Release by PARA LIGHT DCC PARA LIGHT ELECTRONICS CO., LTD. 4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan. Tel: 886-2-2225-3733 Fax: 886-2-2225-4800 E-mail: [email protected] http://www.para.com.tw DATA SHEET PART NO.: L-C155TBJSCT-5A REV: A/0 CUSTOMER’S APPROVAL: _______________ DCC: ____________ DRAWING NO.: DS-31-09-XXXX DATE: 2009-06-30 PAGE 1 of 13 PARA-FOR-065 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No.: L-C155TBJSCT-5A REV:A/0 PACKAGE OUTLINE DIMENSIONS Notes: 1.②④: Yellow; ①③:Blue 2. All dimensions are in millimeters. 3. Tolerance is ± 0.1mm (.004") unless otherwise noted. Features Dual color, top view, wide view angle Chip LED. Package in 8mm tape on 7" diameter reels. Compatible with automatic Pick & Place equipment. Compatible with Reflow soldering and Wave soldering processes. EIA STD package. I.C. compatible. Pb free product. DRAWING NO.: DS-31-09-XXXX PARA-FOR-068 DATE: 2009-06-30 PAGE 2 of 13 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No.: L-C155TBJSCT-5A REV:A/0 Chip Materials Chip Light Color Dice Material ①③ TB:Blue InCaN ②④ JS: Yellow Lens Color Water Clear AllnCaP Absolute Maximum Ratings (Ta=25℃) Symbol PD IPF Rating Parameter Unit Blue Yellow 76 75 mW 100 80 mA Power Dissipation Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) IF Continuous Forward Current 20 30 mA - De-rating Linear From 25℃ 0.25 0.4 mA/℃ 5 5 V VR Reverse Voltage Note A ESD Electrostatic Discharge Threshold (HBM) 2000 Topr Operating Temperature Range -20 ~ +80 ℃ Tstg Storage Temperature Range -30 ~ +100 ℃ - Wave Soldering Condition (Two times Max.) 260 (for 5 seconds) ℃ - Infrared Soldering Condition (Two times MAX.) 260 (for 10 seconds) ℃ Note A: HBM: Human Body Model. Seller gives no other assurances regarding the ability of to withstand ESD. Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Min. Luminous Intensity Blue Yellow 4.5 4.5 IV Typ. Max. 45.0 Unit Test Condition mcd IF=5mA deg Note 2 45.0 Viewing Angle Typ. 2θ1/2 Peak Wavelength Typ. λp 468 591 nm Measurement @Peak Dominant Wavelength Typ. λd 470 589 nm IF=5mA Spectral Line Half-Width Typ. Δλ 25 15 nm 3.1 2.0 3.6 2.4 Forward Voltage Reverse Current Typ. Max. Max. DRAWING NO.: DS-31-09-XXXX PARA-FOR-068 VF IR 130 10 V IF =5mA μA VR = 5V DATE: 2009-06-30 PAGE 3 of 13 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No.: L-C155TBJSCT-5A REV:A/0 Notes: 1. Luminous intensity is measured with a light sensor and filter combination that proximities the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4. Caution in ESD: Static Electricity and surge damages the LED. It is recommended use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. 5. Major standard testing equipment by “Instrument System” Model: CAS140B Compact Array Spectrometer and “KEITHLEY” Source Meter Model: 2400. Typical Electro-Optical Characteristics Curves DRAWING NO.: DS-31-09-XXXX PARA-FOR-068 DATE: 2009-06-30 PAGE 4 of 13 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No.: L-C155TBJSCT-5A REV:A/0 Blue and Yellow Typical Electro-Optical Characteristics Curves (25℃Ambient Temperature Unless Otherwise Noted) DRAWING NO.: DS-31-09-XXXX PARA-FOR-068 DATE: 2009-06-30 PAGE 5 of 13 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No.: L-C155TBJSCT-5A REV:A/0 Label Explanation CUS. PART NO: To be denominated. CUSTOMER: To be denominated. PART NO: Refer to P15 BATCH: MNGA M--- a Chip Luminous Intensity Code N--- b Chip Luminous Intensity Code GA--- a Chip Dominant Wavelength Code LOT NO: E L S 4 7 0009 A B C D E F A---E: For series number B---L: Local F: Foreign C---S: SMD D---Year E---Month F---SPEC. QUANTITY: 3000pcs for 150、110、155、115、195 series 4000pcs for 191 series 5000pcs for 192 series DRAWING NO.: DS-31-09-XXXX PARA-FOR-068 DATE: 2009-06-30 PAGE 6 of 13 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No.: L-C155TBJSCT-5A REV:A/0 Reel Dimensions DRAWING NO.: DS-31-09-XXXX PARA-FOR-068 DATE: 2009-06-30 PAGE 7 of 13 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No.: L-C155TBJSCT-5A REV:A/0 Package Dimensions Of Tape And Reel Notes: All dimensions are in millimeters. Label LIGH T LIGH PARA H:\SMD\SMD\SMD° ü × ° \± ê ? ? .jpg H:\SMD\SMD\SMD° ü × ° \± ê ? ? .jpg T H:\SM PARA D\SM D\SM D° ü .jpg ê ?? × ° \± Moisture Resistant Packaging Reel Label Desiccant Aluminum moistue-proof bag 240 H:\SM D\SMD \SMD ? ? .jpg ° \± ê ° ü× 145 210 255 Label Box 435 Carton Notes: One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit: mm. DRAWING NO.: DS-31-09-XXXX PARA-FOR-068 DATE: 2009-06-30 PAGE 8 of 13 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No.: L-C155TBJSCT-5A REV:A/0 Cleaning If cleaning is required , use the following solutions for less than 1 minute and less than 40℃. Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Suggest Soldering Pad Dimensions Direction of PWB camber and go to reflow furnace DRAWING NO.: DS-31-09-XXXX PARA-FOR-068 DATE: 2009-06-30 PAGE 9 of 13 Release by PARA LIGHT DCC Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No.: L-C155TBJSCT-5A DRAWING NO.: DS-31-09-XXXX PARA-FOR-068 DATE: 2009-06-30 REV:A/0 PAGE 10of 13 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No.: L-C155TBJSCT-5A REV:A/0 Bin Code List CAUTIONS 1.Application Limitation: The LED’s described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household application). Consult PARA’s sales in advance for information on application in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LED’s may directly jeopardize life or health (such as airplanes, automobiles, traffic control equipment, life support system and safety devices). 2.Storage: Before opening the package: The LEDs should be kept at 5°C to 30°C or less and 85%RH or less. The LEDs should be used within a year. After opening the package: The LEDs should be kept at 5°C to 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7 days) after opening the package. Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur. 3.Soldering Do not apply any stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering condition. Reflow Soldering: Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time: 10 sec Max. Soldering Iron: (Not recommended) Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering. DRAWING NO.: DS-31-09-XXXX PARA-FOR-068 DATE: PAGE 2009-06-30 11of 13 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No.: L-C155TBJSCT-5A REV:A/0 Wave soldering: Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max. preformed consecutively cooling process is required between 1st and 2nd soldering processes. 4. Lead-Free Soldering For Reflow Soldering: 1、Pre-Heat Temp:150-180℃,120sec.Max. 2、Soldering Temp: Temperature Of Soldering Pot Over 230℃,40sec.Max. 3、Peak Temperature:260℃，5sec. 4、Reflow Repetition:2 Times Max. 5、Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu For Soldering Iron (Not Recommended): 1、Iron Tip Temp:350℃ Max. 2、Soldering Iron:30w Max. 3、Soldering Time:3 Sec. Max. One Time. For Dip Soldering: 1、Pre-Heat Temp:150℃ Max. 120 Sec. Max. 2、Bath Temp:265℃ Max. 3、Dip Time:5 Sec. Max. 5. Drive Method Circuit model A Circuit model B (A)Recommended circuit. (B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED. DRAWING NO.: DS-31-09-XXXX PARA-FOR-068 DATE: 2009-06-30 PAGE 12of 13 Release Release by by PARA LIGHT DCC PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No.: L-C155TBJSCT-5A REV:A/0 6.Reliability Test Classification Test Item Test Condition Reference Standard Ta= Under Room Temperature As Per Data Sheet Maximum Rating *Test Time= 1000HRS (-24HRS,+72HRS)*@20mA. MIL-STD-750D: 1026 (1995) MIL-STD-883D: 1005 (1991) JIS C 7021:B-1 (1982) IR-Reflow In-Board, 2 Times Ta= 65±5℃,RH= 90～95% *Test Time= 1000HRS±2HRS MIL-STD-202F: 103B(1980) JIS C 7021: B-11 (1982) Ta= 105±5℃ Test Time= 1000HRS (-24HRS, 72HRS) MIL-STD-883D: 1008 (1991) JIS C 7021:B-10 (1982) Ta= -55±5℃ *Test Time=1000HRS (-24HRS, 72H RS) JIS C 7021:B-12 (1982) Temperature Cycling 105±5℃ 10mins MIL-STD-202F: 107D (1980) MIL-STD-750D: 1051(1995) MIL-STD-883D: 1010 (1991) JIS C 7021: A-4 (1982) Thermal Shock IR-Reflow In-Board, 2 Times 105±5℃ -55℃±5℃ 10mins 10mins 100 Cycles MIL-STD-202F: 107D(1980) MIL-STD-750D: 1051(1995) MIL-STD-883D: 1011(1991) Tsol= 260 ± 5℃ Dwell Time= 10 ± 1sec MIL-STD-202F: 210A(1980) MIL-STD-750D: 2031(1995) JIS C 7021: A-1 (1982) Tsol= 235 ± 5℃ Immersion time 2±0.5 sec Immersion rate 25±2.5 mm/sec Coverage ≧95% of the dipped surface MIL-STD-202F: 208D(1980) MIL-STD-750D: 2026(1995) MIL-STD-883D: 2003(1991) IEC 68 Part 2-20 JIS C 7021: A-2 (1982) Operation Life High Temperature Endurance Test High Humidity Storage High Temperature Storage Low Temperature Storage Environmental Test Solder Resistance Solder ability -55±5℃ 10mins 100 Cycles 7.Others: The appearance and specifications of the product may be modified for improvement without notice. DRAWING NO.: DS-31-09-XXXX PARA-FOR-068 DATE: 2009-06-30 PAGE 13of 13