DS-7B-07-0002 L-T650LBCT A5

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PARA LIGHT DCC
PARA LIGHT ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan
Tel: 886-2-2225-3733
Fax: 886-2-2225-4800
E-mail: [email protected]
http://www.para.com.tw
DATA
SHEET
PART NO.: L-T650LBCT
REV: A / 5
CUSTOMER’S APPROVAL : _______________
DRAWING NO. : DS-7B-07-0002
PARA-FOR-065
DATE:2009-10-31
DCC : ____________
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SURFACE MOUNT DEVICE LED
Part No. : L-T650LBCT
REV: A / 5
Features
Top view, Wide view angle, blue color PLCC 2 package SMD LED .
EIA STD package, packing in 8mm tape on 7" diameter reels (ANSI/EIA-481-B-2001).
Compatible with automatic Pick & Place equipment.
Compatible with IR Reflow soldering and TTW soldering.
Pb free product and acceptable lead-free process.
Meet RoHS Green Product.
Application
Backlighting (Switches, keys, displays, illuminated advertising)
Emergency lighting / Signal and symbol luminaries.
Package Outline Dimensions
TOP VIEW
SIDE VIEW
3.00
1.40
0.90
50°
2.00
0.15±0.03
C0.45
POLARITY
-
+
FRONT VIEW
BACK VIEW
2.70
3°
1.30
1.20
1.90
50°
0.75
Notes:
1. All dimensions are in millimeters.
2. Tolerance is ± 0.10mm (.004") unless otherwise noted.
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CHIP MATERIALS
Dice Material : InGaN
Light Color : Blue
Lens Color : Water Clear
Absolute Maximum Ratings(Ta=25℃
℃)
Symbol
PD
Parameter
Power Dissipation
Peak Forward Current
IPF
(1/10 Duty Cycle, 0.1ms Pulse Width)
Rating
Unit
85
mW
100
mA
IF
Continuous Forward Current
20
mA
VR
Reverse Voltage
5
V
1000
V
ESD
Electrostatic Discharge Threshold(HBM)Note A
Topr
Operating Temperature Range
-40 ~ + 85
℃
Tstg
Storage Temperature Range
-40 ~ + 85
℃
Tsld
Soldering Temperature (One times MAX.)
Reflow Soldering:260℃ (for 10seconds)
Hand Soldering:350℃ (for 3 seconds)
Note A :
HBM : Human Body Model. Seller gives no other assurances regarding the ability of to
withstand ESD.
Electro-Optical Characteristics (Ta=25℃
℃)
Parameter
Luminous Intensity
Symbol
Min.
Typ.
IV
190
Max.
Unit
Test Condition
350
mcd
IF=20mA
Viewing Angle
2θ1/2
120
Deg
Peak Emission
Wavelength
λp
465
nm
Measurement @Peak
Dominant Wavelength
λD
470
nm
IF=20mA
∆λ
20
nm
IF=20mA
Forward Voltage
VF
3.1
3.6
V
IF = 20mA
Reverse Current
IR
10
μA
VR = 5V
Spectrum Radiation
Bandwidth
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Notes:
1. Luminous intensity is measured with a light sensor and filter combination that
proximities the CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous
intensity.
3. Caution in ESD :
Static Electricity and surge damages the LED. It is recommended use a wrist band or
anti-electrostatic glove when handling the LED. All devices, equipment and machinery
must be properly grounded.
4. Major standard testing equipment by “Instrument System” Model : CAS140B Compact
Array Spectrometer and “KEITHLEY” Source Meter Model : 2400.
