Chemical Composition of Transistor (SOT-23) (TO-236 ) Bonding Wire Lead Frame Epoxy Molding Plating H C E T M E Dice Weight: 8.72 mg / pc 15-Nov-07 07 Chemical Composition CAS No. Content tent Spec. (%) (% Content (%) Substance Weight (mg) (mg Sn 7440-31-5 31-5 99.95 min. 99.97 0.139958 Others —— — 0.05 max. m 0.03 0.000042 Crystalline e Silica (Quartz) artz) 14808-60-7 808- 70 70 - 90 78.2 4.7053722 Cristobalite balite 14464-46-1 -46- 0-1 0.5 0.0300855 Bisphenol-A BisphenolEpoxy Resin Resi 1675-54-3 3 - 20 10 0.60171 Phenolic Resin Res Water-Soluble Water-Solubl 9003-35-4 2 - 15 9.5 0.5716245 Antimony Antimon Trioxide 1309-64-4 0.1 - 3 1.5 0.0902565 Carbon Black 1333-86-4 0.1 - 0.5 0.3 0.0180513 Au 7440-57-5 99.99 min. 99.998 0.01149977 Others ũũ 0.01 max. 0.002 0.00000023 Alloy (Ni & Fe) 12645-50-0 98.071 98.071 2.47727346 Cu 7440-50-8 0.381 0.381 0.00962406 Ag 7440-22-4 1.548 1.548 0.03910248 Basis Si 7440-21-3 93.2 93.2 0.0236728 Obverse Metal Al 7429-90-5 0.8 0.8 0.0002032 Back Metal Au 7440-57-5 6 6 0.001524 Make up of material Plating (0.14 mg) m Epoxy Molding (6.0171 mg) S Bonding nding Wire (0.0115 (0.0 mg) Lead Frame (2.526 mg) Dice (0.0254 mg) 佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞ᒜ26ῧ05~09ᅸ Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong 䳏䁅 Tel: (852) 2688 6033 ⳳڇFax: (852) 2688 6051 䳏䛉ഄഔE-mail: [email protected] ㎆ഔWebsite: http://www.semtech.com.hk Chemical Composition of Transistor (TO-236 (SOT-23 HAF) Bonding Wire Lead Frame Epoxy Molding Plating H C E T M E Dice Weight: 8.72 mg / pc 16-Apr-09 16-Apr-0 Chemical Composition CAS No. Content Spec. (%) onte Content (% (%) Substance e We Weight (mg) Sn 7440-31-5 99.95 min. 99.97 0.139 0.139958 Others —— 0.05 max. 0.03 0.00 0.000042 Silica Fused 60676-86 60676-86-0 75-90 85.0 5.114535 esin Epoxy Resin 29690-82-2 5-10 8.7 0.5234877 henolic Resin Phenolic 9003-35-4 2-8 6 0.361026 Pigment 1333-86-4 0.1-0.5 0.3 0.0180513 Au 744 7440-57-5 99.99 min. 99.998 0.01149977 Others ũũ 0.01 max. 0.002 0.00000023 Alloyy (Ni & Fe) 12645-50-0 98.071 98.071 2.47727346 Cu 7440-50-8 0.381 0.381 0.00962406 Ag 7440-22-4 1.548 1.548 0.03910248 Basis Si 7440-21-3 93.2 93.2 0.0236728 O Obverse Metal Al 7429-90-5 0.8 0.8 0.0002032 Back Metal Au 7440-57-5 6 6 0.001524 Make up of material Plating (0.14 mg) Epoxy Molding (6.0171 mg) Bonding Wire (0.0115 0.0115 m mg) S Lead Frame (2.526 m mg) 0254 mg) Dice (0.0254 佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞ᒜ26ῧ05~09ᅸ Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong 䳏䁅 Tel: (852) 2688 6033 ⳳڇFax: (852) 2688 6051 䳏䛉ഄഔE-mail: [email protected] ㎆ഔWebsite: http://www.semtech.com.hk Chemical Composition of Transistor (SOT-363) Lead Frame Dice Epoxy