PO3B3253A www.potatosemi.com Dual 4:1 Mux/DeMux High Bandwidth Potato Chip FEATURES: DESCRIPTION: • Patented technology • High signal -3db passing bandwidth at 750 MHz • Near-Zero propagation delay • VCC = 1.65V to 3.6V • Ultra-Low Quiescent Power: 0.1µA typical • Ideally suited for low power applications • Industrial operating temperature: -40°C to +85°C • Available in 16pin 173mil wide TSSOP package • Available in 16pin 150mil wide SOIC package • Available in 16pin 150mil wide QSOP package Potato Semiconductor’s PO3B3253A is designed for world top performance using submicron CMOS technology to achieve 750 MHz high bandwidth. Pin Configuration Block Diagram EA 1 16 VCC S1 2 15 EB IA3 IA2 14 3 13 4 IB3 EB S0 S1 5 12 IA0 6 11 IB1 YA 7 10 IB0 GND 8 9 YB Potato Semiconductor Corporation Description Data Inputs Select Inputs Enable Data Outputs Ground Power IA1 IA2 IA3 IB0 IB1 IB2 IB3 SW S0 IA1 Pin Description IA0 EA IB2 Pin Name IAN, IBN S0-1 EA, EB YA, YB GND VCC The PO3B3253A is a Dual 4:1 Multiplexer / Demultiplexer with 3-state outputs. The switch introduces no additional ground bounce noise or propagation delay. SW SW SW SW Y I SW SW E SW SW YA YB Truth Table Enable Select YA YB Function Hi-Z X Disable A X X Hi-Z Disable B L IA 0 IB0 S1-0 = 0 L H IA 1 IB1 S1-0 = 1 L H L IA 2 IB2 S1-0 = 2 L H H IA 3 IB3 S1-0 = 3 EA EB S1 S0 H X X X X H X L L L L L L L 1 01/01/10 PO3B3253A www.potatosemi.com Dual 4:1 Mux/DeMux High Bandwidth Potato Chip Maximum Ratings (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ................................................ –65°C to +150°C Ambient Temperature with Power Applied ............... –40°C to +85°C Supply Voltage to Ground Potential ........................... –0.5V to +4.6V DC Input Voltage ........................................................ –0.5V to +Vcc DC Output Current................................................................... 120mA Power Dissipation ....................................................................... 0.5W Note: Stresses greater than those listed under MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. DC Electrical Characteristics, 3.3V Supply (Over the Operating Range, TA = –40°C to +85°C, VCC = 3.3V ±10%) Parameters Description Min. Test Conditions Max. Typ. VIH Input HIGH Voltage Guaranteed Logic HIGH Level VIL Input LOW Voltage Guaranteed Logic LOW Level 0.8 IIH Input HIGH Current VCC = Max., VIN = VCC ±1 IIL Input LOW Current VCC = Max., VIN = GND ±1 IOZH High Impedance Output Current 0 Y, In 2.0 VCC ION = -48 mA or -64mA Switch On-Resistance V A ±1 VCC = Min., VIN = 0.0V, RON Units VCC = Min., VIN = VCC , ION = -15 mA 17 22 17 22 DC Electrical Characteristics, 2.5V Supply (Over Operating Range, TA = –40°C to +85°C, VCC = 2.5V ± 10%) Parameters Description Test Conditions Min. Typ. Max. VIH Input HIGH Voltage Guaranteed Logic HIGH Level 1.8 VCC + 0.3 VIL Inout LOW Voltage Guaranteed Logic LOW Level –0.3 0.8 IIH Input HIGH Current VCC = Max., VIN = VCC IIL Input LOW Current VCC = Max., VIN = GND ±1 IOZH High Impedance Current 0 ±1 RON Switch On Resistance Potato Semiconductor Corporation Y, In V ±1 VCC VCC = Min., VIN = 0.0V, ION = –48mA 18 25 VCC = Min., VIN = 2.25V, ION = -15mA 18 25 2 Units A 01/01/10 PO3B3253A www.potatosemi.com Dual 4:1 Mux/DeMux High Bandwidth Potato Chip Power Supply Characteristics Symbol Description Quiescent Power Supply Current Icc Test Conditions (1) Min Typ Vcc=Max, Vin=Vcc or GND - 0.1 Max Unit 3 uA Notes: 1. 