RENESAS 2SJ483TZ-E

2SJ483
Silicon P Channel MOS FET
REJ03G0867-0200
(Previous: ADE-208-519)
Rev.2.00
Sep 07, 2005
Description
High speed power switching
Features
• Low on-resistance
RDS (on) = 0.08 Ω typ (at VGS = –10 V, ID = –2.5 A)
• 4 V gate drive devices.
• Large current capacitance
ID = –5 A
Outline
RENESAS Package code: PRSS0003DC-A
(Package name: TO-92 Mod)
D
1. Source
2. Drain
3. Gate
G
32
Rev.2.00 Sep 07, 2005 page 1 of 6
1
S
2SJ483
Absolute Maximum Ratings
(Ta = 25°C)
Item
Drain to source voltage
Gate to source voltage
Drain current
Drain peak current
Body to drain diode reverse drain current
Symbol
VDSS
Value
–30
Unit
V
VGSS
ID
±20
–5
V
A
–20
–5
A
A
ID (pulse)
IDR
Note 1
Channel dissipation
Channel temperature
Pch
Tch
0.9
150
W
°C
Storage temperature
Note: 1. PW ≤ 10 µs, duty cycle ≤ 1%
Tstg
–55 to +150
°C
Electrical Characteristics
(Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
V (BR) DSS
V (BR) GSS
–30
±20
20
—
—
—
—
V
V
ID = –10 mA, VGS = 0
IG = ±100 µA, VDS = 0
IDSS
IGSS
—
—
—
—
–10
±10
µA
µ
µ
µA
VDS = –30 V, VGS = 0
VGS = ±16 V, VDS = 0
Gate to source cutoff voltage
Static drain to source on state resistance
VGS (off)
RDS (on)
–1.0
—
—
0.08
–2.0
0.11
V
Ω
ID = –1 mA, VDS = –10 V
Note 2
ID = –2.5 A, VGS = –10 V
Forward transfer admittance
RDS (on)
|yfs|
—
3
0.12
5
0.17
—
Ω
S
ID = –2.5 A, VGS = –4 V
Note 2
ID = –2.5 A, VDS = –10 V
Input capacitance
Output capacitance
Ciss
Coss
—
—
630
390
—
—
pF
pF
Reverse transfer capacitance
Turn-on delay time
Crss
td (on)
—
—
135
15
—
—
pF
ns
VDS = –10 V
VGS = 0
f = 1 MHz
Rise time
Turn-off delay time
tr
td (off)
—
—
70
65
—
—
ns
ns
Fall time
Body to drain diode forward voltage
tf
VDF
—
—
60
–1.0
—
—
ns
V
trr
—
60
—
ns
Drain to source breakdown voltage
Gate to source breakdown voltage
Zero gate voltage drain current
Gate to source leak current
Body to drain diode reverse recovery time
Note:
2. Pulse test
Rev.2.00 Sep 07, 2005 page 2 of 6
Test Conditions
Note 2
VGS = –10 V
ID = –2.5 A
RL = 4 Ω
IF = –5 A, VGS = 0
IF = –5 A, VGS = 0
diF/dt = 20 A/µs
2SJ483
Main Characteristics
Maximum Safe Operation Area
Power vs. Temperature Derating
–100
–1
–0.3
Operation in
this area is
limited by RDS (on)
t
ra
–0.1
ID (A)
–0.03
0
0
50
100
Ambient Temperature
Ta = 25°C
–0.01
–0.01 –0.03 –0.1 –0.3 –1 –3 –10 –30 –100
200
150
Ta (°C)
Drain to Source Voltage
Typical Output Characteristics
–10
Ta = 25°C
Pulse Test
–3 V
Drain Current
–6
VDS = –10 V
Pulse Test
ID (A)
–5 V
–4 V
–3.5 V
–8
VDS (V)
Typical Transfer Characteristics
–10 V –6 V
–8
–6
–4
VGS = –2.5 V
–2
Drain Current
ID (A)
–10
n
io
0.4
–3
pe
O
Drain Current
0.8
–10
100 µs
s
s
m t)
m
1
10 o
= 1 sh
(
1.2
C
D
Channel Dissipation
10 µs
–30
PW
Pch (W)
1.6
–4
25°C
–2
Tc = 75°C
–25°C
0
0
–2
–4
–6
–10
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
–1.0
Ta = 25°C
Pulse Test
–0.8
–0.6
ID = –5 A
–0.4
–0.2
–2 A
–1 A
0
0
–4
–8
–12
Gate to Source Voltage
Rev.2.00 Sep 07, 2005 page 3 of 6
–16
–20
VGS (V)
0
–1
–2
–3
–4
Gate to Source Voltage
VDS (V)
–5
VGS (V)
Static Drain to Source on State Resistance
vs. Drain Current
Static Drain to Source on State Resistance
RDS (on) (Ω)
Drain to Source Saturation Voltage VDS (on) (V)
Drain to Source Voltage
–8
0
10
3
Ta = 25°C
Pulse Test
1
0.3
VGS = –4 V
0.1
–10 V
0.03
0.01
–0.1 –0.3
–1
–3
Drain Current
–10
–30
ID (A)
–100
2SJ483
Forward Transfer Admittance vs.