Molding Plating Bonding Wire H C E T M E Adhesive Weight: 6.99 mg/ pc Make up of material S Adhesive ( 0.36 mg) 2 2013-6-27 stance Weight W Substance (mg) Chemical Composition CAS No. Sn 7440-31-5 in. 99.9 min. 99.85 0.29955 Others —— 0.02-0.1 0.15 0.00045 Epoxy Resin 29690-82-2 -82-2 82-2 3-20 13.0 0.5603 Phenolic Resin Water-Soluble 9003-35-4 2-15 2 10 0.4310 Antimony Trioxide de 1309-64-4 0.1-3 2 0.0862 Silicon dioxide 60676-86-0 70-90 72.3 3.11613 Cristobalite tobalite 14464-46-1 0-1 0.5 0.02155 Briminated Epoxy Resin 40039-93-8 4003 40039-93- 0.5-3 2 0.08620 Carbon Black 1333-86-4 1 0.1-0.5 0.2 0.00862 Ag 7440-22-4 70-80 77 0.2772 Bisphenol Bispheno F 28064-14-4 10-20 15 0.0540 2-Ethyl Glycidyl Ether -Ethyl Henxyl He 2461-15-6 0-10 8 0.0288 Au 7440-57-5 99.99 min. 99.99 0.009999 Others —— 0.01 max. 0.01 0.000001 Cu 7440-50-8 0.15 max. 0.12 0.001932 Ni 7440-02-0 40-42.5 40.98 0.659778 Fe 7439-89-6 58 max. 57.5 0.92575 Ag 7440-22-4 1.5 Max 1.40 0.02254 Si 7440-21-3 93.67 93.67 0.37468 Al 7429-90-5 1.03 1.03 0.00412 Au 7440-57-5 4.24 4.24 0.01696 SiO2 14808-60-7 0.55 0.55 0.0022 Si3N4 12033-89-5 0.51 0.51 0.00204 Plating˄0.3mg˅ Epoxy Molding ˄4.31mg˅ ent Content ( (%) Content Spec. (%) Wire˄0.010mg˅ Bonding W Wire ˄0.010mg˅ 0 010mg˅ Lead Frame˄1.61mg˅ Dice ˄0.4mg˅ 佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞ᒜ26ῧ05~09ᅸ Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong 䳏䁅 Tel: (852) 2688 6033 ⳳڇFax: (852) 2688 6051 䳏䛉ഄഔE-mail: [email protected] ㎆ഔWebsite: http://www.semtech.com.hk Chemical Composition of Transistor (SOT-363 HAF) Lead Frame Dice Epoxy Molding Plating Bonding Wire H C E T M E Adhesive Weight: 6.99 mg/ pc Make up of material Chemical Composition CAS No. nt Spec. Content (%) ontent Content %) (%) 2013-6-27 Substanc Substance Weight (mg (mg) Sn 7440-31-5 9.9 min. 99.9 5 99.85 0.29955 Others —— 0.020.02-0.1 0.1 0.15 0.00045 Silica Fused 60676-86-0 75-90 83 83.8 3.61178 sin in Epoxy Resin 29690-82-2 690-82-2 5-10 9 0.38790 enolic nolic Re Phenolic Resin 9003-35-4 -35-4 2 2-8 7 0.30170 Carbon rbon Black Bl 1333-86-4 6-4 0.1-0.5 0.2 0.00862 A Ag 7 7440-22-4 70-80 77 0.2772 Bisphenol F 28064-14-4 10-20 15 0.0540 Ethyl Henxyl Glycidyl Ether 2-Ethyl 2461-15-6 0-10 8 0.0288 Au A 7440-57-5 99.99 min. 99.99 0.009999 Others —— 0.01 max. 0.01 0.000001 Cu 7440-50-8 0.15 max. 0.12 0.001932 Ni 7440-02-0 40-42.5 40.98 0.659778 Fe 7439-89-6 58 max. 57.5 0.92575 Ag 7440-22-4 1.5 Max 1.40 0.02254 Si 7440-21-3 93.67 93.67 0.37468 Al 7429-90-5 1.03 1.03 0.00412 Au 7440-57-5 4.24 4.24 0.01696 SiO2 14808-60-7 0.55 0.55 0.0022 Si3N4 12033-89-5 0.51 0.51 0.00204 Plating˄0.3mg˅ Epoxy Molding ˄4.31mg˅ Adhesive ( 0.36 6 mg) S Bonding Wire˄0.010mg˅ Wi Wir 0 010mg 0.010m