Chemical Composition of Transistor Green Products

Chemical Composition of Transistor (SOT-23)
(TO-236 )
Bonding Wire
Lead Frame
Epoxy Molding
Plating
H
C
E
T
M
E
Dice
Weight: 8.72 mg / pc
15-Nov-07
07
Chemical
Composition
CAS No.
Content
tent Spec.
(%)
(%
Content
(%)
Substance Weight
(mg)
(mg
Sn
7440-31-5
31-5
99.95 min.
99.97
0.139958
Others
——
—
0.05 max.
m
0.03
0.000042
Crystalline
e Silica
(Quartz)
artz)
14808-60-7
808-
70
70 - 90
78.2
4.7053722
Cristobalite
balite
14464-46-1
-46-
0-1
0.5
0.0300855
Bisphenol-A
BisphenolEpoxy Resin
Resi
1675-54-3
3 - 20
10
0.60171
Phenolic Resin
Res
Water-Soluble
Water-Solubl
9003-35-4
2 - 15
9.5
0.5716245
Antimony
Antimon Trioxide
1309-64-4
0.1 - 3
1.5
0.0902565
Carbon Black
1333-86-4
0.1 - 0.5
0.3
0.0180513
Au
7440-57-5
99.99 min.
99.998
0.01149977
Others
ũũ
0.01 max.
0.002
0.00000023
Alloy (Ni & Fe)
12645-50-0
98.071
98.071
2.47727346
Cu
7440-50-8
0.381
0.381
0.00962406
Ag
7440-22-4
1.548
1.548
0.03910248
Basis
Si
7440-21-3
93.2
93.2
0.0236728
Obverse Metal
Al
7429-90-5
0.8
0.8
0.0002032
Back Metal
Au
7440-57-5
6
6
0.001524
Make up of material
Plating (0.14 mg)
m
Epoxy Molding (6.0171 mg)
S
Bonding
nding Wire (0.0115
(0.0
mg)
Lead Frame (2.526 mg)
Dice (0.0254 mg)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Transistor (TO-236
(SOT-23 HAF)
Bonding Wire
Lead Frame
Epoxy Molding
Plating
H
C
E
T
M
E
Dice
Weight: 8.72 mg / pc
16-Apr-09
16-Apr-0
Chemical
Composition
CAS No.
Content Spec.
(%)
onte
Content
(%
(%)
Substance
e We
Weight
(mg)
Sn
7440-31-5
99.95 min.
99.97
0.139
0.139958
Others
——
0.05 max.
0.03
0.00
0.000042
Silica Fused
60676-86
60676-86-0
75-90
85.0
5.114535
esin
Epoxy Resin
29690-82-2
5-10
8.7
0.5234877
henolic Resin
Phenolic
9003-35-4
2-8
6
0.361026
Pigment
1333-86-4
0.1-0.5
0.3
0.0180513
Au
744
7440-57-5
99.99 min.
99.998
0.01149977
Others
ũũ
0.01 max.
0.002
0.00000023
Alloyy (Ni & Fe)
12645-50-0
98.071
98.071
2.47727346
Cu
7440-50-8
0.381
0.381
0.00962406
Ag
7440-22-4
1.548
1.548
0.03910248
Basis
Si
7440-21-3
93.2
93.2
0.0236728
O
Obverse Metal
Al
7429-90-5
0.8
0.8
0.0002032
Back Metal
Au
7440-57-5
6
6
0.001524
Make up of material
Plating (0.14 mg)
Epoxy Molding (6.0171 mg)
Bonding Wire (0.0115
0.0115 m
mg)
S
Lead Frame (2.526 m
mg)
0254 mg)
Dice (0.0254
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Transistor (SOT-363)
Lead Frame
Dice
Epoxy Molding
Plating
Bonding Wire
H
C
E
T
M
E
Adhesive
Weight: 6.99 mg/ pc
Make up of material
S
Adhesive ( 0.36 mg)
2
2013-6-27
stance Weight
W
Substance
(mg)
Chemical Composition
CAS No.
