SOD323 Diodes Material Content Declaration Material name Substance name e.g. Copper (Cu), Gold (Au) Lead Frame Iron (Fe) 24.02% CAS no., if known 7439-89-6 Nickel (Ni) 7440-02-0 Total Chip 1.09% Silicon (Si) 7440-21-3 Gold (Au) 7440-57-5 Aluminuim (Al) 7429-90-5 Total Bonding Wire 0.09% Molding 73.91% Gold (Au) 7440-57-5 Total Silicon Dioxide (SiO2) 14808-60-7 Carbon Black 1333-86-4 Epoxy Resin Phenol Resin Cristobalite 14464-46-1 Total Plating 0.89% Tin (Sn) 7440-31-5 Total Total mass (mg) Substance mass (mg) 0.4457 0.6592 1.105 0.0363 0.0133 0.0005 0.050 0.0045 % OF Weight (%) ppm Of Total Weight 40.34 59.66 96,891.3 143,304.3 72.50 26.60 0.90 7,880.4 2,891.3 97.8 100.00 976.1 0.004 2.6639 78.20 579,104.3 0.0102 0.3747 0.30 11.00 2,221.6 81,456.5 0.3407 0.0170 3.406 0.0340 10.00 0.50 74,054.3 3,695.7 100.00 7,388.9 0.034 4.60