Lead Frame˄1.61mg˅ ˄1 Dice ˄0.4mg˅ 佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞ᒜ26ῧ05~09ᅸ Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong 䳏䁅 Tel: (852) 2688 6033 ⳳڇFax: (852) 2688 6051 䳏䛉ഄഔE-mail: [email protected] ㎆ഔWebsite: http://www.semtech.com.hk Chemical Composition of Transistor (SOT-323) Bonding Wire Lead Frame Epoxy Molding Plating H C E T M E Dice Weight: 5 mg / pc 15-Nov-07 -07 Make up of material Chemical Composition CAS No. Content ntent Spec. (%) ( Content (%) Substance Substanc Weight Weig (mg) (m Sn 7440-31-5 0-31-5 99.95 min. 99.97 0.079976 Others —— 0.05 0.0 max. 0.03 0.000024 Crystalline ine ne Silica (Quartz) artz) 14808-60-7 4808-60-7 70 - 90 78.2 2.692035 Cristobalite balite 14464-46-1 14464-46 0-1 0.5 0.0172125 1675-54 1675-54-3 3 - 20 10 0.34425 9003-35-4 2 - 15 9.5 0.3270375 Antimo Trioxide Antimon Antimony 1309-64-4 0.1 - 3 1.5 0.0516375 Carbon Black 1333-86-4 0.1 - 0.5 0.3 0.0103275 Au 7440-57-5 99.99 min. 99.998 0.016799664 Others ũũ 0.01 max. 0.002 0.000000336 Alloy (Ni & Fe) 12645-50-0 98.071 98.071 1.42006808 Cu 7440-50-8 0.381 0.381 0.00551688 Ag 7440-22-4 1.548 1.548 0.02241504 Si 7440-21-3 93.2 93.2 0.0118364 Al 7429-90-5 0.8 0.8 0.0001016 Au 7440-57-5 6 6 0.000762 Plating (0.08 mg) Bisphenol-A BisphenolEpoxy Resin Res Phenolic Resin Res Water-Solub Water-Soluble Epoxy Molding g (3.4425 mg) S Bonding onding Wire (0.0168mg) ((0 Lead Frame (1.448 mg) Basis Dice (0.0127 mg) Obverse Metal Back Metal 佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞ᒜ26ῧ05~09ᅸ Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong 䳏䁅 Tel: (852) 2688 6033 ⳳڇFax: (852) 2688 6051 䳏䛉ഄഔE-mail: [email protected] ㎆ഔWebsite: http://www.semtech.com.hk Chemical Composition of Transistor (SOT-323 HAF) Bonding Wire Lead Frame Epoxy Molding Plating H C E T M E S Dice Weight: 5 mg / pc 16-Apr-09 16-A Make up of material C ance Weight Content Substance (mg) mg) (%) Chemical Composition CAS No. Content Spec. (%) Sn 7440-31-5 99.95 min. 99.97 0.079976 Others —— 0.05 max. 0.03 0.000024 Silica Fused 60676-86-0 6067 75-90 75- 85.0 2.926125 y Resin Epoxy 2969029690-82-2 5-10 8.7 0.2994975 Phenolicc Resin 9003-35-4 9003-35- 2-8 6 0.20655 Pigment ent 1333-86-4 0.1-0.5 0.3 0.0103275 Au 7440-57-5 99.99 min. 99.998 0.016799664 Others ũũ 0.01 max. 0.002 0.000000336 A lloy (Ni & Fe) Alloy 12645-50-0 98.071 98.071 1.42006808 Cu 7440-50-8 0.381 0.381 0.00551688 Ag 7440-22-4 1.548 1.548 0.02241504 Si 7440-21-3 93.2 93.2 0.0118364 Al 7429-90-5 0.8 0.8 0.0001016 Au 7440-57-5 6 6 0.000762 Plating (0.08 mg) Epoxy Molding (3.4425 mg) Bonding Wire e (0.0168 mg) Lead Frame (1.448 mg) Basis e (0.0127 mg Dice mg) Obverse Metal Back Metal 佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞ᒜ26ῧ05~09ᅸ Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong 䳏䁅 Tel: (852) 2688 6033 ⳳڇFax: (852) 2688 6051 䳏䛉ഄഔE-mail: [email protected] ㎆ഔWebsite: http://www.semtech.com.hk Chemical Composition of Transistor (SOT-523) Bonding Wire Epoxy Molding Plating Lead Frame H C E T M E Dice Weight: 2.390mg / pc Chemical Composition CAS No. o. Content Spec. (%) %) Content (%) Substance Substan Weight Substanc (mg) Sn 7440-31-5 99.95 99.9 min. 99.97 99 97 0.07357792 Others ers —— 0.05 max. 0.03 0.00002208 Crystalline e Silica (Quartz) rtz) 14808-60-7 08-60-7 70 7 - 90 78.2 1.06907220 Cristobalite 14464-46-1 14464-4614464-46 0-1 0.5 0.00683550 1675-54-3 3 - 20 10 0.13671000 9003-35-4 2 - 15 9.5 0.12987450 Antimony Trioxide 1309-64-4 0.1 - 3 1.5 0.02050650 Carbon Black 1333-86-4 0.1 - 0.5 0.3 0.00410130 Au 7440-57-5 99.99 min. 99.998 0.008899822 Others —— 0.01 max. 0.002 0.000000178 Alloy (Ni & Fe) 12645-50-0 98.071 98.071 0.87518560 Cu 7440-50-8 0.381 0.381 0.00340004 Ag 7440-22-4 1.548 1.548 0.01381435 Basis Si 7440-21-3 93.2 93.2 0.04473600 Obverse Metal Al 7429-90-5 0.8 0.8 0.00038400 Back Metal Au 7440-57-5 6 6 0.00288000 Make up of material Plating (0.0736mg) Mold Epoxy Molding (1.3671mg) S Bo Bonding Wire (0.0089mg) Lead Frame (0.8924mg) Dice (0.0480mg) 2007-11-15 Bisphenol-A Epoxy Ep Resin in Phenolic eno Resin Re Water-Soluble Water 佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞ᒜ26ῧ05~09ᅸ Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong 䳏䁅 Tel: (852) 2688 6033 ⳳڇFax: (852) 2688 6051 䳏䛉ഄഔE-mail: [email protected] ㎆ഔWebsite: http://www.semtech.com.hk Chemical Composition of Transistor (SOT-523 HAF) Dice Bonding Wire Plating Lead Frame Epoxy Molding H C E T M E Weight: 2.394mg / pc Chemical Composition CAS No. Content Spec. (%) Content (%) ubstance Wei Weight Substance (m (mg) Sn 7440-31-5 99.95 min. 97 99.97 0.07357792 Others —— 5 max. 0.05 3 0.03 0.00002208 Silica Fused 6-0 -0 60676-86-0 75-90 85 1.1654 1.16543 1.165435 Epoxy Resin 29690-82-2 5-10 8.7 0.1192857 enolic Resin Phenolic 9003-35-4 2-8 6 0.082266 Pigment 1333-86-4 0 0.1-0.5 0.3 0.0041133 Au 7440-57 7440-57-5 99.99 min. 99.998 0.008899822 Others rs —— 0.01 max. 0.002 0.000000178 All Alloy(Ni&Fe) 69012-55-1 98.071 98.071 0.875185604 Cu 7440-50-8 0.381 0.381 0.003400044 Ag 7440-22-4 1.548 1.548 0.013814352 Basis Si 7440-21-3 93.2 93.2 0.04473600 Obverse Metal Al 7429-90-5 0.8 0.8 0.00038400 Back Metal Au 7440-57-5 6 6 0.00288000 Make up of material Plating (0.0736mg) Epoxy Molding (1.3711mg) S Bonding Wire (0.0089mg) 0.008 d Frame (0.8924 Lead (0.8924mg) Dice (0.0480mg) 2011-6-27 201 佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞ᒜ26ῧ05~09ᅸ Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong 䳏䁅 Tel: (852) 2688 6033 ⳳڇFax: (852) 2688 6051 䳏䛉ഄഔE-mail: [email protected] ㎆ഔWebsite: http://www.semtech.com.hk Chemical Composition of Transistor (SOT-89) Epoxy Molding Dice Lead Frame Gold Wire H C E T M E Plating Adhesive Weight: 49.7 mg / pc Make up of material Chemical Composition CAS No. pec. Content Spec. (%) Content (%) 15 15-Nov-07 Substance ce W Weight (mg)) Sn 5 7440-31-5 99.95 min. 7 99.97 0.39988 Others —— 0.05 max. 0.03 0.00012 Crystalline Silica Quartz) (Quartz) 14808-60-7 70 - 90 78.2 21.7103532 Cristobalite ristoba 14464-46-1 1446 0-1 0.5 0.138813 Bisphenol-A phenol-A Epoxy xy Resin 1675-54-3 75-54 3.0 - 20 10.0 2.77626 Phenolic Resin Water-Soluble 9 9003-35-4 2.0 - 15 9.5 2.637447 Antimon timo Antimony Tr Trioxide 1309-64-4 0.1 - 3.0 1.5 0.416439 Carbon Black 1333-86-4 0.1 - 0.5 0.3 0.0832878 Au 7440-57-5 99.99 min. 99.998 0.037399252 Others —— 0.01 max. 0.002 0.000000748 Ag 7440-22-4 70-80 80 0.08 Bisphenol F 28064-14-4 10-20 15 0.015 2-Ethyl Henxyl Glycidyl Ether 2461-15-6 0-10 5 0.005 Cu 7440-50-8 100 100 20.89 Basis Si 7440-21-3 93.2 93.2 0.47532 Obverse Metal Al 7429-90-5 0.8 0.8 0.00408 Back Metal Au 7440-57-5 6 6 0.0306 Plating (0.4mg) g (27.7626mg) Epoxy Molding S Gold Wire (0.03 (0.0 (0.0374mg) Adhesive(0.1mg) Lead Frame (20.89mg) Dice (0.51mg) 佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞ᒜ26ῧ05~09ᅸ Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong 䳏䁅 Tel: (852) 2688 6033 ⳳڇFax: (852) 2688 6051 䳏䛉ഄഔE-mail: [email protected] ㎆ഔWebsite: http://www.semtech.com.hk Chemical Composition of Transistor (SOT-89 HAF) Dice Epoxy Molding Lead Frame Gold Wire Plating H C E T M E Weight: 49.7 mg / pc Make up of material Chemical Composition CAS No. ent Spec. Content (% (%) Content (%) 08-Jan-10 8-Ja Substance We Weight (mg (mg) Sn 1-5 7440-31-5 99.95 min. 99.97 0.39988 Others —— 0.05 m max. 0.03 0.00012 used ed Silica Fused 60676-86-0 75-90 85.0 23.59821 Epoxyy Resin Res 29690-82-2 9690- 5-10 8.7 2.4153462 Phenolic ic Resin 9003-35-4 3-35 2-8 6 1.665756 Pigment 1333-861 333-86-4 1333-86-4 0.1-0.5 0.3 0.0832878 Au 7440-57-5 99.99 min. 99.998 0.037399252 ers Others —— 0.01 max. 0.002 0.000000748 Ag 7440-22-4 70-80 80 0.08 Bisphenol F 28064-14-4 10-20 15 0.015 2-Ethyl Henxyl Glycidyl Ether 2461-15-6 0-10 5 0.005 Cu 7440-50-8 100 100 20.890000 Basis Si 7440-21-3 93.2 93.2 0.47532 Obverse Metal Al 7429-90-5 0.8 0.8 0.00408 Back Metal Au 7440-57-5 6 6 0.0306 Plating (0.4mg) Epoxy Molding (27.7626 mg) re (0.0374 mg) Gold Wire S Adhesive(0.1mg) Lead Frame (20.89mg) Dice (0.51mg) 佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞ᒜ26ῧ05~09ᅸ Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong 䳏䁅 Tel˖(852) 2688 