Sn
7440-31-5
in.
99.9 min.
99.85
0.29955
Others
——
0.02-0.1
0.15
0.00045
Epoxy Resin
29690-82-2
-82-2
82-2
3-20
13.0
0.5603
Phenolic Resin Water-Soluble
9003-35-4
2-15
2
10
0.4310
Antimony Trioxide
de
1309-64-4
0.1-3
2
0.0862
Silicon dioxide
60676-86-0
70-90
72.3
3.11613
Cristobalite
tobalite
14464-46-1
0-1
0.5
0.02155
Briminated Epoxy Resin
40039-93-8
4003
40039-93-
0.5-3
2
0.08620
Carbon Black
1333-86-4
1
0.1-0.5
0.2
0.00862
Ag
7440-22-4
70-80
77
0.2772
Bisphenol
Bispheno F
28064-14-4
10-20
15
0.0540
2-Ethyl
Glycidyl Ether
-Ethyl Henxyl
He
2461-15-6
0-10
8
0.0288
Au
7440-57-5
99.99 min.
99.99
0.009999
Others
——
0.01 max.
0.01
0.000001
Cu
7440-50-8
0.15 max.
0.12
0.001932
Ni
7440-02-0
40-42.5
40.98
0.659778
Fe
7439-89-6
58 max.
57.5
0.92575
Ag
7440-22-4
1.5 Max
1.40
0.02254
Si
7440-21-3
93.67
93.67
0.37468
Al
7429-90-5
1.03
1.03
0.00412
Au
7440-57-5
4.24
4.24
0.01696
SiO2
14808-60-7
0.55
0.55
0.0022
Si3N4
12033-89-5
0.51
0.51
0.00204
Plating˄0.3mg˅
Epoxy Molding ˄4.31mg˅
ent
Content
(
(%)
Content Spec.
(%)
Wire˄0.010mg˅
Bonding W
Wire
˄0.010mg˅
0 010mg˅
Lead Frame˄1.61mg˅
Dice ˄0.4mg˅
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Transistor (SOT-363 HAF)
Lead Frame
Dice
Epoxy Molding
Plating
Bonding Wire
H
C
E
T
M
E
Adhesive
Weight: 6.99 mg/ pc
Make up of material
Chemical Composition
CAS No.
nt Spec.
Content
(%)
ontent
Content
%)
(%)
2013-6-27
Substanc
Substance Weight
(mg
(mg)
Sn
7440-31-5
9.9 min.
99.9
5
99.85
0.29955
Others
——
0.020.02-0.1
0.1
0.15
0.00045
Silica Fused
60676-86-0
75-90
83
83.8
3.61178
sin
in
Epoxy Resin
29690-82-2
690-82-2
5-10
9
0.38790
enolic
nolic Re
Phenolic
Resin
9003-35-4
-35-4
2
2-8
7
0.30170
Carbon
rbon Black
Bl
1333-86-4
6-4
0.1-0.5
0.2
0.00862
A
Ag
7
7440-22-4
70-80
77
0.2772
Bisphenol F
28064-14-4
10-20
15
0.0540
Ethyl Henxyl Glycidyl Ether
2-Ethyl
2461-15-6
0-10
8
0.0288
Au
A
7440-57-5
99.99 min.
99.99
0.009999
Others
——
0.01 max.
0.01
0.000001
Cu
7440-50-8
0.15 max.
0.12
0.001932
Ni
7440-02-0
40-42.5
40.98
0.659778
Fe
7439-89-6
58 max.