Drain Current
Forward Transfer Admittance |yfs| (S)
Static Drain to Source on State Resistance
RDS (on) (Ω)
Static Drain to Source on State Resistance
vs. Temperature
0.5
Pulse Test
0.4
ID = –5 A
0.3
VGS = –4 V
–1 A, –2 A
0.2
–1 A, –2 A, –5 A
0.1
–10 V
0
–40
0
40
80
Case Temperature
120
160
50
VDS = –10 V
Pulse Test
20
10
Tc = –25°C
5
25°C
2
1
0.5
–0.1
Tc (°C)
200
2000
Capacitance C (pF)
Reverse Recovery Time trr (ns)
5000
100
50
20
di / dt = 20 A / µs
VGS = 0, Ta = 25°C
–0.5
–1
–2
Reverse Drain Current
–5
Crss
200
–12
–40
–16
–50
0
8
16
Gate Charge
Rev.2.00 Sep 07, 2005 page 4 of 6
24
32
Qg (nc)
–8
–12
–16
–20
–20
40
VGS (V)
500
Switching Time t (ns)
VGS
Gate to Source Voltage
VDS (V)
Drain to Source Voltage
–8
VDD = –25 V
–10 V
–5 V
Coss
Switching Characteristics
–4
–30
–10
Drain to Source Voltage VDS (V)
ID = –5 A
VDS
–5
Ciss
IDR (A)
0
–20
–2
500
100 V = 0
GS
f = 1 MHz
50
0
–4
–10
0
–10
–1
1000
Dynamic Input Characteristics
VDD = –5 V
–10 V
–25 V
–0.5
Typical Capacitance vs.
Drain to Source Voltage
500
5
–0.1 –0.2
–0.2
Drain Current ID (A)
Body-Drain Diode Reverse
Recovery Time
10
75°C
200
td(off)
100
tf
50
tr
20
td(on)
10
VGS = –10 V, VDD = –10 V
duty ≤ 1 %
5
–0.1 –0.2
–0.5
–1
Drain Current
–2
ID (A)
–5
–10
2SJ483
Reverse Drain Current vs.
Source to Drain Voltage
–10
Reverse Drain Current IDR (A)
Pulse Test
–8
–10 V
–6
–5 V
–4
VGS = 0, 5 V
–2
0
0
–0.4
–0.8
–1.2
–1.6
Source to Drain Voltage
VSD
–2.0
(V)
Switching Time Test Circuit
Waveform
Vin
Vout
Monitor
Vin Monitor
10%
D.U.T.
90%
RL
90%
90%
Vin
–10 V
50 Ω
VDD
= –10 V
Vout
td(on)
Rev.2.00 Sep 07, 2005 page 5 of 6
10%
tr
10%
td(off)
tf
2SJ483
Package Dimensions
JEITA Package Code
RENESAS Code
Package Name
MASS[Typ.]
SC-51
PRSS0003DC-A
TO-92 Mod / TO-92 ModV
0.35g
4.8 ± 0.4
Unit: mm
2.3 Max
0.65 ± 0.1
0.75 Max
0.7
0.60 Max
0.55 Max
10.1 Min
8.0 ± 0.5
3.8 ± 0.4
0.5 Max
1.27
2.54
Ordering Information
Part Name
Quantity
Shipping Container
2SJ483TZ-E
2500 pcs
Taping
Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of
production before ordering the product.
Rev.2.00 Sep 07, 2005 page 6 of 6
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
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