6033 ⳳڇFax˖(852) 2688 6051 䳏䛉ഄഔE-mail˖[email protected] ㎆ഔWebsite˖http://www.semtech.com.hk Chemical Composition of Transistor (TO-92) Bonding Wire Dice Plating H C E T M Epoxy Molding Lead Frame Weight: 190 mg / pc 29-Mar-08 -Mar Chemical Composition CAS No. Content S Spec. %) (%) Sn 40-31-5 7440-31-5 99.95 min. 99.97 2.059382 Others —— 0.05 max. 0.0 0.03 0.000618 Crystalline talline Silica (Quartz) (Q 14808-60-7 0-7 70 - 90 78.2 85.7893882 Cristobalite 14464-46-1 0-1 0.5 0.5485255 675 1675-54-3 3 - 20 10 10.97051 9003-35-4 2 - 15 9.5 10.4219845 A Antimony Trioxide 1309-64-4 0.1 - 3 1.5 1.6455765 Carbon Black 1333-86-4 0.1 - 0.5 0.3 0.3291153 Cu 7440-50-8 99.99 min. 99.998 0.019899602 Others ũũ 0.01 max. 0.002 0.000000398 Fe 7439-89-6 98.569 98.569 76.7359665 Cu 7440-50-8 0.955 0.955 0.7434675 Ag 7440-22-4 0.476 0.476 0.370566 Basis Si 7440-21-3 93.2 93.2 0.34018 Obverse Metal Al 7429-90-5 0.8 0.8 0.00292 Back Metal Au 7440-57-5 6 6 0.0219 Make up of material Plating (2.06 mg) E S Epoxy Molding ng (109.7051 mg) henol-A Epoxy Bisphenol-A Resin Resin Phenolic Resi Water-Soluble Water- Wei Content Substance We Weight (mg (%) (mg) Bonding ing Wire W (0.0199 mg) Lead Frame (77.85 mg) Dice (0.365 mg) 佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞ᒜ26ῧ05~09ᅸ Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong 䳏䁅 Tel: (852) 2688 6033 ⳳڇFax: (852) 2688 6051 䳏䛉ഄഔE-mail: [email protected] ㎆ഔWebsite: http://www.semtech.com.hk Chemical Composition of Transistor (TO-92 HAF) Bonding Wire Dice Plating Epoxy Molding H C E T M E S Lead Frame Weight: 190 mg / pc Make up of material Content Spec. Co Content (%) (%) Substance Weight ht (mg (mg) Chemical Composition CAS No. Sn 7440-31-5 99.95 min. 99.97 2.059 2.059382 Others —— 0.05 max. 0.03 0. 0.000618 Silica 14808-60-7 14808- 65 - 80 7 75.0 82.278825 Epoxy Resin Trade secret secre 2 - 10 9.5 10.4219845 Phenol Resin Trade secret 2 - 10 8.0 8.776408 ˘5 4.5 4.9367295 Plating (2.06 mg) 051 m Epoxy Molding (109.7051 mg) Flame Retardants Trad Trade secret Pigment 1333-86-4 ˘2 1.5 1.6455765 Coupli Co Coupling Agents 2530-83-8 ˘2 1.5 1.6455765 Cu 7440-50-8 99.99 min. 99.998 0.019899602 Others ũũ 0.01 max. 0.002 0.000000398 Fe 7439-89-6 98.569 98.569 76.7359665 Cu 7440-50-8 0.955 0.955 0.7434675 Ag 7440-22-4 0.476 0.476 0.370566 Basis Si 7440-21-3 93.2 93.2 0.34018 Obverse Metal Al 7429-90-5 0.8 0.8 0.00292 Back Metal Au 7440-57-5 6 6 0.0219 Bonding Wire (0.0199 m mg) Lead Frame (77.85 mg) Dice (0.365 mg) 佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞ᒜ26ῧ05~09ᅸ Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong 䳏䁅 Tel: (852) 2688 6033 ⳳڇFax: (852) 2688 6051 䳏䛉ഄഔE-mail: [email protected] ㎆ഔWebsite: http://www.semtech.com.hk