LBA710 Dual Single-Pole OptoMOS® Relay Normally Open & Normally Closed INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to Operate Rating 60 1 0.6 2 Units V Arms / ADC mA Features • • • • • • • • • • • Low On-Resistance (0.6) Low Control Current (2mA) 3750Vrms Input/Output Isolation 100% Solid State Low Drive Power Requirements (TTL/CMOS Compatible) Arc-Free With No Snubbing Circuits No EMI/RFI Generation Machine Insertable, Wave Solderable Surface Mount Versions Small 8-Pin Package Tape & Reel available Description LBA710 is a 60V, 1A, 0.6 dual Solid State Relay integrating independent single-pole normally open (1-Form-A) and single-pole normally closed (1-Form-B) relays into a single package. It features a superior combination of low on-resistance and 1A load current handling capability. Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1175739 • EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 004 Ordering Information Part # LBA710 LBA710S LBA710STR Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1000/Reel) Applications • Telecommunications • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Utility Meters (gas, oil, electric and water) • Medical Equipment-Patient/Equipment Isolation • Security • Aerospace • Industrial Controls Pin Configuration + Control – Control + Control – Control 1 8 2 7 3 6 4 5 Normally Closed Form-B Normally Open Form-A Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton toff Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 90% 10% toff Pb DS-LBA710-R02 ton e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION LBA710 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output ESD Rating, Human Body Model Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 6.67 mW / ºC Ratings 60 5 50 1 Units VP V mA A 150 800 3750 8 -40 to +85 -40 to +125 mW mW Vrms kV °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical Characteristics @ 25ºC Parameter Conditions Output Characteristics: Form-A (Normally Open) Load Current IF=2mA Continuous Peak IF=2mA, t < 10ms On-Resistance IF=2mA, IL=1A Switching Speeds Turn-On IF=5mA, VL=10V Turn-Off Off-State Leakage Current IF=0mA, VL=60V Output Capacitance IF=0mA, VL=50V, f=1MHz Output Characteristics: Form-B (Normally Closed) Load Current IF=0mA Continuous Peak IF=0mA, t < 10ms On-Resistance IF=0mA, IL=1A Switching Speeds Turn-On IF=5mA, VL=10V Turn-Off Off-State Leakage Current IF=2mA, VL=60V Output Capacitance IF=2mA, VL=50V, f=1MHz Input Characteristics: Form-A and Form-B Input Control Current to Activate IL=1A Input Control Current to Deactivate Input Voltage Drop IF=5mA Reverse Input Current VR=5V Common Characteristics: Form-A and Form-B Capacitance, Input to Output - Symbol Min Typ Max Units IL - - 1 Arms / ADC ILPK RON - 0.21 ±5 0.6 AP ton toff ILEAK COUT - 0.7 0.09 44 5 5 1 - A pF ms IL - - 1 Arms / ADC ILPK RON - 0.39 ±5 0.6 AP ton toff ILEAK COUT - 0.63 1.5 125 5 5 1 - A pF IF IF VF IR 0.1 0.9 - 1.2 - 2 1.4 10 mA mA V A CI/O - 3 - pF ms *NOTE: If both poles operate simultaneously, then load current must be derated so as not to exceed the package total power dissipation value. 