2. 3. 4. 5. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type. Typical values are at Vcc = 3.3V, 25°C ambient. This parameter is guaranteed but not tested. Not more than one output should be shorted at one time. Duration of the test should not exceed one second. VoH = Vcc – 0.6V at rated current Capacitance (TA = 25°C f = 1 MHz) Parameters CIN Description Test Conditions Typical Input Capacitance 3 COFFYN YN Capacitance, Switch OFF 5 COFFIN IN Capacitance, Switch OFF CON VIN = 0V 3.7 IN/YN Capacitance, Switch ON Units pF 8.7 Dynamic Electrical Characteristics Over the Operating Range (TA = -40º to +85º, VCC = 3.3V ± 10%) Parameter Description Test Condition Typ. XTALK Crosstalk RL = 100 -60 OIRR Off-Isolation RL = 100 -60 BW -3dB Bandwidth RL = 100 750 Units dB MHz Switching Characteristics over 3.3V Operating Range Parameters Description tPLH tPHL Propogation Delay tPZH tPZL Bus Enable Time tPHZ tPLZ Bus Disable Time Potato Semiconductor Corporation Conditions See Test Diagram Max. Units 0.3 2.0 ns See Test Diagram 3.0 3 01/01/10 PO3B3253A www.potatosemi.com Dual 4:1 Mux/DeMux High Bandwidth Potato Chip Switching Characteristics over 2.5V Operating Range Parameters Description tPLH tPHL Propogation Delay tPZH tPZL Bus Enable Time tPHZ tPLZ Bus Disable Time Max. Conditions See Test Diagram Units 0.3 2.0 ns See Test Diagram 3.0 Test Circuit for Electrical Characteristics Switch Positions Test Switch tPLZ, tPZL 6.0V tPHZ, tPZH GND Prop Delay Open 6.0V VCC 200-ohm Pulse Generator VOUT VIN D.U.T 10pF CL RT 200-ohm Switching Waveforms SEL 2.5V Input tPLH Output 3.5V 2.5V tPHL 2.5V 2.5V 1.5V VOH VOL Voltage Waveforms Propagation Delay Times Potato Semiconductor Corporation Output 1.25V 1.25V tPZL VDD/2 VDD/2 0V VOH VOL +0.3V tPHZ tPZH Output tPLZ 2.5V VOH –0.3V VOL VOH VOL Voltage Waveforms Enable and Disable Times 4 01/01/10 PO3B3253A www.potatosemi.com Dual 4:1 Mux/DeMux High Bandwidth Potato Chip Packaging Mechanical Drawing: 16 pin QSOP Packaging Mechanical Drawing: 16 pin SOIC 16 .149 .157 .2284 .2440 3.78 3.99 1 .0075 .0098 .386 .393 9.80 10.00 .016 .050 5.80 6.20 0.41 1.27 0.19 0.25 .0155 0.393 .0260 0.660 .053 .068 .050 BSC 1.27 Potato Semiconductor Corporation .013 .020 0.330 0.508 .0040 .0098 1.35 1.75 0.10 0.25 X.XX DENOTES DIMENSIONS X.XX IN MILLIMETERS 5 01/01/10 PO3B3253A www.potatosemi.com Dual 4:1 Mux/DeMux High Bandwidth Potato Chip Packaging Mechanical Drawing: 16 pin TSSOP IC Ordering Information Ordering Code Package Top-Marking TA PO3B3253ATU for Tube 16-pin TSSOP Pb-free & Green PO3B3253AT -40°C to 85°C PO3B3253ATR for Tape & Reel 16-pin TSSOP Pb-free & Green PO3B3253AT -40°C to 85°C PO3B3253ASU for Tube 16-pin SOIC Pb-free & Green PO3B3253AS -40°C to 85°C PO3B3253ASR for Tape & Reel 16-pin SOIC Pb-free & Green PO3B3253AS -40°C to 85°C PO3B3253AQU for Tube 16-pin QSOP Pb-free & Green PO3B3253AQ -40°C to 85°C PO3B3253AQR for Tape & Reel 16-pin QSOP Pb-free & Green PO3B3253AQ -40°C to 85°C IC Package Information PACKAGE CODE PACKAGE TYPE TAPE WIDTH (mm) TAPE PITCH (mm) PIN 1 LOCATION TAPE TRAILER LENGTH QTY PER REEL TAPE LEADER LENGTH QTY PER TUBE T TSSOP 16 12 8 Top Left Corner 39 (12”) 3000 64 (20”) 96 S SOIC 16 16 8 Top Left Corner 39 (12”) 3000 64 (20”) 48 Q QSOP 16 12 8 Top Left Corner 39 (12”) 3000 64 (20”) 97 Potato Semiconductor Corporation 6 01/01/10