.5V
This equation shows that the storage capacitor needs
to deliver enough charge to the gate while only
dropping 0.5V. The CPC1590 can deliver 32nC of
charge at rated operating speed, and will operate with
much larger loads, >4nF, with slower turn-on and
turn-off times.
The CPC1590 has an internal J-FET, which is used to
regulate the voltage applied to the storage capacitor.
The voltage applied to the storage capacitor will be
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7
CPC1590
INTEGRATED CIRCUITS DIVISION
between 10V and 16V. The capacitor’s voltage rating
should be two to three times this range.
The designer should select the storage capacitor
based on the particular application requirements. If the
final product requires operating at a higher ambient
temperature range of -40°C to +110°C, then it is better
to select COG/NPO capacitors in order to meet
minimum capacitance requirements.
4.3 Transistor Selection
The CPC1590 charges and discharges an external
MOSFET transistor. The selection of the MOSFET is
determined by the user to meet the specific power
requirements for the load. The CPC1590 output
voltage is listed in the specification, but, as mentioned
earlier, there must be little or no gate leakage.
Another parameter that plays a significant role in the
selection of the transistor is the gate drive voltage
available from the part. The CPC1590 uses
photovoltaic cells to collect the optical energy
generated by the internal LED; to generate more
voltage, the photovoltaic diodes are stacked. As such,
the voltage of the photovoltaic stack reduces with
increased temperature. The user must select a
transistor that will maintain the load current at the
maximum temperature, given the VGS in the CPC1590
specifications.
5. CPC1590 Used as an AC Switch
The CPC1590 can be used in other configurations.
One typical configuration is shown in Figure 3, which
is called an AC Switch. This simply means that either
terminal can be positive or negative. This configuration
requires a second MOSFET (Q2) and two rectifying
diodes (D1 and D2).
The design considerations are identical for this
application. Diodes D1 and D2 must have voltage
ratings greater than the breakdown voltage of the
MOSFETs.
Figure 3. Application Circuit for Using the CPC1590 as an AC Switch
CPC1590
8 VCAP
1
4
NC
+/- VLOAD
7 VL1
NC
LOAD
D1
CST
5
LED +
LED -
VG
Q1
2
3
D2
Q2
6 VL2
+/- VLOAD
6. Conclusion
See IXYS Integrated Circuits Division’s Application Note, AN-202, for a thorough discussion, and for examples of
device usage, component selection, and over-voltage protection circuitry.
8
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R01
CPC1590
INTEGRATED CIRCUITS DIVISION
7. Manufacturing Information
7.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1590P
MSL 1
7.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
7.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device
Maximum Temperature x Time
CPC1590P
260°C for 30 seconds
7.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash
is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
R01
e3
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9
CPC1590
INTEGRATED CIRCUITS DIVISION
7.5 Mechanical Dimensions
7.5.1 CPC1590P 8-Pin Flatpack Package
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
9.398 ± 0.127
(0.370 ± 0.005)
Pin 1
2.286 MAX.
(0.090 MAX.)
PCB Land Pattern
2.54
(0.10)
0.635 ± 0.127
(0.025 ± 0.005)
0.203 ± 0.013
(0.008 ± 0.0005)
9.652 ± 0.381
(0.380 ± 0.015)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
2.159 ± 0.025
(0.085 ± 0.001)
0.457 ± 0.076
(0.018 ± 0.003)
0.864 ± 0.120
(0.034 ± 0.004)
Dimensions
mm
(inches)
7.5.2 CPC1590PTR Tape & Reel
2.00
(0.079)
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Embossment
W = 16.00
(0.63)
7.50
(0.295)
Bo = 10.30
(0.406)
K0 = 2.70
(0.106)
K1 = 2.00
(0.079)
Embossed Carrier
4.00
(0.157)
P = 12.00
(0.472)
Ao = 10.30
(0.406)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and
reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed
or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability
whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a
particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical
harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes
to its products at any time without notice.
Specification: DS-CPC1590-R01
©Copyright 2013, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
7/11/2013
10
www.ixysic.com
R01