2 www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION LBA710 Form-A RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Form-A Typical LED Current to Operate (N=50, IL=1A) 25 15 10 5 20 15 10 5 0 0 0.65 0.69 0.73 0.77 0.81 0.85 LED Current (mA) Form-A Typical LED Forward Voltage Drop (N=50) 15 10 5 0 15 10 5 0.95 -20 1200 80 Turn-Off Time (Ps) 800 600 400 Form-A Typical IF for Switch Operation vs. Temperature (IL=500mA) Turn-On Time (Ps) 0.85 0.80 0.75 68.5 Form-A Typical Turn-Off vs. LED Forward Current (IL=100mA, TA=25ºC) 77.6 77.5 77.4 77.3 77.1 10 20 30 40 LED Forward Current (mA) 50 0 Form-A Typical Turn-On Time vs. Temperature (IL=100mA) 2500 0.90 66.5 67.0 67.5 68.0 Blocking Voltage (VP) 77.2 0 100 66.0 77.7 0 20 40 60 Temperature (ºC) 5 77.8 200 0 10 65.5 1000 IF=50mA IF=20mA IF=10mA IF=5mA IF=2mA 15 0 2000 50 Form-A Typical Turn-Off Time vs. Temperature (IL=100mA) 85 1500 1000 10 20 30 40 LED Forward Current (mA) 90 IF=2mA Turn-Off Time (Ps) 1.1 1.0 -40 LED Current (mA) 20 Form-A Typical Turn-On vs. LED Forward Current (IL=100mA, TA=25ºC) 1.2 0.102 20 Form-A Typical LED Forward Voltage Drop vs. Temperature 1.3 0.082 0.087 0.092 0.097 Turn-Off Time (ms) Form-A Typical Blocking Voltage Distribution (N=50) 0.206 0.207 0.208 0.209 0.210 0.211 0.212 On-Resistance (:) 1.4 5 0.077 0 1.5 10 0.81 1.220 1.225 1.230 1.235 1.240 1.245 1.250 LED Forward Voltage (V) Turn-On Time (Ps) LED Forward Voltage (V) 1.6 0.65 0.69 0.73 0.77 Turn-On Time (ms) Device Count (N) Device Count (N) Device Count (N) 20 0.61 Form-A Typical On-Resistance Distribution (N=50, IF=2mA, IL=1A) 25 25 15 0 0.57 0.89 30 Form-A Typical Turn-Off Time (N=50, IF=5mA) 20 Device Count (N) Device Count (N) Device Count (N) 20 Form-A Typical Turn-On Time (N=50, IF=5mA) IF=5mA 500 80 IF=2mA 75 70 IF=5mA 65 60 55 0.70 -40 0 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 50 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R02 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LBA710 Form-A RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Form-A Typical On-Resistance vs. Temperature (IF=2mA, IL=500mA) 0.26 0.3 0.20 0.18 0.16 -0.1 0 20 40 60 Temperature (ºC) 80 100 Form-A Typical Blocking Voltage vs. Temperature 20 68 67 66 65 64 63 -20 0 20 40 60 Temperature (ºC) 80 0.8 0.7 0.6 0.4 -0.5 0.0 Voltage (V) 0.5 1.0 -40 Form-A Typical Leakage vs. Temperature Measured Across Pins 5&6 (VL=60V) 10 5 -20 0 20 40 60 Temperature (ºC) 80 100 Form-A Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 120 15 0 -40 100 0.9 0.5 -0.3 -1.0 Leakage Current (nA) Blocking Voltage (VP) 0.0 Output Capacitence (pF) -20 69 62 -40 0.1 -0.2 0.14 70 1.0 Load Current (A) 0.22 Form-A Maximum Load Current vs. Temperature (IF=2mA) 1.1 0.2 Current (A) On-Resistance (:) 0.24 0.12 -40 Typical Load Current vs. Load Voltage (IF=2mA) 100 80 60 40 20 -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s 0.1 1 10 Load Voltage (V) 100 Form-A Energy Rating Curve 6 Load Current (A) 5 4 3 2 1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION LBA710 Form-B RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Form-B Typical LED Current to Operate (N=50, IL=1A) 25 15 10 5 0 20 15 10 5 0.21 0.22 0.23 0.24 0.25 LED Current (mA) 10 5 0 0.26 0.54 Form-B Typical LED Forward Voltage Drop (N=50) 30 0.57 0.60 0.63 0.66 0.69 Turn-On Time (ms) 1.2 0.72 Form-B Typical On-Resistance Distribution (N=50, IF=0mA, IL=1A) 20 25 20 15 10 Device Count (N) Device Count (N) 25 Device Count (N) 15 0 0.20 15 10 5 Form-B Typical LED Forward Voltage Drop vs. Temperature Form-B Typical Turn-On Time vs. LED Forward Current (IL=100mA) 1.3 1.1 1.0 -40 0 20 40 60 Temperature (ºC) 80 5 Form-B Typical IF for Switch Operation vs. Temperature (IL=100mA) 0.20 0.16 -20 0 20 40 60 Temperature (ºC) 80 100 73 75 77 79 Blocking Voltage (VP) 81 Form-B Typical Turn-Off Time vs. LED Forward Current (IL=100mA) 8 6 5 4 3 2 1 0 10 20 30 40 LED Forward Current (mA) 50 10 20 30 40 LED Forward Current (mA) 50 Form-B Typical Turn-Off Time vs. Temperature (IF=5mA, IL=100mA) 2.6 2.4 0.8 0.7 0.6 0.5 0.4 -40 0 Form-B Typical Turn-On Time vs. Temperature (IF=5mA, IL=100mA) 0.9 0.24 71 7 0 100 0.28 0.12 -40 0.640 0.638 0.636 0.634 0.632 0.630 0.628 0.626 0.624 0.622 0.620 Turn-On Time (ms) LED Current (mA) 0.32 -20 Form-B Typical Blocking Voltage Distribution (N=50, IF=2mA) 69 Turn-Off Time (ms) 1.2 IF=50mA IF=20mA IF=10mA IF=5mA IF=2mA 1.9 10 Turn-Off Time (ms) 1.4 1.8 0 0.381 0.384 0.387 0.390 0.393 0.396 0.399 On-Resistance (:) 1.5 1.4 1.5 1.6 1.7 Turn-Off Time (ms) 15 0 1.220 1.225 1.230 1.235 1.240 1.245 1.250 LED Forward Voltage (V) Turn-On Time (ms) LED Forward Voltage (V) 1.6 1.3 20 5 0 Form-B Typical Turn-Off Time (N=50, IF=5mA) 20 Device Count (N) 20 Device Count (N) Device Count (N) 25 Form-B Typical Turn-On Time (N=50, IF=5mA) 2.2 2.0 1.8 1.6 1.4 -20 0 20 40 60 Temperature (ºC) 80 100 1.2 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R02 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LBA710 Form-B RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Form-B Typical On-Resistance vs. Temperature (IF=0mA, IL=500mA) 1.0 0.9 0.8 0.7 0.6 0.5 0 20 40 60 Temperature (ºC) 80 -1.0 -0.4 -0.3 -0.2 100 Form-B Typical Blocking Voltage vs. Temperature (IF=2mA) 0.10 Leakage Current (PA) 79 78 77 76 75 74 -20 0 20 40 60 Temperature (ºC) 80 100 0.4 -0.1 0.0 0.1 Voltage (V) 0.2 0.3 Form-B Typical Leakage vs. Temperature Measured Across Pins 7&8 (IF=2mA, VL=60V) 0.06 0.04 0.02 -20 0 20 40 60 Temperature (ºC) 80 100 Form-B Output Capacitance vs. Load Voltage (IF=2mA, f=1MHz) 450 0.08 0.00 -40 -40 0.4 Output Capacitance (pF) -20 80 Blocking Voltage (VP) 0.0 -0.5 0.32 73 -40 Load Current (A) 0.36 81 1.1 0.5 0.40 0.28 -40 Form-B Maximum Load Current vs. Temperature (IF=0mA) 1.0 0.44 Current (A) On-Resistance (:) 0.48 Form-B Typical Load Current vs. Load Voltage (IF=0mA) 400 350 300 250 200 150 100 -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s 0.1 1 10 Load Voltage (V) 100 Form-B Energy Rating Curve 6 Load Current (A) 5 4 3 2 1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 6 www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION LBA710 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LBA710 / LBA710S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LBA710 / LBA710S 250ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R02 e3 www.ixysic.com 7 INTEGRATED CIRCUITS DIVISION LBA710 Mechanical Dimensions LBA710 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 0.457 ± 0.076 (0.018 ± 0.003) 3.302 ± 0.051 (0.130 ± 0.002) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 0.254 ± 0.0127 (0.010 ± 0.0005) 7.620 ± 0.127 (0.300 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LBA710S 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 3.302 ± 0.051 (0.130 ± 0.002) 0.635 ± 0.127 (0.025 ± 0.005) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) 8 www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION LBA710 LBA710STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment W=16.00 (0.63) Bo=10.30 (0.406) Ao=10.30 (0.406) P=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 9 Specification: DS-LBA710-R02 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012