STATUS RoHS – lead-free Status of IXYS Products RoHS Compliance IXYS/Q Jan. ‘06 Efficiency Through Technology 1 STATUS RoHS – lead-free Background ¾ EC Commission prepares an Integrated Product Policy (IPP) since 1997 WEEE 2000/53/EC on IPP Integrated Product Policy end-of life vehicles 2001 RoHS 2002 2003 2005 EUP Registration Evaluation Authorisation Framework for the Setting of Eco-Design Requirements for Energy Using Products of Chemical substances Efficiency Through Technology 2004 REACH Draft status Decision ! implement WEEE & RoHS in Germany 2002/95/EC Restriction of Hazardous Substances ”Green Book” 2000 Waste Electrical and Electronic Equipment 2 STATUS RoHS – lead-free 2002/95/EC Restriction of the use of certain Hazardous Substances in electrical and electronic equipment under Article 4 „Prevention“ Clause 1 Member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE). Efficiency Through Technology 3 STATUS RoHS – lead-free However, there are exemptions listed in the Annex of RoHS : Among others: ¾ lead in high temperature melting type solders (like tin-lead solder alloys containing more than 85 % lead) This means that ¾ high lead die attach soft solders are not affected at all !! like PbSn2Ag2,5 etc. Efficiency Through Technology 4 STATUS RoHS – lead-free Definition Green Package (common use in the industry) “The substances listed below are not intentionally added, but might be present as an impurity with an upper limit according to the listed values. The limits refer to the individual material (such as mold compound, solder, plating, leadframe, substrate...) “ Definition substance upper limit (weight) material e.g. Lead-free Pb < 1000 ppm = 0,1% Lead finish Solder balls Cadmium Cd < 100 ppm = 0,01% All others Hg, Cr6+, PBB, PBDE < 1000 ppm = 0,1% Mold compounds Laminates Solder resist Mold compounds Laminates coatings Efficiency Through Technology 5 STATUS RoHS – lead-free Discrete bipolar & Schottky – products 1 Through Hole Technology (THT) Outline Type TO-220, TO-247, TO-3P TO-262AB DS(A)1, IXBOD 106…10 metal can DS2, TO-3, … Latest Date of Pb-Free Date Terminal Conversion Label Identifier Codes finish *) to Pb-Free (yyww or yww) (JESD97) Terminals higher than suffix “SN” 0404 or 402 after/below part Feb. 1st, 2004 respectively type pure tin (e3) higher than — Jan. 1st, 2004 0401 higher than — May 21, 2004 421 TM ISOPLUS I4-PAC, 220, 247 — suffix “SN” after/below part type n. a. all Ni Apr. 1st, 2004 higher than 0414 higher than 414 SnAgCu (e1) pure tin (e3) *) no Ni underplate Efficiency Through Technology 6 STATUS RoHS – lead-free „SN“ means Pb-free terminals and RoHS compliance Efficiency Through Technology 7 cont STATUS RoHS – lead-free Discrete bipolar & Schottky products - 2 Label Identifier Latest Date of Conversion to Pb-Free Terminals suffix “SN” after/below part type Feb. 1 , 2004 Screw Mount SMT Outline Type TO-263 (D2-Pak) st Pb-Free Date Codes (yyww or yww) Terminal finish *) (JESD97) higher than 0404 higher than 0401 pure tin (e3) SMT TO-252, (D Pak) — Jan. 1 , 2004 SOT-227B (miniBLOC) — n. a. all Ni metal can, stud base DO-4/ DO-5/ TO-48/ TO-64/5 — n. a. All*) pure tin st ‘) DO-5 shims (supplied as accessory) will be RoHS compliant by March 31, 2006 (Cr6+ replaced by Cr3+) *) no Ni underplate D2 D2 D D Efficiency Through Technology 8 STATUS RoHS – lead-free Module Products 1 Outline Types (examples) solderable pin arrays Pin array (V1-Pack) VUO 52, VUB 72, VW2x …io1 Pin array (V2-Pack), VVZB120…io1; VUO/VUB, VWO…NO1/2 MMO, MLO…io1 CBI 1 MWI, MUBW…A/E6K Outline Drawings # (IXYS short form catalogue 04/05) Latest Date of Conversion to Pb-Free Terminals Pb-Free Date Codes (yyww or yww) Terminal finish (JESD97) 47 Aug. 31, 2005 higher than 542 SnAg3Cu0.5* 48, 74 n. a. all Au with Ni underplate (e4) 60, 61 n. a. all Ag, no underplate (e4) 49a n. a. all pure tin**) 81, 77, 95 March 31, 2006 higher than 612 pure tin with Ni underplate 24, 25, 78 n. a. all Au with Ni underplate (e4) CBI 2 & 3 MUBW, MWI …A/E7; …A/E8, …E9 ECO-PAC1/2 VII,VMO…P1, VUE…NO7 * = Ag undercoat ** = no Ni undercoat Efficiency Through Technology 9 STATUS RoHS – lead-free Module Products 2 flexible flat leads Outline Types (examples) VUM24/33, VUC25/36, VVZ/ VVY…io1, VBE20…NO1 Efficiency Through Technology Outline Drawings # (IXYS short form catalogue 04/05) Latest Date of Conversion to Pb-Free Terminals Pb-Free Date Codes (yyww or yww) Terminal finish (JESD97) 45, 46 n. a. all Ag, no underplate (e4) 10 STATUS RoHS – lead-free Module Products 3 Outline Drawings # (IXYS short form catalogue 04/05) Latest Date of Conversion to Pb-Free Terminals Pb-Free Date Codes (yyww or yww) Terminal finish (JESD97) VBO…O2; VUO…NO3; VHF…io5; 40, 43, 44 n. a. all Ni VBO/VUO…NO8; VBO, VHF, VHO, VKO, VTO, VYK, VTOF, VVZF…io7 41, 42, 57, 62 n. a. all Au with Ni underplate (e4) Plug Type (faston) Outline Types (examples) Efficiency Through Technology 11 STATUS RoHS – lead-free ¾ Schedule for the elimination of Cr6+ on washers and screws for modules Part Types Fig. No.* Screw Type Delivery as option ZY253 standard TO-240 style, 26, 27, M5x10 MII75…300 28, 33, 34 MCC/MDD/MCD310/250/220 35, 36 M8x16 MCC/MDD/MCD200/162/132 29…32 FRED modules, VMM650/1500, M6x16 standard 80 MII/MID/MDI400 MCC/MDC/MCD/MDD312/255, 37…39, MDO/MCO450/500/600, M8x20 standard 69 HVL900 *= see IXYS short form catalogue Efficiency Through Technology 12 Alternative Coating Material Date of Conversion week 17 ‘05 week 26 ‘05 Zn with Cr III finish week 29 ‘05 week 18 ‘05 STATUS RoHS – lead-free Module Products 4 Outline Drawings # (IXYS short form catalogue 04/05) Latest Date of Conversion to Pb-Free Terminals Pb-Free Date Codes (yyww or yww) MCC/MCD/MDD 26, 162, 310, 500…io1/NO1/N1 26 … 39, 80, 103 n. a. all VBO, VUO, VWO…NO7/io7 49 … 54, 63 n. a. all Screw Mount Outline Types (examples) Efficiency Through Technology 13 Terminal finish (JESD97) Sn or Ni on tabs and auxiliary pins STATUS RoHS – lead-free IXYS MOS & IGBT products Package Type Conversion date Lead Free later than Date Code Terminal finish (JESD97) TO-251 I-Pak TO-262 I2-Pak TO-220 TO-220 FP Jan 1, 2004 0401 Pure Tin (e3) TO-268 leaded Jul 1, 2004 04027 Sn/Ag/Cu solder dip (e1) TO-3P TO-247 K Jan 1, 2004 0401 Pure Tin (e3) TO-247 Jul 1, 2004 04027 Jan 1, 2004 0401 P TO-264 S TO-264 P TO-220 ISOPLUS/PLUS TO-247 ISOPLUS/PLUS TO-264 ISOPLUS/PLUS I4-PAK TO-3 METAL CAN Efficiency Through Technology 04027 Jul 1, 2004 0427 14 Sn/Ag/Cu solder dip (e1) Pure Tin (e3) Sn/Ag/Cu solder dip (e1) Label Identifier suffix "SN" after/below part type Through Hole Technology (THT) STATUS RoHS – lead-free IXYS MOS & IGBT products Package Type D D Conversion date Lead Free later than Date Code Jan 1, 2004 0401 Terminal finish (JESD97) Label Identifier Pure Tin (e3) suffix "SN" after/below part type Ni — D2 D2 SMT TO-252 D-PAK Screw mount TO-263 D2PAK TO-268 Jul 1, 2004 0427 SOT-227 n.a. all Efficiency Through Technology 15 STATUS RoHS - ICs IXYS PWM controllers and MOSFET/IGBT Drivers Package Type Conversion date Lead Free later than Date Code 8-pin DIP 18-pin DIP 5 pin TO-263 Jul 1, 2004 0427 5-pin TO-220 8-pin SOP 16-pin SOP Efficiency Through Technology 16 Terminal finish (JESD97) Label Identifier Pure Tin (e3) suffix "SN" after/below part type STATUS RoHS – lead-free labels - Discretes How to discern easier between leaded and lead-free on IXYS products ? For discrete components IXYS will apply this marking on the card boxes and containers (according to JESD97) Efficiency Through Technology 17 STATUS RoHS – lead-free labels – Module Products 1, 2, 3, 4 For modules with various kinds of connectors *) (like screws, fast-on, solderable pins etc.) IXYS will apply this marking on the card boxes *) These are modules that have lead-free external electrical connectors, but with internal high-lead solders as exempted by the RoHS Efficiency Through Technology 18 STATUS RoHS – lead-free labels – Module Products 1, 2, 4 For modules that are totally lead-free *) IXYS will apply this marking on the card boxes *) according to the definition given under 3.5 of JESD97 Efficiency Through Technology 19