57.5
0.92575
Ag
7440-22-4
1.5 Max
1.40
0.02254
Si
7440-21-3
93.67
93.67
0.37468
Al
7429-90-5
1.03
1.03
0.00412
Au
7440-57-5
4.24
4.24
0.01696
SiO2
14808-60-7
0.55
0.55
0.0022
Si3N4
12033-89-5
0.51
0.51
0.00204
Plating˄0.3mg˅
Epoxy Molding ˄4.31mg˅
Adhesive ( 0.36
6 mg)
S
Bonding Wire˄0.010mg˅
Wi
Wir
0 010mg
0.010m
Lead Frame˄1.61mg˅
˄1
Dice ˄0.4mg˅
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Transistor (SOT-323)
Bonding Wire
Lead Frame
Epoxy Molding
Plating
H
C
E
T
M
E
Dice
Weight: 5 mg / pc
15-Nov-07
-07
Make up of material
Chemical
Composition
CAS No.
Content
ntent Spec.
(%)
(
Content
(%)
Substance
Substanc Weight
Weig
(mg)
(m
Sn
7440-31-5
0-31-5
99.95 min.
99.97
0.079976
Others
——
0.05
0.0 max.
0.03
0.000024
Crystalline
ine
ne Silica
(Quartz)
artz)
14808-60-7
4808-60-7
70 - 90
78.2
2.692035
Cristobalite
balite
14464-46-1
14464-46
0-1
0.5
0.0172125
1675-54
1675-54-3
3 - 20
10
0.34425
9003-35-4
2 - 15
9.5
0.3270375
Antimo Trioxide
Antimon
Antimony
1309-64-4
0.1 - 3
1.5
0.0516375
Carbon Black
1333-86-4
0.1 - 0.5
0.3
0.0103275
Au
7440-57-5
99.99 min.
99.998
0.016799664
Others
ũũ
0.01 max.
0.002
0.000000336
Alloy (Ni & Fe)
12645-50-0
98.071
98.071
1.42006808
Cu
7440-50-8
0.381
0.381
0.00551688
Ag
7440-22-4
1.548
1.548
0.02241504
Si
7440-21-3
93.2
93.2
0.0118364
Al
7429-90-5
0.8
0.8
0.0001016
Au
7440-57-5
6
6
0.000762
Plating (0.08 mg)
Bisphenol-A
BisphenolEpoxy Resin
Res
Phenolic Resin
Res
Water-Solub
Water-Soluble
Epoxy Molding
g (3.4425 mg)
S
Bonding
onding Wire (0.0168mg)
((0
Lead Frame (1.448 mg)
Basis
Dice (0.0127 mg) Obverse Metal
Back Metal
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Transistor (SOT-323 HAF)
Bonding Wire
Lead Frame
Epoxy Molding
Plating
H
C
E
T
M
E
S
Dice
Weight: 5 mg / pc
16-Apr-09
16-A
Make up of material
C
ance Weight
Content Substance
(mg)
mg)
(%)
Chemical
Composition
CAS No.
Content Spec.
(%)
Sn
7440-31-5
99.95 min.
99.97
0.079976
Others
——
0.05 max.
0.03
0.000024
Silica Fused
60676-86-0
6067
75-90
75-
85.0
2.926125
y Resin
Epoxy
2969029690-82-2
5-10
8.7
0.2994975
Phenolicc Resin
9003-35-4
9003-35-
2-8
6
0.20655
Pigment
ent
1333-86-4
0.1-0.5
0.3
0.0103275
Au
7440-57-5
99.99 min.
99.998
0.016799664
Others
ũũ
0.01 max.
0.002
0.000000336
A
lloy (Ni & Fe)
Alloy
12645-50-0
98.071
98.071
1.42006808
Cu
7440-50-8
0.381
0.381
0.00551688
Ag
7440-22-4
1.548
1.548
0.02241504
Si
7440-21-3
93.2
93.2
0.0118364
Al
7429-90-5
0.8
0.8
0.0001016
Au
7440-57-5
6
6
0.000762
Plating (0.08 mg)
Epoxy Molding (3.4425 mg)
Bonding Wire
e (0.0168 mg)
Lead Frame (1.448 mg)
Basis
e (0.0127 mg
Dice
mg) Obverse Metal
Back Metal
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Transistor (SOT-523)
Bonding Wire
Epoxy Molding
Plating
Lead Frame
H
C
E
T
M
E
Dice
Weight: 2.390mg / pc
Chemical
Composition
CAS No.
o.