Typical Electro-Optical Characteristics Curves
Fig.1 Relative Intensity vs. Wavelength
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Typical Electro-Optical Characteristics Curves
Luminous lntensity(mcd)
(25℃ Ambient Temperature Unless Otherwise Noted)
Fig.1 Forward Current vs.Forward Voltage
Fig.2 Luminous Intensity vs.Forward Current
Relative luminous intensity(%)
Relative Luminous lntensity
Normalized of 20mA
1000
100
10
1
-60 -40 -20 -0 20 40 60 80 100
Ambient Temperature Ta( ℃)
Fig.3 Relative Luminous Intensity vs.Forward Current
Fig.4 Luminous Intensity vs.Ambient Temperature
0°
Forward Current IF(mA)
50
10°
20°
30°
40
30
20
1.0
40°
0.9
50°
0.8
60°
70°
80°
90°
10
0.7
0
0
20
40
60
80
100
0.5 0.3
0.1 0.2 0.4 0.6
Ambient Temperature Ta(℃)
Fig.5 Forward Current Derating Curve
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Fig.6 Relative Intensity vs.Angle
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Part No. : L-T650LBCT
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Bin Code List
Luminous Intensity(IV), Unit:[email protected]
Bin Code
Min
Max
P14
190
230
P15
230
P16
Forward Voltage(VF), Unit:[email protected]
Bin Code
Min
Max
14
2.9
3.0
280
15
3.0
3.1
280
350
16
3.1
3.2
P17
350
430
17
3.2
3.3
P18
430
530
18
3.3
3.4
19
3.4
3.5
20
3.5
3.6
Tolerance of each bin are±10%
Tolerance of each bin are±0.1Volt
Dominant Wavelength (Hue),Unit: [email protected]
Bin Code
Min
Max
AC
465
470
AD
470
475
Tolerance of each bin are±1nm
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Label Explanation
CUS. PART NO: To be denominated.
CUSTOMER: To be denominated.
PART NO: Refer to P15
IV--- Luminous Intensity Code
VF--- Forward Voltage Code
WD--- Dominant Wavelength
LOT NO:
E
L P
A
B
7
6
0001
C D E
F
A---E: For series number
B---L: Local
F: Foreign
C---P:PLCC SMD
D---Year
E---Month
F---SPEC.
PACKING QUANTITY OF BAG :
2000pcs for T670 series
2000pcs for T650 series
2000pcs for S020 series
DATE CODE:2007
G
G--- Year
06
H
08
I
H--- Month
I --- Day
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Reel Dimensions
Notes:
1. Taping Quantity : 2000pcs
2. The tolerances unless noted is±0.1mm, Angle±0.5°, Unit: mm.
Suggest Soldering Pad Dimensions
1.12
1.80
1.34
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DATE : 2009-10-31 PAGE
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Package Dimensions Of Tape And Reel
7
4.00∮
0.10
(.157∮
.004)
2.00∮
0.05
(.079∮
.002)
4.00∮
0.10
(.157∮
.004)
3.50∮.05
(.138∮.002)
(0.315+.012
-.004 )
*3.23∮0.10
(.127∮.004)
*8.00+0.30
-0.10
*0.254∮
0.020
(.0100∮
.0008)
1.75∮
0.10
(.069∮.004)
User Feed Direction
*1.73∮
0.10
(.068∮
.004)
Notes: All dimensions are in millimeters.
Packaging Of Electronic Components On Continuous Tapes
DRAWING NO. : DS-7B-07-0002
DATE
PAGE
:
2009-10-31
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Part No. : L-T650LBCT
Moisture Resistant Packaging
Label
H:\SMD\SMD\SMD° ü × ° \± ê ? ? .jpg
H:\SMD\SMD\SMD° ü × ° \± ê ? ? .jpg
D\SM
D\SM
H :\SM
.jpg
ê ??
× ° \±
D° ü
REV: A / 5
Reel
Label
Desiccant
Aluminum moistue-proof bag
240
H:\SM
\SMD°
D\SMD
ü×°
? .jpg
\± ê ?
145
210
5
25
Label
Box
435
Carton
Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm.
Cleaning
If cleaning is required , use the following solutions for less than 1 minute and less than 40℃.
Appropriate chemicals: isopropyl alcohol. (When using other solvents, it should be confirmed
beforehand whether the solvents will dissolve the package and the resin or not.)
Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as
ultrasonic power and the assembled condition. Before cleaning, a pre-test should be
confirm whether any damage to the LEDS will occur.
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●
Suggest Sn/Pb IR Reflow Soldering Profile Condition:
●
Suggest Pb-Free IR Reflow Soldering Profile Condition:
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CAUTIONS
1. Static Electricity:
* Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
* All devices, equipment and machinery must be properly grounded.
It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs.
* When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged
LEDs by a light-on test or a VF test at a lower current (blew 1mA is recommended).
* Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases,
the forward voltage becomes lower, or the LEDs do not light at the low current.
Criteria: (VF>2.0V,at IF=0.5m A )
2. Storage :
* Before opening the package :
The LEDs should be kept at 30°C or less and 85%RH or less. When storing the LEDs, moisture
proof packaging with absorbent material (silica gel) is recommended.
* After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within
168 hours (7 days) after opening the package. If unused LEDs remain, they should be stored in
moisture proof packages, such as sealed containers with packages of moisture absorbent material
(silica gel). It is also recommended to return the LEDs to the original moisture poof bag and to
reseal the moisture proof bag again.
