Environmental Management and Materials Information Product Content Information for: MAX3671ETN+ Links Qualifications Package Description Chemical Composition Summary Detailed Package Component Data Qualifications Top Lead−Free Qualified Yes REACH Yes: 2011−06−20 RoHS Qualified Yes Starting Date Code: 1117+ Green Moisture Sensitivity Level L3 Flammability Meets UL−94 (V−0 Rating) Yes Assembler Qualified UTL Package Description Top Package Code T5688+3 Package Type TQFN * Package Description Thin Quad Flatpack, No Leads Package Option Sawn/Epad Footprint Area (mm2) 65.6 Body Size 8x8x0.8mm Pin Count 56 Unit Weight in Grams 0.179249 Chemical Composition Summary Top Maxim NIA/NIU Substance List (PDF, 24k) Substance CAS Number Aluminum (Al) 7429−90−5 0 0 Antimony (Sb2O3) 1309−64−4 0 0 0 0 0 0 BCB Resin Bromine (Br) 7726−95−6 Amount (grams) % of Unit Weight 1 Carbon (C) 7440−44−0 0 0 Carbon Black 1333−86−4 0 0 Ceramic (BaTiO3) 12047−27−7 0 0 Chromium (Cr) 7440−47−3 0 0 Cobalt (Co) 7440−48−4 0 0 Copper (Cu) 7440−50−8 0.0251 14.00287 Gold (Au) 7440−57−5 0.00128 0.71409 Indium (In) 7440−74−6 0 0 0 0 0.000573 0.31967 Insulator (Polyimide) Iron (Fe) 7439−89−6 FeO2 12411−15−36 0 0 Lead (Pb) 7439−92−1 0 0 Magnesium (Mg) 7439−95−4 0 0 Manganese (Mn) 7439−96−5 0 0 0 0 0 0 NiPdAu 0 0 Nickel−V (NiV) 0 0 MnO3 Nickel (Ni) 7440−02−0 Palladium (Pd) 7440−05−3 0 0 Phosphorus (P) 7723−14−0 0 0 Silica (SiO2) 11126−22−0 0.119 66.38810 Silicon (Si) 7440−21−3 0.0102 5.69041 Silver (Ag) 7440−22−4 0.00303 1.69039 Solder Mask 0 0 Solder Paste 0 0 Spheron Polymer Passivation 0 0 Sulfur (S) 7704−34−9 0 0 Tin (Sn) 7440−31−5 0.00683 3.81034 Titanium (Ti) 7440−32−6 0 0 0 0 Titanium−W (TiW) Tungsten (W) 7440−33−7 0 0 Vanadium (V) 7440−62−2 0 0 Zinc (Zn) 7440−66−6 3.6e−05 0.02008 ZnO 1314−13−2 0 0 Zirconium (Zr) 7440−67−7 0 0 Detailed Package Component Data Top 2 Bond Wire Components Summary Component Weight 0.00128 Substance Amount (grams) % of Component Weight % of Unit Weight Gold (Au) 0.00128 100.00000 0.71409 0 0 0 Aluminum (Al) Die Attach Epoxy Components Summary Die Attach Material Ablebond 8200T Component Weight 0.0035 % of Component Weight % of Unit Weight 0 0 0 0 0 0 20.00000 0.39052 Functionalized Ester 0 0 Functionalized Urethane 0 0 0 0 0 0 0 0 Polymeric 0 0 Polyoxypropylenediamine 0 0 0 0 0 0.00280 80.00000 1.56207 0 0 0 0 0 Substance Amount (grams) Aromatic Amine Copper (Cu) 0 Diester Epoxy Indium (In) 0.00070 0 Lactone Lead (Pb) Resin Silver Filler (Ag) Tin (Sn) 0 Other Lead Finish/Plating Components Summary Lead Finish Plating 100% Tin Assembly Lead Finish Process Component Weight Substance Lead (Pb) 0.00683 Amount (grams) % of Component Weight % of Unit Weight 0 0 0 3 Tin (Sn) 0.00683 100.00000 3.81034 NiPdAu 0 0 0 Gold (Au) 0 0 0 Nickel (Ni) 0 0 0 Lead Frame Components Summary Lead Frame Material Copper C194 Component Weight 0.025939 % of Component Weight % of Unit Weight Aluminum (Al) 0 0 Carbon (C) 0 0 0 0 0 0 96.76549 14.00287 0 0 2.20903 0.31967 0 0 0 0 0 0 0 0 Palladium (Pd) 0 0 Phosphorus (P) 0 0 Silicon (Si) 0 0 0.88670 0.12831 Sulfur (S) 0 0 Tin (Sn) 0 0 0.000036 0.13879 0.02008 0 0 0 Substance Chromium (Cr) Amount (grams) ND Cobalt (Co) Copper (Cu) 0.02510 Gold (Au) Iron (Fe) 0.000573 Lead (Pb) Magnesium (Mg) ND Manganese (Mn) Nickel (Ni) Silver (Ag) Zinc (Zn) Zirconium (Zr) ND 0.00023 Mold Compound Components Summary Mold Material Sumitomo G770HCD Resin Type Multi−Functional Component Weight Substance 0.1315 Amount (grams) % of Component Weight % of Unit Weight 4 Antimony (Sb2O3) ND 0 0 Bromine (Br) ND 0 0 Carbon Black 0 0 Epoxy 0 0 Epoxy Cresol Novolac 0 0 Metal Hydroxide 0 0 Phenol Novolac 0 0 Silica (SiO2) 0.11900 90.49430 66.38810 Resin 0.01250 9.50570 6.97354 0 0 Substance Amount (grams) % of Component Weight % of Unit Weight Silicon Chip 0.01020 100 5.69041 Other Silicon Chip Components Substrate Components Summary Substrate Weight Substrate Material 0 Substrate Core Material 0 Bromine−Free 0 Amount (grams) % of Component Weight % of Unit Weight Copper 0 0 0 Gold 0 0 0 Nickel 0 0 0 Substrate Core Material 0 0 0 Solder Mask 0 0 0 Triazol 0 0 Other 0 0 Substance 5 Notes: 1. Lead Form: GW − Gull Wing, TH − Through Hole. 2. Refer to product data sheet to confirm actual wire diameter. 3. 'ND' means None Detected, negligible amount present. * This package may be remarked. If remarked, the package will contain additional homogeneous materialsinksthat are not listed in contents of this report. + Existing inventory of non Halogen−free product will be sold first. Halogen−free product is identified by date code only. If you need to confirm delivery of Halogen−free product, please contact Customer Service. This part is qualified as lead−free. Parts qualified as lead−free can be manufactured and supplied as lead−free, if and only if, the customer makes such requests to the Maxim Business Units for approval. The navigation bar on the EMMI website contains information regarding the lead−free process (e.g. MSL's, Peak reflow Temperatures, JEDEC methods, frequently asked questions and answers, lead−free package tables, and status/qualification plans for particular package types qualified as lead−free or in the qualification process). This report was generated on 2012−01−23. For additional information, please visit the Maxim/Dallas Environmental Management and Materials Information website located at: http://www.maxim−ic.com/emmi 6