Content Spec.
(%)
%)
Content
(%)
Substance
Substan Weight
Substanc
(mg)
Sn
7440-31-5
99.95
99.9 min.
99.97
99 97
0.07357792
Others
ers
——
0.05 max.
0.03
0.00002208
Crystalline
e Silica
(Quartz)
rtz)
14808-60-7
08-60-7
70
7 - 90
78.2
1.06907220
Cristobalite
14464-46-1
14464-4614464-46
0-1
0.5
0.00683550
1675-54-3
3 - 20
10
0.13671000
9003-35-4
2 - 15
9.5
0.12987450
Antimony Trioxide
1309-64-4
0.1 - 3
1.5
0.02050650
Carbon Black
1333-86-4
0.1 - 0.5
0.3
0.00410130
Au
7440-57-5
99.99 min.
99.998
0.008899822
Others
——
0.01 max.
0.002
0.000000178
Alloy (Ni & Fe)
12645-50-0
98.071
98.071
0.87518560
Cu
7440-50-8
0.381
0.381
0.00340004
Ag
7440-22-4
1.548
1.548
0.01381435
Basis
Si
7440-21-3
93.2
93.2
0.04473600
Obverse Metal
Al
7429-90-5
0.8
0.8
0.00038400
Back Metal
Au
7440-57-5
6
6
0.00288000
Make up of material
Plating
(0.0736mg)
Mold
Epoxy Molding
(1.3671mg)
S
Bo
Bonding
Wire
(0.0089mg)
Lead Frame
(0.8924mg)
Dice
(0.0480mg)
2007-11-15
Bisphenol-A Epoxy
Ep
Resin
in
Phenolic
eno Resin
Re
Water-Soluble
Water
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Transistor (SOT-523 HAF)
Dice
Bonding Wire
Plating
Lead Frame
Epoxy Molding
H
C
E
T
M
E
Weight: 2.394mg / pc
Chemical
Composition
CAS No.
Content Spec.
(%)
Content
(%)
ubstance Wei
Weight
Substance
(m
(mg)
Sn
7440-31-5
99.95 min.
97
99.97
0.07357792
Others
——
5 max.
0.05
3
0.03
0.00002208
Silica Fused
6-0
-0
60676-86-0
75-90
85
1.1654
1.16543
1.165435
Epoxy Resin
29690-82-2
5-10
8.7
0.1192857
enolic Resin
Phenolic
9003-35-4
2-8
6
0.082266
Pigment
1333-86-4
0
0.1-0.5
0.3
0.0041133
Au
7440-57
7440-57-5
99.99 min.
99.998
0.008899822
Others
rs
——
0.01 max.
0.002
0.000000178
All
Alloy(Ni&Fe)
69012-55-1
98.071
98.071
0.875185604
Cu
7440-50-8
0.381
0.381
0.003400044
Ag
7440-22-4
1.548
1.548
0.013814352
Basis
Si
7440-21-3
93.2
93.2
0.04473600
Obverse Metal
Al
7429-90-5
0.8
0.8
0.00038400
Back Metal
Au
7440-57-5
6
6
0.00288000
Make up of material
Plating (0.0736mg)
Epoxy Molding (1.3711mg)
S
Bonding Wire (0.0089mg)
0.008
d Frame (0.8924
Lead
(0.8924mg)
Dice
(0.0480mg)
2011-6-27
201
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Transistor (SOT-89)
Epoxy Molding
Dice
Lead Frame
Gold Wire
H
C
E
T
M
E
Plating
Adhesive
Weight: 49.7 mg / pc
Make up of material
Chemical
Composition
CAS No.
pec.