If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should e performed using the following conditions.
Baking treatment: more than 24hours at 65±5℃.
* Please avoid rapid transitions in ambient temperature in high humidity environments where
condensation may occur.
3. Soldering:
Do not apply any stress to the LED lens during soldering while the LED is at high temperature.
Recommended soldering condition.
* Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
* Soldering Iron : (Not recommended)
Temperature350°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron :
20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering.
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4. Lead-Free Soldering
For Reflow Soldering :
1、Pre-Heat Temp: 150-180℃,120sec.Max.
2、Soldering Temp: Temperature Of Soldering Pot Over 240℃,40sec.Max.
3、Peak Temperature: 260℃,10sec.
4、Reflow Repetition: 2 Times Max.
5、Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu
For Soldering Iron (Not Recommended) :
1、Iron Tip Temp: 350℃ Max.
2、Soldering Iron: 30w Max.
3、Soldering Time: 3 Sec. Max. One Time.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
6. Reliability
1、Criteria For Judging The Damage
Item
Symbol
Test Conditions
Forward Voltage
VF
Reverse Current
Luminous Intensity
Criteria for Judgement
MIN.
Max.
IF=20mA
-
U.S.L.*)×1.1
IR
VR=5V
-
U.S.L.*)×2.0
IV
IF=20mA
L.S.L**)×0.7
-
*) U.S.L.: Upper Standard Level
**) L.S.L: Lower Standard Level
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2、Test Items And Results
Reference
Standard
Test Item
Resistance to Soldering Heat
JEITA
(Reflow Soldering)
ED-4701300 301
Solder ability (Reflow Soldering)
Thermal Shock
Temperature Cycle
High Temperature Storage
JEITA
ED-4701300 303
JEITA
ED-4701300 307
JEITA
ED-4701100 105
JEITA
ED-4701200201
JEITA
ED-4701100 103
JEITA
ED-4701200 202
Test Condition
Note
Tsld=260℃,10sec.
2times
(Pre treatment 30
℃,70%,168hrs)
Tsld=215℃,3sec.
1time
(Lead Solder)
over 95%
-40℃ ~ 100℃
100cycles
30min. 30min.
-40℃ ~ 25℃~100℃~25℃
100cycles
30min. 5min. 30min. 5min
Number
of
Damaged
0/50
0/50
0/50
0/50
Ta=100℃
1000hrs.
0/50
Ta=60℃,RH=90%
1000hrs.
0/50
Ta=-40℃
1000hrs.
0/50
Ta=25℃,IF=20mA
1000hrs.
0/50
Ta=85℃,IF=5mA
500hrs.
0/50
Ta=60℃,RH=90%,IF=15mA
500hrs.
0/50
Ta=-30℃,IF=20mA
500hrs.
0/50
Vibration
JEITA
ED-4701400 403
100~2000~100HzSweep
4min.200m/s2
3direction,4cycles
48min
0/50
Substrate Bending
JEITA ED-4702
3mm,5±1sec
1time
0/50
Stick
JEITA ED-4702
5N,10±1sec
1time
0/50
Temperature Humidity Storage
Low Temperature Storage
Steady State Operating Life
Condition
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
7.Others:
The appearance and specifications of the product may be modified for improvement without notice.
DRAWING NO. : DS-7B-07-0002
DATE : 2009-10-31 PAGE
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PART NO. SYSTEM :
L – T 65 0 X X T - X X X X
REV: A / 5
XXXX : Special specification for
customer
T : Taping for 7 inch reel
TC : Taping for 13 inch reel
Lens color
C : Water Clear
W : White Diffused
T : Color Transparent
D : Color Diffused
KY : 9mil AlInGap 590nm Super Yellow
KR : 9mil AlInGap 630 nm Super Red
TE : 14mil AlInGap 624 nm Super Red
TY: 14mil AlInGap590 nm Super Yellow
LB : InGaN ITO rough 470nm Blue
LG : InGaN ITO rough 520nm Green
W : InGaN + YAG White color
0 : Single chip
1/2 : Super thin single chip
5/6 : Dual chip
F : Three chip(Full color)
C : PCB Top View Type
T :PLCC Top View Type
S : Side View Type
DRAWING NO. : DS-7B-07-0002
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650 :
670 :
020 :
3020
3528
3812
1.3T TYPE
1.9T TYPE
0.6T TYPE
DATE : 2009-10-31
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