Content Spec.
(%)
Content
(%)
15
15-Nov-07
Substance
ce W
Weight
(mg))
Sn
5
7440-31-5
99.95 min.
7
99.97
0.39988
Others
——
0.05 max.
0.03
0.00012
Crystalline Silica
Quartz)
(Quartz)
14808-60-7
70 - 90
78.2
21.7103532
Cristobalite
ristoba
14464-46-1
1446
0-1
0.5
0.138813
Bisphenol-A
phenol-A
Epoxy
xy Resin
1675-54-3
75-54
3.0 - 20
10.0
2.77626
Phenolic Resin
Water-Soluble
9
9003-35-4
2.0 - 15
9.5
2.637447
Antimon
timo
Antimony
Tr
Trioxide
1309-64-4
0.1 - 3.0
1.5
0.416439
Carbon Black
1333-86-4
0.1 - 0.5
0.3
0.0832878
Au
7440-57-5
99.99 min.
99.998
0.037399252
Others
——
0.01 max.
0.002
0.000000748
Ag
7440-22-4
70-80
80
0.08
Bisphenol F
28064-14-4
10-20
15
0.015
2-Ethyl Henxyl
Glycidyl Ether
2461-15-6
0-10
5
0.005
Cu
7440-50-8
100
100
20.89
Basis
Si
7440-21-3
93.2
93.2
0.47532
Obverse Metal
Al
7429-90-5
0.8
0.8
0.00408
Back Metal
Au
7440-57-5
6
6
0.0306
Plating (0.4mg)
g (27.7626mg)
Epoxy Molding
S
Gold Wire (0.03
(0.0
(0.0374mg)
Adhesive(0.1mg)
Lead Frame (20.89mg)
Dice (0.51mg)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Transistor (SOT-89 HAF)
Dice
Epoxy Molding
Lead Frame
Gold Wire
Plating
H
C
E
T
M
E
Weight: 49.7 mg / pc
Make up of material
Chemical
Composition
CAS No.
ent Spec.
Content
(%
(%)
Content
(%)
08-Jan-10
8-Ja
Substance We
Weight
(mg
(mg)
Sn
1-5
7440-31-5
99.95 min.
99.97
0.39988
Others
——
0.05 m
max.
0.03
0.00012
used
ed
Silica Fused
60676-86-0
75-90
85.0
23.59821
Epoxyy Resin
Res
29690-82-2
9690-
5-10
8.7
2.4153462
Phenolic
ic Resin
9003-35-4
3-35
2-8
6
1.665756
Pigment
1333-861
333-86-4
1333-86-4
0.1-0.5
0.3
0.0832878
Au
7440-57-5
99.99 min.
99.998
0.037399252
ers
Others
——
0.01 max.
0.002
0.000000748
Ag
7440-22-4
70-80
80
0.08
Bisphenol F
28064-14-4
10-20
15
0.015
2-Ethyl Henxyl
Glycidyl Ether
2461-15-6
0-10
5
0.005
Cu
7440-50-8
100
100
20.890000
Basis
Si
7440-21-3
93.2
93.2
0.47532
Obverse Metal
Al
7429-90-5
0.8
0.8
0.00408
Back Metal
Au
7440-57-5
6
6
0.0306
Plating (0.4mg)
Epoxy Molding (27.7626 mg)
re (0.0374 mg)
Gold Wire
S
Adhesive(0.1mg)
Lead Frame (20.89mg)
Dice (0.51mg)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel˖(852) 2688 6033
‫ ⳳڇ‬Fax˖(852) 2688 6051
[email protected]
㎆ഔWebsite˖http://www.semtech.com.hk
Chemical Composition of Transistor (TO-92)
Bonding Wire
Dice
Plating
H
C
E
T
M
Epoxy Molding
Lead Frame
Weight: 190 mg / pc
29-Mar-08
-Mar
Chemical
Composition
CAS No.
Content S
Spec.
%)
(%)
Sn
40-31-5
7440-31-5
99.95 min.
99.97
2.059382
Others
——
0.05 max.
0.0
0.03
0.000618
Crystalline
talline Silica
(Quartz)
(Q
14808-60-7
0-7
70 - 90
78.2
85.7893882
Cristobalite
14464-46-1
0-1
0.5
0.5485255
675
1675-54-3
3 - 20
10
10.97051
9003-35-4
2 - 15
9.5
10.4219845
A
Antimony Trioxide
1309-64-4
0.1 - 3
1.5
1.6455765
Carbon Black
1333-86-4
0.1 - 0.5
0.3
0.3291153
Cu
7440-50-8
99.99 min.
99.998
0.019899602
Others
ũũ
0.01 max.
0.002
0.000000398
Fe
7439-89-6
98.569
98.569
76.7359665
Cu
7440-50-8
0.955
0.955
0.7434675
Ag
7440-22-4
0.476
0.476
0.370566
Basis
Si
7440-21-3
93.2
93.2
0.34018
Obverse Metal
Al
7429-90-5
0.8
0.8
0.00292
Back Metal
Au
7440-57-5
6
6
0.0219
Make up of material
Plating (2.06 mg)
E
S
Epoxy Molding
ng (109.7051 mg)
henol-A Epoxy
Bisphenol-A
Resin
Resin
Phenolic Resi
Water-Soluble
Water-
Wei
Content Substance We
Weight
(mg
(%)
(mg)
Bonding
ing Wire
W (0.0199 mg)
Lead Frame (77.85 mg)
Dice (0.365 mg)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk
Chemical Composition of Transistor (TO-92 HAF)
Bonding Wire
Dice
Plating
Epoxy Molding
H
C
E
T
M
E
S
Lead Frame
Weight: 190 mg / pc
Make up of material
Content Spec. Co
Content
(%)
(%)
Substance
Weight
ht
(mg
(mg)
Chemical
Composition
CAS No.
Sn
7440-31-5
99.95 min.
99.97
2.059
2.059382
Others
——
0.05 max.
0.03
0.
0.000618
Silica
14808-60-7
14808-
65 - 80
7
75.0
82.278825
Epoxy Resin
Trade secret
secre
2 - 10
9.5
10.4219845
Phenol Resin
Trade secret
2 - 10
8.0
8.776408
˘5
4.5
4.9367295
Plating (2.06 mg)
051 m
Epoxy Molding (109.7051
mg)
Flame Retardants Trad
Trade secret
Pigment
1333-86-4
˘2
1.5
1.6455765
Coupli
Co
Coupling Agents
2530-83-8
˘2
1.5
1.6455765
Cu
7440-50-8
99.99 min.
99.998
0.019899602
Others
ũũ
0.01 max.
0.002
0.000000398
Fe
7439-89-6
98.569
98.569
76.7359665
Cu
7440-50-8
0.955
0.955
0.7434675
Ag
7440-22-4
0.476
0.476
0.370566
Basis
Si
7440-21-3
93.2
93.2
0.34018
Obverse Metal
Al
7429-90-5
0.8
0.8
0.00292
Back Metal
Au
7440-57-5
6
6
0.0219
Bonding Wire (0.0199 m
mg)
Lead Frame (77.85 mg)
Dice (0.365 mg)
佭␃ᮄ⬠≭⬄☿⚁⾒ⲯ㸫11㰳Ёᓎ䳏㿞໻ᒜ26ῧ05~09ᅸ
Room 2605~09, 26/F., CCT Telecom Building, 11 Wo Shing Street, Fo tan, Shatin, N.T., Hong Kong
䳏䁅 Tel: (852) 2688 6033
‫ ⳳڇ‬Fax: (852) 2688 6051
䳏䛉ഄഔE-mail: [email protected]
㎆ഔWebsite: http://www.semtech.com.hk